線路板pcb專業(yè)英語詞匯(制造、測試、缺陷名等)

1、pcb英語詞匯（一）1.綜合詞匯printed circuit印制電路printed wiring印制線路printed circuit board印制電路板printed wiring board印制線路板printed component卬制元件printed contact卬制接點single-sided printed circuit board (ssb)單面印制電路板double-sided printed circuit board (ssb)雙面印制電路板multilayer printed circuit board (mlb)多層印制電路板rigid printed cir

2、cuit board剛性印制電路板flexible printed circuit board撓性卬制電路板flex-rigid printed circuit board撓性卬制電路板buildup printed board積層印制板surface laminar circuit (slc)表面層合電路板b2it printd board埋入凸塊互連 印制板altvh multilayer printd board層間全內導通 多層印制板chip on board (cob)載芯片板backplane背板bare board裸板break-away board可斷拼板interconnec

3、tion互連conductor race line導線substrate基底real estate基板面conductor side導線面component side元件面solder side焊接面printing印制grid網格pattern圖形conductive pattern導電圖形non- conductive pattern非導電圖形legend字符mark標總2.基材2. 1基材的種類和結構base material基材laminate層壓板copper-clad laminate (ccl)覆銅箔層壓板prepreg預浸材料bonding shcet/bonding laye

4、r粘結片epoxy glass substrate環(huán)氧玻璃基板copper-clad surface銅箔面foil removal surface去銅箔面length wise direction縱向cross wise direction橫向core material內層芯材2. 2基材的材料a-stage resin/階樹脂b-stage resinb階樹脂c -stage resin|c 階樹脂epoxy resin環(huán)氧樹脂polymer聚合物photosensitive resin感光性樹脂thermosetting resini庶固性樹脂thermoplastic resin熱塑性樹

5、脂adhensive1挖粘劑curing agent固化劑flame retardant牡燃劑opaquer遮光劑polyester film (pet)聚酯薄膜polyimide mm (pi)聚酰亞胺薄膜polytetrafluoetylene(ptfe)'聚四氟乙烯non-woven fabric非織布/無紡布glass fiber3疲璃纖維|glass fabric玻璃布warp-wise經向weft-wise緯向copper foil銅箔eletrodeposited copper foil電解銅箔rolled copper foil壓延銅箔resin coated copp

6、er foil (rcc)涂樹脂銅箔2. 3基材的制造polymerize聚合thermoplastic熱塑性thermoset熱固性clad覆箔layup疊層laminating層壓postcure后固化curing time固化時間resinflow樹脂流動度resin content樹脂含量pcb英語詞匯（二）3設計3. 1通用術語computer-aided design (cad)計算機輔助設計computer-aided manufacturing (cam)計算機輔助制造routing布線layout布圖設計component density元件密度arry陣列3. 2形狀與尺寸

7、conductor導線conductor width導線寬度conductor spacing導線間距conductor width/space導線寬度/間距conductor layer導線層component hole元件孔mounting hole安裝孔supported hole支撐孔unsupported hole非支撐孔via導通孔plated through hole鍍通孔blind via (hole)盲孔buried via (hole)埋孔buried/ blind via埋/盲孔any layer inner via hole (alivh)任意層內部導通孔tooling

8、/ pilot hole定位孔landless hole無連接盤導通孔via-in-pad在連接盤屮導通孔pitch節(jié)距fine pitch粘細節(jié)距3.3電氣互連interfacial connection表面間連接interlayer connection層間連接innerlayer connection內層連接pad, land連接盤component lead3.4其他primary side主面secondary side輔面signal layer信號層crosstalk串擾capacitanee電容electromagnetic interferenee (emt)電磁干擾elec

9、tromagnetic shielding電磁屏蔽impedance特性阻抗inductance電感coplanari ty共面性（度）core material芯板thin type multilayer board薄型多層板buried and blind via hole mutilayer board埋/盲孔多層板buried bump interconnection technology (b2it)嵌入凸塊互連技術multichip modu1e (mcm)多芯片模塊alignment mark對準標記registration mark對位標記layer to layer regi

10、stration層間重合度pcb英語詞匯（三）subtractive process減成法additive process加成法semi-additive process半加成法build up process積層法full-additive processsolder mask on bare copper (smobc)全加成法裸銅覆阻焊工藝tenting掩蔽法sequential laminationwet processpattern plating process濕處理panel plating processreworkingpanelprototypeprocess flowlo

11、t size/ batch圖形電鍍法和制板，拼板試樣板工藝流程ft*finishingtooling featureeirst articleencl productprocess windowjob traveller順序層壓法 板面五鍍狂 最終修飾 工藝標識 首板 最終產品 工藝范圍 工作流程單4. 2照相底版制作artworkartwork masterproduction mastersilver film照相底圖 照相原版 生產底版 銀鹽底片phototoolworking masterphotographic filmdiazo film照相底版工作原版照相底片重氮底片positi

