品質(zhì)管理英文名詞

1、Accuracy準(zhǔn)確度Active主動Action評價.處理Activity 活動Add加Addition rule加法運算規(guī)則Analysis Covarianee 協(xié)方差分析Analysis of Varianee 方差分析Appraisal Variation 評價變差A(yù)pproved 承認(rèn)ASQC美國質(zhì)量學(xué)會Attribute計數(shù)值A(chǔ)udit審核Automatic database recovery 數(shù)據(jù)庫錯誤自動回復(fù)Average平均數(shù)bala nee 平衡Bala nee sheet資產(chǎn)負(fù)債對照表Binomial二項分配Body機構(gòu)Brain storm ing Tech niq

2、ues 腦力風(fēng)暴法Busi ness Systems Pla nning 企業(yè)系統(tǒng)規(guī)劃Cable電纜Capability 能力Cause and Effect matrix 因果圖.魚骨圖Center line 中心線check檢杳Check Sheets 檢杳表Chi-square Distributi on 卡方分布Clutch spring離合器彈簧Coining壓印加工Common cause共同原因Complaint 投訴Compound factor 調(diào)合因素Concept新概念Condenser聚光鏡Conformity 合格Connection 關(guān)聯(lián)Consumer'

3、s risk消費者之風(fēng)險Control 控制Control characteristic 管制特性Control chart 管制圖Control plan管制計劃Correction 纟糾正Correlation Methods 相關(guān)分析法Cost down降低成本CPI: continuouse Process Improvement 連續(xù)工序改善Creep漸變Cross Tabulati on Tables 交 * 表CS: customer Sevice 客戶中心Cushion 緩沖Customer 顧客DSA: Defects Analysis System 缺陷分析系統(tǒng)Data數(shù)據(jù)

4、Data Collection 數(shù)據(jù)收集Data concentrator資料集中緩存器DCC: Docume nt Con trol Ce nter 文控中心Decision決策.判定Defects per unit單位缺點數(shù)Description 扌苗述Detection難檢度Device裝置Digital 數(shù)字Do執(zhí)行DOE: Desig n of Experime nts 實驗設(shè)計Element 兀素Else否則Engineering recbnology 工程技術(shù)Entropy 函數(shù)Environmental 環(huán)境Equipment 設(shè)備Estimated accumulative

5、frequency 計算估計累計數(shù)EV: Equipment Variation 設(shè)備變異Event事件External Failure外部失效，外部缺陷FA: Failure Analysis 壞品分析Fact control事實管理Fatique 疲勞FMEA: Failure Mode and Effect an alysis失效模式與效果分析FPY合格率FQA: Fi nal Quality Assura nee 最終品質(zhì)保證FQC: Fi nal Quality con trol 最終品質(zhì)控制Full-steer完全轉(zhuǎn)向function 職能Gauge system量測系統(tǒng)Grade

6、等級Gum-roll橡皮滾筒Health meter 體重計Heat press沖壓粘著Histogram直方圖Hi-tech高科技hypergeometric超幾何分酉己hysteresis磁滯現(xiàn)象Improvement 改善Inductanee 電感Information 信息In itial review 先期審查Inspection 檢驗Internal Failure內(nèi)部失效，內(nèi)部缺陷IPQC: In Process Quality Co ntrol 制程品質(zhì)控制IQC: In commi ng Quality Co ntrol來料品質(zhì)控制IS Intern ati onal Org

7、ani zatio n for Stan dardizati on國際標(biāo)準(zhǔn)組織Law of large number 大數(shù)法貝ULink連接LCL: Lower Control limit管制下限LQC: Line Quality Co ntrol生產(chǎn)線品質(zhì)控制LSL: Lower Size Limit規(guī)格下限Machine 機械Man age管理Materials 物料Measurement 量測Median中位數(shù)Miss feed 漏送Module,sub-system,sub-unit 單位Momentum原動力Monte garlo method 原子核分裂熱運動法MSA: Measu

