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1、精品半導(dǎo)體一些術(shù)語(yǔ)的中英文對(duì)照離子注入機(jī)ion implanterLSS 理論Lindhand Scharff and Schiott theory又稱“林漢德-斯卡夫 - 斯高特理論” 。溝道效應(yīng)channeling effect射程分布range distribution深度分布depth distribution投影射程projected range阻止距離stopping distance阻止本領(lǐng)stopping power標(biāo)準(zhǔn)阻止截面standard stopping cross section退火annealing感謝下載載精品激活能activation energy等溫退火iso

2、thermal annealing激光退火laser annealing應(yīng)力感生缺陷stress-induced defect擇優(yōu)取向preferred orientation制版工藝mask-making technology圖形畸變pattern distortion初縮first minification精縮final minification母版master mask鉻版chromium plate感謝下載載精品干版dry plate乳膠版emulsion plate透明版see-through plate高分辨率版high resolution plate, HRP超微粒干版plat

3、e for ultra-microminiaturization掩模mask掩模對(duì)準(zhǔn)mask alignment對(duì)準(zhǔn)精度alignment precision光刻膠photoresist又稱“光致抗蝕劑” 。負(fù)性光刻膠negative photoresist正性光刻膠positive photoresist感謝下載載精品無(wú)機(jī)光刻膠inorganic resist多層光刻膠multilevel resist電子束光刻膠electron beam resistX 射線光刻膠X-ray resist刷洗scrubbing甩膠spinning涂膠photoresist coating后烘postbak

4、ing光刻photolithographyX 射線光刻X-ray lithography電子束光刻electron beam lithography感謝下載載精品離子束光刻ion beam lithography深紫外光刻deep-UV lithography光刻機(jī)mask aligner投影光刻機(jī)projection mask aligner曝光exposure接觸式曝光法contact exposure method接近式曝光法proximity exposure method光學(xué)投影曝光法optical projection exposure method電子束曝光系統(tǒng)electron

5、beam exposure system分步重復(fù)系統(tǒng)step-and-repeat system顯影development感謝下載載精品線寬linewidth去膠stripping of photoresist氧化去膠removing of photoresist by oxidation等離子體去膠removing of photoresist by plasma刻蝕etching干法刻蝕dry etching反應(yīng)離子刻蝕reactive ion etching,RIE各向同性刻蝕isotropic etching各向異性刻蝕anisotropic etching反應(yīng)濺射刻蝕reactive

6、 sputter etching離子銑ion beam milling感謝下載載phosphorosilicate glass精品又稱“離子磨削” 。等離子體刻蝕plasma etching鉆蝕undercutting剝離技術(shù)lift-off technology又稱“浮脫工藝” 。終點(diǎn)監(jiān)測(cè)endpoint monitoring金屬化metallization互連interconnection多層金屬化multilevel metallization電遷徙electromigration回流reflow磷硅玻璃感謝下載載精品硼磷硅玻璃boron-phosphorosilicate glass鈍

7、化工藝passivation technology多層介質(zhì)鈍化multilayer dielectric passivation劃片scribing電子束切片electron beam slicing燒結(jié)sintering印壓indentation熱壓焊thermocompression bonding熱超聲焊thermosonic bonding冷焊cold welding點(diǎn)焊spot welding感謝下載載精品球焊ball bonding楔焊wedge bonding內(nèi)引線焊接inner lead bonding外引線焊接outer lead bonding梁式引線beam lead裝架

8、工藝mounting technology附著adhesion封裝packaging金屬封裝metallic packaging陶瓷封裝ceramic packaging扁平封裝flat packaging感謝下載載精品塑封plastic package玻璃封裝glass packaging微封裝micropackaging又稱“微組裝” 。管殼package管芯die引線鍵合lead bonding引線框式鍵合lead frame bonding帶式自動(dòng)鍵合tape automated bonding, TAB激光鍵合laser bonding超聲鍵合ultrasonic bonding感謝

9、下載載精品紅外鍵合infrared bonding微電子辭典Abrupt junction突變結(jié) Accelerated testing加速實(shí)驗(yàn)Acceptor受主 Acceptor atom受主原子Accumulation積累、堆積Accumulating contact積累接觸Accumulation region積累區(qū) Accumulation layer積累層Active region有源區(qū) Active component有源元Active device有源器件 Activation激活A(yù)ctivation energy激活能Active region有源(放大)區(qū)Admittanc

