o新產(chǎn)品開發(fā)整體流程介紹（PPT33）

1、C-System Introduction will coverRole & Responsibility (R&R)ProcessCx Stage:C0: Proposal phase 構(gòu)想階段C1: Planning phase 規(guī)劃階段C2: R&D Design phase 設(shè)計階段C3: Lab Pilot Run phase 樣品試作階段C4: Eng Pilot Run phase 工程試作階段C5: PD Pilot Run phase 試產(chǎn)階段C6: Mass Production phase 量產(chǎn)階段Role & ResponsibilityFunctionResponsi

2、bilityPM產(chǎn)品經(jīng)理- Product Manager (或計畫專案經(jīng)理- Project Manager)為所負(fù)責(zé)計畫或產(chǎn)品線成敗之總負(fù)責(zé)人, 將依產(chǎn)品線之性質(zhì)指定專人負(fù)責(zé)某類產(chǎn)品,必須對所負(fù)責(zé)產(chǎn)品線專業(yè)領(lǐng)域之發(fā)展及行銷雙方面皆有相當(dāng)程度的了解. 並依照產(chǎn)品之條件及市場狀況,做適當(dāng)?shù)倪\(yùn)用,訂定技術(shù)或產(chǎn)品市場競爭策略,並在適當(dāng)?shù)臅r機(jī)推出適當(dāng)之技術(shù)或產(chǎn)品.TMTM is responsible to coordinate technical issues conflict among HW, SW, ID and ME and decision-making. TM has to handl

3、e all project technical issues. PCC為規(guī)劃推廣、連絡(luò)及控制專案進(jìn)行的負(fù)責(zé)人, 掌握專案進(jìn)行之情況以協(xié)助處理異常狀況, 使新產(chǎn)品能順暢切入工廠且如期推出, 以提高產(chǎn)品競爭力.協(xié)助 R&D RELEASE 開發(fā)階段 BOM CHANGE NOTICE.R&DR&D 包括電子部門及工業(yè)設(shè)計部門,若只寫 HW (Hardware Design) 則指電子部門,若只寫 ID (INDUSTRIAL DESIGN) 則指工業(yè)設(shè)計部門; 包括ME, Thermal, Packing design. 若只寫 SW (Software design) 則指軟體設(shè)計部門有負(fù)責(zé) B

4、IOS, Driver 及 Pre-load 不同工作性質(zhì)之軟體開發(fā)功能. R&D 人員負(fù)責(zé)產(chǎn)品之開發(fā)、設(shè)計、測試規(guī)劃，包括 H/W、S/W及ID的開發(fā)、設(shè)計、提出新發(fā)明及著作權(quán)揭露書. - Wistron CaseRole & ResponsibilityFunctionResponsibilityHW (Hardware Design)* Hardware is responsible for Electronic Engineering Design * Co-works with S/W and QT to make sure that the every function works

5、 well according to spec. * H/W should conduct technical transfer to PE. * H/W should input, update, and maintain the bugs/issues information in the bug tracking system. SW (Software Design)* Software is responsible for the design of BIOS, Driver, Utilities, and S/W Preload. * S/W co-works with H/W a

6、nd QT to make sure that every function works well according to the specification. * S/W has to release the SCD and the Cert. Team Document. * S/W should conduct technical transfer to TE. * S/W has to input/update/maintain the bugs/issues information in the bug tracking system.ID/ME (Industrial Desig

7、n/ Mechanical Engineering)* ID/ME is responsible for Mechanical Engineering, Thermal and Packing designs. * ID/ME should conduct technical transfer to PME. * ID/ME should input, update, and maintain the bugs/issues information in the bug tracking system used.- Wistron CaseRole & ResponsibilityFuncti

8、onResponsibilityPA (EMI/Safety, QT, CE/Reliability, PCB, OS Certification)為產(chǎn)品保證暨開發(fā)支援Function之總稱, 主要負(fù)責(zé)根據(jù) MRS/PES 執(zhí)行各項(xiàng)產(chǎn)品之測試, 諸如 EMC/Safety : REGULATORY TEST , CE : RELIABILITY TEST 及 KEY COMPONENT APPROVAL , PCB : PCB LAYOUT, DC : BOM , OS : OS 認(rèn)證 etc;EMC/SafetyAll products to meet EMC/Safety requirem