8、reme nt System An alysis 量測系統(tǒng)分析Multiplication rule 乘法運算規(guī)則NIST美國:標(biāo)準(zhǔn)技術(shù)院Normal常態(tài)分布Occurrenee 發(fā)生率On .off system 開,關(guān)系統(tǒng)Operati on In struct ion 作業(yè)指導(dǎo)書Organization 組織Parameter 參數(shù)Parto柏拉圖Parts零件Parts per million 不良率Passive消極地，被動地Plan計劃Pulse脈沖Policy方針Population 群體Power力量，能源PQA: Process Quality Assuranee 制程品質(zhì)保

9、證Practice 實務(wù)Preeision精密度preemptive先占式多任務(wù)Pressure 壓縮Prevention 預(yù)防Probability 機率Probability den sity fun ction 機率密度函數(shù)Procedure 流程Process 過程Process capability analysis 制程能力分析圖Process control and process capability 制程管制與制程能力Producer s risk生產(chǎn)者之風(fēng)險Product 產(chǎn)品Product ion 生產(chǎn)Program 方案Projects 項目QA: Quality As

10、sura nee 品質(zhì)保證QC: Quality Control 品質(zhì)控制QE: Quality Engin eeri ng 品質(zhì)工程QFD: Quality Fun ction Desg in 品質(zhì)機能展開Quality 質(zhì)量Quality manual 品質(zhì)手冊Quality policy 品質(zhì)政策Random experiment 隨機試驗Random numbers 隨機數(shù)Range全距Record記錄Reflow回流Reject拒收Repair返修Repeatusility 再現(xiàn)性Reproducibility 再生性Requirement 要求Residual 誤差Resp ons

11、e 響應(yīng)Responsibilities 職責(zé)Review評審Reword返工Robust ness 穩(wěn)健性Rolled yield 直通率RPN: Risk Priority Number 風(fēng)險系數(shù)sample抽樣,樣本Sample space樣本空間Sampling with replacement 放回扌由樣Sampling without replacement 不放回扌由樣Scatter diagram散布圖分析Scrap報廢Screw螺旋Severity嚴(yán)重度Shot-preening微粒沖擊平面法Simple random sampling 簡單隨機取樣Size規(guī)格SL: Siz

12、e Line 規(guī)格中心線Slip滑動Stratified random sampling 分層隨機抽樣SOP: Sta ndard Operatio n Procedure 標(biāo)準(zhǔn)作業(yè)書SPC: Statistical Process Control 統(tǒng)計制程管制Special cause特殊原因Specification 規(guī)范SQA: Source(Supplier) Quality Assura nee 供貨商品質(zhì)保證Stage sampli ng分段隨機抽樣Standard Deviation 標(biāo)準(zhǔn)差Sum of squares 統(tǒng)計表supplier平方和System供方systemat

13、ic sampling 系統(tǒng),體系Statistical tables 系統(tǒng)抽樣Taguchi-method 田口方法Technical committees 技術(shù)委員會Test piece測試片Theory原理Time stamp時間戳印Time-lag 延遲Title標(biāo)題Torque轉(zhuǎn)矩Total求和TQC: Total Quality Con trol 全面品質(zhì)控制TQM: Total Quality Man ageme nt 全面品質(zhì)管理Traceability 追溯Training 培訓(xùn)Transaction processing and logging 交易處理Trouble 困擾

14、Up and down 上和下UCL: Upper Control Limit管制上限USL: Upper Size Limit 規(guī)格上限Validation 確認(rèn)Variable計量值Varianee變異禾口Vector向量Verifieation 驗證Version 版本VOC: voice of Customer 客戶需求VOE: V oiee of Engineer 工程需求GRR Gauge Repeatability Reproducibility 量測地再現(xiàn)性與再生性FPI First Piece In spection首件檢查Sampling without replaceme

