制造管理診斷手法與實(shí)例ppt課件

1、製造管理診斷手法與實(shí)例報(bào)告人: 許棟樑清華大學(xué)工業(yè)工程與工程管理系OutlinePart I: A Plant diagnostic methodology1) Crystallize key aspects of concern (認(rèn)清 改善標(biāo)的)2) Diagnostics & Improvement Methodology (善用 分析與改善手法) 3) Process Re-engineering ApproachPart II: Applications & partial results1) Index model & useful new indices2) Improvemen

2、t drivers3) Best practice comparisons4) SMT process re-engineeringPart I: Plant diagnostic methodologyI.1) Crystallize Key aspects of concern (認(rèn)清 改善標(biāo)的)I.2) Diagnostics & Improvement Methodology (分析與改善手法)I.3) Mfg Process Re-engineering ApproachI.1 Key Aspects of concernIdea: Top-down systematic deplo

3、yment of PI - DTCo. ObjectivesPlant ObjectivesKey Perf IndicesAdm. Obj.Determinants PIsDTsPIsDTsPIsDTsI.1.1 Plant Top-level concernsProfitability & Customer satisfactionProductivity/ProductionLead Time & Delivery (target hit rate)Quality & ReliabilityCostFlexibilityServiceI.1 Key Aspects of concernI

4、.1 KEY ASPECTS OF CONCERNI.1.2 Areas of Attention: (DTs)Bottleneck Management/Scheduling & Dispatching (=Productivity)Flow Efficiency & Layout (=Time) Inventory control (Cost/profit)Resource Utilization Effectiveness (=Cost/Profit)Equipment/FacilityMaterials (WIP)Human ResourcesSpaceProcess & Change

5、 Control (= Quality/variability, Flexibility, etc.)Safety (basic req.)= proper set of PIs for each level.I.2. 分析與改善手法Basic methodology:I.2.0 Methodology OverviewI.2.1 Index Model & Standards I.2.2 Data Representation Forms/ToolsI.2.3 Analysis Methods/ToolsI.2.4 Site tour & InterviewsI.3 Process Re-e

6、ngineering approachI.2.0 Methodology OverviewCollect Data &BM-Compare Strength & Weakness-Seek Improvement Opport.- Rank PerformanceRegression Analysis-Model Quantitive Relations Among Performance Indices & Determinants-Performance Index=Fn(Determinants)Data Envelop Analysis-Identify Inefficiencies-

7、Provide Improvement Direction & Reference Target LevelFeedback Recomm.-Compare Strength/Weakness-Identify Improvement Opportunities & target level-Best Practice SharingCorrelation Analysis- Find Out Improvement DriversTrend AnalysisIndex Model-Establish Systematic Performance Indices & DeterminantsA

8、nalysis ToolsVisit/Interview-Understand Factory Procedure-Verify Data-Clarify QuestionsMany other tools .SimulationData rep forms/questionnaire/ tools- Clearly/ completely /ConciselyI.2.1 Performance Index ModelTop down / goal driven /Clear linkagesStandardizationArranged for various levels & Org. I

9、.2.2 Data Representation Tools表單: Well-designed forms to concisely & completely document the detail situations.I.2.2.1 Process/Transport Attribute Table (流程細(xì)目表)Process attribute tableTransport attribute tableI.2.2.2 Layout DiagramI.2.2.3 S/W modeling tools (doc. Processes)ARIS 4 views / IDEF / Power

10、 Designer (etc.)Data view / Function view / Control view / Org viewI.2.3 Analysis Methods/Tools (1)I.2.3.1 Data Benchmarking (Bar/line chart) + Hi / Lo/ Mean3.1.1 Direct Data BenchmarkingHorizontal BMVertical BM (Trends)3.1.2 Indirect Data BenchmarkingDunken method to differentiate groups forVarious

11、 Perf Rankings incl.: Equipment performanceAHP (Analytical Hierarchical Process) RankingI.2.3.2 Improvement driversCorrelationRegressionI.2.3.3 Input/Output Efficiency Analysis (DEA)Plant/Section/Machine levelsData Envelop Analysis (Concept) Identify in-efficiency & Impr. Ref. Target Can identify ef

