ACF(異方性導(dǎo)電膠)介紹

1、 GIANT PLUS GIANT PLUSACF 應(yīng)用之產(chǎn)品型態(tài)應(yīng)用之產(chǎn)品型態(tài) COG type TAB type COF typeDriver ICFPCACFACFACFPassive components TAB (Resist, capacitor) GIANT PLUS異方性導(dǎo)電膠(Anisotropic Conductive Film )之外觀a. 二層型 ACF層+離層 (Ex: Hitachi)b.三層型 ACF層+離層+保護(hù)層 (Ex: Sony)Adhesive filmConductive particleCover filmACFSeparatorACFSeparat

2、or GIANT PLUSMaterial of ACFAdhesive THERMOSETTING-EPOXY. POLYURETHANE THERMOPLASTIC- SILICONE, ACRYLATE, SBRConductive particle CARBON FIBER METAL POWDER-Ni, Ag METAL COATED RESIN-Stylene, Acrylate METAL COATED RESIN with Surface Insulating CoatingNiAuResinInsulation layer GIANT PLUS GIANT PLUSACF之

3、三大功能之三大功能導(dǎo)通絕緣黏著ACF ITOCuFilmSubstrateAdhesiveConductive Particle GIANT PLUSACF選擇標(biāo)準(zhǔn)Panel bump space(大於ACF Spec MIN space)Contact area(大於ACF Spec MIN area)單個(gè)Bump 面積*bump數(shù)MIN areaACF寬度和長(zhǎng)度(1.52.02.53.06.5mm)IC(TCPFPC) Length+1mm Width+1mm粒子密度：密度（個(gè)/m)/粒子(um) GIANT PLUS GIANT PLUSBonding Process ( TAB 、 C

4、OG & COF )1.ACF之貼附之貼附2. Separator分離分離Silicon rubberSeparatorACFSubstrateHeating head(Ex: TAB 1100C, 1.5sec, 10kg/mm2)TAB 、COG、COF OLB-LCDCOF ILB-Film GIANT PLUS4.本壓著本壓著Heating headHeating head Silicon rubberFilm or chipACFSubstrate(Ex: TAB 325 100C, 17sec, 20kg/mm2)(Ex: TAB 120 100C, 1.5sec, 10kg/mm2)TAB 、COF OLB-FilmCOF ILB 、-Chip3.對(duì)位後假壓著對(duì)位後假壓著 GIANT PLUS GIANT PLUSACF使用及儲(chǔ)存注意事項(xiàng)使用及儲(chǔ)存注意事項(xiàng)使用注意事項(xiàng) 1.從冰箱取出ACF時(shí)，請(qǐng)於室溫下放置半小時(shí)後再開(kāi)封，使之恢復(fù)常溫， 以免吸附水氣，造成變質(zhì)。 2.避免置於陽(yáng)光下，及UV照射。 3.避免沾附油、水、溶劑等物質(zhì)。儲(chǔ)存注意事項(xiàng) 1.儲(chǔ)存於-105之冰