PCB行業(yè)現(xiàn)場(chǎng)稽查要點(diǎn)

"Isthereapre-startupchecklistfortheprecleanline?Isitcurrent(completelyfilledin)?針對(duì)預(yù)清潔線是否有建立預(yù)先點(diǎn)檢表單？是否已經(jīng)執(zhí)行（已經(jīng)填寫(xiě)）？""Isthereobjectiveevidencethatthescrub/precleanchemistriesarebeinganalyzedbythelaboratoryonthedocumentedfrequency?刷磨/預(yù)清潔化學(xué)藥水是否有證據(jù)證明其有按照實(shí)驗(yàn)室文件規(guī)定的頻率進(jìn)行分析？""AreDumpandRemakeschedulesdocumentedfortheprecleanlineandobjectiveevidenceexistthattheyarebeingadheredtoo?是否有證據(jù)證明預(yù)清洗傾槽與更曹計(jì)劃有符合文件要求？""IsthereanevidencetodemonstratethatallchemicalsaremonitoredcontrolledaslistedinWI?是否有證據(jù)證明所有的化學(xué)品與WI上管控的物質(zhì)有監(jiān)督并管控？""Isallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有制程上的WIP與相應(yīng)制定材料是否管控在制定的工作區(qū)內(nèi)？""Isawaterbreaktestperformedeveryshifttoensurequalityofpre-clean?槽液測(cè)試是否每班測(cè)試一次以確保預(yù)清潔品質(zhì)良好？""Istheirpositiveairpressurefromthecleanroomattheprecleanlineentranceintothecleanroom?無(wú)塵室的預(yù)清潔線入口到無(wú)塵室是否有良好的壓力？"Imaging干膜"Isthecleanroomwellcontrolledbytemperature,humidityandparticleswhichmeet10KMax.requirementandoutofcontrolnotification?objectiveevidence.10K知系統(tǒng)？審核客觀證據(jù).""AretheresistlaminationandexposureareasinthecleanroomutilizingyellowlightinganddoallexteriorwindowshaveUVblockingfilm?UVresistarestoredintemperatureandhumiditycontrolAlso,inventoriedunderFIFOwithexpireddatecontrol?管控有先進(jìn)先出目錄？""Aretheretackyrollercleanmachinesinfrontofthelaminator?在壓膜前是否有粘塵滾輪清潔機(jī)器？""Fordryfilmlamination,isthetemperatureofthelaminationrollercheckedandverifiedusinganinfraredmeter?針對(duì)干膜壓膜，是否檢查了壓膜滾輪的溫度并使用紅外線表進(jìn)行確認(rèn)？""Isthereadocumentedresistinspectioncriteriawithpass/failguidelines?是否有文件規(guī)定的干膜檢驗(yàn)標(biāo)準(zhǔn)指導(dǎo)書(shū)以判定接受或判退？""Isallin-processWIPandmaterialsproperlyidentifiedandcontrolled indesignatearea?Includingexpirationdateonagesensitivematerial?WIP料有效期過(guò)期？""Isthereadocumentedresiststrip/reworkprocedurewiththemaximumnumberofreworksidentified?是否有文件規(guī)定干膜剝膜/重工程序有定義最大的重工次數(shù)？""Fordryfilmlamination,isthetemperatureofthelaminationrollercheckedandverifiedusinganinfraredmeter?對(duì)干膜壓膜，是否有對(duì)壓膜滾輪溫度進(jìn)行檢驗(yàn)并對(duì)紅外線表表進(jìn)行確認(rèn)？""Istherealatestrevisioncontrolonworkingfilm?是否對(duì)工作菲林的最新版本進(jìn)行管控？""Isthereanevidencethatamaximumnumberofexposureshasbeenestablishedandthenumberofexposuretimesofworkingfilmismonitored?是否有證據(jù)表明管控了曝光的最大次數(shù)并對(duì)工作菲林曝光次數(shù)進(jìn)行監(jiān)控？""IstheartworkcleanedafterdefinedexposuretimesusingtackyReviewtheconditionofthetackyrollers.在確定曝光次數(shù)后，是否使用粘塵滾輪對(duì)底片進(jìn)行清潔？審核粘塵滾輪的狀況？""Aretheretoolsandprocedureswithtolerancelimitsinplaceforfront-to-backregistrationverificationduringtheartworksetup? IsidentifiedasacriticalSPCparameter?在底片設(shè)計(jì)階段，是否確認(rèn)了前后對(duì)準(zhǔn)度的工具/制程最大公差？是否被定義為關(guān)鍵SPC參數(shù)？""Isthefronttobackverifiedduringthisprocess?在這些制程是否對(duì)上下對(duì)準(zhǔn)度進(jìn)行確認(rèn)？""Isthemaximumnumberofpermissibleexposuresdocumentedwithatotrackthenumberofexposures?可允許的最大曝光次數(shù)是否有文件規(guī)定并有相應(yīng)的系統(tǒng)對(duì)其跟蹤？""Isthereanevidencethatthenumberofexposuretimesofworkingismonitoredandtheartworkisnotbeingusedbeyonddocumentedlife?限？""Isthemaxholdingtimebetweenexposeanddevelopdocumentedandfollowed?曝光和顯影之間是否文件規(guī)定最大的靜置時(shí)間并有按照此要求執(zhí)行？""Istheirapre-startupchecklistfortheDESline?Isitcurrent(completelyfilledin)?DES線是否有預(yù)啟動(dòng)點(diǎn)檢表？是否已經(jīng)進(jìn)行（有完整地填寫(xiě)）？""IsthereanevidencetodemonstratethatallchemicalsaremonitoredandcontrolledaslistedinWI?