LED照明常用詞匯中英文對照(三)

1、thin film hybrid circuitLED照明常用詞匯中英文對照( 三)印制電路printed circuit印制線路printed wiring印制板printed board印制板電路printed circuit board印制線路板printed wiring board印制元件printed component印制接點printed contact印制板裝配printed board assembly板 board剛性印制板rigid printed board撓性印制電路flexible printed circuit撓性印制線路flexible printed wir

2、ing齊平印制板flush printed board金屬芯印制板metal core printed board金屬基印制板metal base printed board多重布線印制板mulit-wiring printed board塑電路板molded circuit board散線印制板discrete wiring board微線印制板micro wire board積層印制板buile-up printed board表面層合電路板surface laminar circuit埋入凸塊連印制板B2it printed board載芯片板chip on board埋電阻板burie

3、d resistance board母板mother board子板daughter board背板backplane裸板bare board鍵盤板夾心板copper-invar-copper board動態(tài)撓性板dynamic flex board靜態(tài)撓性板static flex board可斷拼板break-away planel電纜cable撓性扁平電纜flexible flat cable (FFC)薄膜開關(guān)membrane switch混合電路hybrid circuit厚膜thick film厚膜電路thick film circuit薄膜thin film薄膜混合電路互連inte

4、rconnection導(dǎo)線conductor trace line齊平導(dǎo)線flush conductor傳輸線transmission line跨交crossover板邊插頭edge-board contact增強板stiffener基底substrate基板面real estate導(dǎo)線面conductor side元件面component side焊接面solder side導(dǎo)電圖形conductive pattern非導(dǎo)電圖形non-conductive pattern基材base material層壓板laminate覆金屬箔基材metal-clad bade material覆銅箔層壓

5、板copper-clad laminate (CCL)復(fù)合層壓板composite laminate薄層壓板thin laminate基體材料basis material預(yù)浸材料prepreg粘結(jié)片bonding sheet預(yù)浸粘結(jié)片preimpregnated bonding sheer環(huán)氧玻璃基板epoxy glass substrate預(yù)制內(nèi)層覆箔板mass lamination panel內(nèi)層芯板core material粘結(jié)層bonding layer粘結(jié)膜film adhesive無支撐膠粘劑膜unsupported adhesive film覆蓋層cover layer (cov

6、er lay)增強板材stiffener material銅箔面copper-clad surface去銅箔面foil removal surface層壓板面unclad laminate surface基膜面base film surface膠粘劑面adhesive faec原始光潔面plate finish粗面matt finish剪切板cut to size panel超薄型層壓板ultra thin laminateA 階樹脂A-stage resinB 階樹脂B-stage resinC 階樹脂C-stage resin環(huán)氧樹脂epoxy resin酚醛樹脂phenolic resi

7、n聚酯樹脂polyester resin聚酰亞胺樹脂polyimide resin雙馬來酰亞胺三嗪樹脂bismaleimide-triazine resin丙烯酸樹脂acrylic resin三聚氰胺甲醛樹脂melamine formaldehyde resin多官能環(huán)氧樹脂polyfunctional epoxy resin溴化環(huán)氧樹脂brominated epoxy resin環(huán)氧酚醛epoxy novolac氟樹脂fluroresin硅樹脂silicone resin硅烷silane聚合物polymer無定形聚合物amorphous polymer結(jié)晶現(xiàn)象crystalline pola

8、mer雙晶現(xiàn)象dimorphism共聚物copolymer合成樹脂synthetic熱固性樹脂thermosetting resin·熱塑性樹脂thermoplastic resin·感光性樹脂photosensitive resin·環(huán)氧值epoxy value·雙氰胺dicyandiamide·粘結(jié)劑binder·膠粘劑adesive·固化劑curing agent·阻燃劑flame retardant·遮光劑opaquer·增塑劑plasticizers·不飽和聚酯unsatui

9、ated polyester·聚酯薄膜polyester·聚酰亞胺薄膜polyimide film (PI)·聚四氟乙烯polytetrafluoetylene (PTFE)·增強材料reinforcing material·折痕crease·云織waviness·魚眼fish eye·毛圈長feather length·厚薄段mark·裂縫split·捻度twist of yarn·浸潤劑含量size content·浸潤劑殘留量size residue·

10、;處理劑含量finish level·偶聯(lián)劑couplint agent·斷裂長breaking length·吸水高度height of capillary rise·濕強度保留率wet strength retention·白度whitenness·導(dǎo)電箔conductive foil·銅箔copper foil·壓延銅箔rolled copper foil·光面shiny side·粗糙面matte side·處理面treated side·防銹處理stain proo

11、fing·雙面處理銅箔double treated foil·模擬simulation·邏輯模擬logic simulation·電路模擬circit simulation·時序模擬timing simulation·模塊化modularization·設(shè)計原點design origin·優(yōu)化（設(shè)計）optimization (design)·供設(shè)計優(yōu)化坐標(biāo)軸predominant axis·表格原點table origin·元件安置component positioning·

12、;比例因子scaling factor·掃描填充scan filling·矩形填充rectangle filling·填充域region filling·實體設(shè)計physical design·邏輯設(shè)計logic design·邏輯電路logic circuit·層次設(shè)計hierarchical design·自頂向下設(shè)計top-down design·自底向上設(shè)計bottom-up design·費用矩陣cost metrix·元件密度component density·自

13、由度degrees freedom·出度out going degree·入度incoming degree·曼哈頓距離manhatton distance·歐幾里德距離euclidean distance·網(wǎng)絡(luò)network·陣列array·段 segment·邏輯logic·邏輯設(shè)計自動化logic design automation·分線separated time·分層separated layer·定順序definite sequence·導(dǎo)線（通道）co

14、nduction (track)·導(dǎo)線（體）寬度conductor width·導(dǎo)線距離conductor spacing·導(dǎo)線層conductor layer·導(dǎo)線寬度 /間距conductor line/space·第一導(dǎo)線層conductor layer No.1·圓形盤round pad·方形盤square pad·菱形盤diamond pad·長方形焊盤oblong pad·子彈形盤bullet pad·淚滴盤teardrop pad·雪人盤snowman pad&

15、#183;形盤V-shaped pad V·環(huán)形盤annular pad·非圓形盤non-circular pad·隔離盤isolation pad·非功能連接盤monfunctional pad·偏置連接盤offset land·腹（背）裸盤back-bard land· 盤址anchoring spaur·連接盤圖形land pattern·連接盤網(wǎng)格陣列l(wèi)and grid array·孔環(huán)annular ring·元件孔component hole·安裝孔mountin

16、g hole·支撐孔supported hole·非支撐孔unsupported hole·導(dǎo)通孔via·鍍通孔plated through hole (PTH)·余隙孔access hole·盲孔blind via (hole)·埋孔buried via hole·埋 ,盲孔buried blind via·任意層內(nèi)部導(dǎo)通孔any layer inner via hole·全部鉆孔all drilled hole·定位孔toaling hole·無連接盤孔landless hole·中間孔interstitial hole·無連接盤導(dǎo)通