(完整版)IPC標(biāo)準(zhǔn)清單-中文英文對照版

1、No.英文名稱IPC標(biāo)準(zhǔn)清單IPC-T-50GTermsandDefinitionforInterconnectingandPackagingElectronicCircuitsIPC-TM-650TestMethodsManualIPC/EIAJ-STD-001CRequirementsforSolderedElectrical&ElectronicAssembliesIPC/EIAJ-STD-002B SolderabilityTestsforComponent Leads,Terminations,Lugs,TerminalsandWiresIPC/EIAJ-STD-003ASolder

2、abilityTestsforPrintedBoardsIPC/EIAJ-STD-004ARequirementsforSolderingFluxesIPC/EIAJ-STD-005ARequirementsforSolderingPastesIPC-A-610DAcceptabilityofElectronicAssembliesIPC-A-600FAcceptabilityofPrintedBoardsIPC/JEDECJ-STD-033AHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevices

3、11 IPC-7711/21AIPC-9701PerformanceTestMethodsandQualificationRequirementsforSurfaceMountSolderAttachmentsIPC-CC-830BQualificationandPerformanceofElectricalInsulatingCompoundforPrintedWiringAssembliesIPC-7525StencilDesignGuidelinesIPC-7351 General Reqirements for Surface Mount Design and Pattern Stan

4、derdIPC/WHMA-A-620RequirementsandAcceptanceforCableandWireHarnessAssembliesIPC/EIAJ-STD-032PerformanceStandardforBallGridArrayBallsIPC-M-108CleaningGuidesandHandbookManualIPC-5701UsersGuideforCleanlinessofUnpopulatedPrintedBoards IPC-TP-1113CircuitBoardIonicCleanlinessMeasurement:WhatDoesItTellUs?IP

5、C-CH-65AGuidelinesforCleaningofPrintedBoards&AssembliesIPC-SC-60APostSolderSolventCleaningHandbookIPC-SA-61APostSolderSemi-aqueousCleaningHandbookIPC-AC-62AAqueousPostSolderCleaningHandbookIPC-TR-476AElectrochemicalMigration:ElectricallyInducedFailuresinPrintedCircuitAssembliesIPC-TR-582Cleaning and

6、 Cleanliness TestProgram for:Phase3 -LowSolids,FluxesandPastesProcessedinAmbientAirIPC-TR-583AnIn-DepthLookAtIonicCleanlinessTestingIPC-9201SurfaceInsulationResistanceHandbookIPC-M-109ComponentHandlingManualIPC-DRM-18GComponentIdentificationDeskReferenceManual IPC-DRM-SMT-CSurfaceMountSolderJointEva

7、luationDeskReferenceManualIPC-DRM-40EThrough-HoleSolderJointEvaluationDeskReference l5srdygfMountAttachmentsIPC-PD-335ElectronicPackagingHandbookIPC-QLIPC-QL365ACertificationofFacilitiesThatInspect/TestPrintedBoards,ComponentsandMaterialsIPC-MI-660IncomingInspectionofRawMaterialsManualIPC-HDBK-005Gu

8、idetoSolderPasteAssessmentIPC-HDBK-830GuidelineforDesign,SelectionandApplicationofConformalCoatingsIPC-7530GuidelinesforTemperatureProfilingforMassSoldering(Reflow&Wave)ProcessesIPC-TP-1115SelectionandImplementationStrategyforaLow-ResidueNo-CleanProcessIPC-S-816SMTProcessGuideline&ChecklistIPC-CM-77

9、0EComponentMountingGuidelinesforPrintedBoardsIPC-9850-KSurfaceMountPlacementEquipmentCharacterization-KIT IPC-9850-TM-KW,IPC-9850-TM-KTestMaterialsKitforSurfaceMountPlacementEquipmentStandardization4IPC-9850PlacementAccuracyVerificationPanels1IPC-9850CMMMeasurementVerificationPanels150IPC-9850QFP-10

10、0GlassComponents130IPC-9850QFP-208GlassComponents150IPC-9850BGA-228GlassComponentsNISTTraceableMeasurementCertificateCustomStorageCaseIPC-TR-464AcceleratedAgingforSolderabilityEvaluationsSMC-WP-001SolderingCapabilityWhitePaperReportSMC-WP-005PCBSurfaceFinishesIPC:Association Connecting Electronics I

11、ndustries( 電 子 制 造 協(xié) 會 ), 從 The Institute of Printed Cir Institute of the Interconnecting and Packing Electronic Circuit”(中文名稱電子電路互連與封裝的定義和術(shù)語試驗方法手冊電氣與電子組裝件錫焊要求元件引線、端子、焊片、接線柱及導(dǎo)線可焊性試驗印制板可焊性試驗助焊劑需求焊膏需求印制板組裝件驗收條件印制板驗收條件對濕度、再流焊敏感表面貼裝器件的處置、包裝、發(fā)運和使用電子組裝件的返工與返修表面安裝錫焊件性能試驗方法與鑒定要求印制板組裝電氣絕緣性能和質(zhì)量手冊網(wǎng)版設(shè)計導(dǎo)則表面安裝器件和