10、e導(dǎo)納 Allowed band允帶Alloy-junction device合金結(jié)器件Aluminum(Aluminium)鋁Aluminum oxide鋁氧化物 Aluminum passivation鋁鈍化Ambipolar雙極的 Ambient temperature環(huán)境溫度Amorphous無(wú)定形的,非晶體的Amplifier功放 擴(kuò)音器放大器Analogue(Analog) comparator模擬比較器 Angstrom埃Anneal退火 Anisotropic各向異性的Anode陽(yáng)極 Arsenic (AS)砷Auger 俄歇 Auger process俄歇過(guò)程Avalanch

11、e雪崩 Avalanche breakdown雪崩擊穿Avalanche excitation雪崩激發(fā)感謝下載載精品Background carrier本底載流子Background doping本底摻雜Backward反向Backward bias反向偏置Ballasting resistor整流電阻Ball bond球形鍵合Band能帶Band gap能帶間隙Barrier勢(shì)壘Barrier layer勢(shì)壘層Barrier width勢(shì)壘寬度Base基極Base contact基區(qū)接觸Base stretching基區(qū)擴(kuò)展效應(yīng)Base transit time基區(qū)渡越時(shí)間Base tran

12、sport efficiency基區(qū)輸運(yùn)系數(shù)Base-width modulation基區(qū)寬度調(diào)制Basis vector基矢Bias偏置Bilateral switch雙向開(kāi)關(guān)Binary code二進(jìn)制代碼Binary compound semiconductor二元化合物半導(dǎo)體Bipolar雙極性的Bipolar Junction Transistor (BJT)雙極晶體管Bloch布洛赫Blocking band阻擋能帶Blocking contact阻擋接觸Body - centered體心立方Body-centred cubic structure體立心結(jié)構(gòu)Boltzmann波爾茲

13、曼Bond鍵、鍵合Bonding electron價(jià)電子Bonding pad鍵合點(diǎn)Bootstrap circuit自舉電路Bootstrapped emitter follower自舉射極跟隨器Boron硼感謝下載載精品Borosilicate glass硼硅玻璃Boundary condition邊界條件Bound electron束縛電子Breadboard模擬板、實(shí)驗(yàn)板Break down擊穿Break over轉(zhuǎn)折Brillouin布里淵Brillouin zone布里淵區(qū)Built-in內(nèi)建的Build-in electric field內(nèi)建電場(chǎng)Bulk體 / 體內(nèi)Bulk ab

14、sorption體吸收Bulk generation體產(chǎn)生Bulk recombination體復(fù)合Burn - in老化 Burn out燒毀Buried channel埋溝Buried diffusion region隱埋擴(kuò)散區(qū)Can外殼Capacitance電容Capture cross section俘獲截面Capture carrier俘獲載流子Carrier載流子、載波Carry bit進(jìn)位位Carry-in bit進(jìn)位輸入Carry-out bit進(jìn)位輸出Cascade級(jí)聯(lián)Case 管殼Cathode陰極Center中心Ceramic陶瓷(的)Channel溝道Channel b

15、reakdown溝道擊穿Channel current溝道電流Channel doping溝道摻雜Channel shortening溝道縮短感謝下載載精品Channel width溝道寬度Characteristic impedance特征阻抗Charge電荷、充電Charge-compensation effects電荷補(bǔ)償效應(yīng)Charge conservation電荷守恒Charge neutrality condition電中性條件Charge drive/exchange/sharing/transfer/storage電荷驅(qū)動(dòng) / 交換 / 共享 / 轉(zhuǎn)移 / 存儲(chǔ)Chemmica

16、l etching化學(xué)腐蝕法 Chemically-Polish化學(xué)拋光Chemmically-Mechanically Polish (CMP)化學(xué)機(jī)械拋光 Chip芯片Chip yield 芯片成品率Clamped 箝位Clamping diode箝位二極管 Cleavage plane解理面Clock rate 時(shí)鐘頻率Clock generator時(shí)鐘發(fā)生器Clock flip-flop時(shí)鐘觸發(fā)器 Close-packed structure密堆積結(jié)構(gòu)Close-loop gain閉環(huán)增益 Collector集電極Collision 碰撞 Compensated OP-AMP補(bǔ)償運(yùn)放C

17、ommon-base/collector/emitter connection共基極 / 集電極 / 發(fā)射極連接Common-gate/drain/source connection共柵 / 漏/ 源連接Common-mode gain共模增益 Common-mode input共模輸入Common-mode rejection ratio (CMRR)共模抑制比Compatibility兼容性 Compensation補(bǔ)償Compensated impurities補(bǔ)償雜質(zhì)Compensated semiconductor補(bǔ)償半導(dǎo)體Complementary Darlington circu