9、ents and guarantee the legality in the international marketing. 申請產(chǎn)品之安規(guī)、測試、Debug. QT為R&D轄下所屬之測試單位人員,主要負(fù)責(zé)各項(xiàng)產(chǎn)品之測試,諸如COMPATIBILITY TEST, SOFTWARE TEST, S/W PRELOAD TEST, DIAGNOSTIC PROGRAM TEST ,ETC.,CE/Reliability組件承認(rèn)測試、不良品故障分析及其他附件等材料品質(zhì)之管制及保證 產(chǎn)品相關(guān)之可靠度與環(huán)境實(shí)驗(yàn)，以及可靠度工程之研究與制定. PCBPCB Layout之申請、PCB之設(shè)計、Orcad

10、 library & Mentor library的建立與管理. 信號品質(zhì)CAE分析, PCB layout外包廠商之管理，PCB製造廠商之管理. OS Certification執(zhí)行公司各產(chǎn)品之 OS 相容性認(rèn)證測試及 LOGO 申請. O.S. Beta Site 測試 PDM料號編碼及控管,BOM製作 - Wistron CaseRole & ResponsibilityFunctionResponsibilityAM (Account Manager)1.爭取訂單與客戶合約協(xié)商. 2.協(xié)調(diào)產(chǎn)品SPEC.工程變更 SAMPLE APPROVAL.3.適時反應(yīng)市場需求與趨勢. MM (Ma

11、terial Management)1.MM is responsible for new supplier development, parts purchasing2.Controlling mechanical tooling status including the schedule, capacity, parts readiness, concerns3.Manage the dependencies, long lead-time items. 4.MM also co-works with SQM and CE for component quality improvement

12、 and the key component QVL final versionSQM (Supplier Quality Management)* 零件品質(zhì)管理及參與分包商之評鑑/管理 (SQRC Plan/Status)* 負(fù)責(zé)異常材料分析、追蹤與改善.* 負(fù)責(zé)進(jìn)行產(chǎn)品 QVL CANDIDATE APPROVAL 作業(yè)系統(tǒng) AT mfg. GCSD1.開發(fā)及推動全球客戶服務(wù)及支援計劃.2.各項(xiàng)售後服務(wù)及支援作業(yè).3.參與 Field 品質(zhì)改善作業(yè) (EWG)FI負(fù)責(zé)評估 Project Cost , 決定 Project 是否可行以及 Project 所花費(fèi)之 Cost. Legal合約

13、及專利審核- Wistron CaseRole & ResponsibilityFunctionResponsibilityCFECFE acts on behalf of Wistron global manufacturing operation to deal with the customer, and also acts as a representative of the customer when dealing with internal Wistron teams. Based on the C4/C5 checklist, related reports and proje

14、ct status, CFE is responsible to conclude the exit judgment (Ready or Not ready) during C4/C5 Exit meetings to determine whether a product can move on to PD pilot run/MP or notNPI1.負(fù)責(zé)規(guī)劃、協(xié)調(diào)、整合與提供各 Site製造所需相關(guān)資訊與技術(shù)資料2.協(xié)調(diào)安排新產(chǎn)品轉(zhuǎn)移至海外生產(chǎn)工廠 3.協(xié)調(diào)處理海外生產(chǎn)工廠發(fā)生之生產(chǎn)相關(guān)問題 PE/PME1.產(chǎn)品設(shè)計審查, 產(chǎn)品問題之發(fā)覺及產(chǎn)品移交.2.協(xié)助生產(chǎn)良率提昇,克服生產(chǎn)瓶頸

