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1、The Hull Cell (U.S. Pate nt # 2,149,344) is a min iature test cell desig ned to produce a plated deposit over a range of curre nt den sities. The deposit is depe ndent upon the con diti on of the plati ng bath (i.e. concen trati on of primary comp onen ts, additi on agents and impurities). The Hull
2、Cell is a useful tool for varying chemical composition, determ ining coveri ng power (the lowest curre nt den sity at which a deposit is produced), measuri ng average cathode efficie ncy, average metal distributi on or throw ing power, and observ ing the effects of pH, temperature and decompositi on
3、 products. A clear Lucite Hull Cell en ables the operator to observe the plati ng on the back of the test panel to determine relative covering power at very low current den sities.赫爾槽(美國(guó)專利# 2149344 )是一種被設(shè)計(jì)用來在一定電流密度范圍內(nèi)產(chǎn)生電 鍍層的小型測(cè)試槽。電鍍層的狀況由電鍍液的狀況決定(主鹽成分,添加劑和雜質(zhì))。赫爾Cell是一種有用的工具,為不同的化學(xué)組成,確定覆蓋能力(最低電 流密度產(chǎn)生的
4、鍍層),測(cè)量平均電流效率,金屬平均分配或分散能力,并觀察pH 值溫度和分解產(chǎn)物的影響,。一個(gè)透明的合成樹脂赫爾槽能夠讓操作者通過觀察 試片背面的鍍層,以確定在非常低的電流密度下的相對(duì)覆蓋能力。The Hull Cel l was originally developed by the R. O. Hull Company, which later became the ROHCO Divisio n ofMcGea n-Rohco, and is now part of Atotech. The Hull Cell has become an in tegral part of plati n
5、g operati ons everywhere.赫爾槽最早由赫爾公司發(fā)明,該公司現(xiàn)在是安美特公司的一個(gè)部分,赫爾槽已經(jīng)成為 世界各地電鍍操作的一個(gè)必須部分。ADVANTAGESThe Hull Cell en ables an experie need operator to determ ine the follow ing facts about a plat ing soluti on:1. Approximate Bright Curre nt Den sity Range. This is accomplished by compari ngthe bright plated ar
6、eas on the panel with current densities given in a chart. If the bright or operable range is between 1-1/4 ” (3.2 cm) and 2-1/2“ (6.4 cm) from the left side ofthe pan el, and the total curre nt applied is 3 Amps,the corresp onding respective curre nt den sities from a Hull Cell ruler or chart lie be
7、twee n 75 Amps/ft 2 (7.6 Amps/dm 2) and 25 Amps/ft 2 (2.7 amps/dm 2). Si nee these values represe nt extreme limits, it does not follow that either of these curre nt den sities can be used in a plati ng bath without obta ining a poordeposit. However, some in termediate curre nt den sity such as 50 A
8、mps/ft2 (5.4Amps/dm 2) should work best.優(yōu)點(diǎn): 赫爾槽可以讓有經(jīng)驗(yàn)的操作者確定電鍍液的以下狀況:1.近似光亮電流密度的范圍。這是通過用給定的電流密度下比較在試片上的光亮鍍層范圍來實(shí)現(xiàn)。如果光亮或可操作的范圍為從試片的左邊算起1-1/4 ( 3.2厘米)和2-1/2 ” ( 6.4厘米),提供的總電流為3安培,從各自的相應(yīng)赫爾槽尺或圖表電流密度讀出電鍍范圍為 75 Amps/ft2(7.6 Amps/dm2 )和 25 Amps/ft2 (2.7 amps/dm2 )。由于這些值代表了極限,但是這不表示這些電流密度可以在任一鍍液中使用而不產(chǎn)生差的鍍層。所以
9、,一些中間電流密度,如50 Amps/ft2 ( 5.4 Amps/dm2 )是最合適的。2. Approximate Concen trati ons of Primary Con stitue ntssuch as zi nc metalcontent, sodium cyanidecontent, ni ckel metal content, etc. Gen erally, the higher the metal content of a bath,the higher (but notn ecessarily wider) is the operable bright curre
10、nt den sity ran ge.3. Additi on Agent Concen trati on. Although a few additi on age nts can bedeterm ined by an alysis, theHull Cell test usually provides the only satisfactory means of con trolli ng the additi on ofthese materials,provided they exhibit a visible effect on the deposit.4. Metallic or
