教程osram文件pfmea范本p-fmea

1、潛在過程失效模式及分析（過程FMEA）Potent i alFail ure ModeandEffectsysi s( P- FMEA)FMEA:FMEA Number頁(yè)碼:Page第頁(yè)共 24 頁(yè)項(xiàng) 目 名 稱: Part Name / Description過程責(zé)任部門:Pros Responsibility Department關(guān) 鍵 日 期:Key DateOFOsarm T8 編 制 者:Prepared byFMEA日期:FMEA Date用途:LED 照明燈2011-2-1712-Feb-2011User APQP 小組 Core Team:過程功能ProsFunction潛在失

2、效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Current preventive Pro s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls Detection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)

3、行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.進(jìn)料/貨倉(cāng)收料(確認(rèn)接收物料,規(guī)格和數(shù)量正確)Materialing（confirm the QTY/Parts Number)部品和名稱錯(cuò)誤不能保證正常生產(chǎn)5/供應(yīng)商來料混裝2供應(yīng)商評(píng)價(jià)確認(rèn)部品和名稱與送貨單是否相符220無(wú)Parts number and name was wrongCant ensure produce5/Package mixed from vendor side2Assess vendorCheck if submit parts number

4、 as the indenture220N/A送貨單上的數(shù)量與實(shí)物不符不能保證生產(chǎn)數(shù)量5/供應(yīng)商來料少數(shù)2供應(yīng)商評(píng)價(jià)確認(rèn)實(shí)物與送貨單上的數(shù)量是否相符220無(wú)ing number is difference with indentureCant ensure productty5/Shortage from vendor side2Assess vendorCheck if submit partsty as the indenture220N/A包裝破損部品損壞4/包裝材料差;在或搬運(yùn)期間沒保存好2供應(yīng)商評(píng)價(jià)包裝規(guī)范目視來料包裝是否完好216無(wú)Packing damagedComponents

5、 damaged4/1.Packing is worst 2.Not be protected withransport and place2Repuest the vendor assessing specification for packingCheck the outer packing216N/AIQC來料檢查 (部品規(guī)格,外觀符合BOM和客戶圖紙 )IQC inginspect(parts spec. and appearance and size etc.)散熱件刮花外觀不良,客戶投訴4/包裝方法不當(dāng),材質(zhì)差.2列入IQC檢查基準(zhǔn)書.IQC受入檢查裝配前100%目視檢查.324無(wú)

6、Heat sink scratchethe surfaceAppearance defect,user complain4/Package unapt or materials worst2Write this item in IQC Work Instruction1.IQC inspect 2.100% checked before assembly324N/A散熱件有毛刺外觀不良4/模具損壞或調(diào)試不當(dāng)2IQC檢查基準(zhǔn)書中追加此項(xiàng)目.IQC受入檢查裝配前100%目視檢查.324無(wú)過程功能ProsFunction潛在失效模式 Potential Failure Mode潛在失效Potenti

7、al Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Current preventive Pro s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls Detection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken

8、嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.Some burrs with Heat sinkAppearance defect4/Mould is bad,or setting unapt2Write this item in IQC Work Instruction1.IQC inspect 2.100% checked before assembly324N/A五金件尺寸差異不能裝配8供應(yīng)商模具損壞,變形,或者生產(chǎn)時(shí)工藝參數(shù)設(shè)定不當(dāng) Setting up unfit parameters at thers produce line,or the mould ofrdamaged3

9、CTQ尺寸列入IQC測(cè)量基準(zhǔn)書.Key-size(CTQ) recorded in IQC WIIQC受入檢查裝配前100%目視檢查 (CTQ尺寸參考客供圖紙)1.IQC inspect 2.100% checked before assembly* CTQ control porefer to parts drawing3721.供應(yīng)商嚴(yán)格按照CTQ尺寸進(jìn)行管 控,2.IQC對(duì) 供應(yīng)商進(jìn)行監(jiān)察,每月進(jìn)行評(píng)價(jià). 1.Vendor must be managedt submit the key- poasCTQrequired. 2.Audit and assess vendor periodi

