tpm全員生產(chǎn)管理專題教學英文講座步驟PPT學習教案

1、會計學1tpm全員生產(chǎn)管理專題教學英文講座步驟全員生產(chǎn)管理專題教學英文講座步驟 Total Productive Manufacturing is not just a program. It is a long term production efficiency improvement process to attain a predictable manufacturing environment. Through total involvement of the entire workforce, the quality of product and machine uptime ca

2、n be improved by continuously improving the equipment performance. TPM can also reduce total production and maintenance costs.What is Total Productive Manufacturing (TPM) ?第1頁/共77頁EQUIPMENT EFFECTIVENESSMAXIMIZE SEVERE COMPETITION FOR DEVELOPING NEW PRODUCTS # CYCLE TIME # QUALITY # COSTINTERNAL NEE

3、DSREDUCE OPERATION COSTSREDUCTION OF QUALITY DEFECTSREDUCE PRODUCTION CYCLE TIMEREDUCE INVENTORIESSAFETY & CLEAN WORKPLACE OUTSIDE-COMPANY NEEDS TOTAL PRODUCTIVE MANUFACTURINGTHE NEED OF T.P.M.第2頁/共77頁I OPERATE - YOU FIX!I OPERATE AND I MAINTAIN IT! BREAKDOWN MAINTENANCE BREAKDOWN PREVENTIONTPM

4、requires a change in culture to embrace new disciplines !Old ThinkingNew Thinking第3頁/共77頁第4頁/共77頁ZEROZEROZEROZEROZEROZERO第5頁/共77頁E .H. S.Continuous ImprovementAutonomous MaintenancePlanned MaintenanceTraining & EducationInitial Flow ControlQuality MaintenanceOffice TPM不斷改進自覺性維護計劃性維護質(zhì)量維護新產(chǎn)品研究發(fā)展系統(tǒng)

5、環(huán)境健康安全系統(tǒng)行政管理培訓與教育第6頁/共77頁 OVERALL EQUIPMENT EFFECTIVENESS(O.E.E.)(O.E.E.)EQUIPMENTEQUIPMENT 6 BIG LOSSES 6 BIG LOSSESOVERALL EQUIPMENT EFFECTIVENESSOVERALL EQUIPMENT EFFECTIVENESSRUNNING TIMEOPERATINGTIMEDOWN TIMELOSSESNET OPERATING TIMESPEEDLOSSESVALUABLEOPERATINGDEFECTLOSS 1.- EQUIPMENT FAILURES2.

6、- SETUPS ANDADJUSTMENTS3.- IDLING ANDMINORSTOPPAGES4.-REDUCEDSPEED5.- DEFECTS INPROCESS6.- REDUCED YIELDAVAILABILITYRUNNING TIME - DOWNTIMERUNNING TIMEX 100=460 MIN. - 60MIN.460 MIN.X 100 = 87%AVAILABILITY =(e.g)X 100PROCESSED AMOUNT -DEFEC T AMOUNTPROCESSED AMOUNT(e.g)RATE OFQUALITYPRODUCTS=RATE OF

7、QUALITYPRODUCTS400 MIN. - 8 UNITS400 UNITSX 100 = 98%THEORETICAL CYCLE TIME XPROCESSED AMOUNTOPERATING TIMEPERFORMANCE EFFICIENCY =X 100(e.g)PERFORMANCE EFFICIENCY0.5 MIN./UNIT X400 UNITSPROCESSED AMOUNTX 100 = 50%O.E.E. = AVAILABILITY X PERFORMANCE X RATE OF EFFICIENCY QUALITY PRODUCTS第7頁/共77頁Work-

8、hourshours elapsed EffectiveEnergy# of non-defectiveproduct or weightInput EnergyMaterials(weight)Die/Jig/fixture Energy lossesYield lossesDie/Jig/Fixture losses3 Losses that can impede effective use of production resourcesOperating workerhoursOperating hoursLoading workerhoursLoading hoursNet worki

9、nghoursUtilization hoursEffectiveworker hrs.Net utilizationhoursValue-generating(output)worker hoursValue-generatinghoursManagementlossesMotion lossesArrangement lossesLosses resultingfrom lack ofauto systemMonitoring &Adjustment lossesDowntimelossesPerformancelossesDefectlossesScheduleddowntime

10、SD lossesFailure lossesSetting up &adjustment lossesCutting blade/Jigchange lossesStart -up lossesMinor stoppage/idling lossesSpeed lossesDefect/reworklosses7 majorlossesthat impedeequip.efficien-cyLosses thatcan impedeoperatingrate5 majorlossesthat canimpedehumanwork efficien-cy16 Major LossesO