11、 Organic Impuritiesin a plating bath affect the appearance of the HullCell deposit, andtheir prese nce or abse nce can be established.2. 主要成分的大概濃度。如鋅金屬含量,氰化鈉,鎳金屬含量等,一般來說鍍液的金屬含量越高可操作的光亮電流密度越高。(但不一定是更寬的)3. 添加劑用量。雖然有少數(shù)添加劑可以分析,赫爾槽試驗(yàn)通常提供了控制這些添加劑唯一令人滿意的方法,只要添加劑在鍍層 上產(chǎn)生可見的效果。4. 鍍液中的金屬或有機(jī)雜質(zhì)會(huì)影響試片的外觀,因此可以判斷這些雜
12、質(zhì)是否存在。TEST METHODSBefore running a Hull Cell plat ing test, the follow ing steps must be take n:1. Bring the solution to be tested to its normal operating level in the plating tank.2. Either stir the bath thoroughly or use a sampli ng tube exte nding to the bottom of thetank and go overthe tank unif
13、ormly from one end to the other.3. The temperature of the bath sample should be maintained at the proper operating temperature duri ngthe test. The best method for test ing samples at high temperatures is by using aModel HT Hull Cell,which is equipped with a heati ng eleme nt and thermostat.4. Use a
14、 clea n Hull Cell and clea n the cathode pan el. If more tha n one type of plat ing soluti on is to betested regularly, one cell should be used exclusively for each type to avoid crosscon tam in ati on.5. Hull Cell plat ing tests do not elim in ate the n eed for occasi onal chemical an alysis.Such a
15、n alyses shouldbe made before the plati ng test so that the bath sample can be adjusted to the optimum compositi oneither prior to or duri ng the seque nee of Hull Cell tests.分析方法在進(jìn)行赫爾槽測(cè)試前,以下的步驟必修遵循1使要進(jìn)行測(cè)試的鍍液操作條件和鍍槽里的一樣。2要么徹底攪拌鍍液或使用采樣管延伸到鍍槽底部從鍍槽的一邊轉(zhuǎn)到另一邊。3.在測(cè)試時(shí)測(cè)試鍍液的溫度必修保持在一定的操作范圍,一些要在較高溫度下測(cè)試的鍍液,最好采用可
16、加熱和控溫的赫爾槽4使用清潔的赫爾槽和試片。赫爾槽最好專用,避免不同鍍液的交叉污染。5赫爾槽測(cè)試不能取消代替必要的化學(xué)分析,在赫爾槽測(cè)試前應(yīng)分析樣品,以便鍍液可以在赫爾槽測(cè)試時(shí)調(diào)整到最佳的范圍。6. Zinc coated steel cathode pan els must be stripped of the zinc by immers ing theminto a 1:1 soluti on ofhydrochloric acid and water, rinsed and then cleaned with a wet, clean cloth or wet paper towel,
17、 justbefore use. Since the Hull Cell is an actual plat ing tan k, improperly prepared pan elswill not resp ondsatisfactorily in the cell, just as in commercial practice.7. For duplicati on of results, plat ing times in the Hull Cell should be the same as that used in theproducti on tank. Testi ng ti
18、mes for differe nt soluti ons may differ and are specified in the sect ion thatfollows for the different solutions. A conventional timer can be supplied as an accessory to the Hull Cell set.8. The correct volumes of solution to use is 267 ml for the 267 ml Hull Cell, 534 ml for the 534 ml Hull Cella
19、nd 1000 ml for the 1000 ml Hull Cell. A 2-gram addition to 267 ml, 4-gram addition to the 534 ml or7.5-gram addition to a 1000 ml Hull Cell is equivale nt to a 1 oz/gal (7.5 g/l) addition to the plati ng tank.To test a hot bath sample, the Model HT Hull Cell should be used. NOTE: A LuciteHull Cell s
20、houldn ever be placed on a hot plate.9. CAUTION: DO NOT LEAVE THE HEATER ON OVERNIGHT OR UNATTENDED FOR PROLONGEDPERIODS OF TIME. EVAPORATION OF THE SOLUTION COULD CAUSE A MELT DOWN OF THEHULL CELL ITSELF - A POTENTIAL FIRE HAZARD.10. The Filtered Output Rectifier Model B-267 or Model B-534 is the p