12、vepositive patternnegative負像negative patternphoto plottinggerber filelaser plotter光繪圖gerber文件 激光繪圖機laser plattingphotoplotterregistration mark止像圖形 負像圖形 激光繪圖 光繪機 定位標記4.3圖形轉移printing ink印料etching resist ink抗蝕印料plating resist ink耐電鍍印料resist抗蝕劑photo resist光致抗蝕劑dry film photoresist干膜光致抗蝕劑liquid photoresi

13、st液體光致抗蝕劑positive-acting resist正性抗蝕劑xegative-acting resist負性抗蝕劑plating resist耐電鍍抗蝕劑plated resist抗蝕鍍層permanent resist永久性保護層e1cctro-deposited photoresist電沉積光致抗蝕劑mask掩膜solder resistsolder mask阻焊劑solder mask ink阻焊印料dry film solder mask阻焊干膜liquid photosensitivesolder resist液體光致阻焊劑marking ink legend ink標記

14、印料conductive paste導電膏hole filing ink堵孔油墨peelable solder mask ink可剝性防焊汕齦|thermally curable heat cured熱固化ultraviolet curable (uv cured)紫外線固化screen printing網版印刷silk screen絲印網版stencil網版screcnability網印能力|chasex frame網框fabric> cloth絲網»iesh count網目數squeegee刮板pcb英語詞匯（四）（續(xù)上一頁）skip printing漏印thinner、

15、diluent稀樣劑viscosity粘度imaging成像imaging transfer圖像轉移dry film imaging干膜制圖形lamination貼膜wet lamination濕法貼膜exposure曝光holding time停留時間developing顯影developer顯影液anti-foamer/anti-foaming agent消泡劑resolution分辨率definition逼真度ghost image重影halation暈環(huán)air inclusion夾雜氣泡tackiness粘著性post cure后固化shelf life保存期pot life/ wor

16、king 1ife適用期dip coating浸涂法roller coating轆涂法spray coating噴涂法curtain coating簾幕法laser direct imaging激光直接 成像4. 4清洗與蝕刻rinsing / rinse水洗electrolytic cleaning電解淸洗alkaline degreasing化學除油electrolytic degreasing電解除油overflow溢流deionized water去離子水表面活性 劑surface active agent /surfactantsurface tension表面張力wetting潤濕

17、wetting agent / wetter潤濕劑tarnish污化drag in/ drag out帶進/帶 出brushing / scrubbing磨刷abrasive磨料scrubber磨刷機mechanical cleaning機械清洗chemical clearing化學清洗pumice power浮石粉/火山灰sand blasting噴砂deburring去披峰/去毛刺mechanical polishing機械拋光chemical polishing化學拋光electropolishing電拋光etchant蝕刻劑/ 蝕刻液under etch側蝕microetch微蝕ove

18、r etching過腐蝕stripper剝離液bright dip浸亮4.5電鍍和涂覆plating鍍覆electrochemistry電化學electrolyte電解質electrolytic solution電解液electrochemical corrosion電化學腐 蝕chemical corrosion化學腐蝕ionization電離migration遷移solubility溶解度addition agent/additive添加劑brightening agent/brightener光亮劑levelling agent整平劑catalyst/catalyzei'催化劑a

19、ctivator/activatingagent活化劑accelcration agent/accclerator增速劑chelating agcnt/chclant螯合劑complex絡和物swelling agent/sweller膨松劑plasma等離了體electroplating電鍍metal electroplating金屬電沉積bright plating光亮電鍍pcb英語詞匯（五）（續(xù)上一頁）alloy plating合金電鍍strike plating沖擊鍍flash/flash plating閃鍍pulse plating脈沖電鍍rack plating掛鍍barrel p

20、lating滾鍍brush plating刷鍍selective plating選擇性電鍍auxiliary anode輔助陽極auxiliary cathode輔助陰極preplating鍍前處理postplating鍍后處理plating up電鍍加厚pattern plating圖形電鍍panel p1 ating整板電鍍copper (electro) plating電鍍銅tin-lead plating電鍍錫鉛plating line電鍍線electroless plating, electroless deposition無電電鍍immersion plate浸鍍plated th

21、rough孔金屬化electroless copper化學沉銅holeplatingdirect plating靑接電鍍roughening粗化activating敏化catalyzing催化men tallization金屬化acceleration增速chemisorption化學吸附swelling溶脹hole conditioning整孔hole cleaning洗孔desmear, smear removal去鉆污etchback凹蝕plasma desmear等離子去鉆污passivation鈍化acid dipping弱浸蝕pickling強浸蝕hot melting熱熔fusi

22、ng fluid熱熔液solder levelling焊料整平tin immersion浸錫solder焊錫solder coat焊錫涂層flux助焊劑preflux預焊劑organic solderability preservatives(osp)冇機保護劑black oxidation黑氣化brown oxidation棕氧化pink ring粉紅圈（環(huán)）pits麻點peeling起皮blister起泡orange peel桔皮pores針孔porosity孔隙率hardness硬度tarnish金屬變色4. 6機械加工和壓制drilling鉆孔numerical control (no