11、ther D/T losses第8頁/共77頁第9頁/共77頁The primary aim of this pillar is to此 要 點 的 主 要 目 的 是determine the root cause of the problem 在 消 除 16 種 主 要 的 錯 誤 in eliminating the 16 major losses時 找 出 問 題 的 根 本 原 因第10頁/共77頁SCOPE OF C.I.持續(xù)改進的范圍A.M.T&EP.M.Q.M.C.I.Continuous Improvement activities encompass all th

12、e 持續(xù)改進活動包括:在消除16 種主要的錯誤過程中8 TPM pillars in eliminating the 16 Major Losses.的所有 8 個TPM要點IFCEHSOTPM第11頁/共77頁Classification of Failures for AM/PM/CI Activities.AM/PM/CI活動失效分析Responsibility 責任Locations where failures occur 地點Causes of failures 失效原因70 % of Failures that can be preventedthrough A.M.70 % 的

13、失效可以通過防止發(fā)生Pneumatics 氣體 Detector/sensor 探測器/傳感器Driving system 操縱系統(tǒng) Lubricating system 潤滑系統(tǒng)Bolts and nuts 螺釘和螺母Jigs/tools 夾具/工具Electric systems 電子系統(tǒng)Electric/electronic equipment電動/電子設(shè)備Original conditions are not materialized初始條件沒有實現(xiàn)Leaving deterioration unattended(No AM activity)惡化情況沒有解決Shortage of s

14、kills 缺乏技能Non-observance study ofoperating conditions缺乏對操作條件的研究30% of remaining Failures that cannot besolved except through P.M. & C.I.其余的失效只有30不能通過 P.M.和 C.I. 來解決Electric/electronic equipment電動/電子設(shè)備Driving system 操縱系統(tǒng)Hydraulic system 水壓系統(tǒng)Lubricating system 潤滑系統(tǒng)Electric and air pressure systems

15、電動和氣壓系統(tǒng)Detectors/jigs/tools探測器/夾具/工具Leaving deterioration uncertified惡化最后造成停止Inherent design shortcomings內(nèi)在的設(shè)計缺陷Shortage of skills缺乏技能Basic and operatingconditions are not kept不能保持基本的操作條件第12頁/共77頁Collaboration with AM /PM/ T&E /QM和AM/PM/T&E/QM的合作PM Pillar PM要點AM Pillar AM要點CI/QM Pillar CI/QM

16、要點for Continuous Team spirit Enhancement through OPL of Every Information每一條信息的OPL能提高持續(xù)改進小組的團體精神T&E Pillar T&E要點Maintenance維護* Planned Maintenance Activities*維護行動計劃的制定- Periodic Maintenance-定期維護- Predictive Maintenance-預先性維護- Corrective Maintenance-糾正性維護-“Breakdown Maintenance Activities” -細

17、分維護計劃Manufacturing 制造 *AM Activity AM行動 -Correct Operation 正確的操作 -Oiling - Inspection 檢查潤滑油-Cleaning 清潔 -Tightening ？- AM data analysis AM數(shù)據(jù)分析-Restoring 復位-dealing with 處理.-Minor Stoppages 不必要的停機 -Speed Loss 速度降低-Specification Review/Write ups-規(guī)范考評/報告-Zero Defect 零缺陷- 8 equipment & 5 manpower lo

18、sses & Zero Defects-零丟失和缺陷的8種設(shè)備因素和5種人力因素- Dust free root cause analysis-分析根本原因- One stop defect free changeover- Fan In / Fan Out第13頁/共77頁The 9-Steps CI Approach持續(xù)改進的九步曲123456789Theme / Reason For Selection主題/原因選擇Understanding Current Situation了解目前狀況Goal Setting & Plan目標設(shè)定和制訂計劃Outline Of Equ

19、ipment & Process Flow設(shè)備和工藝流程的概要Clarification Of Phenomenon / Problem識別現(xiàn)象/問題Root Cause Analysis分析根本原因Countermeasures對策Effectiveness Verification效果評估Prevent Recurrence & Standardization防止再發(fā)生和標準化第14頁/共77頁Step 1 of CI Approach CI步驟一11.Theme 主題 * Key point 1: Linkage to factory metric* 要點1: 連接工廠的