15、,提高生產(chǎn)力. 3.協(xié)助訂定製造規(guī)格及引進(jìn)新的製作技術(shù),進(jìn)行改善以確保產(chǎn)品品質(zhì). IE1.設(shè)計及管理一個高效率的整合製造系統(tǒng).2.消除浪費(fèi)、杜絕不合理，提高生產(chǎn)力 3.生產(chǎn)流程規(guī)劃、製程改善、標(biāo)準(zhǔn)工時製定 QA1.執(zhí)行製程及產(chǎn)品之檢驗(yàn)並反應(yīng)品質(zhì)報告請相關(guān)單位改善品質(zhì) 2.收集及處理市場及客戶品質(zhì)回饋資料反應(yīng)相關(guān)單位改善品質(zhì) 3.協(xié)助工程單位必要之驗(yàn)證測試. 4.建立PCBA,Final Assembly之檢驗(yàn)標(biāo)準(zhǔn)QE1.執(zhí)行 DQA.FDI, MTBF, ORT Test2.執(zhí)行產(chǎn)品開發(fā)過程之可靠度及環(huán)境測試 (C4)3.協(xié)助工程測試驗(yàn)證 4.品質(zhì)工程問題分析與解決 - Wistron Cas

16、eRole & ResponsibilityFunctionResponsibilityPD (Production)PD has to work with PE, PME and IE respectively to get testing equipment & tools, assembly tools, and SOP ready before C5 Exit. PD is responsible to produce the product. PD is not just for efficiency only but also quality.PSE (Process Engine

17、er)PSE is responsible for SMT process and for releasing the SMT pilot run report. PSE is also responsible for the process continuous improvement (CIP).FAE (Failure Analysis Engineer) or REFAE is responsible for issuing the failure analysis report and forwarding this to related departments for produc

18、t quality improvement. FAE is also responsible for preparing repair SOP if applicable.TETE is responsible for providing and maintaining Test Plan and Test Program. TE also implement all the preload to production line and report the problems related to preload to preload team.PMC/GPMC (Plan Material

19、Control/ Global Plan Material Control)GPMC/PMC is responsible for product fulfillment, final shipping model, supply site and capacity plan, and ramp up plan for all sites.- Wistron CaseWistron C-System Quality ControlProposalPhasePlanningPhaseR&DDesignPhaseLabPilot-runPhaseEngineeringPilot-runPhaseP

20、roductionPilot-runPhaseMassProductionPhaseC0C1C2C3C4C5CheckPointWistron C- PhaseNPIFDI/MTBFDQA/PQC/ FQC Compatibility/DiagnosticSimulation TestLayout & drawing-Signal Integrity-DFX Check-AVL-C-Test Plans Reliability/Stress EMI/ Safety OS & Pre-LoadWIH/WPH/WZS/WKSMRS Check-Service Cost Estimate-Simul

21、ation-Design Peer Review -Lessons LearnedAvailabilityDevelop PlanLaunch FAI & SPCMTBF DemoCIP/CLCAPareto AnalysisEWG ReadyAFRTest ReportsPre-QVL ReadyDiagnostics ProgramBug List & ActionDCN/ECN/ECR FAI report PFMEASQRCTrainingMTBF ReviewQMP/QPA/QSAFPYRPPAPServiceability DesignTest PlansIntegrate Des

22、ign Review Signal QualityDFX IndexInitial Supplier AuditMemorandumDFMEASimulationMTBF EstimateMVPConcept/ProposalMRS Definition ScopeSCEInvestigation& ProposalDesign & SourcingIntegrationValidationReleaseProduct Life CycleMDRR/C4Go/ No Go?MRR/C5Go/ No Go?C6OOB/OBAORT/StressEWG/FQHAFR/DOANew C System

23、 ArchitectureProgressC0 ExitC0 ActivityC0 EntryC1 ExitC1 ActivityC1 EntryC2 ExitC2 ActivityC2 EntryC3 ExitC3 ActivityC3 EntryC4 ExitC4 ActivityC4 EntryC5 ExitC5 ActivityC5 EntryC6 ExitC6 ActivityC6 EntryTimeDetail ActivitiesSubjectScopeDefinitionProcedure.Activities DefinitionRecord & ReportFormat D