21、referred current source. A sin glephaserectifier without a properly designed filter circuit must not be used.11. Steel cathodes have a semi-bright, uniform appeara nee. Cathodes should only be used once and the nfiled for future referen ce. They should not be stripped and reused, as this will cha ng
22、e the con diti on ofthe surface. Experie nee has show n that a poor or non-uniform steel surface can cause misleadi ngresults. Replaceme nt cathodes that duplicate the origi nal zinc plated cathode pan els provided with theset may be ordered from Atotech. Polished brass pan els are also available fo
23、r usewith copper, ni ckeland chromium plati ng soluti ons.12. Do not make too many tests on one sample of plat ing bath. Gen erally, six pan els cannot be made on asin gle ni ckel-plat ing bath sample uni ess the pH is checked after each sec ond pan el.Here the HT 534cell is desirable because of the
24、 high volume-low curre nt ratio.6.有鋅層的鋼試片在使用前必須用1:1的鹽酸水溶液退掉鋅層,然后用濕的紙巾或布清潔,由于赫爾槽就是一個(gè)實(shí)際上的鍍槽,沒有經(jīng)過認(rèn)真處理清潔的 試片就不能確定滿意的效果,就像實(shí)際電鍍中那樣。7為了實(shí)驗(yàn)結(jié)果的可復(fù)制性,赫爾槽的測(cè)試時(shí)間應(yīng)和實(shí)際的電鍍時(shí)間一致,不同鍍液的測(cè)試時(shí)間可能不同,可通過一個(gè) 計(jì)時(shí)器來控制時(shí)間。8. 使用正確體積的鍍液來測(cè)試, 如 267ml 在 267ml 規(guī)格的赫 爾槽里。測(cè)試熱的鍍液可以用可加熱的赫爾槽,但是應(yīng)注意 透明樹脂的赫爾槽不能用來測(cè)試熱的鍍液。9 注意:使用加熱的赫爾槽時(shí)應(yīng)有人看守,避免鍍液蒸發(fā)完 產(chǎn)
25、生火災(zāi)危險(xiǎn)。10 使用具有良好濾波能力的整流器。11. 試片有半光亮均勻的外觀, 試片只能用一次, 然后保存起 來以供日后參考,試片不能退鍍和重復(fù)使用,因?yàn)檫@將改變 試片表面的狀況,經(jīng)驗(yàn)表明一個(gè)表面很差的或者不均勻的試 片可能會(huì)導(dǎo)致實(shí)驗(yàn)結(jié)果的誤判,安美特可提供覆鋅的鋼板試 片,拋光的黃銅片也可用于銅鎳鉻鍍液的測(cè)試。12 同一個(gè)鍍液樣品不能做太多次的測(cè)試, 一般來說一個(gè)鎳的 樣品最多打六張片,而且每打一張都要檢測(cè)溶液的 PH 值。 如果是 534ML 的槽則可以在低電流打片的時(shí)候多打幾張。13 單位換算克/升=0.134 盎司 /加侖克/升=0.1 千克 /百升SPECIFIC PLATING
26、BATHSThe Hull Cell plating test is best used to determine the effects of varying each type of plating bath used inproduction. For example, if a bright nickel bath is to be tested, each parameter (e.g.temperature, agitation,nickel, sulfate, chloride, brightening agents and metallic impurities such as
27、 copper,lead, zinc, etc.) should beevaluated individually and the effects noted on the deposit. In conducting such tests, itis helpful to make updilute solutions of the proprietary addition agents so that unit volumes added to theHull Cell volume are equivale nt to simple additi ons to the plat ing
28、bath.具體的各種鍍液測(cè)試赫爾槽電鍍測(cè)試是最好的用來確定每個(gè)不同鍍液生產(chǎn)中各種因素的影響,例如,如果一個(gè)光亮鎳鍍液進(jìn)行測(cè)試,每個(gè)參數(shù)(如溫度,攪拌,鎳,硫酸鹽,氯化物, 光亮劑和金屬雜質(zhì)如銅,鉛,鋅等)應(yīng)獨(dú)立的考慮并且在鍍層上表示出來。在進(jìn) 行這種試驗(yàn),稀釋專門的添加劑很有用,以便計(jì)算添加入鍍槽中的量。For solid chemicals, the addition of 2 grams to 267 ml, 4 grams to 534 ml, and 7.5grams to 1000 ml Hull Cellsis equivale nt to 1 oz/gal (7.5 g/l) t
29、o the plati ng tank. Liquid chemicals such asbrighte ners or additi on age nts areno rmally specified or con trolled based on perce nt (%) by vol. (ml/l) or fl.oz/gal.對(duì)固體化學(xué)品,添加2克至267毫升,4克至534毫升,7.5克到1000毫升赫 爾槽相當(dāng)于添加1盎司/加侖(7.5克/升)至電鍍槽。對(duì)光亮劑或補(bǔ)充劑等液體 化學(xué)品通常通過毫升/升或fl.oz /加侖指定或控制的體積百分比。When the additive is a
