手機(jī)開發(fā)與設(shè)計(jì)流程詳解ppt課件

1、手機(jī)產(chǎn)品設(shè)計(jì)與開發(fā) 明基電通 移動(dòng)通訊事業(yè)群 專案管理部產(chǎn)品經(jīng)理邱珮瑜 Polly Chiu 2006/12/26Topic個(gè)人簡介明基BenQ 簡介產(chǎn)品開發(fā)流程手機(jī)開發(fā)功能區(qū)塊手機(jī)系統(tǒng)演進(jìn)3G 介紹手機(jī)功能發(fā)展趨勢無線通訊發(fā)展趨勢個(gè)人簡介 個(gè)人簡介2000年畢業(yè)於中山大學(xué)物理研討所2001.042006.03:明基儲(chǔ)存事業(yè)部研發(fā)處研發(fā)部Team Leader of Write Strategy Team / Firmware R&DSlim DVD+-R(RW)(12x)/DVD+-R(RW)(4x,8x,16x)/CDR(RW)(32x,40 x,48x) drive developmen

2、t團(tuán)隊(duì)發(fā)表世界第一的4x, 8x, DL, 16x DVD燒錄機(jī)IEEE 論文發(fā)表發(fā)表4 篇專利 2006.032006.12:明基移動(dòng)通訊事業(yè)群專案管理部技術(shù)產(chǎn)品經(jīng)理-目前負(fù)責(zé) 3.5G HSDPA feature phone project明基BenQ 簡介-享用快樂科技數(shù)位時(shí)尚品牌3C數(shù)位整合國際級設(shè)計(jì)實(shí)力1984年成立企業(yè)願(yuàn)景: 傳達(dá)資訊生活的真善美1996年股票在臺(tái)灣上市2001年BenQ品牌誕生2005年?duì)I收: 明基電通: 新臺(tái)幣1,623億元明基集團(tuán): 新臺(tái)幣3,979億元全球員工人數(shù) (2006/10)明基電通: 13,000+人 明基集團(tuán): 68,000+人量做精品:量身訂做

3、讓消費(fèi)者生活 充滿樂趣的網(wǎng)絡(luò)時(shí)尚產(chǎn)品獨(dú)特3C產(chǎn)品組合：將數(shù)位產(chǎn)品整合成符合未來消費(fèi)者生活型態(tài)的數(shù)位中樞 一 筆記型電腦、手機(jī)、數(shù)位電視享用快樂科技之企業(yè)化企業(yè)願(yuàn)景為品牌使命19922002 明基集團(tuán)企業(yè)願(yuàn)景1562632695268311 264162846243517371,0471,6501,6231,2082847774271,1002,3473811,8753,6483,979BenQ GroupBenQ Corp.單位:億元(新臺(tái)幣)Phase 11984-1991OEM強(qiáng)大的生產(chǎn)製造才干從製造代工到深耕技術(shù)與設(shè)計(jì)之品牌Phase 21991-2001From OEM to ODM多

4、元化的技術(shù)投資“程度整合+專業(yè)分工Phase 32001-2006From ODM to Branded Business數(shù)位時(shí)尚品牌3C數(shù)位整合國際級設(shè)計(jì)實(shí)力 單位:億元(新臺(tái)幣)三大事業(yè)群明基電通移動(dòng)通訊事業(yè)群(MCG)數(shù)位媒體事業(yè)群(DMG)整合製造服務(wù)事業(yè)群(IMS)洞悉數(shù)位市場 掌握絕對優(yōu)勢獨(dú)特5C戰(zhàn)略 強(qiáng)化競爭優(yōu)勢電子商品整合趨勢贏家Computing 資訊產(chǎn)品個(gè)人電腦, 液晶顯示器,電腦週邊Consumer Electronics數(shù)位媒體產(chǎn)品 數(shù)位投影機(jī), 液晶電視,個(gè)人無線影音, 數(shù)位相機(jī), 車用顯示器Mobile Communications 移動(dòng)通訊產(chǎn)品行動(dòng)電話產(chǎn)品開發(fā)流程

