LED芯片制程課件

LED工藝簡介1精選2021版課件LED發(fā)光管是怎樣練成的襯底材料生長或購買襯底LED結(jié)構(gòu)MOCVD生長芯片加工芯片切割器件封裝Sapphire藍(lán)寶石2-inch2精選2021版課件襯底片

3精選2021版課件氮化物L(fēng)ED發(fā)光管的器件結(jié)構(gòu)及發(fā)光機(jī)理electrons電子空穴復(fù)合發(fā)光P歐姆接觸N歐姆接觸藍(lán)寶石或碳化硅4精選2021版課件MOCVD外延藍(lán)寶石緩沖層N-GaNp-GaNMQW5精選2021版課件第一步清洗有機(jī)物金屬離子6精選2021版課件第二步n區(qū)光刻

7精選2021版課件刻蝕Cl2+Bcl3+Ar8精選2021版課件去膠3#液9精選2021版課件p電極蒸發(fā)10精選2021版課件P電極光刻11精選2021版課件P電極腐蝕KI+I212精選2021版課件去膠丙酮+酒精13精選2021版課件P電極合金O214精選2021版課件N電極光刻15精選2021版課件N電極蒸發(fā)16精選2021版課件N剝離17精選2021版課件N退火N218精選2021版課件P壓焊點(diǎn)光刻19精選2021版課件P壓焊點(diǎn)蒸發(fā)20精選2021版課件P壓焊點(diǎn)剝離21精選2021版課件鈍化層沉積氣體，功率22精選2021版課件鈍化層光刻23精選2021版課件鈍化層刻蝕24精選2021版課件鈍化層去膠丙酮25精選2021版課件中道終測檢驗(yàn)26精選2021版課件減薄27精選2021版課件劃片28精選2021版課件裂片29精選2021版課件擴(kuò)膜30精選2021版課件劃片,裂片工作流程圖劃片前晶片背面劃片后背面劃片后,側(cè)視圖裂片后,側(cè)視圖擴(kuò)膜后,正視圖31精選2021版課件測試分檢32精選2021版課件LED:What’sinside?electrodessemiconductorchipepoxydomebondwires“silvercup”reflectorDesignGrowthProcessingPackaging

CharacterizationApackagedLEDDifferentpartsofanLEDProcessflow:33精選2021版課件RadiometryPhotometryPowerWatt(W)lumen(lm)PowerperunitareaW/m2lm/m2=lux(lx)PowerperunitsolidangleW/srlm/sr=candela(cd)Photometryisjustlikeradiometryexceptthateverythingisweightedbythespectralresponseoftheeye光學(xué)知識Solidangle:sr=2

(1-cos(θ/2))立體角:34精選2021版課件如何理解光通量(Lumen)和發(fā)光強(qiáng)度(Mcd)470nmLED:3000mcd(20mA)P*62.13