10、c.IQC/befor C- sle已將OSM提供的圖紙中的 CTQ尺寸給供應(yīng)商82348Handware size over spec.Cant assemble8電線尺寸差異不能裝配/爬電距離不夠8Wire size over spec.Cant assemble/safety ies8塑膠件尺寸差異不能裝配8Plastic size over spec.Cant assemble8燈座PIN變形量規(guī)通不過、爬電距離不夠8包裝方法不當(dāng),材質(zhì)差.3IQC檢查基準(zhǔn)書中追加此項(xiàng)目.IQC受入檢查裝配前100%目視檢查.372供應(yīng)商嚴(yán)格按照CTQ尺寸進(jìn)行管 控,IQC對(duì)供應(yīng)商進(jìn)行監(jiān)察,每月進(jìn)行評(píng)價(jià)

11、.IQC/C-sle前已將OSM提供的圖紙中的CTQ尺寸給供應(yīng)商，供應(yīng)商采用 JIG100%檢查確認(rèn)82232Lbase deform/whorl less/glass breakGauge test NG/safety ies8Package unapt or materials worst3Write items in IQC WI1.IQC inspect 2.100% checked before assembly372Vendor must controlt submit the key- poas CTQ required. Audit and assess vendor peri

12、odic.IQC/befor C- sleRequest supr to 100% check with the gauge.82232過程功能ProsFunction潛在失效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Current preventive Pro s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls D

13、etection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.包裝材料顏色差異4/包材來料不良2IQC檢查基準(zhǔn)書中追加此項(xiàng)目.對(duì)照色卡進(jìn)行檢查.IQC受入檢查裝配前100%目視檢查.432無(wú)Different color for PackingEnd user complain4/e defect21.Write in IQC WI 2.Base on the

14、 color sle to check1.IQC inspect 2.100% checked before package432N/A包裝材質(zhì)與仕樣書不符不能保護(hù)產(chǎn)品4/供應(yīng)錯(cuò)材料;2IQC檢查基準(zhǔn)書中追加此項(xiàng)目.IQC對(duì)照樣品檢查.432無(wú)Packing didnt submit the spec.Product cant be protected4/Vendor use wrong materials2Write in IQC WIBase on the sle to check432N/A部品損壞不能裝配5/包裝材料差;在或搬運(yùn)期間沒保存好2供應(yīng)商評(píng)價(jià)包裝規(guī)范對(duì)來料外觀進(jìn)行檢查330無(wú)

15、Parts damagedCant assemble5/1.Packing is bad 2.Protection badness at transporion and place2Repuest the vendor assessing specification for packingIQC sle check330N/ALED Bin 混整燈的亮度色溫差異7/供應(yīng)商來料混.2檢查員使用掃描系統(tǒng)確認(rèn)用掃描系統(tǒng)核對(duì)檢查342無(wú)LED BixedBrightness and color Temp. differential of whole l7/Mixed fromr2Use the sca

16、ncer system to controlUse the scancer system to check,and then detect.342N/A生產(chǎn)物料配送Kitting沒有按先進(jìn)先出管控材料過期影響產(chǎn)品品質(zhì)5/入倉(cāng)材料標(biāo)識(shí)不明確2入倉(cāng)前在物料盤上貼條形碼貼紙進(jìn)行區(qū)分管理每月對(duì)物料進(jìn)行盤點(diǎn)IQC定期對(duì)庫(kù)存品進(jìn)行330無(wú)t observe FIFOOver the use phase and affect quality5/Marker unclear and place mixed2Attached bar code to define and controlMake an inven

17、tory of all material every monthIQC do sle check periodic330N/A過程功能ProsFunction潛在失效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Current preventive Pro s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls Detect

18、ion探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.溫濕度材料氧化5/未對(duì)保管條件進(jìn)行管控2在倉(cāng)庫(kù)中掛溫濕度計(jì)進(jìn)行;使用空調(diào)系統(tǒng)確認(rèn)溫濕度計(jì)實(shí)際值并進(jìn)行;220無(wú)Temperature and humidity over the spec.Material oxidize5/t control the condition.21.Use meter to con