15、nt 不放回扌由樣SQA: Source(Supplier) Quality Audit 供貨商品質(zhì)審核1. QC : quality con trol質(zhì)量管理2. IQC : in comi ng quality con trol 進料質(zhì)量管理3. OQC : output quality con trol出貨質(zhì)量管理4.PQC : process quality control 制程質(zhì)量管理也稱 IPQC : in process quality control .5. AQL : acceptable quality level允收標(biāo)準(zhǔn)6.CQA: customer quality as

16、sura nee客戶品質(zhì)保證7. MA : major defeat主要缺點8. MI : minor defeat次要缺點9. CR :critical defeat關(guān)鍵缺點10. SMT : surface mounting technology 表面粘貼技術(shù)11. SMD :surface mou nting device 表面粘貼程序SMC : surface mounting component 表面粘貼組件12.ECN : en gi neeri ng cha nge notice工程變更通知13.DCN : desig n cha nge notice 設(shè)計變更通知14.PCB

17、: printed circuit board 印刷電路板15.PCBA : printed circuit board assembly 裝配印刷電路板16. BOM : bill of material材料清單17. BIOS : basically in put and output system 基本輸入輸出系統(tǒng)18. MIL-STD-105E :美國陸軍標(biāo)準(zhǔn)，也稱單次抽樣計劃.19. ISO : in ternatio nal sta ndard orga ni zatio n 國際標(biāo)準(zhǔn)化組織20. DRAM:內(nèi)存條21.Polarity :電性22. Icicles :錫尖23.

18、No n-wetti ng :空焊24. Short circuit :短路25. Missing component : 缺件26. Wrong comp onent :錯件27 . Excess comp onent :多件28. I nsufficie nt solder :錫少29 . Excessive solder :錫多30. Solder residue:錫渣31. Solder ball :錫球32. Tombst one :墓碑33 . Sideward :側(cè)立34. Comp onent damage :零件破損35. Gold fin ger:金手指36. SOP :

19、standard operation process 標(biāo)準(zhǔn)操作流程37. SIP : sta ndard in spection process 標(biāo)準(zhǔn)檢驗流程38 .The good and not good segregation :良品和不良品區(qū)分39. OBW : on board writer 熸錄 BIOS40 . Simple ran dom sampli ng :簡單隨機抽樣41. Histogram :直方圖42 . Standard deviation :標(biāo)準(zhǔn)差43. CIP : Con ti nu ous improveme nt program持續(xù)改善計戈 U44. SP

20、C : Statistical process control 制程統(tǒng)制45 . Sub-contractors :分包商46. SQE: Supplier quality engin eeri ng47. Sampli ng sample :抽樣計劃48. Loader :治具49. QTS: Quality tracki ng system 質(zhì)量追查系統(tǒng)50. Debug :調(diào)試51. Spare parts:備用品52. Inven tory report for :庫存表53. Manpower/Tact estimation 工時預(yù)算54. Calibration :校驗55. S/

21、N :serial number 序號56. Corrugated pad :波紋墊57.Takeout tray:內(nèi)包裝盒58. Outer box :外包裝箱59. Vericode :檢驗碼60. Sum of square :平方和61. Range :全距62. Conductive bag :保護袋63. Preve ntive maintenance :預(yù)防性維護64. Base unit :基體65. Fixture :制具66. Probe :探針67. Host probe :主探針68. Golden card :樣本卡69. Diagnostics program :

22、診斷程序70. Frame :屏面71. L in t-free gloves :靜電手套72 .Wrist wrap :靜電手環(huán)73. Target value :目標(biāo)值74. Related departme nt :相關(guān)部門75. lifted solder浮焊76.plug hole 孔塞77. Wrong direction 極性反ponent damage or broken 零件破損79.Unmeleted solder 熔錫不良80.fluxresidue 松香未拭81.wrong label or upside down label 貝占反82. mixed parts 機種

