半導(dǎo)體基礎(chǔ)英文用語

1、精品Siliconingot硅錠Wafer晶片Mirrorwafer鏡面晶圓Patter晶圓片F(xiàn)AB：fabrication制造FabricationFacility制造wafer生產(chǎn)工廠Probetest探針測試Probecard探針板Contact連接ProbeTip探頭端部ChipFunction功能EPM：ElectricalParameterMonitoringSummary總結(jié)R&D：ResearchandDevelopment研究和開發(fā)MCP：MultiChipPackage多芯片封裝POP：PackageonPackagee-MMC：embeddedMultiMedia

2、card嵌入式多媒體卡WLP：WaferLevelPackage晶圓級(jí)封裝SDP一層DDP兩層QDP四層感謝下載載ODP八層PadoutBackGrind背研磨WaferGrindBackGrind磨片Overview概述TPM：TotalProfitManagementSKTPMOperation操作Erase消除KeyPara.：Keyparameter關(guān)鍵參數(shù)Cycling寫入次數(shù)、循環(huán)次數(shù)Retention保留時(shí)間Non-VolatilememoryVolatilememoryRead讀Write寫Refresh更新Speed速度、速率、轉(zhuǎn)速Restore修復(fù)、恢復(fù)Electrical

3、Signal電信號(hào)WFBI：WaferBurn-InPT1H：ProbeTest1HotTestPT1C：ProbeTest1ColdTestL/Rep：LaserRepairPurpose目的Substrate基片Trend趨勢SmallSize小體積HighDensity高集成HighSpeed高速度Roadmap路標(biāo)TSOP：Thinsmalloutlinepackage薄型小尺寸封裝FBGA：(FineBallGridArray)package細(xì)間距球柵陣列(一種封裝模式)FlipChipPackage：在wafer的chip上形成bump直接在substrate或PCB基板上填充形態(tài)

4、，使I/O最高密度化的填充方式。Stack堆疊stackpackageB/G：BackGrind背研磨W/S：WaferSawD/A：DieAttachW/B：WireBondM/D：MoldM/K：MarkingSBM：SolderBallMountS/G：SingulationEMS：EpoxyMoldingCompound環(huán)氧樹脂Assembly裝配、集會(huì)、集合PreLoardTDBI：TestDuringBurnInEarlyfailure初期不良率Constantfail-rate穩(wěn)定的fail分布Wear-out磨損PDA：PercentageDefectAllowanceBurn

5、-In后Device的可靠性check的基準(zhǔn)Burn-In高溫加速老化試驗(yàn)MVP：MarkingVisualPackingM/S:Markingstore按speed分類Laser激光Server服務(wù)器FB-DIMM：FullyBufferedDualIn-lineMemoryModule全緩存雙線內(nèi)存模組So-DIMM：SmalloutlineDIMM筆記本內(nèi)存Application應(yīng)用程序Shipping產(chǎn)品出口PCB：PrintCircuitBoard印刷電路板MLCC：MultiLayerCeramicCapacitor多層陶瓷電容器A/R：ArrayResister數(shù)組電阻器Chip

6、Resister片狀電阻器EEPROM：ElectricallyErasableProgrammableReadOnlyMemory電可擦只讀儲(chǔ)存器PrintPCBPad上涂抹SolderPasteSolder焊接ChipMount往PCB上Mount附件Reflow用Reflow用產(chǎn)生的熱來使附件和PCB進(jìn)行連接AutoOpticalInspection通過光學(xué)檢查附件的Joint狀態(tài)LabelAttach用Auto在Module上貼LabelRouter分割連在一起的PCBAOQ：AverageOutgoingQuality平均出貨品質(zhì)T/B：TestBankLOAD：LoadingU/L

7、：UnloadingLIS：LeadInspectionSystemFVI：FinalVisualInspection最后外觀檢查EFR：EarlyFailureRateQPE：QAPackageElectricalQPV：QAPackageVisualIPK：InnerBoxPackingQPP：QAPackagePackingQFS：QAFinishedGoodsStoreFGS：FinishedGoodsStoreTAT：TurnAroundTimeLithography光刻Microlithography顯微光刻Expose曝光Coat涂層Bake烘烤Develop顯影Thicknes

8、s層、濃度Temp臨時(shí)雇員、做臨時(shí)工作Energy精神、能量、活力focus焦距、清晰illumination景深overlay覆蓋物、鍍lens透鏡、鏡頭、給攝影alignment隊(duì)列、校準(zhǔn)、結(jié)盟oxide絕緣體、氧化物polymer聚合物WetEtching濕法刻蝕DryEtching干法刻蝕chamber房間、室、腔pump用抽水機(jī)抽、泵、打氣筒plasma等離子體effect產(chǎn)生、作用、效果inhibitor抗化劑pattern模仿、樣品hole穴、洞、孔content內(nèi)容、目錄化學(xué)氣相沉積物理氣相沉積等離子增強(qiáng)化學(xué)氣象沉積高密度等離子化學(xué)氣相沉積Deposit存款、使沉積、沉淀物CV