20、尺度 * Hints: How does it affect factory performance ? % impact to bottom line ? * 提示：它是如何影響工廠的績效的？* Key point 2: How do you select the project ? * 要點2：如何選擇方案？ * Hints: Line Balance Chart, Bottleneck Area, Work needed in the bottleneck operation * 提示：描出對比圖，瓶頸區(qū)，* Key point 3: Evidence as Proof, Correla

21、tion, Mutual & Future Understanding *要點3：驗證的根據(jù)，相互關(guān)系，共同的和將來的理解 * Hints: Visual Sample of Good product with relevant dimension (Valid for VM defect) * 提示：標注有相關(guān)尺寸的優(yōu)良產(chǎn)品的樣圖（對VA 缺陷尤其有效) 第15頁/共77頁Situation: We faced Open/Short Defect in past three years, andthis issue often reduced our Test Yield and i

22、ncrease cost.0.00%0.05%0.10%0.15%0.20%0.25%0.30%0.35%0.40%0.45%May.1999Aug.Nov.Feb.May.Aug.第16頁/共77頁Step 2 of CI Approach CI步驟2122.Understand Current Situation 了解目前狀況* Key point 1: Start with a Big Picture - Overall Trend*要點1：從一幅大圖片開始總的趨勢 * Performance or Defect Trend Charts by Months or Weeks * 績效或

23、缺陷走向圖以月或周計* Key point 2: Paretorise as detail as possible* 要點2： Paretorise 盡可能詳細 * Ex1: Lifted bonds - 1. No bonding impression on pad 2. With bonding impression on pad 3. With bonding impression on die (which part of die from pad?) 4. With damaged post on previous wire 5. With discolored bond pad (

24、what discoloration: yellow, black?) * Ex2: Bent leads - 1. Leads bent sideways (left or right ?) 2. Leads bent downwards 3. Leads bent upwards 4. Leads bent inwards第17頁/共77頁12%6%53%29%ShortNo DieNo WireF/T ContactProblem &Wafer Problem01000020000300004000050000600007000080000Apr May JunJulAug Se

25、pOctNov Dec Jan. Feb.D ShiftC ShiftB ShiftA Shift第18頁/共77頁Step 3 of CI Approach CI 步驟31233.Goal Setting & Plan 目標設(shè)定和制定計劃3.1 Goal: Zero within 3 months 目標：(三個月)之內(nèi)達到（零)3.2 Time Frame: From month to month 時間制定：從月到月3.3 The various items paretorized Ex: Activities GoalTime Frame 1. No bonding impress

26、ion Zero in 1 mth1999 Sep 1 starts 2. With bonding impressionZero in 1 mth1999 Oct 1 starts 3. Bond impression on die Zero in 1 mth1999 Nov 1st starts 4. Damaged post Zero in 1 mth 1999 Dec 1st starts 5. Discolored pad 50% reduction in 2 mth 2000 Jan 1st starts第19頁/共77頁 To Reduce F/T Open Defect Los

27、s from 0.25% in April in 2000 to 0.14% by Apr. 2001.GOAL9-steps CI ApproachStep 1Theme/reason for Selection9 Mar.Step 2Understanding Current Situation22 Mar.Step 3Goal Setting and Plan5 Apr.Step 4Outline of Equipment and Process Flow19 Apr.Step 5Clarification of Phenomenon/Problem3 May.Step 6Root Ca

28、use Analysis9 Dec.Step 7Countermeasures31 Feb.Step 8Effectiveness Verification30 Mar.Step 9Prevent Recurrence and Standardization15 Apr.Completed by Date第20頁/共77頁Step 4 of CI Approach CI步驟四12344.Equipment & Process Flow (Genba Starts here till Step 8)設(shè)備和工藝流程(Genba 由此至步驟八) Genba=現(xiàn)場觀察 * Key point:

29、 Outline major equipment/ process steps related to the problem *要點：描述出與問題相關(guān)的主要的設(shè)備/工藝步驟4.1List the Equipment and/or the process flow of the likely operations that may give rise to the problem. 列出那些能幫助解決問題的合適的操作中的設(shè)備和/或工藝流程Ex1: Lifted bonds - Type 1 to 4 defect Pareto modes Auto Index In - PR Recogniti

30、on - Bond - Auto Index Out Lifted wire - Type 5 defect Incoming Wfr - Saw - Die bond - Auto Index In - PR - Bond - Index Out Ex2: Bent Lead Manual Index In - Trim & Form - Manual Index Out to Tube第21頁/共77頁 Use Five Genes For Data Collection利用數(shù)據(jù)收集的五個因素Go to the shop floor, observe actual conditio