是否能證明所有的化學(xué)品有進(jìn)行監(jiān)控并有管控WI清單？""Areallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有的制程上WIP與材料是否有定義并管控在指定的區(qū)域？""AredefectivesandreworkschedulesdocumentedfortheDESlineandobjectiveevidenceexistthattheyarebeingfollow?DES行？""Isafirstarticlerunpriortoetchingthelottoconfirmetchersettingsandlinewidths?在批量蝕刻前是否先進(jìn)行首件確認(rèn)，以保證蝕刻機(jī)設(shè)備與線徑？""Istheetchunifomitymonitoredatleastmonthlyandrecordsmaintainedasaqualitydocument?是否至少定期稽核一次蝕刻站并有相應(yīng)的維護(hù)記錄作為品質(zhì)文件？""Aretheetcherconveyorspeedsdefinedanddocumentedbycopperweight/thickness?蝕刻機(jī)運(yùn)作速度是否有規(guī)定并且有文件規(guī)定銅重量/厚度？""Isthefiltrationsystemadequate? What'sthecleanfrequencyandfrequency?過(guò)濾系統(tǒng)是否完善？清潔頻率與更換頻率是多少？""Aretheredocumentedmaximumfinalrinsewatercontaminationlevels,rinseflowratesandaretheseverifiedbyconductivitymeasurements?是否有文件規(guī)定最大水洗污染水準(zhǔn)，水洗流動(dòng)率與對(duì)傳導(dǎo)性進(jìn)行確認(rèn)？""ArethecoresobservedcomingofftheDESlineclean,dryandstainfree?是否有專門(mén)的對(duì)DES線清潔，烘干與無(wú)沾污進(jìn)行檢驗(yàn)？""Doesthestrippingmodulecontainafilteringsystemfortheremovalthedryfilmresist?剝膜機(jī)是否有過(guò)濾系統(tǒng)以去除干膜膜屑？""Areseperatorsusedtoseparateeachcore(signals&power/grounds)topreventscratches?是否有作業(yè)員單獨(dú)操作每個(gè)重要項(xiàng)目（信號(hào)，電能，地面）以防止刮傷？""Arethereidentifiedscheduleofcleaningtheseperaors?是否規(guī)定作業(yè)員的清潔計(jì)劃？""Isthereasysteminplacetoidentifywhichlinewidthstobemeasuredonacore?現(xiàn)場(chǎng)是否有系統(tǒng)規(guī)定主要測(cè)試哪條線徑？""Arelinewidthmeasurementfrequencydocumentedandisthefrequencyaminimumofthefirstcore,middleandlastcoreoffthelineinthelot?是否有文件規(guī)定線徑測(cè)試的頻率？"Subsectionscores部分得分Section6-AOIofinnerlayer 外層AOI"IsAOIperform100%inspectionforallsignal所有層數(shù)是否100%進(jìn)行AOI檢測(cè)？""AreallWIPproperlyidentifiedandplaceinthedesinatedarea?所有的WIP是否有相應(yīng)的規(guī)定并放置在指定的區(qū)域？""Arethepower/groundlayerinspectedperhistoricalstatisticssamplingplan?是否對(duì)能源/接地層進(jìn)行檢驗(yàn)并按照抽樣計(jì)劃定期統(tǒng)計(jì)？""AretheAOIprogramsdatabaseoncustomer'sdataandareallthecriticalAOIsettingsandprogramsestablishedbyEngineering?AOIAOI序？""DoestheAOIprogramhaveappropriateparametersprogramedtocoverminimumlinewidths,minimumspacing,dishdowns,etc?AOI程序是否有相應(yīng)的參數(shù)，其涉及到最小線徑，最小間距，等？""IsastandarddefectboardusedtoverifyeachAOImachineiscatchingalldefectsatthebeginningofeachshift?AOI不良？""IsthereasysteminplacetonotifytheImageAreaforfirstarticleswithrepeatdefects?現(xiàn)場(chǎng)是否系統(tǒng)要求干膜首件發(fā)現(xiàn)重復(fù)不良時(shí)作出相應(yīng)的通知？""IfexcessrandomdefectsaredetectedonalotisthisinformationimmediatelyfedbacktotheDESoperationforreviewandaction?i.e.excesscopper,nicks,shorts,opens?若一批內(nèi)出現(xiàn)了各種不良，此信息是否立即反饋給DES作業(yè)員并審核其作業(yè)動(dòng)作？例如：殘銅，線路缺口，短路，斷路？""IstheAOIdefectverificationperformedonseparateverificationstationsanddefectdatacollectedandreportedinameaningfulAOI"Arerepairedpanelsre-AOItoconfirmalldefectswerefoundandrepaired?AOIOK？""AreyieldstrackeddailyatAOIandfeedbacklooptoI/Lprocessimprovementteamestablished? Arefirstpassyieldandfinaltargetsdefined?AOI站的產(chǎn)率是否每日進(jìn)行跟蹤并及時(shí)反饋給I/L制程建立相應(yīng)的改善小組？是否對(duì)直通率與最終生產(chǎn)率目標(biāo)進(jìn)行定義？""Arecorrectiveactionstakenifyieldsfallbelowtarget?若產(chǎn)量低于目標(biāo)，是否采取相應(yīng)的改善措施？""Isparetoanalysisusedtodeterminethetopdefects? Iseffectivecontinuousimprovementusedtoeliminatetopdefects?是否針對(duì)最高不良項(xiàng)目有要求使用柏拉圖進(jìn)行分析？是否采取持續(xù)有效的改善方法以減少最高不良？""DoesthereworkinstructioncomplywithSynapticsSpecandIPCspecification?重工指導(dǎo)書(shū)是否符合synaptics規(guī)格與IPC規(guī)范？""