12、f 4 multiple inputs & multiple outputs35投入人力月產(chǎn)量I.2.3 Analysis Methods/Tools (2)I.2.3.4 Bottleneck analysisLine Balance RateProcess time + Transport time histogram by sectionBottleneck identification / inclination indicesI.2.3.5 Layout analysisLayout analysis (Layout efficiency) Petri net analysisI.2

13、.3.6 Cycle time analysisFlow efficiencyI.2.3.7 Cost decomposition/Waste analysisI.2.3 Analysis Methods/Tools (3)I.2.3.8 Process & Material flow analysisProcess flow (WIP Journey) AnalysisKey component time journey by org./sectionWIP distribution I.2.3.9 Resource Utilization analysisInventory utiliza

14、tion/shortage & Stock waste.Equipment OEE / Waste analysisHR (productivity?)Area utilization/productivityI.2.3.10 SimulationSimulate existing situation to find out problematic/bottleneck areasSimulate re-engineered situation to:Predict possible results. Perform “what if? analysesDebug new designs be

15、fore major capital investments.I.3 Process Re-engineering ApproachDetermine proj scope & target of studyPreliminary process tour & discussionEstablish PIs & DTsData collection (Use Data Representation Tools I.2)AS-IS Process simulation/ARIS ModelUse Analysis Tools (I.2.3) w/ external data = Improvem

16、ent ideasEstablish TO-BE modelTO-BE Model simulation = 改善效益評(píng)估Feedback to co. & Discussion.Part II: Applications & Result ExcerptII.1) Index model & Useful new indicesII.2) Improvement driversII.3) Best practice comparisonsII.4) SMT Process re-engineering casesII.1 Highlights of Index ModelOrganized:

17、13 Key performance Indices 124 Detail indices (various levels)Created 12 useful New indices & 2 redefined indices:ORT ratio: O-ratio / R-ratio / T-ratio (3*2) Layout Efficiency(LE) (4)Flow Efficiency (FE) (2)Line Balance Rate (LBR) (redefined) (1)MTBFU based on uptime. (redefined) (1) New Index: ORT

18、-ratioORT_Ratio_Station： Operation _Ratio _ Station = # operation stationsTotal # stations Repair _Ratio _ Station = # repair stations Total # stations Test _Ratio _ Station = # test stations Total # stations ORT_Ratio_People：Operation _Ratio _ People= operation headcountsTotal line headcount Repair

19、 _Ratio _ People = repair headcount Total line headcount Test _Ratio _ People = testing headcount Total line headcount Represents the “maturity level of product & Process design/qualification。 O-ratio High: few non-value-add headcount/process R-ratio High: poor process control. Need many people/stat

20、ion to repair T-ratio H: over testing or immature product-process capabilityNeed lots of testing.A manager: ORT ratio 有如照妖鏡，讓管理不佳者無(wú)所遁形。Key PI: Line Balance rateLBR (%):Original：( ti )/tmNNormalized： ( ti )1/N /tm ti：Time for the ith processtm：Max(ti) i=1,NN：Total number of processesOriginal method p

21、enalize on longer/more sophiticate lines. = Recomm. Normalized method.Index desc.Layout EfficiencyLayout Efficiency_Time= Theoretical total process time/(theoretical total transport time + Theoretical total process time)Index Desc.Layout Efficiency_length= Theoretical total process length/(theoretic

22、al total transport length + Theoretical total process length )Index Desc.Flow EfficiencyFlow Eff.= theoretical cycle time/Actual cysle timeIndex Desc.Theoretical cycle time = total theoretical process time total theoretical transportActual cycle time Actual process time + 實(shí)際製程時(shí)間+actual transport tim

23、e + actual idle time Revised Indices: MTBFUMTBFu (Mean Time Between Failure - Up-Time based) = uptime/ # failure during the periodMost use: all time/ # failure or prod. Time/ # failure Avoid over-estimating MTBF when down time is long. (down 1 time for 6 months in a year.MTBFu = 6/1; MTBFT = 12/1. )