31、ns, collect/verify data and confirm Losses.親臨現(xiàn)場，實地觀察，收集核實數(shù)據(jù)和確認損失 Do not depend on second-source data. 不依賴于二手資料JapaneseDefinitionGenbaOn-SiteGenbutsuActual ObjectGenshoPhenomenonGenriTheory / PrincipleGensokuRules & Standards第22頁/共77頁PHENOMENON = an OCCURRENCE or FACT that can be OBSERVED現(xiàn)象能觀察到的事

32、件或事實To avoid action on assumptions, observe Phenomenon live on the shop floor.為了消除猜測，請親臨現(xiàn)場去觀察“Clear understanding of problem = Half the problem solved”.“徹底地理解問題解決問題的一半”To help clarify the Phenomenon statement, ask為了闡明對現(xiàn)象的陳述，請問以下問題1) During what specific machine operation does the phenomenon occur? 現(xiàn)

33、象出現(xiàn)在機器運行的哪一個環(huán)節(jié)？2) Does it always occur under the same circumstances? 在同樣的環(huán)境下此現(xiàn)象是否經(jīng)常發(fā)生？3) Does it occur at regular or irregular intervals? 此現(xiàn)象發(fā)生的時間間隔是否有規(guī)律？4) Does it get better or worse over time? 此現(xiàn)象朝著好的方向還是壞的方向發(fā)展？5) Does it occur on more than one machine? 此現(xiàn)象是否在一臺以上的機器發(fā)生？6) Does it occur only for c

34、ertain operators? 此現(xiàn)象是否只在某些員工身上發(fā)生？Step 5 of CI Approach CI步驟五12345第23頁/共77頁Step 5 of CI Approach CI步驟五Flow Validation Results123455.Clarification of Phenomenon/ Problem認清現(xiàn)象/問題* Key point: Matching “signature” of problem to the Equipment/ Process flow *要點：問題“信號”與設(shè)備/工藝流程的匹配5.1Post Mortem on Defective

35、units: 在有缺陷的管子上 找出真正原因a) Examine units for clue leading to root cause of problem 檢查管子以找到根本原因的線索b) Items checked are: Scratch or Chip on Surface of package/ leads/ 檢查項目:封裝/管腳表面的劃痕或碎裂 5.2Defect Mapping or Multi-Vari Study:a) Check Pattern/ Trend / Location for which defects occur 缺陷出現(xiàn)時檢查圖案/趨勢/位置b) Dra

36、w conclusion 下結(jié)論5.3Prepare Table for Validation 準備確認表格a) List Equipment/ Process Flow in Column 1 第一欄列出設(shè)備/工藝流程b) List Content for Validation in Column 2 第二欄列出確認項c) List Validation Result in Column 3 第三項列出確認結(jié)果第24頁/共77頁Step 5 of CI Approach CI步驟五 Flow Validation ResultsManual Lead does not touch OKInd

37、ex in any part of the indexerTrim & Unit is pushed off the NGForm floater after trimEtc.123455.4Equipment/ Process Flow Validation:確認設(shè)備工藝流程 a) Validate evidence from 5.1 and 5.2 against each equipment/ process flow in Step 4 b) Enter result in Column 3 of which 在第三欄輸入結(jié)果對應(yīng)于 OK = No problem from t

38、his Equipment/ Process Step or Flow OK = 此設(shè)備/流程無任何問題 NG = Not Good, Problematic Area, To identify differences NG = 不好，有問題的地方，發(fā)現(xiàn)異樣 P = Potential, To include as item for further validation in Step 6 P = 潛在的，有待在步驟六中進一步確認后作結(jié)論5.5Zoom in on problematic step/ flow縮小有問題的范圍第25頁/共77頁Activity 1 - 60 mins1-60分種

39、的活動Divide into groups of 5 to 8 people按每組5至8人分組Select one current issue, and perform CI 9-Steps approach for Step 2, 3, 4 and 5.選擇一個當前的問題，實踐CI 九步法的第2,3,4和第5步After 45 mins, be prepared to share your teams result.45分鐘后，做好與大家分享結(jié)果的準備第26頁/共77頁Step 6 of CI Approach CI步驟六1234566.Root Cause Analysis6.1Sub-P