18、it互補(bǔ)達(dá)林頓電路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)互補(bǔ)金屬氧化物半導(dǎo)體場(chǎng)效應(yīng)晶體管感謝下載載精品Complementary error function余誤差函數(shù)Computer-aideddesign(CAD)/test(CAT)/manufacture(CAM)計(jì)算機(jī)輔助設(shè)計(jì)/測(cè)試/ 制造Compound Semiconductor化合物半導(dǎo)體Conductance電導(dǎo)Conduction band (edge)導(dǎo)帶 (底 ) Conduction level/state導(dǎo)帶態(tài)Cond

19、uctor導(dǎo)體Conductivity電導(dǎo)率Configuration組態(tài)Conlomb庫(kù)侖Conpled Configuration Devices結(jié)構(gòu)組態(tài) Constants物理常數(shù)Constant energy surface等能面 Constant-source diffusion恒定源擴(kuò)散Contact接觸 Contamination治污Continuity equation連續(xù)性方程Contact hole接觸孔Contact potential接觸電勢(shì)Continuity condition連續(xù)性條件Contra doping反摻雜 Controlled受控的Converter

20、轉(zhuǎn)換器 Conveyer傳輸器Copper interconnection system銅互連系統(tǒng) Couping耦合Covalent共階的 Crossover跨交Critical臨界的 Crossunder穿交Crucible坩堝Crystal defect/face/orientation/lattice晶體缺陷 / 晶面 / 晶向 / 晶格Current density電流密度Curvature曲率感謝下載載精品Cut off截止 Current drift/dirve/sharing電流漂移 / 驅(qū)動(dòng) / 共享Current Sense電流取樣Curvature彎曲Custom int

21、egrated circuit定制集成電路Cylindrical柱面的Czochralshicrystal直立單晶Czochralski technique切克勞斯基技術(shù)(Cz 法直拉晶體J)Dangling bonds懸掛鍵Dark current暗電流Dead time空載時(shí)間Debye length德拜長(zhǎng)度De.broglie德布洛意Decderate減速Decibel (dB)分貝 Decode譯碼Deep acceptor level深受主能級(jí)Deep donor level深施主能級(jí)Deep impurity level深度雜質(zhì)能級(jí)Deep trap深陷阱Defeat缺陷Degen

22、erate semiconductor簡(jiǎn)并半導(dǎo)體Degeneracy簡(jiǎn)并度Degradation退化Degree Celsius(centigrade) /Kelvin攝氏 / 開(kāi)氏溫度Delay延遲Density密度Density of states態(tài)密度Depletion耗盡Depletion approximation耗盡近似Depletion contact耗盡接觸Depletion depth耗盡深度Depletion effect耗盡效應(yīng)感謝下載載精品Depletion layer耗盡層 Depletion MOS耗盡 MOSDepletion region耗盡區(qū) Deposite

23、d film淀積薄膜Deposition process淀積工藝Design rules設(shè)計(jì)規(guī)則Die 芯片(復(fù)數(shù) dice ) Diode二極管Dielectric介電的 Dielectric isolation介質(zhì)隔離Difference-mode input差模輸入 Differential amplifier差分放大器Differential capacitance微分電容 Diffused junction擴(kuò)散結(jié)Diffusion擴(kuò)散 Diffusion coefficient擴(kuò)散系數(shù)Diffusion constant擴(kuò)散常數(shù) Diffusivity擴(kuò)散率Diffusion cap

24、acitance/barrier/current/furnace擴(kuò)散電容 /勢(shì)壘/電流/爐Digital circuit數(shù)字電路 Dipole domain偶極疇Dipole layer偶極層 Direct-coupling直接耦合Direct-gap semiconductor直接帶隙半導(dǎo)體Direct transition直接躍遷Discharge放電Discrete component分立元件Dissipation耗散Distribution分布Distributed capacitance分布電容Distributed model分布模型Displacement位移Dislocatio

25、n位錯(cuò)Domain疇 Donor施主Donor exhaustion施主耗盡Dopant摻雜劑Doped semiconductor摻雜半導(dǎo)體Doping concentration摻雜濃度感謝下載載精品Double-diffusive MOS(DMOS)雙擴(kuò)散 MOS.Drift漂移Drift field漂移電場(chǎng)Drift mobility遷移率Dry etching干法腐蝕Dry/wet oxidation干/ 濕法氧化Dose劑量Duty cycle工作周期Dual-in-line package(DIP ) 雙列直插式封裝Dynamics動(dòng)態(tài)Dynamic characteristic