24、as long as in up-time, there is a possibility for failure.RetII.2 Improvement DriversII.3 Best practice comparisonsProcess Benching Marking - ExcerptC1 Company Benchmarking TableC2 Company Benchmarking TableC3 Company Benchmarking TableBest-in-class BMOther Detail Index TableII.4) SMT Process reengi

25、neering cases樣本定義本次選擇了國(guó)內(nèi)前三大筆記型電腦廠商，三家廠商1999年產(chǎn)量占全臺(tái)灣產(chǎn)量的51%以上，基於嚴(yán)密原則，我們將三家公司定為C1 、C2 、C3，並保管相關(guān)機(jī)密資料。在C1-C3中，各參與公司提供一條最具代表性的PCBA生產(chǎn)線為樣本，實(shí)地由研討人員到廠 3-5 天，以搜集所需的資料。研討流程建立PCBA生產(chǎn)線流程之ARIS MODEL訂定PCBA製造流程指標(biāo)方式問(wèn)卷訪談、資料搜集無(wú)效率分析To-Be Model的建立系統(tǒng)模擬分析改善效益分析參與廠商回饋報(bào)告C1 PCBA layout: IS vs TO-BE改善後改善前Advantages: 1) Keep I/P

26、O/P from same side. 2) Reduce manual cart transp. 3) Fast overhead movements. No traffic congestions.Recommendation for C1 Case Change layout to continuous U-shaped to connect whole PCBA area. Remove the board clipping stations.Adding placement machine to increase line balancing rate & reduce pulse

27、rate.Reduce manual assembly and inspection to reduce cycle time. Automate repair data collection and analysis.Automate loading/unloading of ATE stations. C1 AS-IS SimulationRemove 2 split stationsAdd Placement machine & adopt U-shape layoutC1 Improvement Effects 1/3Benefit Estimate After Changing Pr

28、oduction Line LayoutSimulation ItemPresent SimulationDiscarding two Split stationsU-line Layout / Increasing Two Placement MachineImprove%Pulse rate14%Production per day16%Area Productivity8.788.9710.721.87%Labor Productivity12.6313.0215.0719.32%Avg WIP73 % PCBA Total Cycle Time77 %C1 Improvement Ef

29、fects 2/3Layout Efficiency _ Length45.59%49.04%75.40%52 %Layout Efficiency _ Time82.74%82.58%89.25%7.87%Flow Efficiency12.16%11.93%46.49%282%Line balance rate54.47%53.11%60.14%10.5%C1 Improvement Effects 3/3Bottleneck StationTop Side Line Medium- SpeedTop Side Line Medium- Speed Bottom Side Line Scr

30、een PrintingCycle Time Of Bottleneck Station13.3%Number of Labor5755552 peopleNumber of StationsXX-2XC1: IS vs TO-BE (1)MaximizationC1: IS vs TO-BE (2)MinimizationC3: PCBA layout IS vs To-be WasTo-beRecommendation for C3 Case (1)Continuous U-shaped layout to connect whole PCBA line.Removing the X-RA

31、Y test process. Yield at the station is already very high & it is too slow. Remove the vibration test.Other plant can do without it. High test ratio. Review needs for tests. Introduce AOI.C3 AS-IS SimulationC3 Remove X-ray.Vibration. Use AOI. U-shape Layout C3 Improvement effects (1/3)Benefit Estima

32、te After Changing Production Line LayoutSimulation ItemPresent SimulationDiscarding X-Ray/Discarding Vibration test/AOI replaces visual inspection U-shaped LayoutImprove %Pulse ratesameProduction per daysameArea Productivity13.4214.0814.659.17%Labor Productivity25.8426.9927.024.58%Number of Production Segment32166.7%C3 Improvement effects (2/3)Avg WIPXXXXXXXXX58 % PCBA Total Cycle TimeXXXXXXXXX58 %Layout Efficiency _ Length61.87%62.41%76