24、efinitionEscalation RuleMeasurementStandardProject Management & System MaintenanceNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meetingC3 checklistHW D

25、V test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list reviewC4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R

26、 report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts listC5 checkli

27、stService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportPMPMC0 meetingC1 meetingPMC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleappro

28、val request formC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC0 ChecklistMRSC0/PM C0 Meeting階段 C0構(gòu)想階段 (Proposal Phase) 負(fù)責(zé)單位 計畫經(jīng)理 (Project Manager) 或產(chǎn)品經(jīng)理 (Product Manager) 目的 *

29、確訂提案構(gòu)想或市場需求規(guī)格書 (MRS)* 可行性分析 工作重點(diǎn) * 相關(guān)提案之市場資料搜集* 相關(guān)提案之關(guān)鍵技術(shù)資料搜集* R&D 提出技術(shù)可行性分析* PM 執(zhí)行可行性及效益評估審核會議 C0目的 評估是否成立專案計畫，進(jìn)行研發(fā) 檢核項(xiàng)目 計畫提案書或市場需求規(guī)格書 (MRS) C0-工作重點(diǎn)及檢核項(xiàng)目New C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass

30、production phaseC2 meetingC3 meetingC4 meetingC5 meetingC3 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list reviewC4 checklistBOMQVLTime standardSyst

31、em BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Rel

32、iability test reportKey Component verificationSpare parts listC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportPMPMC0 meetingC1 meetingPM C0 ChecklistMRSC2 checklistPESEMC/Safety Request FormBOM/QVL

33、(Prel.)PCB Layout (prel.)Outsourcing modulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request formC1/PMC1 MeetingC1-工作重點(diǎn)及檢核項(xiàng)目

34、階段 C1規(guī)劃階段 (Planning Phase) 負(fù)責(zé)單位 計畫經(jīng)理 (Project Manager) 或產(chǎn)品經(jīng)理 (Product Manager) 目的 * 規(guī)格的擬訂* 專案組織的成立* 專案時程的規(guī)劃 工作重點(diǎn) * 選任技術(shù)經(jīng)理 (Technical Manager, 簡稱TM) 並成立專案組織* 計畫專案經(jīng)理(Project Manager)或產(chǎn)品經(jīng)理，規(guī)劃專案時程* 召開C1審核會議* 法務(wù)確認(rèn)Legal Concern、如Potential Patent List, Invention Disclosure* 成立專案團(tuán)隊(duì) 審核會議 C1目的 成立專案團(tuán)隊(duì)、確定開發(fā)時程 檢

35、核項(xiàng)目 Time ScheduleProject TeamInvention DisclosureGreen Design Check ListSample Request Form Case - bottle Coca in England開採鋁礦一噸鋁土提鍊半噸氧化鋁半小時加工半噸氧化鋁熔煉成1/4噸金屬鋁再加工二週成鋁錠瑞典或梛威熔爐工廠澳大利亞澳大利亞化學(xué)還原工廠加熱至華氏900度壓延成1/8 inch薄片瑞典和德國壓延廠船運(yùn)一個月冷軋成1/80 inch薄片冷軋廠英國易開罐廠成型，清洗，烘乾，防鏽裝填，印刷英國可樂廠消費(fèi)鋁罐回收儘16%Ecological Rucksack (生態(tài)包

36、袱)生產(chǎn)一片半導(dǎo)體晶片所產(chǎn)生之廢料為產(chǎn)品重量之十萬倍生產(chǎn)一臺筆記型電腦所產(chǎn)生之廢料為產(chǎn)品重量之四千倍生產(chǎn)一公升佛羅里達(dá)橘子汁需要兩公升汽油及一千公升之水生產(chǎn)一噸紙需用掉九十八噸之其他資源 資料來源 : 綠色資本主義 天下出版社EU RoHS Directive指令期程2003.01.27 指令發(fā)布2003.02.13 歐盟公報發(fā)行,指令生效2004.08.13 轉(zhuǎn)為會員國當(dāng)?shù)胤?法規(guī)或行政指令2006.07.01 新投入之產(chǎn)品不得含有禁用物質(zhì)指令要求/禁用項(xiàng)目鉛 (Pb)鎘 (Cd)汞 (Hg)六價鉻 (Cr6+)多溴聯(lián)苯(PBB)多溴化二苯乙醚(PBDE)(The restriction