Isthereclearinstructiontoscrapthepartsifmorethanthreeopencircuitfoundatrework?是否有明確的說(shuō)明若重工時(shí)超過(guò)3條線路斷路，則報(bào)廢？""Isthetapetestandresistancemeasurementperformedontheweldedtracestoensurethereliabilityofrepair?是否針對(duì)已經(jīng)焊接的線路進(jìn)行膠帶測(cè)試，以確保修補(bǔ)板的信賴性？"Subsectionscores部分得分Section7-Lamination 壓合"IsthereevidenceexistthattheOxideChemistrysupplierhasauditedthelineinthepreviousthreemonths?Ifso,wereactionstaken?3采取了相應(yīng)的措施？""HaveDOEsbeenconductedtoverifytheoptimumoxidethicknesstoensurenodelaminationafterthermalstresstest?是否有進(jìn)行DOE確保最好的棕化厚度以保證在熱壓測(cè)試制程發(fā)生分層"Areallin-processWIPandmaterialsproperlyidentifiedandcontrolled indesignatearea?所有在制品WIP與材料是否有定義并管控在指定的地方？""Isthemicroetchratemonitored?IsitunderSPCcontrolwithcalculatedcontrollimitsandarethecharts&actionscurrent?是否對(duì)微蝕率進(jìn)行監(jiān)控？其是否有SPC圖管控并有正在進(jìn)行的措施？""AreoxidebondstrengthtestperformedforallmaterialtypesforeachoxidelineusedonSynapticsProductonaweeklybasis?synaptica一次測(cè)試？""Aretheoxidechemistriesonaauto-dosingsystem?棕化藥水是否有定量給料系統(tǒng)？""IsDIwaterusedforrinses?是否使用DI水進(jìn)行水洗？"Arethecoresexitingthemachinedryandstainfree?機(jī)器是否干燥并無(wú)污染？"Isthereanevidencethatblackoxidethicknessiswellcontrolled?是否能證明黑化厚度有很好的管控？""Aretheoxidedpanelsuniformincolor,appearanceandfreeofscratches/handlingdamage?氧化板是否顏色統(tǒng)一，外表無(wú)刮傷/或操作導(dǎo)致?lián)p壞？""Isioniccontaminationtestconductedonce/shiftasdefinedintheSynapticsspecification?離子污染測(cè)試是否按照synaptics規(guī)范要求每次換班執(zhí)行一次？""Arecoresreworkedatoxide?Ifso,isthereadocumentedreworkprocedurewiththemaximumnumberofreworksestablished?氧化線是否重工？若有重工，是否有文件規(guī)定最大重工次數(shù)？""Isthelay-updoneinacleanroomwithadequatetemperatureandhumiditycontrol?疊合線無(wú)塵室是否有相應(yīng)的溫度與濕度管控？""Arethereestablishedhold-timesforoxidecoresinthalayupoperation?是否規(guī)定氧化線-疊合作業(yè)的靜置時(shí)間？ ""Areallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有在制品WIP與材料是否有定義并管控在指定的地方？""Isthereaprocedureinplacetoinsurethestack-upisperformedperlayupprovidedandapprovedbySynaptics?現(xiàn)場(chǎng)是否有文件以確保每對(duì)預(yù)疊有按照synaptics承認(rèn)的要求執(zhí)行？""Isthematerialprofiledoneregularlytoensuretheactualcooldownratenotexceed5degC/minute? Whatistheheatriseandcooldown是否定期檢查以確保實(shí)際降溫率不超過(guò)5度/分？溫度升溫與降溫速率是多少？""Aresteelplatescleanedforeachcycleandpolishedperiodically?Isthethicknessofthesteelplatecheckedregularly?每批鋼板是否定期清潔并打磨？鋼板的厚度是否定期檢查其厚度？""Isthereanevidencethatlaminationpressplatenflatness/parallelismischeckedaminimumofonce/sixmonths?是否能證明壓合平臺(tái)是否平整/1-6"Isboardthicknessmeasuredafterlaminationonallpanelsorappropriatesamplesizeatamin5pointsoneachpanel?壓合后的板厚是否進(jìn)行抽樣檢驗(yàn),對(duì)每PNL至少檢驗(yàn)的5個(gè)點(diǎn)？""IsthereX-raypunchwithaccuracycompensationdesignforcontrol?X-RAY沖床是否管控對(duì)準(zhǔn)度的設(shè)計(jì)補(bǔ)償精確度？""Isthereadocumentedqualityinspectionprocedureforresinspotsonlaminatedpanels?是否有品質(zhì)檢驗(yàn)程序文件對(duì)壓合板數(shù)脂沾污進(jìn)行定義？""IstheTganddeltaTgcheckedweeklyforallmaterialtypesusedforSynapticsproductoneachlaminationpress?所有用于synaptics型號(hào)的板材，是否每周對(duì)壓合產(chǎn)品檢測(cè)一次TG與△TG？""Doesthereexistadocumentedaccept/rejectcriteriaatpre-drillformisregistration?是否有文件規(guī)定X-RAY鉆孔對(duì)準(zhǔn)度的接受/判退標(biāo)準(zhǔn)？""Isthereadocumentedroutinedimensionalmeasurementconfirmationperformedonthex-raypre-drillmeasurementsystem?X-RAYSubsectionscoresSection8-Drilling 鉆孔"Doesthedrillingmachinehavebrokenbitandwrongbitsizedetectioncapability?鉆孔機(jī)是否有破損鉆咀與不良鉆咀尺寸鑒定能力？""Doesthetravellerclearlydefineallthedrillingparametersincludingstackheight?