pcb最常用術(shù)語知識(shí)講解

1、pcb最常用術(shù)語精品文檔A/W (artwork)底片Ablation 燒溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 力口速腐蝕accelerated test 力口速試驗(yàn)acceleration速化反響accelerator力口速齊 Uacceptable 允收activator 活化液active work in process 實(shí)際在制品adhesion 附著力adhesive method黍占著法air inclusion 氣泡ai

2、r knife 風(fēng)刀amorphous change 不定形的改變amount總量amylnitrite 硝基戊烷analyzer 分析儀anneal 回火收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔annular ring環(huán)狀墊圈;孔環(huán)anode slime (sludge) 陽極泥anodizing 陽極處理AOI ( automatic optical inspection )applicable documents弓 I 用之文件AQL sampling允收水準(zhǔn)抽樣aqueous photoresist 液態(tài)光阻aspect ratio 縱橫比(厚寬比)As received 到貨時(shí)b

3、ack lighting 背光back-up 墊板banked work in process預(yù)留在制品base material 基材baseline performance基準(zhǔn)績(jī)效batch 批beta backscattering貝他射線照射法beveling 切斜邊；斜邊biaxial deformation二方向之變形black-oxide 黑化blank controller空白對(duì)照組自動(dòng)：光學(xué)檢測(cè)blank panel 空板收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔blanking 挖空blip 彈開blister 氣泡;起泡blistering 氣泡blow hole 吹孔b

4、oard-thickness error 板厚錯(cuò)誤bonding plies黍占結(jié)層bow ; bowing 板彎break out 從平環(huán)內(nèi)破出bridging搭橋；橋接BTO (Build To Order)接單生產(chǎn)burning 燒焦burr毛邊(毛頭)camcorder 一體型攝錄放機(jī)carbide 碳化物carlson pin 定位梢carrier 載運(yùn)劑catalyzing 催化catholic sputtering陰極濺射法caul plate 隔板；鋼板calibration system requirements校驗(yàn)系統(tǒng)之各種要求收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔c

5、enter beam method中央光束法central projection集中式投射線certification 認(rèn)證chamfer 倒角(金手指)chamfering 切斜邊;倒角characteristic impedance特性阻抗charge transfer overpotential電量傳遞過電壓chase網(wǎng)框checkboard 棋盤chelator 蟹和劑chemical bond 化學(xué)鍵chemical vapor deposition化學(xué)蒸著鍍circumferential void圓周性之孔破clad metal 包夾金屬clean room 無塵室clearanc

6、e 間隙coat鍍外表coating error防焊覆蓋錯(cuò)誤coefficient of thermal expansion (CTE)熱 3彭脹系數(shù)cold solder joint 冷焊點(diǎn)cold-weld金屬粉末冷焊收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔color 顏色color error顏色錯(cuò)誤compensation 補(bǔ)償competitive performance競(jìng)爭(zhēng)力績(jī)效complex salt 錯(cuò)化物complexor 錯(cuò)化物component hole 零件孔component side 零件面concentric 同心conformance 密貼性consumer

7、 products 消費(fèi)性產(chǎn)品contact resistance接觸電阻continuous performance 連續(xù)發(fā)揮效能contract service協(xié)力廠controlled split均裂式conventional flow舌 L 流方式conventional tensile test傳統(tǒng)張力測(cè)試法conversion coating 轉(zhuǎn)化層convex 突出coordinate list 數(shù)據(jù)清單copper claded laminates (CCL) 銅箔基板copper exposure線路露銅收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔copper mirror

8、鏡銅copper pad銅箔圓配copper residue (copper splash) 銅渣c(diǎn)orrosion rate numbering腐蝕速率計(jì)數(shù)系統(tǒng)corrosion resistance 抗蝕性coulombs law 庫倫定律countersink 喇叭孔coupon試樣coupon location 試樣點(diǎn)covering power 遮蓋力CPU中央處理器crack破裂；裂痕crazing 裂痕；白斑cross linking交聯(lián)聚合cross talk 照應(yīng)作用crosslinking 交聯(lián)crystal collection結(jié)晶收集curing 聚合體current