23、混裝83. poor solder mask 綠漆不良84. oxidize零件氧化85.stand off height 浮高86. IC reverse IC 反向87.supervisor 課長88. Forman 組長89. Wl=work in structio n 作業(yè)指導(dǎo)90. B.P.V:非擦除狀態(tài)91. I nternal notificatio n:內(nèi)部聯(lián)絡(luò)單92. QP :Quality policy 質(zhì)量政策93. QT: Quality target 品質(zhì)目標(biāo)94. Trend:推移圖95.Paret柏拉圖96. UCL: Upper con trol limit 管

24、制上限97.L CL:Lower con trol limit管制下限98. CL: Center line 中心線99.R.T.Y: Rolled throughout yield 直通率100. PPM: Parts per millio n不良率101.DPU: Defects per unit 單位不良率102.Resistor:電阻103.Capacitor:電容104. Resistor array :排阻105. Capacitor array:排容106. DIODE:二極管107.SOT:三極管108. Crystal:震蕩器109.Fuse 保險絲110.Bead:電感11

25、1.Connector:聯(lián)結(jié)器112.ADM: Admi nistrati on Departme nt 行政單位113. CE: Compo nent En gi neeri ng零件工程114. CSD :Customer Service Departme nt 客戶服務(wù)部115. ID: In dustrial Desig n 工業(yè)設(shè)計116.IE: In dustrialEngin eeri ng 工業(yè)工程117. IR: In dustrialRelationship工業(yè)關(guān)系118. ME: Mechanical Engineering 機構(gòu)工程119. MIS :Managemen

26、t InformationSystem信息部120. MM: Material Management 資材121. PCC: ProjectCoordination/Control 專案協(xié)調(diào)控制122. PD: Production Department 生產(chǎn)部123. PE: Product Engineering 產(chǎn)品工程124. PM: Product Manager 產(chǎn)品經(jīng)理125. PMC: ProductionMaterial Control生產(chǎn)物料管理126. PSC: Project Support & Control 產(chǎn)品協(xié)調(diào)127.Magnesium Alloy:鎂

27、合金128. Metal Sheari ng:裁剪129.CEM:C on tract Electro nicsManufacturing 電子制造服務(wù)企業(yè) EMS: Electronics Manufacturing Services130. ERP: Enterprise Resource Planning 企業(yè)資源規(guī)劃SCM+CRM+ERP+EAI=Network direct TM links procureme nt, productio n. Logistics and sales采購，生產(chǎn)，后勤管理及市場營銷地融合EAI: En terprise applicati on In

28、tegration企業(yè)應(yīng)用系統(tǒng)整合CRM: Customer Relatio nship Pla nning 客戶服務(wù)規(guī)劃SCM : Supply chain management 供應(yīng)鏈管理131. OJT: On job trai ning 在職培訓(xùn)132.Access Time:光盤搜尋時間133. B2CEC:Busi ness to con sumer electro nic commerce企業(yè)對消費者地電子商務(wù)B2BEC:Bus in ess to bus in ess electr onic Commerce企業(yè)間地電子商務(wù)134.CCL:Copper Clad Laminat

29、e 銅箔基板135. Intranet:企業(yè)內(nèi)部通訊網(wǎng)路136. ISP: In ternet Service Provider 網(wǎng)絡(luò)服務(wù)提供者ICP: In ternet Co ntent Provider網(wǎng)絡(luò)內(nèi)容提供者137. GSM: Global System for Mobile Com mun icatio n泛歐數(shù)子式行動電話系統(tǒng)GPS:全球衛(wèi)星定位系統(tǒng)138. Home Page:網(wǎng)絡(luò)首頁139.Video Clip:影像文件140. HTML:超文標(biāo)記語言141.Domainname:網(wǎng)域名稱142. IP:網(wǎng)絡(luò)網(wǎng)域通訊協(xié)議地址143.Notebook:筆記型計算機144.