鉆孔機(jī)是否能夠清楚地定義鉆孔參數(shù)，包括堆疊厚度？""Isthedrillingprogramcheckedpriortobeingreleasedforproduction?是否在開(kāi)始生產(chǎn)國(guó)產(chǎn)前，對(duì)鉆孔程序進(jìn)行檢驗(yàn)？""Isthereevidencetodemonstratethatspindlerun-outiswellcontrolled?是否能證明鉆軸偏移管控良好？""Isthestackheight,maximumhitperdrillbit,andfeedsandspeedsasafunctionoflaminatetype,boardthickness,layercountandholecontrolledproperly?堆疊高度，每鉆咀的最大鉆次，進(jìn)刀速度是否對(duì)板材類型，板厚，曾數(shù)，與孔尺寸進(jìn)行管控？""Aredrillbitregistrationcheckedbycross-sectionorX-ray? Whatisthefrequency?是否通過(guò)切片或X-RAY對(duì)鉆咀對(duì)準(zhǔn)度進(jìn)行檢驗(yàn)？頻率是多少？""Doactionplansexistforinvestigatingandreducingbrokenbits?Doesobjectiveevidenceexistthatthisisincontrol?是否對(duì)鉆咀破損有調(diào)查改善計(jì)劃并減少了不良次數(shù)？是否有客觀證據(jù)證明已經(jīng)有管控此項(xiàng)？""Isthereadocumenteddrillrework/repairprocedurewithqualitychecks?是否有文件規(guī)定鉆孔重工/修補(bǔ)程序并有相關(guān)品質(zhì)點(diǎn)檢表？""ArePCB'swithmissingholesplacedbackonthedrillmachineanddrilled?所有PCB漏鉆孔位于鉆孔機(jī)臺(tái)面上已經(jīng)鉆過(guò)的位置？""Areresharpeneddrillbitinspectedandidentifiedpriortouse?再次研磨的鉆咀是否在使用前進(jìn)行檢驗(yàn)與確認(rèn)？""Arethemaximumnumberofre-sharpensdocumented&controlled?是否有文件規(guī)定并對(duì)最大研磨次數(shù)進(jìn)行管控？""AreAluminumplatesinspectedfordentsandscratchesbeforeuse?在使用之前是否對(duì)鋁板進(jìn)行檢驗(yàn)，以確保無(wú)凹陷與刮傷？""Areoutputboardsatthebottomofeachspindleinspectedontheholesize&location,holeregistrationandholequantityetc?每軸底部的板子是否檢驗(yàn)其孔尺寸，孔位，孔對(duì)準(zhǔn)度與孔數(shù)量等？""IsthereageneralinspectionprocedurewithDrillingaccuracy,HoleHolequantity,HolelocationandCoppersurfaceappearancedefined?對(duì)鉆孔精確度，孔徑，孔數(shù)量，孔位與銅箔表面確認(rèn)，是否有相應(yīng)的檢驗(yàn)程序？""Aredrillmachinescapabilitydataforholepositionaccuracytraceableforeachmachineandspindle?鉆孔機(jī)孔位對(duì)準(zhǔn)度能力數(shù)據(jù)是否對(duì)每臺(tái)機(jī)器/每軸進(jìn)行跟蹤？""Aredrillmachinescapabilitydataforrunouttraceableforeachandspindle?鉆孔機(jī)偏移度是否追蹤到每臺(tái)機(jī)器/每軸？""IsregistrationmonitoredbyPerfectTestmachineorX-raycheckafterDrilling?X-RAY"IsSPCusedinDrillingprocess?鉆孔制程是否使用SPC？""Areallpassed/rejectedboardsproperlylabeledandsegregatedtomixingormissing?所有的PASS/REJECT板是否貼有相應(yīng)的標(biāo)簽以避免混料或遺失？""Doesall inprocessWIPandmaterialsbeproperlyidentifiedcontrolled?所有的WIP制程是否有相應(yīng)的定義并進(jìn)行管控？""IsthereaSPCcontrolimplementedandcontrolchartupdatedforcriticalparameters?是否有SPC管控并有最近更新關(guān)鍵參數(shù)管控？""Arerelevantcorrectiveactionstakentowardalltheoutofcontrolpoints?所有超出管控的項(xiàng)目是否有相應(yīng)的改善對(duì)策？"Subsectionscores部分得分Section9-Electroless 化學(xué)沉銅"Isthereapre-startupchecklistfortheDeburrline?Isitcurrent(completelyfilledin)?去毛刺線是否有啟動(dòng)前點(diǎn)檢表？是否已經(jīng)運(yùn)行（完整填寫(xiě)）？""Arethereairknives,fluidheads&ultrasonicsonthedeburrmachine?去毛刺機(jī)器是否有風(fēng)刀，流動(dòng)性&超聲波？""Areallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有在制品WIP與材料是否有定義并管控在指定的區(qū)域？""Isaholeinspection/checkerusedafterdeburrforpluggedholes?Ifso,arethedatausedforcontinuousimprovementactivities.在去沖孔孔內(nèi)毛刺后，是否檢驗(yàn)孔？若有，是否有持續(xù)改善的資料？""Arethesurfaceoftheboardsandholescompletelydryafterdeburrprocess?去毛刺后，板面與孔是否完全干燥？""Isthereapre-startupchecklistfortheDesmearline?Isitcurrent?去毛刺線是否有開(kāi)機(jī)點(diǎn)檢表？目前是否運(yùn)行？""Areallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有在制品WIP與材料是否有定義并管控在指定的區(qū)域？""Arethetemperatures,pumps,bathcondition,tanks/sumpsandprocesstimesonthelinewithintheprocessspecifications?生產(chǎn)線上的溫度，抽水機(jī)，槽液條件等是否管控在制程規(guī)范內(nèi)？""Isthereanevidencethatchemicalanalysisisperformedperiodically?是否能證明化學(xué)藥水分析有定期完成？""