9、efficiency電流效率cut-outs 挖空cutting 裁板收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔cyanide 氧化物cycles of learning 學(xué)習(xí)循環(huán)cycle-time reduction交期縮短date code 周期deburring 去毛頭dedicated 專用型degradation 退變delamination 分層dent / pin hole 凹陷/ 針孔department of defense 國(guó)防部designation 字碼簡(jiǎn)示法de-smear 除膠渣developing 顯影dewetting 縮錫dewetting time 縮錫

10、時(shí)間dimension error 夕卜形尺寸錯(cuò)誤dielectric constant 介質(zhì)常數(shù)difficulty 困難度difunctional 雙功能dimension 尺寸dimension stability尺寸安定性收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔dimensional stability尺度安定性收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除dimension and tolerance 尺寸與公差dirty hole 孔內(nèi)異物discolor hole孔黑；孔灰；氧化discoloration變色disposable eyelet method消耗性聊車丁法distorti

11、on factor 尺寸變形函數(shù)double side 雙面板downtime停機(jī)時(shí)間drill 鉆孔drill bit 鉆頭drill facet鉆尖切葡面drill pointer鉆尖重(研)磨機(jī)drilled blank board已鉆孔之裸板drilling鉆孔dry film干膜ductility 延展性economy of scale經(jīng)濟(jì)規(guī)模edge spacing板邊空地edge-board contact ( gold finger )金手指efficiency 能量效率精品文檔electric test電測(cè)electrical testing 電測(cè);測(cè)試electrochem

12、ical machine ECM電化學(xué)加工法electrochemical reactor 電化學(xué)反響器electroforming 電鑄electroless plate化學(xué)銅electroless-deposition 無電鍍electropolishing電解拋I光electrorefining電解精煉electrowinning電解萃取elliptical set橢圓形embrittlement 脆性entitlement performance可達(dá)成績(jī)效entrapment電鍍夾雜物epoxy環(huán)氧樹酯equipotential 電位線error data file異常情形etch r

13、ate蝕銅速率etchants 蝕刻液etchback 回蝕evaluation program評(píng)估用程序exposure 曝光收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔external pin method 夕卜部插梢法eyelet hole聊車丁孑 LEyeletting 獅眼fabric 網(wǎng)布failure 故障fast response快速響應(yīng)fault 瑕疵；缺陷fiber exposure纖維顯露fiber protrusion纖維突出fiducial mark 光學(xué)點(diǎn),基準(zhǔn)記號(hào)filler 填充料film 底片filtration 過濾finished board 成品fixi

14、ng 固著fixture 電測(cè)夾具治具flaking off 粹離flammability rating燃性等級(jí)flare 喇叭形孔flat cable并排電纜feedback loop 回饋循環(huán)收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔first-in-first-out (FIFO)先進(jìn)先出flexible manufacturing system (FMS)彈性制造系統(tǒng)flux 助焊劑foil distortion銅層變形fold 空泡foreign include異物foreign material 基材內(nèi)異物free radical chain polymerization自 由基

15、連鎖聚合fully additive 加成法fully annealed type徹底回火軻化之類形function 函數(shù)fundamental and basic 根本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap鉆尖分開gauge length 有效長(zhǎng)度gel time 膠化時(shí)間general resist ink般阻齊U油墨general 通論general industrial一般性電子工業(yè)級(jí)收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔geometrical levelling幾何平整glass transiti

16、on temperature (Tg)玻璃態(tài)轉(zhuǎn)換溫度Gold 金gold finger金手指gold plating鍍金golden board 標(biāo)準(zhǔn)板gouges刷磨凹溝gouging 挖破grain boundary 金屬晶體之四邊green 綠色grip 夾頭ground plane 接地層ground plane clearance接地空環(huán)hackers 駭客HAL ( hot air leveling ) 噴錫haloing 白邊；白圈hardener 硬化齊Uhardness 硬度hepa filter 空氣濾清器high performance industrial 高性能(電子