30、 liquid, a solution diluted with water is recommended for HullCell additi ons and testi ng.The material should be diluted to a 20% by volume solution. The addition of one (1.0)ml of a 20% by volumesolution to a 267 ml Hull Cell is equivale nt to an addition of 0.075% by vol. (0.75 ml/l),0.1 fl. oz./
31、gal, of theadditive to the plati ng tank.當(dāng)添加劑是液體時(shí)最好將添加劑稀釋成20%的水溶液,添加1ml到267ml的赫爾槽里相當(dāng)于添加0.75ml/l的這種添加劑到鍍槽里。The value of the Hull Cell test depe nds upon the experie nee that the operator hasgained in using it. Thefollowing generalizations serve as a guide as to what can be expected when testing diffe
32、re nt types of baths.赫爾槽測(cè)試的價(jià)值取決于操作者的經(jīng)驗(yàn),以下概括為一個(gè)測(cè)試不同鍍液的指導(dǎo)。BRIGHT NICKELBright ni ckel baths are probably the most difficult to con trol whe n tryi ng to main tai ndeposit luster. Somebrighte ning age nts can be determ ined by an alysis, in which case, Hull Cell tests serveas a check on theoperating co
33、ndition of the bath. Other brightening agents cannot be checkedan alytically .In this case, the HullCell becomes a useful tool for controlling concentration. Testing of bright nickelsoluti ons requires a uniformquality steel cathode panel in order to check the ability of the bath to build bright nes
34、s.光亮鍍鎳光亮鎳鍍液可能是最難以控制的鍍液,因?yàn)橐3皱儗庸饬?。一些光亮劑可以通過分析確定,在這種情況下,赫爾槽測(cè)試提供了一個(gè)對(duì)鍍液使用狀況的檢查,其他添加劑不能分析,在這種情況下,赫爾 槽成為一種控制濃度的有用工具。光亮 鎳鍍液的測(cè)試需要一個(gè)均勻的優(yōu)質(zhì)試片,以檢查鍍液的光亮能力。Before running a Hull Cell test, the bath should be analyzed for nickel, sulfate, chloride, boric acid and pH.在進(jìn)行測(cè)試前,應(yīng)分析鍍液的鎳,硫酸鹽,氯化物,硼酸和 pH值。Gen erally, the c
35、urre nt used for the 267 ml or 534 ml Hull Cell is 3 amperes and for the1,000 ml un it, 5amperes. For low curre nt den sity problems, a on e-ampere panel is recomme nded.The plating time should be5 minu tes.一般來說,電流密度為的267毫升的赫爾槽或534毫升赫爾槽3安培,為1000毫升的5安培,關(guān)于低電流密度的問題,建議1安培,5分鐘。The plating tests should be
36、 run on the bath as sampled and then after the salts andpH have bee n adjusted.Additional Hull Cell tests should then be made to determine the effects of impuritiesand brighte neradjustme nts.測(cè)試應(yīng)在主鹽和PH值調(diào)整后進(jìn)行,然后再確定添加劑和雜質(zhì)的影響。Solution agitation, if used, is provided by regular movement of a glass-stirr
37、ing rodparallel to the face of thecathode. This can be done either manually or mechanically using the Atotech Hull CellAgitator. Air agitati oncan also be provided by use of the Model HT Hull Cell with a built in air line. Hull Celltests may not alwaysin dicate the slight pitti ng tenden cies of bat
38、hs.鍍液攪拌,如果使用,是由一個(gè)玻璃攪拌棒平行于試片表面反復(fù)運(yùn)動(dòng)這可以手動(dòng)或機(jī)械使用阿托赫爾槽攪拌??諝鈹嚢?,也可用空氣泵提供,赫爾槽試驗(yàn)不一定表明了鍍液的輕微針孔傾向。The temperature should be maintained at the same level as that of the productionbath. The Model HT Hull Cellshould be used for testi ng heated baths.鍍液溫度應(yīng)該和生產(chǎn)鍍液的溫度一致,可使用帶加熱裝置的赫爾槽。The maximumnu mber of tests that ca
