pcb板制作工藝流程介紹課件

1、HDI Manufacturing Process FlowHDI Manufacturing Process FlowPre-engineeringPattern imagingEtchingLaminatingDrillingCu platingHole pluggingPattern imagingLaminationLaser AblationMechanical drillingPattern imagingCu platingSolder MaskSurface FinishedRoutingVisual inspectionElectric testShippingPre-eng

2、ineeringPattern imagingEtchingLaminatingDrillingDesmearCu platingHole pluggingCu platingBelt SandingLaminationLaser AblationMechanical drillingCu platingPattern imagingSolder MaskGold platingRoutingElectrical testPattern imagingHole counterShippingVisual inspection* Raw material (Thin Core,Copper,Pr

3、epreg.)Raw Material : FR-4 (Difuntional,Tetrafuntional)Raw Material : FR-4 (Difuntional,Tetrafuntional)Supplier : EMC ,Nan-YaSupplier : EMC ,Nan-YaSheet size : 36Sheet size : 36”* *4848” , 40 , 40”* *4848” ,42 ,42”* *4848Core Thickness : 0.003Core Thickness : 0.003”,0.004,0.004”,0.005,0.005”,0.006,0

4、.006” 0.008 0.008”,0.010,0.010”,0.012,0.012”,0.015,0.015” 0.021 0.021”,0.031,0.031”,0.039,0.039”,0.047,0.047”Copper Foil : 1/3 oz,1/2 oz,1.0 oz,2 ozCopper Foil : 1/3 oz,1/2 oz,1.0 oz,2 ozPrepreg type : 1080,2113,2116,1506,7628,7630Prepreg type : 1080,2113,2116,1506,7628,76301.內(nèi)層基板 (THIN CORE)Laminat

5、eCopper Foil裁板裁板(Panel Size)Panel Size) COPPER FOILCOPPER FOILEpoxy GlassEpoxy GlassPhoto ResistPhoto Resist2.內(nèi)層線路製作(壓膜) (Dry Film Resist Coat)Etch Photoresist (D/F)Etch Photoresist (D/F)Photo ResistPhoto Resist3. 內(nèi)層線路製作(曝光)(Expose)A/WA/WArtworkArtwork( (底片底片) )ArtworkArtwork( (底片底片) )After ExposeAf

6、ter ExposeBefore ExposeBefore Expose4. 內(nèi)層線路製作(顯影)(Develop)Photo ResistPhoto Resist5. 內(nèi)層線路製作(蝕刻)(Etch)Photo ResistPhoto Resist6. 內(nèi)層線路製作(去膜)(Strip Resist)7.黑氧化 ( Oxide Coating)8. 疊板 (Lay-up)LAYER 2LAYER 3LAYER 4LAYER 5LAYER 1LAYER 6Layer 1Layer 1Layer 2Layer 2Layer 3Layer 3Layer 4Layer 4Copper FoilCop

7、per FoilInner LayerPrepreg(膠片)Prepreg(膠片)9. 壓合 (Lamination)典型之多層板疊板及壓合結(jié)構(gòu)典型之多層板疊板及壓合結(jié)構(gòu).COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZThin Core ,FR-4Thin Core ,FR-4prepreg prepreg COMPCOMPS0LD.S0LD.prepreg prepreg Thin Core ,FR-4Thin Core ,FR-4prepreg prepreg COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZ疊合用之鋼板疊合用之鋼板疊合用之

8、鋼板疊合用之鋼板10-1210-12層疊合層疊合壓合機(jī)之熱板壓合機(jī)之熱板壓合機(jī)之熱板壓合機(jī)之熱板COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZThin Core ,FR-4Thin Core ,FR-4prepreg prepreg COMPCOMPS0LD.S0LD.prepreg prepreg Thin Core ,FR-4Thin Core ,FR-4prepreg prepreg COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZ疊合用之鋼板疊合用之鋼板疊合用之鋼板疊合用之鋼板墊木板鋁板10. 鑽孔 (Drilling)11. 電鍍De