19、trol 2.Adjusting by air- conditionDo the record and check every day220N/A捺印&裝基板&上板框（捺印 LED BIN 與貼裝物品一致,PCB貼裝位置正確;基板和板框裝入方向正確） Input PCB boardLED BIN捺印錯(cuò)誤或漏捺印LED用錯(cuò)或貼裝后無(wú)法追溯8捺印不清楚2制作捺印解說WI及捺印對(duì)照表班長(zhǎng)每天早上用WI對(duì)操作員進(jìn)行教育,不定期348Stis wrong or loss stLED Bixed8stunclear and miss st2make WI for st Teach operator.Ope

20、rator be teached and check random248貼板錯(cuò)誤印刷機(jī)不印刷或印刷亂5/貼板方法不清楚2作成貼板WI,明確貼板方法班長(zhǎng)每天早上用WI對(duì)操作員進(jìn)行教育,不定期330無(wú)Put wrongitionSoldaste can not be pr5/method of put PCB on holder is unclear2Define the method in WIOperator teach and check random330N/A基板裝反 PCB install the wrong direction設(shè)備不能正確識(shí)別Fixture didnt identif

21、y5/操作員裝反2WI中明確基板裝入板框方向班長(zhǎng)每天早上用WI對(duì)操作員進(jìn)行教育,不定期330無(wú)5/Operator mistake2Show the direction in WIOperator teach and check random330N/A過程功能ProsFunction潛在失效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Curren

22、t preventive Pro s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls Detection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.5/板框安裝方向未說明2WI中對(duì)板框安裝方向進(jìn)行說明班長(zhǎng)每天早上用WI對(duì)操作員進(jìn)行教育,不定期330無(wú)5/t show the direction at the PCB casing

23、2Show the direction in WIOperator teach and check random330N/A錫膏印刷 (錫膏印刷位置、面積正確且用量均勻)Soldr (location and volume fit)印錫過厚、過薄Soldasteheightover spec.元件貼裝后多錫或少錫No solder or more sloder after mounting5刮刀磨損或壓力不符3定期更換刮刀，安裝前進(jìn)行確認(rèn)。氣壓在設(shè)備日常保養(yǎng)表中，制造/成型條件確認(rèn)表中確認(rèn)； 3.WI中體現(xiàn)錫膏印刷厚度1.生產(chǎn)或更換型號(hào)生產(chǎn)時(shí)首件要做錫膏厚度測(cè)試；2依鋼網(wǎng)操作指導(dǎo)進(jìn)行確認(rèn)；3.

24、定期保養(yǎng)鋼網(wǎng)4.追加手動(dòng)清潔刮刀345無(wú)Scrr abraded or press over spec.Change the scrr perioheck before using.Press check base on.Spec of soldaste height wrote in WI1.Soldaste height test every change line 2.Check base on WI 3.Maahe stencil mask periodic4.Added manual clean for crr345N/A1.印刷速度快，2.補(bǔ)充錫膏量3WI中規(guī)定刮刀印刷速度；規(guī)定錫

25、膏一次加錫量為約250g，制造成型條件表中確認(rèn)設(shè)定一次供給錫膏可印刷的塊數(shù)345無(wú)Pred speed over spec.soldaste unfull3Specification recorded at WIThe rules of adding paste is 250g every times.1.Do record at 2.Setup machine warning when soldaste unfull345N/A/鋼網(wǎng)清潔不干凈3設(shè)定每4H手動(dòng)清潔鋼網(wǎng)一回SMT鋼網(wǎng)、刮刀清潔表345無(wú)/Stencil mask dirtyManual clean Stencil mask o

26、nce per 4HDo record345N/A過程功能ProsFunction潛在失效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Current preventive Pro s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls Detection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended

27、Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.錫膏攪拌不充分3按照錫膏管理基準(zhǔn)書作業(yè)在錫膏使用管理表記錄345無(wú)過程功能ProsFunction潛在失效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行

28、預(yù)防過程控制 Current preventive Pro s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls Detection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.soldaste mixed unfull3Control Base on WIDo record345N/A錫膏在鋼網(wǎng)上放置時(shí)間過長(zhǎng)3W/I中規(guī)定錫膏未使