5、產(chǎn)品開發(fā)流程Proposal 構(gòu)想階段Plan 評估規(guī)劃階段Design 設(shè)計(jì)階段Execute 研發(fā)執(zhí)行階段Mass production生產(chǎn)階段Close 結(jié)束階段C SystemC1PlanningPhaseC2R&D DesignPhaseC3Lab PilotRun PhaseC4ENG PilotRun PhaseC5PD PilotRun PhaseMassProductionPhaseC6C0ProposalPhasePlanning-PM Manufacture -FactoryDesign-RD Product definitionFeasibility analysisI

6、D initiation Organize Project team memberProject schedule HW/SW design HW/SW design lock downHW/SW design approved Verification of Product maturity verificationProduction line set up Verification of production line maturity /stabilityProduct design finalized Mass production DVT PhaseMVT PhaseQVT Pha

7、seDVT : Design Verification TestingMVT: Manufacture Verification TestingQVT : Quality Verification TestingLPR: Laboratory Pilot RunEPR: Engineering Pilot RunPPR: Production Pilot RunMP: Mass ProductionMobile development function IntroductionMobile development function外觀設(shè)計(jì) (ID) Industry Design 機(jī)構(gòu)設(shè)計(jì) (

8、MD) Material Design硬體設(shè)計(jì) (HW) Hard WareBB (Base Band 基頻)RF (Radio Frequency 射頻)Antenna (天線)軟體設(shè)計(jì) (SW) Soft WareMMI (Man Machine Interface 人機(jī)介面)ProtocolDriverFunctional Architecture of Mobile TodayFeature List-HW Camera Sony 2.0 Mega Pixel CMOS Auto Focus camera Strobe LED flash lightDisplay AUO 2.0 AM

9、OLED 176x220 Pixels , 262K colorsMemoryNOR Flash: 128Mbit, PSRAM: 64Mbit, NAND: 256MbitSDRAM : 128MbitExternal Memory T-FlashI/O DC Jack , 10 pin I/OConnectivity USB1.1 , BluetoothIDVol. Up / Vol. Down2 Segment Shutter KeyMode Switch Key10 Pin I/ODC JackMicrophoneReceiverT-Flash CardMD : Appearance

10、treatment descriptionA鋁板陽極+噴砂B塑膠射出+噴漆C塑膠射出+噴漆D塑膠射出+噴漆E平板背印FP+R噴塗雷雕GH雙料射出+噴漆IRUBBERJ電鍍K電鍍L玻璃背印M塑膠射出+背印N銘版髮絲處理PQ噴漆Exploded drawing1235810796111241513141716Front case assy.Keypad assy.Main lensJoystick capOLED moduleReceiverKeypad FPCMain PCB assy.DSC moduleDSC FPCDSC holderSpeakerVibratorRear case ass

11、y.Antenna coverBattery cover.Battery pack.Placement description - IShielding case 1 -BBShielding case 2 -BBT-flash connector(push-push type)Pogo pin (for ESD)Back-up battery(Capacitor)30pin BTB Conn.(for DSC module)Joystick(Mitsumi)SMT-type MICPlacement description - III/O connectorBattery connector

12、Mode switchBT antenna switchDC jackAntenna connectorAntenna switchSide-key (Vol-key)RF shielding case10 pin Conn.(Spk. and flash)LCM connectorBB shielding caseSIM connectorKey FPC connectorHW Block Diagram-2GPlacement (Top Side)Antenna RF Area10 Pin I/OBattery ConnectorIOTASIM ConnectorG23 Combo Mem

13、ory LCDM ConnectorKeypad ConnectorBT AreaDC JackPlacement (Bottom Side)Audio CODECMMPMIC.T Flash ConnectorOLED Limit AreaLevel ShifterCamera ConnectorReceiverCharging ICPower ICAntennaSW Feature ReviewBandTri-band GSM/GPRS 900/1800/1900, GPRS Class 10Tri-band GSM/GPRS 850/1800/1900, GPRS Class 10Spe

