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1、 PACKAGING INFORMATIONOrderable Device Status (1Package Type Package DrawingPins Package Qty Eco Plan (2Lead/Ball Finish MSL Peak Temp (3SN74LV4051AD ACTIVE SOIC D 1640Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051ADBR ACTIVE SSOP DB 162000Green (RoHS &no Sb/BrCU NIPDAU Level-1
2、-260C-UNLIM SN74LV4051ADBRE4 ACTIVE SSOP DB 162000Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051ADE4ACTIVE SOIC D 1640Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051ADGVR ACTIVE TVSOP DGV 162000Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051ADGVRE4
3、ACTIVE TVSOP DGV 162000Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051ADR ACTIVE SOIC D 162500Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051ADRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051AN ACTIVE PDIP N 1625Pb-Free (RoHSCU
4、 NIPDAU N /A for Pkg Type SN74LV4051ANE4ACTIVE PDIP N 1625Pb-Free (RoHSCU NIPDAU N /A for Pkg Type SN74LV4051ANSR ACTIVE SO NS 162000Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051ANSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051APW ACTIVE TSS
5、OP PW 1690Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051APWE4ACTIVE TSSOP PW 1690Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051APWG4ACTIVE TSSOP PW 1690Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051APWR ACTIVE TSSOP PW 162000Green (RoHS &no S
6、b/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051APWRE4ACTIVE TSSOP PW 162000Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051APWRG4ACTIVE TSSOP PW 162000Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051APWT ACTIVE TSSOP PW 16250Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C
7、-UNLIM SN74LV4051APWTE4ACTIVE TSSOP PW 16250Green (RoHS &no Sb/BrCU NIPDAU Level-1-260C-UNLIM SN74LV4051ARGYR ACTIVE QFN RGY 161000Green (RoHS &no Sb/BrCU NIPDAU Level-2-260C-1YEAR SN74LV4051ARGYRG4ACTIVEQFNRGY161000Green (RoHS &no Sb/BrCU NIPDAULevel-2-260C-1YEAR(1The marketing status v
8、alues are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend usi
9、ng this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.PACKAGE OPTION ADDENDUM18-Jul-2006Addendum-Page 1OBSOLETE:TI has discontinued the production of the device.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (R
10、oHS:TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperature
11、s,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt:This component has a RoHS exemption for either 1lead-based flip-chip solder bumps used between the die and package,or 2lead-based die adhesive used between the die and leadframe.The component is otherwis
12、e considered Pb-Free (RoHS compatibleas defined above.Green (RoHS &no Sb/Br:TI defines "Green"to mean Pb-Free (RoHS compatible,and free of Bromine (Brand Antimony (Sbbased flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material(3MSL,Peak Temp.-The Moisture Sensit
13、ivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on informat
14、ion provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In
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