29、用時(shí)在鋼網(wǎng)上放置時(shí)間發(fā)生異常時(shí)及時(shí)處理確認(rèn)345無(wú)Soldaste keng on thestencil over limit3Show time Spec.of solder paste stay at stencil in WIhandleime when bursting345N/A印錫漏印、偏位 No solder paste,solder paste shift元件貼裝欠品，偏位，豎立 Parts missing, shifting,upright5鋼網(wǎng)孔堵塞3設(shè)定每4H手動(dòng)清潔鋼網(wǎng)一回錫膏檢查機(jī)對(duì)印刷狀態(tài)進(jìn)行檢查345無(wú)Hole jammed3Manual clean Stenci

30、l mask once per 4H3X Visual Inspection345N/A基板偏位3調(diào)整最適合基板寬度的軌道錫膏檢查機(jī)對(duì)印刷狀態(tài)進(jìn)行檢查345無(wú)PCB shift3Adjust track3X Visual Inspection345N/A錫膏規(guī)格用錯(cuò)降低產(chǎn)品功能.5/操作員取用錯(cuò)誤3WI中體現(xiàn)錫膏規(guī)格型號(hào)填寫錫膏使用管理表345無(wú)Type of solder paste is mistakeFunction lower5/Operator choose wrong3Show Type Name at WIDo record345N/A錫膏印刷位置錯(cuò)誤零件無(wú)法貼裝導(dǎo)至元件欠品5/

31、鋼網(wǎng)未標(biāo)識(shí)，使用錯(cuò)誤程序選用錯(cuò)位;3在程序一覽表中體現(xiàn)鋼網(wǎng)，鋼網(wǎng)進(jìn)行管理標(biāo)示選用鋼網(wǎng)時(shí)用程序管理一覽表進(jìn)行核對(duì)，制作鋼網(wǎng)一覽表345無(wú)prlocation is wrongParts cant mount5/1.stencil mask choosed wrong 2.Program choosed wrong31.show number of stencil mask at 2.Stencil mask marked and managedChecked base on345N/A錫膏檢查(錫膏印刷位置、面積正確)Soldaste quality未檢查出印刷錫膏偏位，少錫，漏零件無(wú)法貼裝導(dǎo)至

32、元件欠品，裂錫，焊接不良5/錫膏檢查機(jī)程序設(shè)定21.制作錫膏印刷樣品，生產(chǎn)前對(duì)程序進(jìn)行確認(rèn)； 2.W/I中體現(xiàn)錫膏印刷面積基準(zhǔn)及使用樣品對(duì)檢查程序進(jìn)行確認(rèn)填寫錫膏印刷樣品測(cè)試 表及印刷狀況確認(rèn)表330無(wú)過程功能ProsFunction潛在失效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Current preventive Pro s Control

33、s現(xiàn)行探測(cè)過程控制 Current Pros Controls Detection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.inspect(locat ion,volume etc.)Defect cant detect such as shift and no pasteParts solder defect after mounting5/Fixtur

34、e program made insufficient21.Make sle to confirm. 2.Show Spec.at WI , check software base onsle.Do record330N/A過程功能ProsFunction潛在失效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Current preventive Pr

35、o s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls Detection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.自動(dòng)貼片(元件貼裝位置及極性正確)SMT pick up(parts right,direction right etc.)元件漏貼裝、錯(cuò)件、極性錯(cuò)產(chǎn)品無(wú)功能或性能不良No function8/元件貼裝程序設(shè)置錯(cuò)

36、誤；2工程技術(shù)T依元件座標(biāo)作成實(shí)裝程序.元件規(guī)格及元件位置按照BOM設(shè)定上料站位.對(duì)照程序管理一覽表進(jìn)行程序選用每臺(tái)產(chǎn)品進(jìn)行AOI、ICT測(cè)試及PQC目視檢查。232無(wú)Parts missing,wrong parts,wrong direction8/Program set up wrong21.Make program base on parts specification 2.Mount the parts per BOM1 confirm the program type per program list 2.inspect by AOI/ICT/PQC232N/A偏位、破損8/吸嘴不

