PCB專業(yè)術(shù)語(yǔ)名詞解釋A50

線路板專業(yè)名詞解釋Tilt

e印制電路：printed

circuit印制線路：printed

wiring印制板：printed

board印制板電路：printed

circuit

board(pcb)印制線路板：printed

wiring

board(pwb)印制元件：printed

component印制接點(diǎn)：printed

contact印制板裝配：printed

board

assembly板：board第一篇：

常用術(shù)語(yǔ)18.MI:

Manufacture

Instruction(制作指示).

ECN:

Engineering

Change

Notice(工程更改通知).MOR：Marketing

Order

ReleaseOC

:Order

Confirmation(定單).IPC

---

The

Institute

for

Interconnectingand

packaging

Electronic

Circuits(美國(guó)電子電路互連與封裝協(xié)會(huì))22.UL

:Underwrites’Laboratories(美國(guó)保險(xiǎn)商實(shí)驗(yàn)所)ISO

--International

Standards

Organization國(guó)際標(biāo)準(zhǔn)化組織On

hold

and

Release

:暫停和釋放SPEC

:specification客戶規(guī)格書WIP:

Work

in

process

正在生產(chǎn)線上生產(chǎn)的

產(chǎn)品Gerber

file

:軟件包Master

A/W

:客戶原裝菲林Net

list

:客戶提供的表明開短路的文件HMLV

:High

Mixed

Low

Volume,多批少量31.TCN：

Temporary

Change

notice臨時(shí)更改通知32.

ENIG

:

Electroless

Nickel

/Immersion

Gold(IPC-4552)33.

OSP

:

Organic

Surface

protectionIT

:

Immersion

TinIS:

Immersion

SilverHAL:

Hot

air

leveling第二篇：

有關(guān)材料Copper-clad

Laminate

:覆銅箔基材Prepreg:聚酯膠片F(xiàn)R-4(FlameRetardant-4):一種用玻璃布和環(huán)氧樹脂制造有阻燃性能的材料Solder

mask:阻焊劑Peelable

solder

mask:藍(lán)膠Carbon

Ink:碳油Dry

film

:干膜RCC

:Resin

Coated

Copper(不含玻璃布)9.基材：base

material層壓板：laminate覆金屬箔基材：metal-clad

bade

material12、覆銅箔層壓板：copper-clad

laminate

(ccl)13、單面覆銅箔層壓板：single-sided

copper-cladlaminate14、雙面覆銅箔層壓板：double-sided

copper-cladlaminate15、復(fù)合層壓板：composite

laminate16、薄層壓板：thin

laminate17、金屬芯覆銅箔層壓板：metal

core

copper-cladlaminate18、金屬基覆銅層壓板：metal

base

copper-cladlaminate第三篇：有關(guān)工序1.

PTH:

(Plated

through

hoTHPA.Via

hole:通路孔。·作用：僅作為導(dǎo)通用（不作插件或焊接），如測(cè)試點(diǎn)和一般導(dǎo)通孔。le)電鍍孔B.

IC

hole:插件孔?！ぷ饔茫河糜诓寮蚝附?，也可導(dǎo)通內(nèi)外層。2.

NPTH：·

作用：一般是作為裝配零件的定位孔或工具孔。NP

HT·

(Non-plated

through

hole)非電鍍孔3.

SMT/SMDSurface

Mounting

TechMST

nology:表面貼覆技術(shù)SMTPad:指在線路板表面帖覆焊接元件的Pad，包括QFP

(Quad

flat

pad)，2-Roll等。這些也是SMT

pad4.

BGA/CSP:BGA---Ball

Grid

ArrayCSP---

Chip

Scale

package·

說(shuō)明：它們都是一種封裝技術(shù)。在PCB上都表現(xiàn)為一VIA孔聯(lián)了一個(gè)焊接PAD。PSC/AGBBGA

PadLineVia

Hole·

要求：一般BGA區(qū)域VIA孔要求塞孔5.

Fiducial

mark

:·

作用：裝配時(shí)作為對(duì)位的標(biāo)記·

說(shuō)明：它是非焊接用的焊盤，通常為圓形或方形，有金屬窗和綠油窗。almarkFiduci6.

Dummy

pattern(thief

pattern)：·

作用：使整塊板的線路分布更均勻，從而提高圖電質(zhì)量和減少板的曲度和扭度。·

要求：通常以不影響線路為標(biāo)準(zhǔn)，一般為又有三種：圓形/方形----命名為“Dummy”網(wǎng)狀----命名為“網(wǎng)狀Dummy”銅皮------命名為“銅皮”Dumm

y7.無(wú)孔測(cè)試Pad：eT

tx

aP/d

rB

ae

ik

gnaT

b·

此類Pad僅供裝配完后作為測(cè)試點(diǎn)，不裝配零件。不包括SMT

PAD,BGA

PAD,Fiducial

mark

pad.8.

Breaking

Tab：·

印制板上無(wú)電氣性能，在制作過(guò)程中用于加工具孔、定位孔或Dummy等的部分。與線路板主體部分相連處有折斷孔或V-Cut。Breaking

TabV-CutThermal：(heat

shield）熱隔離盤（大面積導(dǎo)電圖形上，元件周圍被蝕刻掉的部分）作用：它使在焊接時(shí)因截面過(guò)分散熱而產(chǎn)生虛焊的可能性減少。Thermal/Clearance10.