30、VR: Virtual Reality 虛擬實境145. WAP: Wireless Applicati on Protocol 無線應(yīng)用軟件協(xié)議146. LAN : Local area network 局域網(wǎng)絡(luò)WWW: World Wide Web 世域網(wǎng)WAN: Wide Area Network 廣域網(wǎng)絡(luò)147. 3C: Computer, Communication, Consumer electronic計算機，通訊，消費性電子三大產(chǎn)品地整合148.Information Supplier Highway:信息高速公路149.UPS:Uninterrupted powersyste

31、m不斷電系統(tǒng)150.Processed material:流程性材料151.Entity/ltem:實體152.Quality loop:質(zhì)量環(huán) 153.Quality losses:質(zhì)量損失154.Corrective action:糾正措施155. Preventive action:預(yù)防措施156.PDCA:Plan/Do/Check/Action計劃 / 實施 /檢查 /處理157. Integratedcircuits(IC):集成電路158. Applicati onprogram:應(yīng)用程序159. Utilities:實用程序160.Auxiliary storage/Secon

32、d storage:;輔助存儲器161.Silicon chip:硅片162Diskette drive:軟驅(qū)163.Display screen/Monitor:顯示器164.Foreground:前面165.Montherboard:母板166.Mermory board:內(nèi)存板167.Slot :插槽168.Bus:Data-bus/address-bus/Control bus:總線 /數(shù)據(jù)總線 /地址總線 /控制總線169. Plotter:繪圖170. MPC:Multimedia personal computer 多媒體171.Oscillator:振蕩器172.Automat

33、ic teller term in al:自動終端(出納)機173.Joystick port:控制端口174.VGA: VideoGraphics Array 顯示卡175.Resolution:分辨率176.Register:寄存器177.ISA: Industry Standard Architecture:工業(yè)標(biāo)準(zhǔn)結(jié)構(gòu)178.EISA: Extended IndustryArchitecture179.Adapter:適配器180.Peripheral:外部設(shè)備181.Faxmodem:調(diào)制解調(diào)器181.NIC:Network in terface card 網(wǎng)絡(luò)接口卡182. SCS

34、I: Small computer system in terface183.VESA: Video Electro nicStan dards Associati on184. SIMM: Single in-line memory module單排座存儲器模塊（內(nèi)存條）185.Casing:外箱186.Aluminum:鋁質(zhì)187.Ceramic:陶瓷地188.Platter:圓盤片189.Actuator:調(diào)節(jié)器190.Spindle:軸心191.Actuation arm:存取臂192.Default code:缺省代碼193.Auxiliary port:輔助端口194.Carria

35、ge return :回車195.L in efeed:換行196.ASCII: American Standard Code for Information Interchange197.Video analog:視頻模擬198.TTL: Transistor- Transistor logic 晶體管-晶體管邏輯電路199. Three-pro ngplug:三芯電插頭200. Female co nn ector:連接插座201.Floppy disk:軟盤202.Output level:輸出電平203.Vertical/Horizo ntal synchroni zati on:場

36、/ 行同步204.H(Horizontal)-Phase:行相位205.Compatible:兼容機2O6.Hardware Expansion Card:硬件擴充卡2O7.Buffer:緩沖208.CRM:Customer relatio nship Ma nageme nt 客戶關(guān)系管理209.WIP: Work in process半成品21O.Waiver:特別采用211.CXO 系列一CEO Chief Executive Office 首COO :Chief Operating OfficeCFO Chief Finance OfficerCBO Chief Busi ness O

37、fficerCTO Chief Techn ology OfficerCIOChief In formation OfficerCGO Chief Governme nt Officer212. NASDAQ:納斯達(dá)克證券市場NASDAQ Automated Quotati on system213.VC: Venture Capital 風(fēng)險投資214. PDA: Perso nal Date Assista nt 個人數(shù)字助理PLA: Perso nal In formation Assista nt個人信息助理215. PPAP: Adva need Product Quality Pl