37、良 ；吸嘴高度設(shè)定不合理4定期對(duì)吸嘴進(jìn)行保養(yǎng)；制作程序時(shí)選用正確物料規(guī)格及現(xiàn)物測(cè)量程序確認(rèn)264制作吸嘴SMT3月底已購(gòu)入吸嘴82232shift,damaged8/1.Nozzadness 2.Nozzle height set up illogical4Nozzle maain periodic.confirm pros of make programConfirme program264order spel NOZZLE for LED mountingSMTEnd of Mar.(C-sle)Use spel NOZZLE for LEDmounting82232錯(cuò)料7/作業(yè)員上料錯(cuò)誤

38、.3作業(yè)員上料時(shí)拿排位表及BOM核對(duì)物料.首件確認(rèn)每次換線或新型號(hào)生產(chǎn)時(shí)由制造部、品管部及制造技術(shù)T進(jìn)行首件確認(rèn);作業(yè)員一個(gè)換料完成后 OK后再進(jìn)行下一個(gè)物料更換操作。363無(wú)Wrong parts7/Operator put wrong parts3Checked base on BOM and Sion List.Do FA1.Do FA 2.Operator confirm one by one,and do record363N/ALED Bin 混用整燈的亮度色溫差異8/作業(yè)員上料錯(cuò)誤.3作業(yè)員上料時(shí)目視確認(rèn)每次換線或新型號(hào)生產(chǎn)時(shí)由制造部、品管部及制造技術(shù)T進(jìn)行首件確認(rèn);作業(yè)員一個(gè)換

39、料完成后 OK后再進(jìn)行下一個(gè)物料更換操作。372當(dāng)SMT自動(dòng)貼片時(shí)，一卷 LED少于18顆時(shí)停止使用該卷，進(jìn)行換 料，確保同一 R的LED使用在同一個(gè)燈管里SMT/PD3月底針對(duì)LED BIN的管理做成管理流程，全員培訓(xùn)，施行。82232過程功能ProsFunction潛在失效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Current preven

40、tive Pro s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls Detection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.LED BixedBrightness and color differential of whole l8/Operator put wrong parts3Use the scancer sys

41、tem to control1.Do FA by PD/QA/ME 2.Operator confirm one by one,and do record372when the LEDs qty in one roll lessn 18pcs,stop this roll,change a new roll to mountingSMT/PDEnd of Mar.(C-sle)Control following LED BINcontrol pro s chart.82232LED貼裝散熱不好,產(chǎn)品壽命短8/元件貼裝高度設(shè)定錯(cuò)誤3測(cè)量高度,根據(jù)實(shí)際高度修正程序.貼裝首件確認(rèn)372使用吸嘴吸取L

42、ED部品SMT/3月底已購(gòu)入吸嘴82232LED mounting shift or floatHeat dispersed difficult, llife lower8/Nozzle height set up illogical3Modify program according to actual sizeDo FA372Order the spel nozzle for mounting LEDSMT/End of Mar.Use the spel nozzle for mounting LED82232過回流焊(回流爐條件符合)Reflow( Submit temperature p

43、rofile the required )錫不充分融化產(chǎn)品無(wú)功能或性能不良No function7焊接溫度設(shè)定過低;回流爐傳送速度過快3在W/I中注明回流爐條件;設(shè)備條件在制造成型條件表中體現(xiàn).1.生產(chǎn)前有爐溫測(cè)試板測(cè)試回流爐參數(shù) 2.爐溫曲線由以上確認(rèn)簽名363無(wú)solder non- wetting71.Temperature set up lower 2.Transport fast31.Show Profile STD at WI 2.Show the equipment index at the 1.Measuring once produce 2.Manager check rec

44、ords and sign363N/A基板變形、燒焦、破損PCB bending damage5焊接溫度設(shè)定過高;回流爐傳送速度過慢3在W/I中注明回流爐條件;設(shè)備條件在制造成型條件表中體現(xiàn).1.生產(chǎn)前有爐溫測(cè)試板測(cè)試回流爐參數(shù),爐溫曲線由以上確認(rèn)簽名345無(wú)過程功能ProsFunction潛在失效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Cur

45、rent preventive Pro s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls Detection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.51.Temperature set up high 2.Transport slow31.Show Profile STD at WI 2.Show the equipmen