37、of the use of certain hazardous substances in electrical and electronic equipment)EU RoHS 管制規(guī)格SubstancesE.U. 建議值Lead (Pb) 鉛 ; 銲錫1000 PPMLead (Pb) 鉛 ; 塑膠,線材,塗料1000 PPMCadmium (Cd) 鎘100 PPMMercury (Hg) 汞1000 PPMHex. Chromium (Cr6+) 六價鉻1000 PPMPBB (聚溴聯(lián)苯) 1000 PPMPBDE (聚溴二苯醚)1000 PPM重金屬：汞、鉛、鎘、六價鉻溴性耐燃劑：聚

38、溴聯(lián)苯(PBBs)、溴聯(lián)苯醚(PBDEs)註：另有管制規(guī)範(fàn)外的項(xiàng)目EU WEEE DirectiveDirective 2002/96/EC期程2003.01.27 指令發(fā)布2003.02.13 歐盟公報發(fā)行，指令生效2004.08.13 轉(zhuǎn)為會員國當(dāng)?shù)胤?法規(guī)或行政指令2005.08.13 完成回收系統(tǒng)建構(gòu),製造商因應(yīng)回收之 財務(wù)規(guī)劃就緒2006.12.31 回收再利用率達(dá)每人每年4kg2008.12.31 訂定下階段目標(biāo)回收Target of Recovery and Recycling(Waste Electrical and Electronic Equipment)WEEE Cat

39、egoryLarge household appliancesSmall household appliancesIT & telecommunications appliancesConsumer equipmentLighting equipmentElectrical and electronic toolsToys, leisure & sports equipmentMedical devicesMonitoring and control instrumentsAutomatic dispensersRate of RecoveryRate of Recycling80%75%70

40、%50%75%65%75%65%70%50%70%50%70%50%*70%50%80%75% * To be determined by 31 December 2006New C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meetingC3 checklist

41、HW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list reviewC4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng.

42、 P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts listC5 che

43、cklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportPMPMC0 meetingC1 meetingPM C0 ChecklistMRSPMC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck l

44、istNon QVL/Sampleapproval request formNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modulespecificationC2/PMC2 MeetingC2 -工作重點(diǎn)及檢核項(xiàng)目階段 C2設(shè)計階段 (R&D Design Phase) 負(fù)責(zé)單位 技術(shù)經(jīng)理 (Technical Manager)研發(fā)部門 目的 *

45、 軟、硬體、機(jī)構(gòu)設(shè)計* 証實(shí)設(shè)計可行性* 修正軟、硬體、機(jī)構(gòu)規(guī)格 工作重點(diǎn) * 電路設(shè)計並完成電路圖* 機(jī)構(gòu)設(shè)計並完成機(jī)構(gòu)設(shè)計圖* 機(jī)電整合設(shè)計並完成機(jī)電介面設(shè)計* 軟體設(shè)計並完成初步版本* 電路設(shè)計Review* 機(jī)構(gòu)設(shè)計Review* 機(jī)電整合設(shè)計Review* 建立初步之測試計畫(硬體、軟體、機(jī)構(gòu)) 審核會議 C2目的 * 確定計畫規(guī)格* 檢討設(shè)計階段之工作成效* 決定是否進(jìn)入樣品試作* 查核是否發(fā)出專利之申請 檢核項(xiàng)目 Schematics (Preliminary)S/W SpecificationMechanical & ThermalTest PlanInvention Disc

46、losure Invention DisclosureNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meetingC4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/U

47、tility/DiagnosticRelease EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component ve

48、rificationSpare parts listC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportPMC0 meetingC1 meetingPM C0 ChecklistMRSPMC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen

49、design guide and reviewcheck listNon QVL/Sampleapproval request formC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC3 checklistHW DV test reportSW FV test reportME test reportRel