17、)工業(yè)級(jí)high reliability高可靠度收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔high resolution高分辨率high temperature elongation (HTE)高溫延展性銅箔h(huán)igh temperature epoxy (HTE) 高溫樹酯hit擊hole counter 數(shù)孔機(jī)hole diameter 孔徑hole diameter error孑 L 徑錯(cuò)誤hole location 孔位hole number 孔數(shù)hole wall quality孔壁品質(zhì)hook外弧hot dip 熱浸法hull cell 哈氏槽hybrid 混成集成電路hydrog

18、en bonding 氫鍵hydrolysis 水解hydrometallurgy濕法冶金法image analysis system影像分析系統(tǒng)image transfer影像轉(zhuǎn)移immersion gold浸金(化銀金)immersion plating 浸鍍法收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔impedance 阻抗infrared reflow 紅外線重熔inhibitor 熱聚合抑制劑injection mold 射模ink油墨innerlayer & outlayer 內(nèi)外層insulation resistance 絕緣電阻intended position 應(yīng)

19、該在的位置intensifier 增強(qiáng)器intensity 強(qiáng)度inter molecular exchange交互改變interconnection 互相連通ionic contaminants 離子性污染物ionic contamination testing 離子污染試驗(yàn)IPA異丙醇5I : inspiration 啟蒙identification確認(rèn)方案目標(biāo)implementation改善方案information 數(shù)據(jù)internalization制度化invisible inventory 無形的庫存收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔knife edges 刀緣Knoop

20、努普硬度單位kraft paper 牛皮紙返回頂部laminar flow 層流laminate 基層板laminating 壓合lamination 壓合laminator 壓膜機(jī)land焊墊lay back 刃角磨損lay up組合疊板layout 布線;布局lead screw 牽弓I螺絲leakage 漏電learning curve 學(xué)習(xí)曲線legend 文字標(biāo)記leveling 平整levelling additive平整劑Ilevelling power 平整力life support維系生命limiting current極限電流收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔li

21、ne space線距l(xiāng)ine width線寬linear variable differential transformer(LVDL)線性可變差動(dòng)：轉(zhuǎn)換器liquid 液狀(態(tài))liquid crystal resins液晶樹脂liquid photoimageable solder resist ink液態(tài)感光防焊油墨liquid photoresist ink液態(tài)光阻劑油墨lot size 批量lower carrier 底部承載板mechanical plating機(jī)械鍍法machine scrub 刷磨清潔法macrothrowing power巨分布力margin 鉆頭刃帶mark

22、et share市場(chǎng)占有率marking error 文字錯(cuò)誤masked leveling儒裝平整mass lamination 大型壓板mass transfer 質(zhì)量傳送效應(yīng)mass transfer overpotential質(zhì)量傳遞過電壓mass transportation 質(zhì)傳master drawing 主圖；藍(lán)圖收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔material use factor 材料使用率mealing 泡點(diǎn)；白點(diǎn)memory記憶裝置新月型焊錫效果meniscograph solderability measurement microetch 微蝕microe

23、tching 微蝕microfocus 微焦距microfocus system微焦距系統(tǒng)microprofile 微外表microsectioning微切片法microthrowing power微分布力migration 遷移mini-tensile tester迷你拉力測(cè)試儀mis hole location孔位錯(cuò)誤misregistration焊錫面與零件面對(duì)位偏差misregsitration對(duì)不準(zhǔn)濕氣與絕緣電阻試驗(yàn)moisture and insulation resistance test molded circuit board (MCB) 模制電路板monoethanal a

24、mine 單乙醇氨monohydrate state 水化物monomer單分子膜;單體收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔mouse bite 鋸齒;蝕刻缺口msec毫秒muffle furnace高溫焚火爐multichip 超大IC型多芯片模塊mylar保護(hù)膜nail head 釘頭NC drill數(shù)字鉆孔機(jī)negative etchback 反回蝕negative film 負(fù)片negative rake angle負(fù)摳耙角network 回路；網(wǎng)絡(luò)neutralization 中和nick 缺口nickel 銀nodule 銅瘤;瘤粒no flow resin 不流樹脂noi