Isthereapre-startupchecklistfortheelectrolessline?Isitcurrent(completelyfilledin)?化學(xué)沉銅線是否有開(kāi)機(jī)點(diǎn)檢表？目前是否運(yùn)行（完整填寫(xiě)）？""Areallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有在制品WIP與材料是否有定義并管控在指定的區(qū)域？""Isbacklightinspectionperformedtocheckthecoverageoftheelectrolesscopperincludingbothsidesofthehole?是否檢查化學(xué)沉銅的孔兩面的背光？""Isdummy-platingperformedaspartofthestart-upprocedurebeforeelectrolesscopperplatingproduct?化學(xué)沉銅在開(kāi)始生產(chǎn)前是否有進(jìn)行是試鍍？""Isthereadocumentedqualityconformanceprocedurewithaccept/rejectcriteriaforelectrolessplatinglinemalfuctions(hoist,time,temperature,eruptions)toinsurethequalityoftheproductinthelineatthetimeofmalfunction?化學(xué)沉銅線生產(chǎn)是否有規(guī)定的品質(zhì)確認(rèn)程序的判定接受/判退標(biāo)準(zhǔn)。（提升，時(shí)間，溫度，等）以確保線上的生產(chǎn)品質(zhì)？""Isthereanactivecontinuousimprovementteamforplatingvoidsintheelectrolesscopperoperation?化學(xué)沉銅是否對(duì)電鍍空洞有積極的持續(xù)改善小組？""IsSPCusedforDesmearandElectrolessprocess? Isthecorrectiveactiontakenfortheoutofcontrolstatus?去膠渣與化學(xué)沉銅制程是否使用SPC？超出管控要求時(shí)，是否采取相應(yīng)的改善措施？""Aretheplatingcurrentandprogramsuseddocumentedontraveler?天車電鍍電流與程序是否有規(guī)定的文件？""IsincomingwatertestedwithPHandorganics?新增加水是否測(cè)試PH與有機(jī)物？""Isthecontaminationoftheplatingtankmonitoredregularly?電鍍槽污染是否定期進(jìn)行監(jiān)控？""Isvibrationused? Howoftenisthevibrationchecked?是否對(duì)其攪拌？攪拌確認(rèn)頻率是多少？""Arefiltersmanagedproperly? Cleanfrequency,renewfrequency?過(guò)濾器管控是否恰當(dāng)？清潔頻率，更新頻率是多少？""Isthereanestablishedcarbontreatmentschedulewithamaximumfrequencyoftreatingeachplatingtankeverysixmonths?每個(gè)電鍍槽最大處理頻率為每6個(gè)月一次，是否建立碳處理計(jì)劃？""Arecross-sectionsperformedasanin-processplatingcontrol?制程電鍍管控是否有進(jìn)行切片確認(rèn)？""Isthereadocumentedqualityconformanceprocedurewithcriteriaforplatinglinemalfuctions(hoist,time,temperature,eruptions)toinsurethequalityoftheproductinthepress?電鍍線生產(chǎn)是否有規(guī)定的品質(zhì)確認(rèn)程序的判定接受/判退標(biāo)準(zhǔn)。（提升，時(shí)間，溫度，等）以確保線上的生產(chǎn)品質(zhì)？""Areplatingdistributionsperformedoneachplatingtankonamonthlybasis?是否每月進(jìn)行一次電鍍槽藥液添加？""Isthereadocumentedallowablereworkprocedurewithappropriatequalitychecks?相應(yīng)品質(zhì)檢驗(yàn)是否有文件規(guī)定允許重工？""Ifproductisreworked,isthereworkdocumentedonthetraveler,doesthereworkedproductreceiveappropriatere-inspectionandtesting?Subsectionscores部分得分Section10-Outerlayer外層"Isthereapre-startupchecklistfortheprecleanline?Isitcurrent(completelyfilledin)?前處理線啟動(dòng)時(shí)是否有點(diǎn)檢表？是否已經(jīng)運(yùn)行（填寫(xiě)完整）？""Isthereobjectiveevidencethatthescrub/precleanchemistriesarebeinganalyzedbythelaboratoryonthedocumentedfrequency?是否能證明有文件規(guī)定實(shí)驗(yàn)室有對(duì)刷磨/前處理化學(xué)藥水分析，并規(guī)定其分析頻率？""Areallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有制程WIP與材料是否有相應(yīng)的定義并管控在指定的區(qū)域？""Arethepanelsasobservedcomingofftheprecleanlineclean,dryandstainfree?前處理后，是否觀察板面有清潔度，干燥度與無(wú)污染？""Isthecleanroomwellcontrolledbytemperature,humidityandparticleswhichmeet10KMax.requirementandoutofcontrolnotification?objectiveevidence.無(wú)塵室的溫度，濕度，塵埃粒子是否管控良好，其符合10K最高要求，并且，超過(guò)規(guī)格時(shí)有相應(yīng)通知？審核客觀證據(jù)。""Isthecleanroompositivepressuremonitoredonaregularbasiswithalarmsforoutofcontrolnotification?無(wú)塵室壓力是否管控良好并且當(dāng)超過(guò)管控范圍時(shí)有報(bào)警系統(tǒng)？""Areallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有制程WIP與材料是否有相應(yīng)的定義并管控在指定的區(qū)域？""AretheresistlaminationandexposureareasinthecleanroomutilizingyellowlightinganddoallexteriorwindowshaveUVblockingfilm?UVresistarestoredintemperatureandhumiditycontrolAlso,inventoriedunderFIFOwithexpireddatecontrol?