14、ech CodecFR/EFR/HF/AMREmbedded DSC2.0 Mega Pixel CMOS sensor with Auto Focus + LED flash lightMemoryRSS 3 combo: NOR flash: 128Mb, Pseudo SRAM: 64Mb, Super-AND: 256Mb, SDRAM: SH-Mobile J2 embedded 128MbConnectivityUSB 1.1 (MSC, CDC, Pict-Bridge), Bluetooth (A2DP, HS/HF, BIP, OPP, DUN)JavaMIDP 2.0, C

15、LDC1.1, JTWIMP3, MelodyMP3/AAC(3D, EQ)/AAC+, SW-MIDIVoice recordingAMRVideo recording/playingMP4, 3GP, H.263DRMOMA DRM 1.0SW Architecture-2GToolMMIXPI ( Extend Programming Interface)Layer-1 / DriverServiceDisplayInputMenuPPFAPCameraMP3PIMToolProtocolCCWAPSTKJavaMessageSMSEMSMMSPS ( Protocol Stack)OS

16、手機(jī)系統(tǒng)演進(jìn)3G Evolution OverviewAnalogcdmaOneUSGSM EuropeTDMA USPDC JPGPRSEDGEWCDMA(UMTS, ULTRA FDD)HSDPAcdma 2000cdma2000(1xEVDO)cdma2000(1xEVDV)TD-SCDMAChina1G2G2.5G3G3.5G3G introductionRF chipsetBB chipsetPower Mgmt IC3G Mobile HWSirius BREW-3GApplicationsDevice driverServicesBREW OEMBREWExtensionsBRE

17、W3G手機(jī)單晶片趨勢多方式應(yīng)用WEDGE晶片 ( WCDMA+EDGE) 援助WCDMA、EDGE、GPRS、GSM和HSDPA標(biāo)準(zhǔn)可以在2G和3G網(wǎng)路間切換roaming以CMOS製程應(yīng)用,達(dá)到低本錢減少零組件數(shù)、縮小尺寸、降低功耗，及提高效能等3G -3.5GHSDPA網(wǎng)路陸續(xù)開通3G升級到3.5G，不需再進(jìn)行基地臺(tái)建設(shè)，只需軟體升級3.5G網(wǎng)路的下載傳輸速率已達(dá)3.6Mbps( 比3G快9倍,甚至高於普通家用的2M ADSL)2021年預(yù)計(jì)行動(dòng)數(shù)據(jù)服務(wù)將會(huì)超越行動(dòng)語音服務(wù)，為手機(jī)系統(tǒng)業(yè)者最重要的收入來源 預(yù)計(jì)全球3.5G用戶數(shù)將從250萬個(gè)(2006年)，成長到3億個(gè)(2021年) 臺(tái)灣

18、業(yè)者中華電信: 採諾基亞的系統(tǒng),只開通援助1.8Mbps的HSDPA網(wǎng)路服務(wù)遠(yuǎn)傳電信: 採易利信的系統(tǒng), 推廣傳輸速率高達(dá)3.6Mbps的HSDPA網(wǎng)路援助3.6Mbps的手機(jī)尚未到位，只能以3.5G數(shù)據(jù)網(wǎng)卡先行困難 2007 年會(huì)大幅改善網(wǎng)路涵蓋率缺乏3.5G手機(jī)選擇少, 價(jià)格高手機(jī)功能發(fā)展趨勢-高整合化重外觀設(shè)計(jì)個(gè)人化多媒體多用途手機(jī)功能發(fā)展趨勢-整合通訊(Voice)，資訊(Data)，傳播(Video)和無線(Wireless)現(xiàn)有功能Mobile/Music/Video/Camera/Recorder/GameStorage Memory/FM radio/Application/Brower/High data rate/Connectivity : , BT, USB, I