25、se 噪聲nominal 標(biāo)示nominal dimension標(biāo)定長(zhǎng)度nominal gel time標(biāo)示膠性時(shí)間nominal resin content 標(biāo)示膠含量收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔nominal resin flow標(biāo)示膠流量nominal scaled flow thickness標(biāo)示比例流量厚度OA equip辦公室自動(dòng)：化設(shè)備obsolescence factor 寸艮廢因素OEM原設(shè)備制造商offset-list 補(bǔ)償數(shù)據(jù)清單ohmmeter歐姆計(jì)open斷路open circuits 斷路open short testing斷短路測(cè)試opening

26、開口original art work (A/W)原稿底片Others其它outgrowth 增出over design 牛刀殺雞overlap 鉆尖重疊overlay entry蓋板overpotential過電壓oxidation 氧化oxide treatment黑化處理oxided cytochrome氧化性之細(xì)包色素收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔oxygen evolution氧氣發(fā)生反響packed bed 充填床式pad錫墊;圓配pad copper exposure pad 露銅panel小型板面；母板panel plating次銅電鍍parasitic 寄生的p

27、art no. 料號(hào)pattern plating二次銅電鍍PCB print circuit board 印刷電路板pcs片peel strength 抗撕強(qiáng)度peeling off 剝離錄U落performance specification 性能標(biāo)準(zhǔn)permittivity 透電率perspectives on experience 經(jīng)驗(yàn)透視PET聚酯photodiode detector 發(fā)光二極管偵測(cè)器photo initiator感光啟始劑photoresist 光阻phototool 光具指工作底片收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔poor solderability焊

28、錫性不良收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除piece 子板面pinceton applied research腐蝕測(cè)定儀pink ring 粉紅圈pit 凹點(diǎn)pitch 腳距planar 平面plating 電鍍plating exposure下鍍層露出plug gauge 插規(guī)plug hole 孔塞PNL (panel)排板polar-polar interaction極性之間的吸力polyester 聚酯類polyglycols 聚乙二醇polyimide聚亞醯氨poor bevelling磨邊加工引起突起,剝離poor drill孔形不良poor HAL噴錫不良poor markin

29、g字體不良poor pad 錫墊不良poor printed印刷偏差精品文檔poor touch-up補(bǔ)線不良position control system位置限制系統(tǒng)positive rake angle 正摳耙角power curve model幕次曲線模式practice 工藝慣例preferred 良好premature tearing提前撕裂prepolymer 預(yù)聚合物prepreg 膠片pre-process ( front-end) 制前press 壓床press cycle 壓合周期primary current distribution一次電流分布primary 主要pro

30、duct lifetimes生命周期product process 制程promoter 促進(jìn)劑protocal 初步資料prussic acid 普魯士酸PTF-based process厚膜糊法PTH (plating though hole) 導(dǎo)通孔收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔pull away 拉開pumice浮石粉pumice scrub 噴砂清潔法pyrometallurgy火燒法冶煉QC ( quality control)品管QFP (quad flat pack )扁方型封裝體qualification inspection資格審查檢驗(yàn)qualificatio

31、n testing資格檢定quality classification 品質(zhì)等級(jí)quantitative計(jì)量式測(cè)試rack 掛架radiometer能量齊 Urake angle 摳耙角RAM Random Access Memory 隨機(jī)存取內(nèi)存real time 關(guān)鍵時(shí)刻recessed trace process凹槽線路法recovery tank 回收槽reduction 復(fù)原re-eninforcement 強(qiáng)化reinforcement style補(bǔ)強(qiáng)材料的型式收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除refraction 折光率精品文檔register mark對(duì)位用標(biāo)記registr