39、n be run on one sample is three (five in the 534 ml Hull Cell),uni ess thepH is checked and adjusted.一個(gè)樣最多打三張片,除非鍍液的PH值檢查調(diào)整過。In terpretati on - Bright Nickel解釋-光亮鎳In terpretati on - Bright NickelOptimum Compositi on - Brillia nt, uniform, non-pitted deposits from 5-125 Amps/ft2(0.5-12.5 Amp/dm 2).Hi
40、gh pH - Yellow tinge to deposit, may be irregular and brittle at high current den sities.Low pH - Gassing at cathode, smoky-blue or brittle deposit.Low Nickel - Burned high curre nt den sities area.Low Boric Acid - Checked deposit at high current density, nickel hydroxide precipitated on cathode pan
41、el or a tendency toward pitt ing.Low Chloride - Gass ing at the ano de, low anode efficie ncy, higher tha n no rmal voltage.High An ti-pit Agen t- Smoky, irregular deposit.Low Anti-pit Agent- Pitting of the deposit, particularly noticeable at high current den sities. To check, bend thelower 1/4 (6 c
42、m) edge of the panel to be horizontal and repeat the test. Examine the horiz on tal edge for pits if boric acid concen trati on is n ormal.High Primary or Carrier Brightener - Usually there is no upper limit to this brighte ner content, except solubility.Low Primary or Carrier Brighte ner - Dull, no
43、n-uni form brittle deposit, usually at higher curre nt den sities, poor chrome receptivity.High Booster or Sec on dary Brighte ner -Low Secondary Brightener - Semi-bright deposit exhibiting poor leveling.Organic Contamination - Brittle, hazy deposit usually over the entire plating range, peeli ng at
44、 high curre ntden sity, dull low curre nt den sity ran ge.Dissolved Air or Oil in Bath - Pits or oran ge-peel deposit; splotches that represe nt thin areas.High Bath Temperature - A dull or hazy deposit.Low Bath Temperature - A dull or burned deposit at high current density.最優(yōu)組合:在0.5-12.5 ASD范圍內(nèi) 光亮,
45、均勻,無針孔高PH:鍍層發(fā)黃,高區(qū)異?;虼嘈源蟮蚉H:陰極產(chǎn)生氣體,鍍層發(fā)霧發(fā)藍(lán),脆性大。鎳含量低:高區(qū)燒焦。硼酸低-檢查高電流區(qū),氫氧化鎳沉淀于鍍層或產(chǎn)生針孔。低氯-在陽(yáng)極放氣,低陽(yáng)極效率,高于正常電壓。高濕潤(rùn)劑 -發(fā)霧,非正常鍍層。低濕潤(rùn)劑-針孔,在試片六厘米處彎曲測(cè)試,如果硼酸含量是正常的在試片邊緣檢查是否有針孔。柔軟劑或初級(jí)光亮劑過多-不考慮溶解度外通常無上限。柔軟劑或初級(jí)光亮劑不足-不光亮,不均勻脆性鍍層,套鉻困難。(高電流區(qū)較明顯)光亮劑或次級(jí)光亮劑過多-脆性鍍層,低區(qū)黑色沉積,套鉻困難。次級(jí)光亮劑過少-半光亮度層。有機(jī)污染-脆性大,整個(gè)試片發(fā)朦,低區(qū)無光亮。鍍液中有氣泡或油-針孔
46、或橘皮狀鍍層。高溫-不光亮,發(fā)朦。低溫-不光亮,高區(qū)燒。雜質(zhì)影響Show n by dark deposits at low curre nt den sities.Copper or Zi nc - See Electrolytic Purificati on.Chromium - Black at high curre nt den sities, skip plati ng in low curre nt den sities. Iron - Slight bur ning at high curre nt den sities, rough ness.低區(qū)出現(xiàn)灰黑的鍍層銅或鋅-鉻-高區(qū)
47、發(fā)黑,低區(qū)斷層。 鐵-高區(qū)輕微燒,鍍層粗糙。ROCHELLE COPPER CYANIDEUn der optimum con diti ons, the Rochelle Copper Cyanide bath produces deposits that are smooth and semibrightin appeara nee. The bath serves two purposes - one, to produce a flash coati ng in which variati ons inbath compositi on may be tolerated; and se
48、c ond, to build thick nesses up to 0.4 mils (10 micro ns), where bath composition is more critical.A current of two amperes for 5 minutes should be used at a temperature that corresp onds to that of the plat ingsoluti on. Steel cathodes are recomme nded. The anode should be made of pure copper; phos