9、D：ChemicalVaporDepositionPVD：PhysicalVaporDepositionPECVD：PlasmaEnhancedCVDHDPCVD：HighDensityPlasmarare速度、責(zé)罵temperature溫度Range偏差、排、山脈Uniformity均勻度Sigma標(biāo)準(zhǔn)差DriverTorqueWrenchWrenchLongNoseplierNipperSolderingFileWireStripperMonkeySpannerOpenspannerLevelMeterPipeWrenchSnapRingPlireMircoMeterStepCoverag

10、e臺(tái)階覆蓋率AspectRatio深寬比Metal金屬Particle顆粒雜質(zhì)Stress應(yīng)力Reflectance反射系數(shù)Dielectric介電質(zhì)RefractiveIndex折射系數(shù)Dopant參雜濃度Tensile拉應(yīng)力Compressive壓應(yīng)力Incidentlight入射光Application應(yīng)用Conformity共形性O(shè)verhang懸突LPCVD：LowPressureChemicalVaporDeposition低壓化學(xué)氣相沉積CMP：ChemicalMechanicalPlanarization化學(xué)機(jī)械平坦化Analysis分析Synthesis綜合Convergen

11、t集中性Divergent發(fā)散性Vertical垂直性Latercal水平性Skills技術(shù)Techniques方法、技巧、技術(shù)LogicTree邏輯樹Brainstorming頭腦風(fēng)暴Visualization形象化Solution解決方案Thinking思考SPC：StatisticalProcessControlCPK：CapabilityIndexIQC：IncomingQualityControlCAR：correctiveActionRequestCleanRoomPurging去除產(chǎn)生的微粒子Prohibiting防止微粒子的產(chǎn)生Preventing防止微粒子的侵入Providi

12、ng維持必要的溫度、濕度SupplyunitReturnunitAirshowerBondheadBondingtimeCodingtimeMCP：MultiChipPackageVacuum真空吸塵器Ventury噴嘴Cassette片匣TDBI：TestDuringBurnIn進(jìn)行rest中，進(jìn)行BurnIn的工程B/I：BurnInSORTER:向bib進(jìn)行Load/Unload作業(yè)的device設(shè)備SYSTEM:進(jìn)行B/I&test裝載Device的BIB設(shè)備BIB：BurnInBoardSYSREM設(shè)備中為了DeviceTest按Socket個(gè)別裝載Device的BoardB

13、IN：按照DeviceTest結(jié)果值以Category來區(qū)分BS：Burn-infailsplit在SYSTEM設(shè)備DeviceTest結(jié)果中發(fā)生Fail的BIN用語O/S：Open/ShortDeviceTest結(jié)果中發(fā)生Fail的BIN用語BC：B/Ifailcombine1次BIfailcombineBCC：B/Ifailcombine2次BIfailcombineINS/REM：Insent/Remove進(jìn)行l(wèi)oad/Unload作業(yè)Device向BIBSocketCapa-UpAlign排列Renaissance復(fù)活、復(fù)興、新生Wearasmock穿防塵服Wearamask戴口罩We

14、arasmockcap帶防塵帽Putyourshoeson/Finish穿防塵鞋/完畢Cleanmat去出異物用墊ESD：ElectroStaticDischarge靜電Conductive導(dǎo)電性StaticDissipative消散性Insulator絕緣體Antistatic帶電防止性EOS電過載ElectrostaticShield屏蔽靜電Ground接地Ionizer防靜電裝置Neutralization中和TriboelectricCharging摩擦帶電InductionCharging引導(dǎo)帶電SprayCharging噴出帶電4M：Man、Machine、Material、Met

15、hodEPA：ESDProtectAreaESD保護(hù)區(qū)域PCN：ProcessChangeNotificationProcess裝置標(biāo)RAM：ReturnedMaterialAnalysis/AuthorizationEOP：EquipmentEngineer設(shè)備、Operator工作者、Engineer工程EPSC：EquipmentProcessStandardizationCommittee準(zhǔn)化橫展開Frontline一般用紙Whiteboard粉板Filler填充劑MSDS：MaterialSafetyDataSheet物質(zhì)安全保健資料Line生產(chǎn)作業(yè)現(xiàn)場Work-man-ship基本技能UPH：UnitPerHour每小時(shí)生產(chǎn)量SW：SuperWideW：wideN：normalCarrier=ContainerDostcoverMagazineIndexPickupSensor傳感器KPT：KeyPerformanceIndicatorLaminationUV：ultraviolet紫外線