38、a nning and Con trol Pla n生產(chǎn)性零組件核準(zhǔn)程序216. FMEA: Pote ntial Failure Mode and Effects An alysis失效模式與效應(yīng)分析217. MSA: Measureme nt Systems An alysis 量測系統(tǒng)分析218. QAS: Quality System Assessment 質(zhì)量系統(tǒng)評鑒219. Cusum:累計總合圖220. Overall Equipment Effectiveness 設(shè)備移動率221. Benchmarking: 競爭標(biāo)桿Analysis of motion/Ergonomics

39、 動作分析/人體工程學(xué)222. Roka Yoke 防錯法MCR: machine capability ratio機器利用率223. Mistake Proofing防呆法Taguchi methods 田口式方法224, Vertical integration 垂直整合Surveillanee 疋期追蹤審查225. EMS: Electr on ics Manu facturi ng Supply-cha in226. Cause & Effects charts 特性要因圖227. Scatter:散布圖Fool-Proof System 防呆系統(tǒng)228. VE: Value

40、Engineering 價值工程QFD: Quality FunctionDevelopment質(zhì)量機能展開229. Arrow Chart箭頭圖法Affiliate Chart 親和圖法230. PDPC: Process Decision Program ChartSystem Chart 系統(tǒng)圖法231. Relation Chart 關(guān)邊圖法 Matrix Chart 矩陣圖法232. Matrix Data An alysis 矩陣數(shù)據(jù)分析法234. Brain-storm 腦風(fēng)暴法JIT: Just In Time:及時性生產(chǎn)模擬235. Demi ng Prize:戴明獎Prot

41、otype 技術(shù)試作236. BPM: Business Process Management .業(yè)務(wù)流程管 MBO 目標(biāo)管理237. MBP:方針管理FTA:故障樹分析QSCV:服務(wù)質(zhì)量238. IPPB: Information 情況planning 策劃Programming 規(guī)劃Budget預(yù)算239. EQ: Emotion Quotient:情商IQ: Intelligenee Quotient:智商240. Implied Needs:隱含要求Specified Requirement:規(guī)定要求241. Probati on:觀察期Incoming Product release

42、d for urgent product ion 緊急放行242.Adva need quality pla nning先進地質(zhì)量策劃243. AOQ: Average Outgoi ng Quality平均檢出質(zhì)量AOQL: Average Outgoi ng Quality Limit平均檢出質(zhì)量界限244.Approved Supplier List經(jīng)核準(zhǔn)認(rèn)可地供應(yīng)商名單245.Attribute date 特征Benchmarking基準(zhǔn)點Calibration校準(zhǔn)246.C apable process 工序能力 Capability Index 工序能力指數(shù)Cap ability

43、ratio工序能力率247.CHANGE CYCLE TIME修改地時間周期Continuous improvement持續(xù)改進248. Control pla ns控制策劃Cost of quality質(zhì)量成本249. Cycle time reduction減少周期時間250. Design of experiments實驗設(shè)計Deviation / Substitution偏差 / 置換251. ESD: Electrostatic discharge靜電釋放252. EH&S: Environmental, Health, and Safely環(huán)境，健康.安全253. ESS:

44、 Environmental Stress Scree ning環(huán)境應(yīng)力篩選254. FMEA: Failure Mode Effect An alysis失誤模式效應(yīng)分析255. First Article approval產(chǎn)品地首次論證256. First pass yield一次性通過地成品率257. First sample in spection第一次樣品檢驗258. FMECA: Failure mode effect and critically analysis失誤模式，效應(yīng)及后果分析259. Gauge control 測量儀器控制260. GR&R: Gauge repeatability and reproducibility測量儀器重復(fù)性和再現(xiàn)性261. HALT: Highly Accelerated Life Test高加速壽命試驗262. HAST: Highly Accelerated Stress Test高加速應(yīng)力試驗263.