HDI印刷線路板流程介紹

HDIManufacturingProcessFlowPre-engineeringPatternimagingEtchingLaminatingDrillingCuplatingHolepluggingPatternimagingLaminationLaserAblationMechanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShippingPre-engineeringPatternimagingEtchingLaminatingDrillingDesmearCuplatingHolepluggingCuplatingBeltSandingLaminationLaserAblationMechanicaldrillingCuplatingPatternimagingSolderMaskGoldplatingRoutingElectricaltestPatternimagingHolecounterShippingVisualinspection*Rawmaterial(ThinCore,Copper,Prepreg…...)RawMaterial:FR-4(Difuntional,Tetrafuntional)Supplier:EMC,Nan-YaSheetsize:36”*48”,40”*48”,42”*48CoreThickness:0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”CopperFoil:1/3oz,1/2oz,1.0oz,2ozPrepregtype:1080,2113,2116,1506,7628,76301.內(nèi)層基板(THINCORE)LaminateCopperFoil裁板(PanelSize)

COPPERFOILEpoxyGlassPhotoResist2.內(nèi)層線路製作(壓膜)(DryFilmResistCoat)EtchPhotoresist(D/F)PhotoResist3.內(nèi)層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)AfterExposeBeforeExpose4.內(nèi)層線路製作(顯影)(Develop)PhotoResist5.內(nèi)層線路製作(蝕刻)(Etch)PhotoResist6.內(nèi)層線路製作(去膜)(StripResist)7.黑氧化(OxideCoating)8.疊板(Lay-up)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)9.壓合(Lamination)典型之多層板疊板及壓合結(jié)構(gòu)...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機(jī)之熱板壓合機(jī)之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板墊木板鋁板10.鑽孔

(Drilling)11.電鍍Desmear&CopperDeposition12.楊塞孔(Hol院eP漁lug打gin釀g)13.司去溢膠捎(Bel咸tS右and屋ing鄰)14.頸減銅(Cop緒per掃Re考duc毯tio委n)植→O并pti北on15.盟去溢鄙膠(Bel訪tS峽and撕ing褲)→斯Op逢tio飛n16.崗?fù)鈱优D壓膜Dry般Fi烏lm卡Lam判ina栗tio嗎n(版Out潑er幟lay稿er)PhotoResist17.毀外層曝光Expo跑seUV光源18.Aft心er熟Exp配ose之d19.弊外層顯影Dev輕elo蛾p20.計蝕刻Etc磁h20.究去乾奇膜Stri難pRe鳥sist21.禿壓合顛(Buil啦d-up事Lay植erL據(jù)amin竭atio鋪n)RCC(ResinCoatedCopperfoil)21.叔護(hù)誓形層製退作(艇壓膜)港(Conf拒orma梯lMa蔬sk)DryFilm(乾膜)DryFilm(乾膜)Artwork(底片)Artwork(底片)22.汽護(hù)弟形層製啞作(甲曝光)舍(Conf杰orma齊lMa酒sk)Bef跑ore鳥Ex妻pos棟ureAfte邪rEx引posu昆re23.布護(hù)形層挑製作有(顯像旁)(Conf率orma餡lMa科sk)24.躍護(hù)形層申製作(絮蝕銅)省(Con謹(jǐn)for暫mal斧Ma暮sk)25.進(jìn)護(hù)形層徹製作(昨去膜)瞎(Con浪for畜mal連Ma向sk)26.規(guī)雷員射鑽孔暴(Lase忌rAb岸lati責(zé)on)及機(jī)械沉鑽孔MechanicalDrill(P.T.H.)LaserMicrovia(BlindVia)27.光機(jī)械鑽孔礙(Mech盯anic之a(chǎn)lD酷rill黃)28.孫電鍍杏(Des寨mea符r&抹Co降ppe政rD閣epo趨sit掠ion椅)29.層外層線路晚製作(Pat寺ter血ni惜mag衡ing醒)壓膜(D/F俱La亞min毫ati納on)曝光(Exp但osu壟re)顯像(D/F聞Deve泄lopi貢ng)蝕銅(Etc講hin漢g)去膜(D/F嬌St鼻rip謝pin士g)30.芝防焊(綠夕漆)製作拌(Sol央der蘇Ma簡sk)WWEI94V-射0R10夠531.S/M顯像(紹S/M具Deve惜lopi宏ng)32.次印文字蛙(Leg鐘end頌Pr贈int傾ing招)33.煎浸金(噴舟錫……)諷製作(Elec總trol企ess描Ni/A渡u,捉HAL…墳…)WWEI94V-0R105WWEI94V-0R105DedicateoruniversalTesterFlyingProbeTester34.勵成型(Pro鋸file凱)35.間測試(Elec啊tric組alT昏esti杏ng)WWEI94V-0R105WWEI94V-0R10536.燥終窗檢(Fin婆al牢Ins照pec山tio傲n)37.O.S.蝕P.(掉ente暢kpl擠usC修u_10僚6A….災(zāi))→Opt唐ionLAS場ER搭BLI屢ND喊&B匆URI求ED鐵VIA疫LA駱Y-U拐PA=傾TH廚ROU趟GH蒙VIA弱HO勒LE邊(導(dǎo)通孔頂)B=輛BU營RIE笛DV怕IA粉HOL笑E(埋孔)C=龍On晚eL權(quán)eve挎lL姻ase糊rB羨lin革dV定ia烘(雷射盲孔)LASE部RBL懸IND度&BU沖RIED役VIA唉LAY零-UPBUR芬IED翅VI豬AANDLASE困RBLIN假DVI剝AOP田TION棗(雷射盲埋孔柜之選擇挨)DCCD=胳Two題Leve田lLa沒ser酷Via欲(雷射盲孔)CDCB-ST灑AGEFR-育4C舊oreRCCFR-4CoreB-STAGERCCABBABURI陜EDV蓋IAL幟AY-U雜PA=殊TH街ROU賠GH裝VIA節(jié)HO完LE仁(導(dǎo)通孔)B=造BURI卵EDV狀I(lǐng)AH瓜OLE聚(埋孔)C=轟BL放IND紛VI監(jiān)AH飲OLE猜(盲孔看)D=帥BLIN僚DHO倡LEM繁LBV續(xù)IA(多層盲孔客)BLI任ND拾VIA蔽LA卵Y-U統(tǒng)PBLI嫩ND招VIA呢SE康QUE磚NTI抗AL某LAY差-UPABBARESI爆NB-S佛TAG發(fā)EBLIN道DAN妨DBU閱RIED揀VIA飄OPT瓜ION災(zāi)(盲埋綠孔敘之選驚擇鹽)DACCE=姨VI龍AI杠NP瀉AD短(VI寶P)稈(導(dǎo)通孔鐘在pad裡面)ECon娘ven渣tio顫nal劑PC薯BFR-4Build-upLayerBuild-upLayerPhoto-viaPhot誤o-Im清agea雄ble爬Diel徑ectr甩ic(嗚PID)FR-4ConventionalPTHConventionalPTHCon傍ven騙tio浩nal息PC日BBlin怒dVi逆aPC慣BPTH3millineSVHIVHChip-on-SVHFR-4ConventionalPTHConventionalPTHQ&勉AEND謝謝觀看/歡迎下競載BY政FAI免TH本IM