26、s動(dòng)態(tài)屬性Dynamic impedance動(dòng)態(tài)阻抗Early effect厄利效應(yīng)Early failure早期失效Effective mass有效質(zhì)量Einstein relation(ship)愛(ài)因斯坦關(guān)系Electric Erase Programmable Read Only Memory(E2PROM)一次性電可擦除只讀存儲(chǔ)器Electrode 電極 Electrominggratim電遷移Electron affinity電子親和勢(shì) Electronic -grade電子能Electron-beam photo-resist exposure光致抗蝕劑的電子束曝光Electron

27、 gas電子氣 Electron-grade water電子級(jí)純水Electron trapping center電子俘獲中心Electron Volt (eV)電子伏Electrostatic靜電的 Element 元素 / 元件 / 配件Elemental semiconductor元素半導(dǎo)體 Ellipse橢圓Ellipsoid 橢球 Emitter發(fā)射極感謝下載載精品Emitter-coupled logic發(fā)射極耦合邏輯Emitter-coupled pair發(fā)射極耦合對(duì)Emitter follower射隨器 Empty band空帶Emitter crowding effect發(fā)射

28、極集邊(擁擠)效應(yīng)Endurance test =life test壽命測(cè)試 Energy state能態(tài)Energy momentum diagram能量 - 動(dòng)量 (E-K) 圖 Enhancement mode增強(qiáng)型模式Enhancement MOS增強(qiáng)性 MOS Entefic (低 )共溶的Environmental test環(huán)境測(cè)試 Epitaxial外延的Epitaxial layer外延層 Epitaxial slice外延片Expitaxy外延 Equivalent curcuit等效電路Equilibrium majority /minority carriers平衡多數(shù)

29、/ 少數(shù)載流子Erasable Programmable ROM (EPROM)可搽取(編程)存儲(chǔ)器Error function complement余誤差函數(shù)Etch 刻蝕 Etchant刻蝕劑Etching mask抗蝕劑掩模Excess carrier過(guò)剩載流子Excitation energy激發(fā)能 Excited state激發(fā)態(tài)Exciton激子 Extrapolation外推法Extrinsic非本征的Extrinsic semiconductor雜質(zhì)半導(dǎo)體Face - centered面心立方Fall time下降時(shí)間Fan-in扇入Fan-out扇出Fast recovery

30、快恢復(fù)Fast surface states快界面態(tài)Feedback反饋Fermi level費(fèi)米能級(jí)感謝下載載精品Fermi-Dirac Distribution費(fèi)米 - 狄拉克分布Femi potential費(fèi)米勢(shì)Fick equation菲克方程(擴(kuò)散)Field effect transistor場(chǎng)效應(yīng)晶體管Field oxide場(chǎng)氧化層 Filled band滿帶Film 薄膜 Flash memory閃爍存儲(chǔ)器Flat band平帶 Flat pack扁平封裝Flicker noise閃爍(變)噪聲 Flip-flop toggle觸發(fā)器翻轉(zhuǎn)Floating gate浮柵 Fluo

31、ride etch氟化氫刻蝕Forbidden band禁帶 Forward bias正向偏置Forward blocking /conducting正向阻斷 / 導(dǎo)通Frequency deviation noise頻率漂移噪聲Frequency response頻率響應(yīng)Function 函數(shù)Gain增益Gallium-Arsenide(GaAs)砷化鉀Gamy ray r射線Gate門、柵、控制極Gate oxide柵氧化層Gauss ( ian ) 高斯Gaussian distribution profile高斯摻雜分布Generation-recombination產(chǎn)生 -復(fù)合Geo

32、metries幾何尺寸 Germanium(Ge)鍺Graded 緩變的 Graded (gradual) channel緩變溝道Graded junction緩變結(jié) Grain晶粒Gradient梯度 Grown junction生長(zhǎng)結(jié)Guard ring保護(hù)環(huán) Gummel-Poom model葛謀 -潘 模型感謝下載載精品Gunn - effect狄氏效應(yīng)Hardened device輻射加固器件 Heat of formation形成熱Heat sink 散熱器、熱沉 Heavy/light hole band重/ 輕 空穴帶Heavy saturation重?fù)诫s Hell - eff

33、ect霍爾效應(yīng)Heterojunction異質(zhì)結(jié) Heterojunction structure異質(zhì)結(jié)結(jié)構(gòu)Heterojunction Bipolar Transistor( HBT )異質(zhì)結(jié)雙極型晶體High field property高場(chǎng)特性High-performance MOS.( H-MOS)高性能 MOS. Hormalized歸一化Horizontal epitaxial reactor臥式外延反應(yīng)器 Hot carrior熱載流子Hybrid integration混合集成Image - force鏡象力 Impact ionization碰撞電離Impedance阻抗 I