50、iability test report (prel.)ME/Artwork packing drawingPAL/ROM data listingC3 manufacturability review reportSample approve status & bug list reviewC3/PMC3 MeetingC3 -工作重點(diǎn)及檢核項(xiàng)目階段 C3樣品試作階段 (Lab Pilot Run Phase) 負(fù)責(zé)單位 技術(shù)經(jīng)理 (Technical Manager)研發(fā)部門 目的 * 設(shè)計驗(yàn)證* 依測試結(jié)果修改、變更設(shè)計 工作重點(diǎn) * 樣品試作材料準(zhǔn)備* 樣品試作* 針對樣品進(jìn)行測試及驗(yàn)

51、證* 搜集Project成本資料* 擬定C3品質(zhì)量化目標(biāo)* 機(jī)構(gòu)設(shè)計問題檢討及除錯(Debug)，測試報告檢討* 電路設(shè)計問題檢討及除錯(Debug)，測試報告檢討* 軟體設(shè)計問題檢討除錯(Debug)，測試報告檢討* 法務(wù) - 稽核文件之形成要件是否符合法定要件或工程規(guī)範(fàn) - 專利著作權(quán)、商標(biāo)等智慧財產(chǎn)權(quán)之申請準(zhǔn)備 審核會議 C3目的 檢討樣品測試驗(yàn)證之結(jié)果、並決定是否進(jìn)入工程試作階段 檢核項(xiàng)目 * HW design verification report* Micro processor/EEPROM data listing* Mechanical test report* SW fu

52、nction verification test report* Mechanical Drawing (Preliminary)* C3 Test Report* C4 Test Plan New C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meetingC3

53、 checklistHW DV test reportSW FV test reportME test reportReliability test report (prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus & bug list reviewC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection inst

54、ructionProduct inspection instructionMTBF DEMO test reportPMC0 meetingC1 meetingPM C0 ChecklistMRSPMC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request formC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.

55、)PCB Layout (prel.)Outsourcing modulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC4 checklistBOMQVLTime standardSystem BIOS/KBC FW releaseS/W Driver/AP/Utility/Diagnostic release EE Eng. P/R report SMT WS P/R reportPCBA WS P/R reportME Eng. P/R reportEng. P/R QA

56、review reportSchematics & jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts listC4/PMC4 MeetingWistron Mobile Reliability Test PlanEnvironment Thermal Pro Temperat

57、ure and Humidity Test Vibration, Shock, Drop Tests Altitude Test, Acoustics Tests MTBF Prediction EMC Lightning/Surge Test Voltage Dip Test EFT, ESD Test Harmonic Test IEC1000-4-XX EMI/EMSPower Line Interference Line Voltage/Frequency Test Power Surge Test Voltage Dip and Interruption Power On/Off T

58、est EFT/B Immunity Test Complex Margin TestTransportation Vibration Test Altitude Test Shock Test Drop TestUser Incline Operation Test Bench Handling Test Power Saving Test Pressure Test Audio Quality Torture TestReliability Test LCD ModuleWistron Mobile Reliability Test PlanItemTest ConditionSample

59、 SizeTimeResultHigh Temp / High Humid Op50 80%RH Dynamin20500 HoursPassLow Temp Op0, Dynamic5500 HoursPassHigh Temp Op60, Dynamic10500 HoursPassHigh Temp / High Humid storage60, 90%RH, Storage2240 HoursPassLow Temp storage-20, Storage2240 HoursPassT/C ( Non-Op )-20(30Min) 60(30Min), Storage3100cycle

60、PassAltitude testOperating & Storage272 HoursPassELP-20, Dynamic5072 HoursPassVibration(Non-Op)5500Hz, 0.37Oct/min, 1.5G, X/Y/Z3-PassShock(Non-Op)180G, 2msec, Half Sine, X, Y, Z3-PassBox Vibration5500Hz, 1.0G, 0.5Oct/min15-PassBox Drop76 drop15-PassESDOperatingTop_Case : 12kVPanel : 15kVPanel : 15kV