32、ation hole 對(duì)位孔registration pattern 長(zhǎng)方形銅地REJ ( reject )退貨；拒收rejectable 拒收release agent脫模齊 Urelief angle 浮離角remark 備注repair 修理resin content樹脂含量(膠含量)resin flow 膠流量resin flow percentage樹脂流量之百分率resin recession 樹脂下陷resin smear 膠渣resist strippers錄U 干膜齊 Uresistor network排列電阻resolution 解像度return on assets資產(chǎn)才

33、艮酬率reversibility 可逆性rework 重工rosin 天然松香收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔rotating cylinder旋轉(zhuǎn)圓柱形roughtness 孔壁粗糙；粗情routing 切外形,成型routing bit銃刀runout 偏轉(zhuǎn)S/L on hole孔內(nèi)沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder mask) 防焊S/M error防焊種類錯(cuò)誤S/M on hole 孔內(nèi)綠漆salt spray test 鹽水噴霧試驗(yàn)sampling size 抽樣數(shù)scope范圍scored 亥 U 痕scoring 樞

34、方t;刮線scrap 廢框scratches舌 U 傷screen printing 網(wǎng)版印刷scum透明殘膜sealing 封孔處理secondary 次要收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔semi-additive半力口成法sensitize 敏化sensitizer 敏化液separator 鋼隔板sequential lamination 漸成式壓法serrated edges 毛邊shatter 破碎short 短路shunt分路silane treatment硅烷處理silicone coupling agent硅烷偶合齊 Usilk screen文字印刷simulato

35、r 仿真器single axis單軸sizing底片之伸縮補(bǔ)償skip 漏印skip printing 跳印;漏印sliver 絲條slot 開槽slotting 開槽SMD ( surface mount device )外表黏著組件smear膠渣收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔SMT ( surface mount technology ) 外表黏著技術(shù)sodium carbonate monohydrate 結(jié)晶水碳酸鈉soft tooling軟性工具solder 焊錫；錫鉛solder bridge 錫橋solder bump 錫突solder float 漂錫solder

36、 mask adhesion 綠漆附著力solder on G/F金手指沾錫solder on trace線路沾錫solder plug錫塞solder side焊錫面solderability焊錫性solid carbide實(shí)質(zhì)碳化物spacing 間距spacing nonenough 間距缺乏SPC ( Statistical Process Control )統(tǒng)計(jì)生管specification 標(biāo)準(zhǔn)special considerations特另 Ll 考慮spin coating旋轉(zhuǎn)涂布spindle 鉆軸收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔spiral contractom

37、eter螺旋收縮儀spot face 銃靶spray coating 噴涂Squeegee 舌U刀stacking structure疊板結(jié)構(gòu)stamping 沖壓standard hydraulic lamination 標(biāo)準(zhǔn)液壓法standardizing 標(biāo)準(zhǔn)化starvation 缺膠step tablet 格片數(shù)stock option認(rèn)股選擇權(quán)strain 應(yīng)度strength 強(qiáng)度stressmeter 應(yīng)力計(jì)subtractive 減除法surface convex外表突起surface examination 外表檢查surface insulation resistance

38、 (SIR)外表絕緣電阻surface mount外表黏著方式surface roughness外表粗情度surges 突波switch circuit開關(guān)線路收集于網(wǎng)絡(luò),如有侵權(quán)請(qǐng)聯(lián)系治理員刪除精品文檔tab金手指tack free 不黍占taped hole gauge 錐形孔規(guī)target hole靶孑 Ltask force任務(wù)編組tensile strength 抗拉強(qiáng)度tensile stress張性應(yīng)力tent 浮蓋terms and definitions 術(shù)語與定義termination load 抗匹配負(fù)載test circuit測(cè)試線路test method試驗(yàn)方法test point測(cè)試點(diǎn)thermal shock熱震蕩試驗(yàn)thermal stress熱應(yīng)力試驗(yàn)thermistor熱電感應(yīng)式thermo cycling熱循環(huán)試驗(yàn)theoretical cycle time理論性周期時(shí)間th