Clearance：·

無(wú)銅空間（通常指銅皮上為孔開的無(wú)銅區(qū)域）11.

S/M

Bridge：S/Mbri阻焊橋（裝配Pad間的阻焊條）·

作用gd

：防止焊接時(shí)Pad間被焊錫短路。eS/M

Bridge

Solder

mask

in

theseareasS/M

bridge12.Gold

finger：金手指·

說(shuō)明：電鍍金耐磨。一般金指的S/M

OPENING均為整體開窗。13.Key

slot：鍵槽·

作用：使印制板（金手指）只能插入與之配合的連接器中，防止插入其他連接器中的槽口?！?/p>

要求：一般公差要求較緊。14.Beveling：金指斜邊Go

dl

if

gn

re

K/

ye

ls

to

B/

ve

leing16.

VOP：15.

VIP：·

(Via

In

Pad)Via

孔位于SMT

Pad上?！?/p>

要求：一般為S面塞孔，C面作為SMT

PAD?！ふf(shuō)明：(Via

On

Pad)Via

孔先被樹脂塞滿，其表面（一面或兩面）經(jīng)過(guò)打磨、沉銅、板電鍍等工序后，要求作為裝配Pad。VIP/VO

PS面塞孔SMT

PadVia

hole樹脂塞孔SMT

PadBlind/Buriedhole17.

Blind/Buried

hole：盲/埋孔·

盲孔：從一個(gè)表面開始，在內(nèi)層結(jié)束，未貫穿整板的孔?！?/p>

埋孔：不經(jīng)過(guò)兩外表面，只在某些內(nèi)層中貫穿的孔。盲孔埋孔·

High

Density

Interconnection

:18.

HDI高密度互聯(lián)----特點(diǎn)：一般線寬/線間小于3mil/3mil導(dǎo)通孔小于8mil,microvia一般要求用激光鉆孔。19.

LDI·

Laser

Direct

Image---鐳射直接曝光----特點(diǎn)：直接用激光在干膜上曝光，不必用菲林，能保證完成線寬更細(xì)。20.

Heat

sink:Side

faceBottom

SideTop

SidePCBPallet大銅塊PrepregPCB+Prepreg+PalletAspectratio21.

Aspect

Ratio：縱橫比（板厚孔徑比）---影響電鍍和噴錫·

說(shuō)明：一般采用板厚最大值與最小孔徑之比。dHDAspect

Ratio

=

d

/

H22.

AGP:顯卡主顯示芯片AGP內(nèi)存插孔PCI插槽CPU插座AGP插槽23.

Mother

board:主(機(jī))板MotherboardMe

om

yr

ab

kn24.Memory

bank:內(nèi)存條內(nèi)存芯片組第四篇：檢查與測(cè)試歐盟RoHS

&

WEEE指令對(duì)無(wú)鉛PCB要求無(wú)鉛PCB必須滿足歐盟RoHS（Restriction

of

the

use

ofcertain

Hazardous

Substances

in

electrical

andelectronic

equipment）2002/95/EC指令和《電子信息產(chǎn)品生產(chǎn)污染防治管理辦法》的規(guī)定，從2006年7月開始禁用六種物質(zhì)（鉛、鎘、六價(jià)鉻、水銀、PBB（多溴化聯(lián)苯）、PBDE（多溴聯(lián)苯醚）。其中PCB板主要檢測(cè)項(xiàng)目包括：PCB基材、阻焊、絲印、銅皮等。

If

this

specification

conflicts

with

any

other

documentthe

following

order

of

precedence

shall

apply:a)b)Purchase

orderPrinted

wiring

board

drawings

and

drill

and

trimdocumentationThis

specificationDocuments

referred

to

in

this

speciation.c)d)?

Supplier

shall

use

applicable

fabrication

panelcoupon

as

defined

in

IPC-2221.Micro-sectionscoupon

,and

solder

samples

shall

be

provided

witheach

shipment

for

validation

requirement.

1.

Maximum

3

repair

operations

are

allowed

on

eachboard

and

the

number

of

repaired

PCB’S

cannot

exceed

the10

percent

of

the

entire

lot

population.?

2.

Unless

otherwise

specified

on

the

engineeringdrawing

,plated

through

via

holes

with

a

nominal

size

of0.020inch

or

less

may

be

partially

or

completely

plugged

witsolder.?

3.

As

a

preventive

precaution

.before

the

laying

dowof

the

solder

,the

PCB’S

will

have

to

be

washed

toremove

the

residuals

due

to

the

production

process,

theclearing

degree

of

the

PCB’S

before

the

coating

has

tothe

following

one

MAX

1

ug

/square

cm..1.Solder

mask

(SMOBC)-Apply

LPI

solder

masks

per

IPC-SM-840

type

B.

class

3.

color

green

and

minimum

solder

masksthickness

over

the

edges

shall

be

0.001”.LPI

solder

mask

andsolder

shall

meet

the

UL

94v-o

requirements.

There

shall

be

nosolder

masks

over

the

SMT

pads

,there

shall

be

no

exposed

traceson

outside

layers

and

solder

mask

opening

should

be

0.002”sidelarger

than

pad.2.

PCB “Stack-Up”

construction

requirements

are

to

bedetermined

by

the

PCB

vendor

unless

specified.

Leit