40、rocess Analysis: 附屬步驟分析a) Zoom in on the problematic sub-processes 縮小有疑問的附屬步驟范圍b) Identify all failure modes 識別所有的失效模式c) Perform Restoration for obvious failure modes detected during Genba 在Genba中，如發(fā)現(xiàn)明顯的失效模式時采取恢復 行動6.2Perform Why-Why Analysis (or other analysis tools) for each Failure modeRefer Why-

41、Why Analysis Training Package進行 Why-Why 分析（或別的分析方法)-根據(jù)每一個失效模式參考相應(yīng)的 Why-Why 分析材料6.3Restoration needed only when需復位的情況a) This is the Spec 它是一種規(guī)格b) This is what we found (not per spec) 它為我們所發(fā)現(xiàn)(不一定是每種規(guī)格)c) Corrective action: Restoration per spec (all dimension shall be quantified!) 糾正行動：復位每一種規(guī)格(所有的尺度都應(yīng)量

42、化)d) Identify permanent corrective action to prevent recurrence 確定長期糾正行動以防止再發(fā)生第27頁/共77頁1Step 6 of CI Approach CI步驟六234566.4Result of Restoration: Validate result of restoration復位的結(jié)果：驗證復位的結(jié)果a) Result 1 is the physical outcome of the restoration 結(jié)果1是復位的物理結(jié)果 a1) The restoration will bring back Accuracy

43、 to within +- 0.5 mil or force within +- 10 kg / cm square . mil或 每平方厘米小于10kg的壓力 a2) Validate that the above is obtained 以上的復位是可行的 a3) If not obtainable, then identify “What has Changed?” before proceeding to Counter-Measures 如果不可行，在執(zhí)行對策之前確定“什么發(fā)生了變化”b) Result 2 is the final outcome on defect elimina

44、tion 結(jié)果2是缺陷排除的最后結(jié)果 b1) If (a) is fully characterized, the result is GIVEN and we will definitely see the improvement. 如果(a)顯示所有的特征，結(jié)果是特定的而且我們可以明確的看出其重要性 b2) If not, then identify “What has Changed ?” before Repeating Restoration 否則，則在重復復位之前明確“什么發(fā)生了變”第28頁/共77頁Understand operating functions and princi

45、ples of the equipment / process熟悉設(shè)備程序的操作功能和方法- perform step-by-step functional sequencing mapping of the equipment /process繪制設(shè)備程序的出按部就班的功能順序圖- perform detailed process mapping of the equipment / process 完成設(shè)備程序的詳細的流程圖Step 6 of CI Approach CI步驟六123456Press IndexbuttonSend signalto CPUEnergizesZ-motorM

46、otor turnsclockwiseTurns beltclockwiseTurns leadscrew c.wSlider assymoves upEXAMPLE第29頁/共77頁Self-teachDie patternDie positionClamperCannot findTest DieInk DieProbed DieNon-sticking第30頁/共77頁36%35%22%4%3%0%0%5%10%15%20%25%30%35%40%NVD UnitNo WireNo DiePull wireNon-stickingShort WireNVD Unit Short Wire

47、 No Die No Wire Pull wire Non-sticking TotalDual Die17051420424363Transistor30711524681737982Total477629446859411345Including:- F/T contact.- Wafer Open(N/A).- Wafer Short.(N/A)D/B& W/B problemF/T Open Defect Units Mapping第31頁/共77頁第32頁/共77頁1Step 7 of CI Approach CI步驟七2345677.Counter-Measures對策7.

48、1Improvement Proposals & Implementation改進建議和執(zhí)行a) Define Problem Statement from “What has Changed?” 根據(jù)“什么發(fā)生了改變”詳細說明問題b) Put up proposal to overcome the above problem 提出建議以克服以上問題c) Implement Proposal 執(zhí)行建議7.2Results of Improvement 改進的結(jié)果a) Validate result of implemented action with respect to quanti

49、fiable data that is, Accuracy within +- 0.5 mil or force within +- 10 kg / cm square. mil或 每平方厘米小于10kg的壓力第33頁/共77頁2. Standardize Touch Sensor wire setup method, standardize Touch Sensor wire spare parts make method. Resp: Guo Zhi Status: Done.3. Made some standard Touch sensor wire spare parts and i

50、ssue to 4 shifts. Resp: Guo Zhi Status: Done.4. Train related technicians in 4 shifts. Resp: Guo Zhi Status: Done.Upper Touch BlockLower Touch BlockSpringTouch Sensor WireLEDJPG(PCB)第34頁/共77頁5. Report Touch Sensor Audit Report every night shift. Related shift repair ASAP. Resp: Night shift superviso

51、r Status: DoneUpper Touch BlockLower Touch BlockSpringTouch Sensor WireLEDJPG(PCB)Touch Sensor AssignmentA Shift: Module 0, 1, 2; 3AB shift: Module 4, 5; 3B, 3X, 3Y, 3ZC shift: Module 6,7; 8A, 8B, 8CD shift: Module 9,10, 8X, 8Y, 8Z6. Related shift repair Touch Sensor ASAP according to above report.