23、)數控back-up墊板entry material蓋板spindle主軸ring / collar鉆套feed rate進給速率off set鉆面不勻resin smear樹脂鉆污foil burr銅箔毛刺break-out破出hole counter數孔機laser via hole激光鉆孔photo via hole光致穿孔plasma via hole等離子穿孔counterboring沉頭孔（埋頭孔）countersinking錐形孔platen熱壓板opening/daylight開檔press plate壓模板bonding layer / bonding sheet粘結層kra

24、ft paper牛皮紙lamination void層間空洞dent凹蝕crease皺褶punching沖切bugle hole冷沖die沖模shearing / cutting喇叭孔routing銖切bevelling倒斜邊chamfer倒角scoring刻槽v cutv槽切割sewing hole縫紉孔fixture夾具indexing hole基準孔too ling feature定位特征pcb英語詞匯（六）（續(xù)上一頁）5.檢測5. 1通用術語inspection檢驗tes t試驗as received驗收態(tài)production board成品板test board測試板coupon附連

25、板qualification testing鑒定試驗acceptanee tests驗收試驗accelerated test加速試驗aging老化quality conformance testing質量一致性試驗storage life貯存期specification觀范standard標準tolerance容差/公差nonconformity不合格nonconforming i tern(unit)不合格品defect缺陷sampling inspection抽樣檢驗acceptable quality level (aql)可接收質量水平5. 2外觀和尺寸visualexaminatio

26、n/visualinspection目檢blister起泡blow hole氣孔bulge凸起cracking裂縫crazing微裂紋burr毛刺dishdown凹陷measling白斑delamination分層dent / indentation壓痕fiber exposure露纖維wrinkle皺褶haloing暈圈hole breakout破環(huán)void空洞hole void孔壁空洞foreign mnteri況1（基材內）外來物lifted land連接盤起翹nail heading釘頭nick缺口nodule結瘤pin hole針孔pit麻點resin recession樹脂凹縮sc

27、ratch劃痕3ump凸瘤laminate void層壓空洞mealing粉點shadowing / etch back凹蝕陰影5.3電性能surface insulation resistance (sir)表明絕緣電阻dielectric constant介電常數dielectric strength介電強度dielectric breakdown介電擊穿dielectric withstanding耐電壓1metal migration金屬遷移voltageelectro migration電遷移known good board (kgb)已知好板pcb英語詞匯（七）（續(xù)上一頁）5.4非

28、電性能bond strength粘合強度pull-off strength拉脫強度pull-out strength拉出強度pull strength拉離強度peel strength剝離強度flexural strength彎曲強度tensile strength拉伸強度shear strength剪切強度torsional strength抗扭強度hole pull strength孔拉脫強度pull away拉離tear strength撕裂強度bow弓曲twist扭曲coefficient of thermal expansion (cte)熱導率dimensional stabi1i

29、ty尺寸穩(wěn)定性machinability機械加工性heat resistance耐熱性thermal stress熱應力thermal shock熱沖擊substrate bending test基板彎曲試驗bendability彎曲能力fatigue life疲勞壽命fatigue limit疲勞極限fatigue strength疲勞強度abrasion resistance耐磨（擦）性wear resistance耐磨（損）性crease褶痕soiderability可焊性wetting焊料潤濕dewetting、卜潤濕xonwetting不潤濕microsectioning顯微剖切po

30、rosity test孔隙率試驗cleanliness清潔度ionic cleanliness離子清潔度ionizable contaminant離了污染nonionic contaminant非離了污染organic contarninat i on有機污染outgassing排氣self-extinguishing自熄性chemical resistance耐化學性bleeding滲出6.組裝surface mount technology (smt)表面組裝技術surface mount component(smc)表而組裝元件chip scale package (csp) /chip

31、 scale mounting芯片級組裝flip chip package (fcp)倒芯片封裝soldering焊接reflow soldering再流焊wave soldering波峰焊assembly density組裝密度lead引線lead foot / lead引腳（腿）lead pitch引腳節(jié)距fine pitch devices(fpd)精細節(jié)距器件node連接節(jié)點chip carrier芯片載體ball grid array(bga)球柵陣列chip / die / dice裸芯片flip chip倒裝芯片active devices (parts)有源器件passive

32、devices(parts)無源器件embedded component埋入元件add-on component附加兀件integrated circuit (ic)集成電路resin flux樹脂（松香）助焊 劑bond焊（連）接electrical bridging電橋接dross焊渣：residue殘留物stress relief消除應力印制電路技術英語縮略語alivh (any layer inner via hole)任意層內部導通孔aoi (automatic optional inspection)自動光學檢驗bga (ball grill array)球柵陣列bum (bui1

33、d-up mu11 訂 ayer)積層式多層板but (build-up technology)積層式技術cam (computer aided manufacturing)計算機輔助制造ccl (copper clad laminate)覆銅箔層壓板|cmt (chip mount technology)芯片安裝技術cxc (computer numerical control)計算機數字控制cob (chip-on-board)載芯片板|cpca (china printed circuit association)中國印制電路行業(yè)協(xié)會csp (chip scale packaging)芯片級封裝di (direct imag