49、phorized coppershould not be used. The best means of heat ing soluti ons is in a Model HT Hull Cell.堿銅在最佳條件下,諾切液氰化銅鍍液產(chǎn)生平滑和半光亮的鍍層,鍍液有兩個(gè)目的:1產(chǎn)生一個(gè)閃鍍層,這種用途鍍液成分的變化可以較大的容忍度2.加厚鍍層,這時(shí)鍍液的成分很關(guān)鍵,建議2安培五分鐘,適當(dāng)加溫,采用鋼試片,純銅陽(yáng)極,不能用磷銅,最好采 用可加溫的赫爾槽。In terpretati onOptimum Compositi on for a Still Soluti on - Smooth, fair
50、ly uniform deposit from 5-45Amps/ft 2 (0.5-4.5Amp/dm 2).Optimum Compositi on for an Agitated Soluti on - Semi-bright from 3-60 Amps/ft2(0.3-6.0 Amp/dm 2).Low Overall Concen trati on - Low cathode efficie ncy, gass ing, semi-bright but thi n deposit, depe nding upon actual concen trati on.High Overal
51、l Concen trati on -Same as that for “ Optimum Compositi onLow Free Cyanide-A dull deposit that is not as uniform and smooth as that from the“ Optimum Compositi onThe solution is slightly blue in color.Slightly High Free Cyanide - Somewhat lower efficie ncy tha n that from the“ OptimumComposition ”,b
52、ut a somewhat brighter deposit.Very High Free Cyanide 2 oz/gal (15 g/l) - Low efficie ncy; bur nt deposit at high curre nt den sity.Low Rochelle Salts - Dull deposit similar to that from low free cyanide, but solution is not blue-colored.High Rochelle Salts - Better, brighter, more uniform deposit a
53、ppearance than from optimum compositi on, possibly slightly lower cathode efficie ncy.Low Carbon ate - No effect on cathode; anode polarizati on in the plati ng tank may be no ticed.High Carbon ate 8 oz/gal (60 g/l) - Appreciable dulli ng of depositLow pH (e.g. 11.0) - Slightly irregular depositsHig
54、h pH ( 13.5) - Poor anode corrosion, rough deposit, inclusion of particles in deposit 解釋:正常靜鍍-0.5-4.5ASD范圍內(nèi)產(chǎn)生平滑均勻的鍍層 正常攪拌鍍-0.3-6ASD范圍內(nèi)產(chǎn)生半光亮鍍層 低濃度-陰極效率低,施放氣,半明亮而鍍層較薄,這取決于實(shí)際濃 度。低游離氰-不光亮鍍層,不均勻和光滑,鍍液略有藍(lán)色輕微較高的游離氰-效率較低,但鍍層較光亮。非常高的游離氰-15g/L,效率低,高區(qū)燒。低諾切液-同低游離氰的狀況,但鍍液不會(huì)發(fā)藍(lán)。高諾切液-更光亮均勻平滑的鍍層,可能會(huì)輕微降低陰極效率。低碳酸鹽-試片上
55、無影響,可能會(huì)影響陽(yáng)極極化。高碳酸鹽-60g/L,消光。低PH-輕微的不正常鍍層。高PH-13.5陽(yáng)極腐蝕,鍍層粗糙,有顆粒。Impurities - Rochelle Copper CyanideLead - May brighten slightly, also may cause dark deposits; concentration as a brighte ner is very critical.Iron (large amount) - Reduced cathode efficie ncy; thi n deposit.Zinc - Brassy, irregular dep
56、osit.Chromium - Poor coverage, no deposit at low curre nt den sity end of cathode. The con diti on may be correctedby small additions e.g. 0.01 oz/gal (0.075 g/l) of sodium hydrosulfite powder added to bath (0.02 grams/267 mlin Hull Cell). Additi ons may be made in these amounts un til the problem i
57、s corrected. Excessive additi ons ofsodium hydrosulfite should be avoided to prevent rough deposits. Commercial chrome con trol age nts may alsobe used, as per supplier s recommendation.雜質(zhì):鉛-輕微光亮,也可導(dǎo)致灰黑鍍層,作為光亮劑含量很重要。鐵(大量)-降低陰極效率,鍍層薄。鋅-黃銅鍍層,不規(guī)則鍍層,鉻-低覆蓋性,低電流區(qū)無鍍層,可添加保險(xiǎn)粉處理,但不能過量添加以免鍍層粗糙。 也可以使用商業(yè)除鉻劑。BRIGHT ACID COPPERThe Hull Cell is an excellent tool for bath control, additive balanee, preventive maintenan ce, andtroubleshooting of bright acid copper solutions.The current normally used is two
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