34、mperfect structure不完整結(jié)構(gòu)Implantation dose注入劑量 Implanted ion注入離子Impurity雜質(zhì) Impurity scattering雜志散射Incremental resistance電阻增量(微分電阻)In-contact mask接觸式掩模Indium tin oxide (ITO)銦錫氧化物Induced channel感應(yīng)溝道Infrared 紅外的 Injection注入Input offset voltage輸入失調(diào)電壓Insulator絕緣體Insulated Gate FET(IGFET)絕緣柵 FET Integrated

35、injection logic集成注入邏輯Integration集成、積分Interconnection互連感謝下載載精品Interconnection time delay互連延時(shí)Interdigitated structure交互式結(jié)構(gòu)Interface界面Interference干涉International system of unions國(guó)際單位制Internally scattering谷間散射Interpolation內(nèi)插法Intrinsic本征的Intrinsic semiconductor本征半導(dǎo)體Inverse operation反向工作Inversion反型Inverte

36、r倒相器Ion離子 Ion beam離子束Ion etching離子刻蝕Ion implantation離子注入Ionization電離Ionization energy電離能Irradiation輻照 Isolation land隔離島Isotropic各向同性Junction FET(JFET)結(jié)型場(chǎng)效應(yīng)管Junction isolation結(jié)隔離Junction spacing結(jié)間距Junction side-wall結(jié)側(cè)壁Latch up閉鎖 Lateral橫向的Lattice晶格Layout版圖Lattice binding/cell/constant/defect/distorti

37、on晶格結(jié)合力 / 晶胞 / 晶格 / 晶格常熟/ 晶格缺陷 / 晶格畸變Leakage current(泄)漏電流Level shifting電平移動(dòng)Life time壽命 linearity線性度感謝下載載精品Linked bond共價(jià)鍵Liquid Nitrogen液氮Liquid phase epitaxial growth technique液相外延生長(zhǎng)技術(shù)Lithography光刻Light Emitting Diode(LED)發(fā)光二極管Load line or Variable負(fù)載線Locating and Wiring布局布線Longitudinal縱向的Logic swin

38、g邏輯擺幅Lorentz洛淪茲Lumped model集總模型Majority carrier多數(shù)載流子 Mask 掩膜板,光刻板Mask level掩模序號(hào) Mask set掩模組Mass - action law質(zhì)量守恒定律Master-slave D flip-flop主從 D 觸發(fā)器Matching匹配 Maxwell 麥克斯韋Mean free path平均自由程 Meandered emitter junction梳狀發(fā)射極結(jié)Mean time before failure (MTBF)平均工作時(shí)間Megeto - resistance磁阻 Mesa 臺(tái)面MESFET-Metal

39、Semiconductor金屬半導(dǎo)體 FETMetallization金屬化 Microelectronic technique微電子技術(shù)Microelectronics微電子學(xué) Millen indices密勒指數(shù)Minority carrier少數(shù)載流子 Misfit 失配Mismatching失配 Mobile ions可動(dòng)離子Mobility 遷移率 Module 模塊Modulate調(diào)制 Molecular crystal分子晶體Monolithic IC單片 IC MOSFET金屬氧化物半導(dǎo)體場(chǎng)效應(yīng)晶體管感謝下載載精品Mos. Transistor(MOST )MOS.晶體管Mul

40、tiplication倍增Modulator調(diào)制Multi-chip IC多芯片 ICMulti-chip module(MCM)多芯片模塊Multiplication coefficient倍增因子Naked chip 未封裝的芯片(裸片)Negative feedback負(fù)反饋Negative resistance負(fù)阻 Nesting套刻N(yùn)egative-temperature-coefficient負(fù)溫度系數(shù)Noise margin噪聲容限Nonequilibrium非平衡 Nonrolatile非揮發(fā)(易失)性Normally off/on常閉 / 開(kāi) Numerical analys

41、is數(shù)值分析Occupied band滿帶 Officienay功率Offset 偏移、失調(diào)On standby待命狀態(tài)Ohmic contact歐姆接觸Open circuit開(kāi)路Operating point工作點(diǎn)Operating bias工作偏置Operational amplifier (OPAMP)運(yùn)算放大器Optical photon =photon光子 Optical quenching光猝滅Optical transition光躍遷Optical-coupled isolator光耦合隔離器Organic semiconductor有機(jī)半導(dǎo)體 Orientation晶向、定向Outlin

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