12、焊盤圖形標(biāo)準(zhǔn)通用要求電纜和引線貼裝的要求和驗收BGA球形凸點的標(biāo)準(zhǔn)規(guī)范清洗導(dǎo)則和手冊非密集型印制板清潔應(yīng)用導(dǎo)則電路板離子潔凈度測量：它告訴我們什么？印制板及組裝件清洗導(dǎo)則錫焊后溶劑清洗手冊錫焊后半水溶劑清洗手冊錫焊后水溶液清洗手冊電化學(xué)遷移：印制電路組件的電氣誘發(fā)故障IPC第3階段非清洗助焊劑研究深入離子潔凈度測試中文名稱電子電路互連與封裝的定義和術(shù)語試驗方法手冊電氣與電子組裝件錫焊要求元件引線、端子、焊片、接線柱及導(dǎo)線可焊性試驗印制板可焊性試驗助焊劑需求焊膏需求印制板組裝件驗收條件印制板驗收條件對濕度、再流焊敏感表面貼裝器件的處置、包裝、發(fā)運和使用電子組裝件的返工與返修表面安裝錫焊件性能試驗

13、方法與鑒定要求印制板組裝電氣絕緣性能和質(zhì)量手冊網(wǎng)版設(shè)計導(dǎo)則表面安裝器件和焊盤圖形標(biāo)準(zhǔn)通用要求電纜和引線貼裝的要求和驗收BGA球形凸點的標(biāo)準(zhǔn)規(guī)范清洗導(dǎo)則和手冊非密集型印制板清潔應(yīng)用導(dǎo)則電路板離子潔凈度測量：它告訴我們什么？印制板及組裝件清洗導(dǎo)則錫焊后溶劑清洗手冊錫焊后半水溶劑清洗手冊錫焊后水溶液清洗手冊電化學(xué)遷移：印制電路組件的電氣誘發(fā)故障IPC第3階段非清洗助焊劑研究深入離子潔凈度測試表面絕緣電阻手冊元件處理手冊零件分類標(biāo)識手冊接插件焊接點評價手冊接插件焊接點評價手冊表面安裝焊接件加速可靠性試驗導(dǎo)則電子封裝手冊印制板, 元件和材料檢驗/試驗企業(yè)的授證印制板, 元件和材料檢驗/試驗企業(yè)的授證原材

14、料接收檢驗手冊焊膏性能評價手冊敷形涂層的設(shè)計，選擇和應(yīng)用手冊大規(guī)模焊接(回流焊與波峰焊)過程溫度曲線指南低殘留不清洗工藝的選擇和實施表面安裝技術(shù)過程導(dǎo)則及檢核表印制板元件安裝導(dǎo)則表面貼裝設(shè)備性能檢測方法的描述（附Gerber格式CD盤）表面貼裝設(shè)備性能測試用的標(biāo)準(zhǔn)工具包可焊性加速老化評價(附修訂)可焊性工藝導(dǎo)論印制電路板表面清洗電子組裝的IPC標(biāo)準(zhǔn)列表制造協(xié)會),從The Institute of Printed Circiut(印制電路板協(xié)會),The cuit”(電子電路互連與封裝協(xié)會)逐步發(fā)展衍變而來.No.英文名稱IPC標(biāo)準(zhǔn)清單IPC-T-50GTermsandDefinitionfo

15、rInterconnectingandPackagingElectronicCircuitsIPC-TM-650TestMethodsManualIPC/EIAJ-STD-001CRequirementsforSolderedElectrical&ElectronicAssembliesIPC-HDBK-001HandbookandGuidetoSupplementJ-STD-001IncludesAmendment1IPC-A-610DAcceptabilityofElectronicAssembliesIPC-HDBK-610HandbookandGuidetoIPC-A-610(Incl

16、udesIPC-A-610BtoCComparisonIPC-EA-100-KElectronicAssemblyReferenceSetIPC/WHMA-A-620RequirementsandAcceptanceforCableandWireHarnessAssembliesIPC/EIAJ-STD-012ImplementationofFlipChipandChipScale4srdyIPC/EIAJ-STD-026SemiconductorDesignStandardforFlipChip-MechanicaledrppdpConfigurationsIPC/EIAJ-STD-028P

17、erformanceStandardforConstructionofFlipChipandChipScaleBumpsJ-STD-013ImplementationofBallGridArrayandOtherHighDensityTechnologyIPC-7095DesignandAssemblyProcessImplementationforBGAsIPC/EIAJ-STD-032PerformanceStandardforBallGridArrayBallsIPC-MC-790GuidelinesforMultichipModuleTechnologyUtilizationIPC-M

18、-108CleaningGuidesandHandbookManualIPC-5701UsersGuideforCleanlinessofUnpopulatedPrintedBoards IPC-TP-1113CircuitBoardIonicCleanlinessMeasurement:WhatDoesItTellUs?IPC-CH-65AGuidelinesforCleaningofPrintedBoards&AssembliesIPC-SC-60APostSolderSolventCleaningHandbookIPC-SA-61APostSolderSemi-aqueousCleani