是否能夠證明所有的干膜/或濕膜均管控在相應(yīng)的溫度/濕度范圍之內(nèi)？并且，有先進(jìn)先出過(guò)期日期管控目錄？""IsthetemperatureofthePCBpanel/laminationrollercheckedandverifiedusingtheinfraredmeterattheentrancetothedryfilmlaminator?PCB/壓合滾輪進(jìn)行紅外線確認(rèn)？""Isthereinspectioncriteriaappliedfordryfilmlaminationdocumentedpass/failcriteria?(eg,bubble,tensionforce)干膜壓膜是否有規(guī)定的檢驗(yàn)標(biāo)準(zhǔn)以判定PASS/Fail？（例如：氣泡，張力）""Areresistdefectivepanelsduetothelaminationorcoatingprocessfullyexposedbeforeresistremovali.e.stripped?壓膜或涂布制程在去膜前的不良板是否在去膜前（例如：剝膜）完全曝光？""IstheartworkcleanedafterdefinedexposuretimesusingtackyReviewtheconditionofthetackyrollers.在確定曝光次數(shù)后是否使用粘塵滾輪對(duì)底片進(jìn)行清潔？審核清潔滾輪狀況？""ArefirstarticlesprocessedthroughOuterlayerDevelop&AOIpriortoexposingtheremainderofthelot?Isthefronttobackverifiedduringthisprocess?AOI度？""Isthefront-to-backregistrationonlayersmeasuredandcontrolled?是否測(cè)試并管控層間上下對(duì)準(zhǔn)度？""Isthemaximumnumberofpermissibleexposuresdocumentedwithatotrackthenumberofexposures?可允許的最大曝光次數(shù)是否有文件規(guī)定并有系統(tǒng)對(duì)曝光次數(shù)進(jìn)行跟蹤？""Istheartworksegregatedanddestroyedafterthemaximumnumberofexposureshavebeenreached?當(dāng)?shù)灼_(dá)到最大曝光次數(shù)后是否隔離并處理掉？""Isthemaxholdingtimebetweenexposeanddevelopdocumentedandfollowed?曝光與顯影之間的靜置時(shí)間是否有文件規(guī)定并有按照其要求執(zhí)行？""Isthereapre-startupchecklistforthedevelopline?Isitcurrent(completelyfilledin)?顯影線是否有啟動(dòng)前有點(diǎn)檢表？目前是否已經(jīng)執(zhí)行（完整的填寫(xiě)）？""Isafirstarticlerunpriortodevelopingthelottoconfirmdevelopersettingsandlinewidths?是否在批量顯影前做首件以確認(rèn)顯影設(shè)備與線徑？""Aretheredocumentedmaximumfinalrinsewatercontaminationlevels,rinseflowratesandaretheseverifiedbyconductivitymeasurements?是否有文件規(guī)定最大最終水洗污染水準(zhǔn)，水流率與傳導(dǎo)性測(cè)試？""Arethepanelsobservedcomingoffthedeveloperlineclean,dryandfree?顯影線后是否對(duì)板面檢查清潔度，干燥度，與無(wú)污染度？""Isthereasysteminplacetoidentifythelinewidthstobemeasuredapanel?現(xiàn)場(chǎng)是否有系統(tǒng)對(duì)板面線徑進(jìn)行測(cè)量？""Areallrepairedboardsidentifiedfortraceability?所有的修補(bǔ)板是否有規(guī)定并可以追蹤？""Isthereadocumentedmaximumholdtimeforpanelswithlaminatedphotoresistbeforecopperplating是否有文件規(guī)定干膜壓膜到鍍銅之間的最大靜置時(shí)間？"Subsectionscores部分得分Section11-AOIofOuterlayer外層AOI"Is100%AOIperformedonoutlayer? IfNo,what'sthesamplesize?外層是否100%進(jìn)行AOI？若沒(méi)有，抽樣頻率是多少？""Areallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有在制品WIP與材料是否有定義并管控在指定的區(qū)域？""IsthereasysteminplacetonotifytheImageAreaforfirstarticleswithrepeatdefects?當(dāng)影像轉(zhuǎn)移區(qū)首件重復(fù)發(fā)現(xiàn)不良時(shí)是否有通知系統(tǒng)？""IstheAOIdefectverificationperformedonseparateverificationstationsanddefectdatacollectedandreportedinameaningfulmanner?AOI不良確認(rèn)是否有獨(dú)立的確認(rèn)站，收集不良數(shù)量并進(jìn)行有意義的報(bào)告？""Isthereadocumentedprocedureidentifingthemaximumnumberofrepairsallowed,includingbutnotlimitedtooweldingopens,cuttingoutandexcesscopperspots,etc?是否有文件規(guī)定允許修補(bǔ)的最大次數(shù)，包括但不限于OPEN焊接，處理短路或殘銅等？""Isthereasetlimitofno.offailurethatthelotshouldreviewedbyaMRBteam?是否設(shè)置不良數(shù)量限定，以使MRB小組審核？""Arerepairedpanelsre-AOItoconfirmalldefectswerefoundandrepaired?AOI"Areallrepairedboardsidentifiedfortraceability?修補(bǔ)的板子是否可以確定其跟蹤性？""AreyieldstrackeddailyatAOIandfeedbacklooptoO/Lprocessimprovementteamestablished? Arefirstpassyieldandfinaltargetsdefined?AOIing與最終達(dá)成率進(jìn)行定義？""Arecorrectiveactionstakenifyieldsfallbelowtarget?若生產(chǎn)率低于目標(biāo)是否采取改善措施？""IsgoldenboardsusedtochecktheAOImachinebeforetheinspectioneachshift?在每次換班前是否用AOI機(jī)器檢驗(yàn)鍍金板？""