9、smear & Copper Deposition12. 塞孔(Hole Plugging)13. 去溢膠 (Belt Sanding)14. 減銅 (Copper Reduction) Option15. 去溢膠 (Belt Sanding) Option16. 外層壓膜 Dry Film Lamination (Outer layer)Photo Resist17. 外層曝光 ExposeUV光源18. After Exposed19. 外層顯影 Develop20. 蝕刻 Etch20. 去乾膜 Strip Resist21.壓合 (Build-up Layer Laminati

10、on)RCCRCC(Resin Coated Copper foil)(Resin Coated Copper foil)21. 護(hù)形層製作 (壓膜)(Conformal Mask)Dry FilmDry Film( (乾膜乾膜) )Dry FilmDry Film( (乾膜乾膜) )ArtworkArtwork( (底片底片) )ArtworkArtwork( (底片底片) )22. 護(hù)形層製作 (曝光)(Conformal Mask)Before ExposureAfter Exposure23.護(hù)形層製作 (顯像)(Conformal Mask)24. 護(hù)形層製作 (蝕銅) (Confo

11、rmal Mask)25.護(hù)形層製作(去膜) (Conformal Mask)26. 雷射鑽孔 (Laser Ablation)及機(jī)械鑽孔Mechanical DrillMechanical Drill(P.T.H.)(P.T.H.)Laser Microvia(Blind Via)27. 機(jī)械鑽孔 (Mechanical Drill)28. 電鍍(Desmear & Copper Deposition)29. 外層線路製作 (Pattern imaging)壓膜壓膜(D/F Lamination)D/F Lamination) 曝光曝光(Exposure)Exposure)顯像顯像(

12、D/F Developing)D/F Developing) 蝕銅蝕銅 (Etching)Etching)去膜去膜(D/F Stripping)D/F Stripping) 30. 防焊(綠漆)製作 (Solder Mask)WWEI94V-0R10531. S/M 顯像 (S/M Developing)32. 印文字 (Legend Printing)33. 浸金(噴錫)製作(Electroless Ni/Au , HAL)WWEI94V-0R105WWEI94V-0R105Dedicate or universal Tester Dedicate or universal Tester F

13、lying Probe Tester Flying Probe Tester 34. 成型 (Profile)35. 測(cè)試 (Electrical Testing)WWEI94V-0R105WWEI94V-0R10536. 終檢 (Final Inspection)37. O.S.P. (entek plus Cu_106A.) OptionLASER BLIND & BURIED VIA LAY-UPLASER BLIND & BURIED VIA LAY-UPA = THROUGH VIA HOLE (導(dǎo)通孔導(dǎo)通孔) B = BURIED VIA HOLE (埋孔埋孔)C

14、= One Level Laser Blind Via (雷射雷射盲孔盲孔 ) LASER BLIND & BURIED VIA LAY-UPLASER BLIND & BURIED VIA LAY-UPBURIED VIABURIED VIA ANDAND LASER BLIND VIA OPTION (BLIND VIA OPTION (雷射雷射盲埋孔之選擇盲埋孔之選擇)D DC CC CD = Two Level Laser Via (雷射雷射盲孔盲孔 ) C CD DC CB-STAGEB-STAGEFR-4 CoreRCCRCCFR-4 CoreB-STAGEB-ST

15、AGERCCRCCA AB BB BA ABURIED VIA LAY-UPBURIED VIA LAY-UPA = THROUGH VIA HOLE (導(dǎo)通孔導(dǎo)通孔) B = BURIED VIA HOLE (埋孔埋孔)C = BLIND VIA HOLE (盲孔盲孔 ) D = BLIND HOLE MLB VIA (多層盲孔多層盲孔)BLIND VIA LAY-UPBLIND VIA LAY-UPBLIND VIA SEQUENTIAL LAY-UPBLIND VIA SEQUENTIAL LAY-UPA AB BB BA AR RE ES SI IN NB-STAGEB-STAGE BLIND AND BURIED VIA OPTION (BLIND AND BURIED VIA OPTION (盲盲 埋埋 孔孔 之之 選選 擇擇 )D DA AC CC C E = VIA IN PAD (V