52、Resp: Night shift supervisor Status: Done第35頁/共77頁1Step 8 of CI Approach CI步驟八23456788.Effectiveness Verification效果的確認8.1 Validate improvement in defect/ problem elimination 確認缺陷的改進/問題的解決8.2 Validate impact of improvement to factory indices 確認改進對工廠帶來的影響8.3 Calculate Cost Saving or Avoidance計算節(jié)約或節(jié)省的成

53、本第36頁/共77頁Reduce by half0.19%0.17%0.16%0.14%0.11%55453826250.10%0.12%0.14%0.16%0.18%0.20%Jan. Feb.Mar. Apr.May. Jun010203040506070F/T Open defect rateCannot Find time/machineF/T Open rate vs F/E W/B PRS detect Error第37頁/共77頁F/T Open Defect Rate Trend Chart0.25%0.22% 0.22% 0.22%0.20%0.19%0.18%0.20%0.

54、19% 0.19%0.17%0.16%0.14%0.11%0.08%0.10%0.12%0.14%0.16%0.18%0.20%0.22%0.24%0.26%Apr.00May.Jun.Jul.Aug.Sep.Oct.Nov.Dec.Jan.01FebMar.Apr.May(MTW)Open RateOpen RateGoalGoalReturning High Open rate decrease from 1.0% to 0.08%Charge W/B PRS detect error Returning High Open rate decrease from 0.08% to 0.05

55、%Standard D/B touch sensorinstall method and train techniciansReturn the sample and informationof High Open lot (1.0%) to F/end daily.Charge it into performance.Send out touch sensor report everynight shift. Related shift repair it.第38頁/共77頁1Step 9 of CI Approach CI步驟九234567899.Prevent Recurrence &a

56、mp; Standardization 9.1 Fan-In/ Fan-Out through QM pillar 通過QM輸入/輸出 a) all machines within the departments/ sites部門/場所的所有機器 b) similar machines within departments/ sites 部門/場所相似的機器9.2 Maintenance Prevention Data to IFC PM數(shù)據(jù) 交給IFC 9.3 Sharing in Engineering Showcase/ Symposium/ CFM/ QER在工程櫥窗/討論會/ CFM

57、/ QER 展示 9.4 Recognition through TEA通過TEA得到公認第39頁/共77頁Why?Why?Why?Why?Why?Why?Why?Why?Why?Developed by :KA LimTraining DeptOrg. rel. date : Apr 1999第40頁/共77頁It is a TOOL to determine all PROBABLE CAUSES for each PHENOMENON.它是一種對現(xiàn)象發(fā)生的可能原因進行分析的方法。It is a refined variation of Cause & Effect analysi

58、s, that considers all factors instead of trying to decide the most influential factors.它是一種更進一步的因果分析法,它考慮了所有的因素而不是只找出最具影響的因素。In short, it is a .總而言之，它是.Problem問題Solving解決Tool工具PHENOMENON = an OCCURRENCE or FACT that can be OBSERVED現(xiàn)象一種能觀察到事件或事實第41頁/共77頁Why?It is another tool that can help us determi

59、ne root causes.它是一種尋找根本原因的分析方法It is not a complicated tool, anyone can use it.more users, more benefits.它不是一個復雜的工具，人人都可能使用它，它帶來更大的進步From JIPMs long experience, it has been proven to be EFFECTIVE!JIPM長期的經(jīng)驗已經(jīng)證明它是有效的！第42頁/共77頁JIPM recommended methods to determine root causes JIPM 提倡找到根本原因的方法Defect Rate

60、5 - 1%=/ 1%10 - 5%Cause & EffectAnalysis因果分析法Why-WhyAnalysisPhenomena -Mechanism (P-M)AnalysisTraditionaltools (7 QCCtools)第43頁/共77頁Why-Why Analysisa tool to determine all root causes.尋找所有原因的分析工具based on actual physical facts.建立在所有事實上a tool that requires thorough knowledge of the part/unit/equipment being analyzed.需要對被分析部件/管子/設(shè)備充分了解的分析方法a tool to address problems with relatively low levels of f