Isprateoanalysisusedtodeterminethetopdefects? Iseffectivecontinuousimprovementusedtoeliminatetopdefects?針對(duì)已經(jīng)確定的最高不良項(xiàng)目是否有柏拉圖進(jìn)行分析？是否使用有效的改善對(duì)策以減少不良？""Doesthereworkinstructionspecifyweldingconditionsandnumberofwelds?ForSynapticsproductisthisproceduredefinedbasedonIPC-7721重工指導(dǎo)書(shū)是否規(guī)定焊接條件與焊接次數(shù)？SynapticsIPC-7721定義？""Isthetapetestandresistancemeasurementperformedontheweldedtracestoensurethereliabilityofrepair? Isthereanycontrolledthenumberofwelds?是否對(duì)焊接處進(jìn)行膠帶測(cè)試或阻抗測(cè)試以確保修補(bǔ)后的信賴性？焊接次數(shù)是否有管控？"Subsectionscores部分得分Section12-Plating電鍍"Isthereapre-startupchecklistfortheelectrolyticcopperplatingIsitcurrent(completelyfilledin)?電鍍制程啟動(dòng)是否有點(diǎn)檢表？是否已經(jīng)執(zhí)行（完整的填寫(xiě)）？""Dotheplatingcurrentandprogramusedmatchthedesignandtraveler? WhatistheASFrangeusedduringplating?WhodeterminesHow?電鍍電流與程序是否符合設(shè)計(jì)要求？電鍍時(shí)的ASF范圍是多少？誰(shuí)確定ASF？如何確認(rèn)？""Isthecopperplatingprocessanelectrolyticacidcopperplatingsystem?電鍍站是否有酸解電鍍銅系統(tǒng)？""Isdummy-platingperformedaspartofthestart-upprocedurebeforeplatingproduct?在電鍍前是否作為啟動(dòng)程序執(zhí)行試鍍？""Isallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?WIP"Isallchemistryutilizing(DI)water?化學(xué)藥水是否使用DI水？""Istheiranestblishedschedulefortheanode,bussbarsandcablesmaintenance?Isitcurrent?是否建立陽(yáng)極，電鍍條魚(yú)電纜的維護(hù)計(jì)劃？是否已經(jīng)運(yùn)行？""Isthefilterbagcleanedandcheckedperiodicallytoensurenopluggingandbroken?是否定期對(duì)過(guò)濾袋進(jìn)行清潔與檢驗(yàn)以確保無(wú)堵塞于破損？""Isthereanestablishedcarbontreatmentschedulewithamaximumfrequencyoftreatingeachplatingtankeverysixmonths?6followedbyaclosedloopcorrectiveaction?是否通過(guò)切片檢驗(yàn)PTH與小導(dǎo)通孔孔壁狀況，并有相應(yīng)的改善對(duì)策跟蹤？""Isthe specificationforcopperthicknessdocumentedontheandotherqualitydocuments?銅厚是否有規(guī)定的規(guī)范？""Isthereafeedbacklooptopre-productionengineeringtoprovidesizedatatoinsuretheholesizesarecenteredonnominalandhaveagoodCpk?前工程提供的孔徑是否有相應(yīng)的反饋跟蹤以確?？讖降闹行闹嫡２⒂泻芎玫腃PK？""Areplatingdistributionsperformedeachplatingtankonamonthlybasis?每個(gè)電鍍槽是否每月進(jìn)行藥水添加？""Arethermalstressedcross-sectionsperformedasanin-processcontrol?制程電鍍管控是否有熱應(yīng)力切片試驗(yàn)？""Isthereanevidencethatexpirationdateofallwetmaterialsarecontrolled?是否能證明所有的潮濕材料的過(guò)期日期有很好的管控？""IsthereanevidencethatplatedthroughholereliabilitytestingisconductedonperiodicbasisthatmeetstherequirementsinSYNAspecification?是否能證明孔德信賴性測(cè)試由定期執(zhí)行以符合syna規(guī)范要求？""Isthereadocumentedallowablereworkprocedurewithappropriatequalitychecks?是否有文件規(guī)定可以重工的程序與相應(yīng)的品質(zhì)檢驗(yàn)要求？""Ifproductisreworked,isthereworkdocumentedonthetraveler,doesthereworkedproductreceiveappropriatere-inspectionandtesting?"AreDumpandRemakeschedulesdocumentedforthestrip-etch-stripandobjectiveevidenceexistthattheyarebeingadheredtoo?報(bào)廢與重工計(jì)劃是否規(guī)定要求有剝膜-蝕刻-剝膜的客觀證據(jù)？""Istheiramanifoldnozzlelayout&conveyorscheduleavailableandisitusedtovalidatecorrectequipmentsetup?是否有噴嘴設(shè)計(jì)圖/轉(zhuǎn)運(yùn)計(jì)劃并且其用于改善設(shè)備布局？""Areallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有在制品WIP與材料是否有相應(yīng)的定義并管控在指定區(qū)域？""Isthefiltrationsystemadequate? What'sthecleanfrequencyandfrequency?過(guò)濾系統(tǒng)是否完善？其清潔頻率與更新頻率是多少？""Isafirstarticlerunpriortoetchingthelottoconfirmetchersettingsandlinewidths?在批量蝕刻前是否進(jìn)行首件與確認(rèn)蝕刻機(jī)設(shè)備與線徑？""Aretheredocumentedmaximumfinalrinsewatercontaminationlevels,rinseflowratesandaretheseverifiedbyconductivitymeasurements?是否有文件規(guī)定最大水洗污染水準(zhǔn)？""Areslipsheetsusedtoseparateeachpaneltopreventscratches?每片板之間是否有分隔膠片以避免刮傷？""