PCB術(shù)語(yǔ)中英文對(duì)照表.doc

Adhesion附著力AnnularRing孔環(huán)AOI（automaticopticalinspection）自動(dòng)光學(xué)檢測(cè)AQL（acceptablequalitylevel）可接受的質(zhì)量等級(jí)B²it(buriedbumpinterconnectiontechnology)埋入凸塊焊點(diǎn)互連技術(shù)BBH(buriedblindhole)埋盲孔BGA(ballgridarray)球柵陣列Blister起泡BoardEdges板邊Burr毛頭/毛刺BUM(Build-upmultilayer)積層式多層板BVH（buried/blindviahole）埋/盲導(dǎo)通孔CAD(computeraideddesign)計(jì)算機(jī)輔助設(shè)計(jì)CAM(computeraidedmanufacturing)計(jì)算機(jī)輔助制造Carbonoil碳油CEM(compositeepoxymaterial)環(huán)氧樹(shù)脂復(fù)合板材chamfer倒角Characteristicimpedance特性阻抗CNC（computerizednumericalcontrol）計(jì)算機(jī)化數(shù)字控制ConductorCrack導(dǎo)體破裂ConductorSpacing導(dǎo)線間距connector連接器Copperfoil銅箔（皮）Crazing微裂紋(白斑)Delamination分層Dewetting半潤(rùn)濕(縮錫)DFM（designformanufacturing）可制造性設(shè)計(jì)DIP(dualin-linepackage)雙列直插式組件Dk（dielectricconstant）介電常數(shù)DRC(designrulechecking)設(shè)計(jì)規(guī)則檢查drawing圖紙ECN(engineeringchangenotice)工程更改通知ECO(engineeringchangeorder)工程更改指令Eglass電子級(jí)玻璃entekOSP處理Epoxyresin環(huán)氧樹(shù)脂ESD(electrostaticdischarge)靜電釋放EtchedMarking蝕刻標(biāo)記Flatness翹曲度ForeignInclusion外來(lái)夾雜物Flameresistant阻燃性FR-2(flame-retardant2)耐燃酚醛紙基板FR-3(flame-retardant3)耐燃環(huán)氧紙基板FR-4(flame-retardant4)耐燃環(huán)氧玻璃布基板FR-5(flame-retardant5)耐燃多功能環(huán)氧玻璃布基板ground地面（層）Haloing暈圈HDI(highdensityinterconnection)高密度互連技術(shù)HASL(hotairsolderleveling)熱風(fēng)焊料整平（整平）IC(integratedcircuits)集成電路InkStampedMarking蓋印標(biāo)記Insulationresistance絕緣電阻Ioncleanliness離子清潔度IPC(theinstituteforinterconnectingandpackagingofelectroniccircuits)印制電路互連與封裝協(xié)會(huì)ISO(Internationalorganizationforstandardization)國(guó)際標(biāo)準(zhǔn)化組織LaminateVoids壓合空洞laser激光LDI(laserdirectimaging)激光直接成像legend文字標(biāo)記、符號(hào)LiftedLands焊盤浮起logo標(biāo)志LPI(liquidphotoimageable)液態(tài)感光成像LPISM(liquidphotoimageablesoldermask)液態(tài)感光阻焊膜marking標(biāo)記Measling白斑M(jìn)icrovoids微坑mil密耳（千分之一英寸）MIL-STD(militarystandard)美國(guó)軍用標(biāo)準(zhǔn)NegativeEtchback欠蝕Nicks缺口Nodules鍍鎦Nonwetting不潤(rùn)濕(拒錫)open開(kāi)路OSP(organicsolderabilitypreservatives)表面抗氧化oxides氧化物pad焊盤panel拼板pattern板面圖形PCB(printedcircuitboard)印制電路板Pcs(pieces)件、片、只Peeling剝落pinhole針孔PinkRing粉紅圈Pits凹坑pitch中心距PlatingVoids鍍層破洞plug塞PositiveEtchback過(guò)蝕power電源層prepreg半固化片PTFE(polytetrafluoroethylene)聚四氟乙烯PTH(platedthrough-hole)金屬化孔PWB(printed-wiringboard)印制線路板Registration對(duì)準(zhǔn)QA(qualityassurance)質(zhì)量保證QC(qualitycontrol)質(zhì)量控制QE(qualityengineering)質(zhì)量工程QFP(quadflatpackage)方形扁平組件repair修理RCC(resincoatedcopper)已涂覆樹(shù)脂的銅箔Referencedimension參考尺寸registration對(duì)準(zhǔn)度resin樹(shù)脂rejection拒收revision修訂版RF(radiofrequency)射頻Ripples紋路rout外形銑scratch劃傷ScreenedMarking綱印標(biāo)記scoring刻槽short短路signal信號(hào)Silkscreen絲網(wǎng)SkipCoverage漏印slot開(kāi)槽SMD(surfacemountdevice)表面安裝器件SMOBC(soldermaskoverbarecopper)裸銅覆蓋阻焊膜SMT(surfacemounttechnology)表面安裝技術(shù)smear毛刺solder焊錫S/M(soldermask)綠油solderability可焊性SodaStrawing(汽水)吸管式浮空SPC（statisticalprocesscontrol）統(tǒng)計(jì)過(guò)程控制spacing間距Tapetest膠帶實(shí)驗(yàn)TCE（thermalcoefficientofexpansion）熱脹系數(shù)TDR（time-domainreflectometry）時(shí)域反射測(cè)試tolerance公差Tenting蓋孔TextureCondition顯布紋Tg(glasstransitiontemperature)玻璃軟化溫度THT(throughholetechnology)通孔（插裝）技術(shù)trace線路（條）UL(underwriterslaboratories)安全實(shí)驗(yàn)所NPTH非金屬化孔UV(ultraviolet)紫外線輻射v-cutV刻Viahole導(dǎo)通孔（過(guò)線孔）void空洞warp板彎Waves波浪WeaveExposure露織物wetting沾錫Wicking燈芯效應(yīng)（滲銅）Wrinkles起皺五、形狀與尺寸：1、導(dǎo)線（通道）：conduction(track)2、導(dǎo)線（體）寬度：conductorwidth3、導(dǎo)線距離：conductorspacing4、導(dǎo)線層：conductorlayer5、導(dǎo)線寬度/間距：conductorline/space6、第一導(dǎo)線層：conductorlayerno.17、圓形盤：roundpad8、方形盤：squarepad9、菱形盤：diamondpad10、長(zhǎng)方形焊盤：rectanglepad11、子彈形盤：bulletpad12、淚滴盤：teardroppad13、雪人盤：snowmanpad14、v形盤：v-shapedpad15、環(huán)形盤：annularpad16、非圓形盤：non-circularpad17、隔離盤：isolationpad18、非功能連接盤：monfunctionalpad19、偏置連接盤：offsetland20、腹（背）裸盤：back-bardland21、盤址：anchoringspaur22、連接盤圖形：landpattern23、連接盤網(wǎng)格陣列：landgridarray24、孔環(huán)：annularring25、元件孔：componenthole26、安裝孔：mountinghole27、支撐孔：supportedhole28、非支撐孔：unsupportedhole29、導(dǎo)通孔：via30、鍍通孔：platedthroughhole(pth)31、余隙孔：accesshole32、盲孔：blindvia(hole)33、埋孔：buriedviahole34、埋/盲孔：buried/blindvia35、任意層內(nèi)部導(dǎo)通孔：anylayerinnerviahole(alivh)36、全部鉆孔：alldrilledhole37、定位孔：toalinghole38、無(wú)連接盤孔：landlesshole39、中間孔：interstitialhole40、無(wú)連接盤導(dǎo)通孔：landlessviahole41、引導(dǎo)孔：pilothole42、端接全隙孔：terminalclearomeehole43、準(zhǔn)表面間鍍覆孔：quasi-interfacingplated-throughhole44、準(zhǔn)尺寸孔：dimensionedhole45、在連接盤中導(dǎo)通孔：via-in-pad46、孔位：