46、t index at the 1.Measuring once produce 2.Manager check records and sign345N/A6/送風(fēng)冷卻失敗3技術(shù)檢查設(shè)備并填寫設(shè)備點(diǎn)檢表由工程技術(shù)T每二小時(shí)對(duì)爐溫變化進(jìn)行點(diǎn)檢確認(rèn);每次換線生產(chǎn)或新型號(hào)生產(chǎn)時(shí)做爐溫測(cè)試并執(zhí)行首件檢查確認(rèn)焊錫品質(zhì)354無(wú)6/Cooling tooling failure3checked by eng.,and then do record1.Checked by engineer once/2H 2.Measuring once change line or new start354N/A元件偏移裂

47、開產(chǎn)品無(wú)功能或性能下降6/回流爐溫度設(shè)定不適當(dāng)識(shí)別精度下降3開始作業(yè)時(shí)，確認(rèn)回流爐的加熱器溫度設(shè)定，傳送帶速度設(shè)定.對(duì)設(shè)備進(jìn)行定期保養(yǎng)可通過PQC;AOI及FCT均可檢查此現(xiàn)象354無(wú)Parts shift and damagedNo function6/1.Temperature profile setting up over Spec.2.Identify preci lower3Check reflow temperture and transporion speed before startPeriodic maahe equipmentsDetect by AOI,PQC,ICT,F

48、CT354N/A錫珠影響產(chǎn)品性能或異響5/鋼網(wǎng)清潔不干凈3設(shè)定每4H手動(dòng)清潔鋼網(wǎng)一回錫膏檢查機(jī)對(duì)印刷狀態(tài)進(jìn)行檢查345無(wú)Solder ballShort and noise when the solder ball drop5/Stencil mask dirty3Manual cleaning of stencil mask once per 4H3X Visual Inspection345N/AAOI檢查(檢查所有外觀不良產(chǎn)品)AOI inspect (visual check)元件極性反、規(guī)格錯(cuò)誤,反貼等不良無(wú)法檢出 Cant check out the defect不良流出Defec

49、t pass down6/技術(shù)員編輯AOI測(cè)試程序時(shí)不正確2技術(shù)員依AOI操作辦法及該型號(hào)BOM設(shè)定程序建立相同型號(hào)的 OK&NG樣板進(jìn)行檢驗(yàn)確認(rèn)336無(wú)6/Program have bug2Eng.edit program base on BOM and Operate GuideMake OK/NG sle to check336N/A過程功能ProsFunction潛在失效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mech

50、anism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Current preventive Pro s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls Detection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.6/技術(shù)員測(cè)試程序2依AOI作業(yè)指示書進(jìn)行程序選定每次換型號(hào)測(cè)試時(shí)技術(shù)員用相同型號(hào)OK &NG

51、樣品進(jìn)行驗(yàn)證確認(rèn)336無(wú)6/Program choosed wrong2Set up program base onOk/NG sle check once change m336N/APCB分板 PCB Cutting基板破損功能不良,影響品質(zhì)7/分板方法不正確.3制作分板治具,WI中明確分板方法及順序首件確認(rèn)分板后每片確認(rèn)分板質(zhì)量363無(wú)PCB damagedNo function7/method of cut PCB is wrong3order JIG for cut PCB,mentioned method in WI.Do buy-offOne by one check after

52、 cutting363N/ALED擺放LED表面刮花7/產(chǎn)品無(wú)周轉(zhuǎn)工具2制作周轉(zhuǎn)吸塑PQC全檢228無(wú)No safeguard for LED PCBScratch on LED surface7/No device to transport and place2Plan some tray to transportInspection by PQC228N/AICT測(cè)試(對(duì)實(shí)裝基板元件規(guī)格值,開短路進(jìn)行檢查)ICT testing(for drive PCB)測(cè)試錯(cuò)誤產(chǎn)品無(wú)功能或性能不良7/ICT測(cè)試程式選擇錯(cuò)誤;作業(yè)員誤判.31.制作ICT測(cè)試程序一覽表,由技術(shù)員選擇調(diào)試; 2.對(duì)作業(yè)員進(jìn)

53、行技能培訓(xùn),合格后頒發(fā)上崗合格證.生產(chǎn)前使用OK&NG樣品檢驗(yàn)設(shè)備;定期對(duì)技能操作者進(jìn)行考核評(píng)估.363無(wú)Test faultyNo function7/program choosed wrongoperator judge wrong31.Make a list of program,for Eng. Referance. 2.Trahe worker to qualify1.use Ok/NG sle to check once change line2.Assessworkeriodic.363N/A等不良不能被檢出產(chǎn)品無(wú)功能或性能不良5/ICT測(cè)試治具設(shè)計(jì)弊端.3ICT程序分析,列出不

54、能測(cè)試元件和位置.PQC對(duì)不能測(cè)試位置重點(diǎn)確認(rèn).345無(wú)過程功能ProsFunction潛在失效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Current preventive Pro s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls Detection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mend

55、ed Action(s)完成日期Reponsibilit y& CompleteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.Defect such as bridge,short cant detectNo function5/Some bugshe design of ICT fixture31.Modify ICT software, 2.Make a parts list of cant detectPQpel inspect for ICT cant detect345N/A過程功能Pros

56、Function潛在失效模式 Potential Failure Mode潛在失效Potential Effect(s) of Failure嚴(yán)重度（s）SEV分類Class潛在失效起因/機(jī)理 Potential Effect(s) Mechanism(s) of Failure頻度（O）Occur現(xiàn)行預(yù)防過程控制 Current preventive Pro s Controls現(xiàn)行探測(cè)過程控制 Current Pros Controls Detection探測(cè)度（D）Detect風(fēng)險(xiǎn)順序數(shù) R.P.N.建議措施mended Action(s)完成日期Reponsibilit y& Comp

57、leteDate措施執(zhí)行結(jié)果Action resultsRequirement采取的措Taken嚴(yán)重度 SEV頻度 OCC探測(cè)度 DETR.P.N.LED PCBA防濕油涂布Applydproof solvent around LED防濕油涂布量錯(cuò)誤元件吸濕，功能降低8涂布作業(yè)方法不明確3W/I明確指示出防濕油的涂布量定期對(duì)技能操作者進(jìn)行考核評(píng)估.首件確認(rèn)/PQC巡檢372one by one check when C-sle and fix on method3月底 End of Mar.已購(gòu)入專用點(diǎn)膠機(jī)82232Apply quantum is wrongFunction lower8ap

58、ply method unclear3mentioned apply quantum in WI1.Skills on a regular basis for the operator to carry out the assessment examination. 2.Do FA /QA audit372Use fixture to apply.82232LED表面及LENS上粘有防濕油影響LED發(fā)光8涂布作業(yè)方法不明確31、W/I明確指示出防濕油的涂布量定期對(duì)技能操作者進(jìn)行考核評(píng)估.首件確認(rèn)/PQC巡檢372增加紫光燈外觀檢查82232dproof slovent tounch LED s

59、urfaceAffect LED Lums.8apply method unclear3mentioned apply quantum in WI1.Skills on a regular basis for the operator to carry out the assessment examination. 2.Do FA /QA audit72Use UV l to check82232元件面及防濕油PQC檢查 PQC inspect漏檢或檢測(cè)不到影響產(chǎn)品質(zhì)量7/檢查方法錯(cuò)誤或不標(biāo)準(zhǔn)；目視判斷;檢查技能.3W/I中明確檢查內(nèi)容,順序和方法；檢查時(shí)用放大鏡&紫光燈輔助全數(shù)確認(rèn);崗前培訓(xùn)

60、檢查員,提高檢查技能班長(zhǎng)定期；指導(dǎo)員工按照W/I指示作業(yè);定期對(duì)技能操作者進(jìn)行考核評(píng)估.363無(wú)skipFunction lower7/Operator mistake3mentioned method in WIUse tool(purple l) to check 3.Operator teached1.Monitor audit 2.Periodic assess worker.363N/A修理(正確修理不良內(nèi)容) Repair換錯(cuò)料產(chǎn)品性能不良,影響品質(zhì)6/修理員換料時(shí)未確認(rèn)上錯(cuò)料.3作成修理手順及修理W/I,指導(dǎo)修理作業(yè).修理OK后作記號(hào)和填寫修理票多重檢查進(jìn)行確認(rèn)354無(wú)Use t