分公司經(jīng)理求職英文簡歷表格

1、分公司經(jīng)理求職英文簡歷表格用人單位在招聘期間也會收取到大量的個人簡歷，求職 者也需要了解在職場中擊敗競爭對手的方式，比如說利用個 人簡歷來擊敗對手。那么，求職者又該如何利用個人簡歷擊 敗競爭對手呢在求職的過程中個人簡歷起到怎樣的作用，在競爭方面 又能起到怎樣的作用，這是更好利用個人簡歷的來在競爭中 為自己加分，進而才能在有效的擊敗競爭對手。在編寫個人 簡歷之前，也要根據(jù)個人簡歷的作用，來從中領(lǐng)悟到個人簡 歷的競爭力包括有哪些方面，像是個人簡歷整體外在形象、 個人簡歷的基本內(nèi)容，還有個人簡歷中所突出的重點部分等 等，這些都是可以作為競爭優(yōu)勢。利用個人簡歷來擊敗競爭對手，簡單來說就是通過個人 簡歷

2、來順利的獲得求職面試的機會，從而來提高求職成功率。 在這里個人簡歷能夠順力的通過篩選，也就是人通過其高品 質(zhì)的簡歷效果。編寫出高質(zhì)量的個人簡歷，一來要能夠的明 確的指導(dǎo)什么樣的個人簡歷更具有吸引力，二來要學(xué)習(xí)個人 簡歷的寫作技巧，尤其是在語言的使用方面。Name:fwdqSex：Date of Birth：Hukou：Residency：Work Experience：Current Salary：Tel：Email：Career ObjectiveDesired Industry：,Science/Research ,GovElectronics/Semiconductor/ICernmen

3、t ,Others ,Testing,CertificationDesiredPosition：Senior HardwareEngineer ,SemiconductorTechnology, Branch Office Manager ,ChiefRepresentative ,ResearchSpecialist StaffDesiredaddressShanghai ,Hongkong ,Beijing,Taiwan ,MacaoDesiredSalary：NegotiableWorkExperienceXX/06 Present*CompanyIndustry:Electronics

4、/Semiconductor/ICIntel Flash EngineeringDepartment IndividualContributorResponsibilities：I have been working in Intel Flash Assembly Test EngineeringDepartment as an Individual Contributor since June ofXX.Being Leader of ATEYield team, I have been working with the teammembers to improve the products

5、 yield. Our efforts are paid off:yield of year XX has been dramatically increased than that of yearXX.yield of all products, consecutively meets the goal.total amount of cost saving due to yield improvement is more than 1million compared with year XX. Being the Leader of Board RepairTeam in ATE, I w

6、orked with my team members, setup a set of newprocedure to replace the current one, I defined the schedule, dividedthe roles responsibilities among team members, follow up theprogress. Finally, the team has made a great cost saving of in XX.Report Directly to: Department ManagerNumber of Subordinate

7、: 14Reference: Bao PowelAchievements: Being Leader of ATE Yield team, I have beenworking with the team members to improve the products yield.Our efforts are paid off:yield of year XX has been dramatically increased than that of yearXX.yield of all products, consecutively meets the goal.total amount

8、of cost saving due to yield improvement is more than 1million compared with year XX. Being the Leader of Board RepairTeam in ATE, I worked with my team members, setup a set of newprocedure to replace the current one, I defined the schedule, dividedthe roles responsibilities among team members, follo

9、w up theprogress. Finally, the team has made a great cost saving of inXX.XX/01XX/05Intel(Shanghai) Technology Development Ltd.CompanyIndustry: Electronics/Semiconductor/ICIntel STTDChina Department Electronics Development EngineerResponsibilities：had been working in STTDChina since Jan XX to May XX

10、as asenior module engineer.that time, as a main contributor of this project, we succeeded indeveloping a set of MASSIVELY PARALLEL CLASS TESTequipment, which is able to test more than 6700 units in one time.Report Directly to: Hopman MarkNumber of Subordinate:14Reference: Bao PowelReason for Leaving

11、:I was transferred toIntel(Shanghai)Products Ltd.Company due totheinternalreorganization in June of XX.Achievements: Asa main contributorofSTTDChinadepartment, I cowork with my colleagues to succeed in developing aset of MASSIVELY PARALLEL CLASS TEST equipment, which isable to test more than 6700 un

12、its in one cycle.XX/05XX/01Nanyang University of Science TechnologyIndustry:Electronics/Semiconductor/ICElectronics ElectricalEngineeringDepartmentResearch FellowResponsibilities：work in ElectronicsElectricalEngineeringDepartment of NanyangUniversityof ScienceTechnology as a Research Fellow.majored

13、at Gate Oxide Reliability Research in the duration.Report Directly to: Professor Pey Kin LeohSubordinate: 3Reference: Patrick LowReason for Leaving: I completed the project which I undertook bymyself, and want to do more challenging job.Achievements: In less than one year, I made a lot of experiment

14、sand acquired the wonderful data for the project by myself.ProjectExperienceXX/01PresentAssembly NPI (New ProductIntroduction)Project Description: To introduce more products intoIntel Flash Assembly factory, I join Assembly NPI team and work asthe team leader. I coordinate with IE, Planner, Marketin

15、g guy andEngineer to select new product items, do demo in factory, and thenqualify it.Responsibility: I am working as NPI Team leader and coordinate allteam members, define the NPI candidate, make Assembly buildplan, follow up the /01XX/12Marginal Electrical BoardsRescueProject Description: To rescu

16、e some electrical boards oftesting equipment, a Task Force team was built up and led by me.We categorized each kind of board, made historical failure analysison each kind of board and around million dollars was saved finally.Responsibility: Being the team leader, I took the job of data analysis,defi

17、ne each members role, make program plan, coordinate eachteam member and follow up the /10XX/05Optimization thecurrent Test Process Order for Flash MemoryProject Description:To simplify the current Test procedure and enhance the workingefficiency, a Task Force team has been called and started by me.R

18、esponsibility: Being the Project leader, I take the mainresponsibility, such as, design, plan, organize and /05XX/12TestYield of Flash memory ImprovementProject Description: To improvethe test yield of different products, a Task Force team was built upand led by me. Being the team leader, I worked w

19、ith all teammembers to dig out the failure root cause for each product, definedaction taken plan for each emergency case, coordinated each teammember and make proactive plan to avoided unexpected thingshappen. Responsibility: Being the team leader of Improving TestYield, coordinate each team member,

20、 make program plan andfollow up.Education and Training XX/05XX/01NanyangUniversity of Science Technology Microelectronics DoctorateIworked in Nan yang University of Science Technology as aResearch Fellow. I major at Gate oxide Reliability research in the/03XX/03Seoul National University of Korea Mic

21、roelectronicsOthersI had been working in National Physical Lab of SeoulNational University in Korea since March of XX to March of XX as aPostdoctor. WhereI unhook the project of research development of CarbonNan tubeBiosensor. And only after one year, an EIS sensor based on CMOStechnology has been successfully produced. And one SCI paperabout it has been published in Semiconductor Science and /03XX/03Shanghai Institute of Microsystemsand InformationTechnology，Chinese Academy of SciencesInformationTechnology Doctorate1998/09XX/03NanjingUniversity of Science Technology Material Science and