Isthereasysteminplacetoidentifythelinewidthstobemeasuredapanel?是否有系統(tǒng)要求對(duì)線徑的測(cè)量進(jìn)行定義？""ArefinepitchSMTpadsizemeasuredandSPCutilized?SMTPAD是否測(cè)試其節(jié)距并適用SPC進(jìn)行管控？""ArethepanelsobservedcomingofftheSESlineclean,dryandstainfree?SESSubsectionscoresSection13-GoldPlating 鍍金"Istheirapre-startupchecklistfortheprecleanlines?Isitcurrent(completelyfilledin)?前處理線是否有啟動(dòng)點(diǎn)檢表？是否已經(jīng)運(yùn)行（完整的填寫(xiě)）？""Isthereobjectiveevidencethattheprecleanchemistriesareanalyzedbythelaboratoryonthedocumentedfrequency?是否能證明前處理化學(xué)藥水有被化驗(yàn)室按照文件要求的頻率進(jìn)行分析？""Areallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有的在制品WIP與材料是否有相應(yīng)的定義并管控在指定區(qū)域？""IsthereadocumentedprocessforselecttheplatingcurrentortomatchthedifferentGoldandNickelthickness?是否有文件規(guī)定電鍍電流或要求符合不同的電鍍金厚？""Doesthespraynozzlecheckedbeforeeachshiftoperation?在每班轉(zhuǎn)班前是否檢查噴嘴？""IsthereanevidencetodemonstratethatthePCBsurfacecleanlinessmonitoredandcontrolled?Waterbreaktest?是否能證明PCB表面清潔狀況有進(jìn)行監(jiān)控與管控？是否有水不良測(cè)試？""Isafirstarticlesetuppanelruntoconfirmprocessparametertomeetingnickelandgoldthicknessandotherqualityparametersbeforeprocessingtheremainderofthelot?數(shù)？""Isthereadocumentedqualityconformanceprocedurewithaccept/rejectcriteriaforgoldplatinglinemalfuctions(chemistriesoutofspec.time,temperature,eruptions)toinsurethequalityoftheproducttheplatingline?是否有品質(zhì)合格品程序文件規(guī)定鍍金板的接受與判退標(biāo)準(zhǔn)。（化學(xué)藥水，時(shí)間，溫度等超出規(guī)格），以確保電鍍線品質(zhì)標(biāo)準(zhǔn)？""DoesthetravelerorotherprocessdocumentationspecifytheNickel/Goldthickness?是否有文件規(guī)定鎳金厚度？""Isthereadocumentedallowablereworkprocedurewithappropriatequalitychecks?是否有文件規(guī)定允許的重工程序和相應(yīng)的品質(zhì)檢驗(yàn)？""Isthetapetestperformedtomakesuretheadhesionofgoldplating?是否用膠帶測(cè)試確保鍍金的附著力？""IsX-raymeasurementusedtomeasureAu/Nithicknessmeasurement,Ifwhatmeasurement?X-RAY/"Howlongbetweencarbontreatments?碳處理之間的時(shí)間是多長(zhǎng)？""IsporositytestperformedtoensureG/Fhavingveryfinedeposition?是否對(duì)板子進(jìn)行多個(gè)孔測(cè)試以確保鍍金板很好的沉積？"Subsectionscores部分得分Section14-SolderMask防焊"Istheirapre-startupchecklistfortheprecleanlines?Isitcurrent(completelyfilledin)?前處理線是否有開(kāi)機(jī)點(diǎn)檢表？其是否已經(jīng)運(yùn)行（完整的填寫(xiě)）？""Isthereobjectiveevidencethattheprecleaningchemistriesareanalyzedbythelaboratoryatthedocumentedfrequency?是否有客觀證據(jù)說(shuō)明前處理化學(xué)藥水有被化驗(yàn)室按照文件規(guī)定的程序進(jìn)行分析？""Isthesoldermaskprecleanprocessbeingrunperthecurrentprocedure,i.e.thespeed,chemicalconcentration?防焊前處理是否按照程序進(jìn)行運(yùn)行，即，速度，化學(xué)藥水污染？""Arethepanelscompletelydry(heholes)aftertheairdryer?板子在熱風(fēng)烘干后是否完全烘干（例如，孔）？""Isallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有的在制品WIP與材料是否有相應(yīng)的定義并管控在指定區(qū)域？""Istheirpositiveairpressurefromthecleanroomattheprecleanlineentranceintothecleanroom?在前處理線進(jìn)口的無(wú)塵室到無(wú)塵室是否有很好的空氣壓力？""Istheirapre-startupchecklistforthesoldermaskcoaters?Isitcurrent(completelyfilledin)?是否有防焊涂布機(jī)的開(kāi)機(jī)點(diǎn)檢表？是否已經(jīng)運(yùn)行（填寫(xiě)完整）？""Aretheboardsplaceintrayscanseparateboardsonebyonebutnotstack?板子是否可以一片一片通過(guò)而無(wú)堆疊？""Isallin-processWIPandmaterialsproperlyidentifiedcontrolled indesignatearea?所有在制品WIP與材料是否有相應(yīng)的定義并管控在指定區(qū)域？""Istheviscosityofthesoldermaskafterpreparationcheckedtothequality?在檢驗(yàn)前是否測(cè)試防焊的粘性以確保品質(zhì)？""Isthedateandtimethatthesoldermaskexpiresafterpreparationspecifiedonitscontainer?在準(zhǔn)備相應(yīng)的容器前是否確認(rèn)防焊油墨有沒(méi)有過(guò)期？""Isthereevidencetodemonstratethatallsoldermasksarestoredintemperatureandhumiditycontrolenvironme