19、ngHandbookIPC-AC-62AAqueousPostSolderCleaningHandbookIPC-TR-476AElectrochemicalMigration:ElectricallyInducedFailuresinPrintedCircuitAssembliesIPC-TR-582Cleaning and Cleanliness TestProgram for:Phase3 -LowSolids,FluxesandPastesProcessedinAmbientAirIPC-TR-583AnIn-DepthLookAtIonicCleanlinessTestingIPC-

20、9201SurfaceInsulationResistanceHandbookIPC-TP-104-KCleaning&CleanlinessTestProgram,Phase3WaterSolubleFluxes,IPC-M-109ComponentHandlingManualIPC/JEDECJ-STD-020CMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevicesIPC/JEDECJ-STD-033AHandling,Packing,ShippingandUseofMoistu

21、re/ReflowSensitiveSurfaceMountDevicesIPC/JEDECJ-STD-035AcousticMicroscopyforNon-HermeticEncapsulatedElectronicComponentsIPC-DRM-18GComponentIdentificationDeskReferenceManualIPC-DRM-SMT-CSurfaceMountSolderJointEvaluationDeskReferenceManualIPC-DRM-40EThrough-HoleSolderJointEvaluationDeskReferencel6en&

22、gkeManualIPC-DRM-53IntroductiontoElectronicsAssemblyDeskReference3sreMountsManualIPC-M-104StandardsforPrintedBoardAssemblyManualIPC-TA-722TechnologyAssessmentofSolderingIPC-TA-723TechnologyAssessmentHandbookonSurfaceMountingIPC-TA-724TechnologyAssessmentSeriesonCleanRooms IPC-SM-780ComponentPackagin

23、gandInterconnectingwithEmphasisonSurfaceMountingIPC-SM-785GuidelinesforAcceleratedReliabilityTestingofSurfaceMountAttachmentsIPC-9701PerformanceTestMethodsandQualificationRequirementsforSurfaceMountSolderAttachmentsIPC/JEDEC-9702 Monotonic Bend Characterization of Board-LevelInterconnectsIPC-PD-335E

24、lectronicPackagingHandbookIPC-7525StencilDesignGuidelinesIPC-QL365ACertificationofFacilitiesThatInspect/TestPrintedBoards,ComponentsandMaterialsIPC-9191GeneralGuidelinesforImplementationofStatisticalProcessl1CeIdegIPC-MI-660IncomingInspectionofRawMaterialsManualIPC/EIAJ-STD-004A Requirements forSold

25、eringFluxes-IncludesAmendment1IPC/EIAJ-STD-005 RequirementsforSolderingPastes-IncludesAmendment1IPC-HDBK-005GuidetoSolderPasteAssessmentIPC/EIA J-STD-006A Requirements for Electronic Grade SolderAlloys and Fluxed and Non-Fluxed Solid Solders錫焊合金、帶焊劑及不帶劑整體焊料技術(shù)要求IPC-SM-817 General Requirements for Die

26、lectric Surface Mounting RModernryreManufacturingIPC-WP-006RoundRobinTesting&Analysis:Lead-FreeAlloys-Tin,Silver,&CopperIPC-CA-821GeneralRequirementsforThermallyConductivesryeeMount lsryAdhesivesFilmsIPC-CC-830BQualificationandPerformanceofElectricalInsulatingCompoundforPrintedWiringAssembliesIPC-HD

27、BK-830GuidelineforDesign,SelectionandApplicationofConformalCoatingsIPC-SM-840C Qualification and Performance of Permanent SolderMask-IncludesAmendment1IPC-HDBK-840GuidetoSolderPasteAssessmentELEC-MICROHandbookofLeadFreeSolderTechnologyforMicroelectronicAssembliesIPC-TP-1114TheLaymansGuidetoQualifyin

28、gaProcesstoJ-STD-0y&JoiningIPC-7530GuidelinesforTemperatureProfilingforMassSoldering(Reflow&Wave)ProcessesIPC-TP-1090TheLaymansGuidetoQualifyingNewFluxes IPC-TP-1115SelectionandImplementationStrategyforaLow-ResidueNo-CleanProcessIPC-S-816SMTProcessGuideline&ChecklistIPC-TR-460ATrouble-ShootingCheckl

29、istforWaveSolderingPrintedWiringBoardsIPC-CM-770EComponentMountingGuidelinesforPrintedBoardsIPC-7912ACalculationofDPMO&ManufacturingIndicesforPrintedBoardAssembliesIPC-9261In-ProcessDPMOandEstimatedYieldforPWAsIPC-DPMO-202IPC-7912/9261EndItemandInProcessDPMOSet IPC-9500-KAssemblyProcessComponentSimu

30、lations,Guidelines&ClassificationsPackageIPC-9501PWBAssemblyProcessSimulation forEvaluationofElectronicComponentsIPC-9502PWBAssemblySolderingProcessGuidelineforElectronicComponentsIPC-9503MoistureSensitivityClassificationforNon-ICComponents IPC-9504AssemblyProcessSimulationforEvaluationofNon-ICCompo

31、nents(PreconditioningNon-ICComponents)IPC-9850-KSurfaceMountPlacementEquipmentCharacterization-KITIPC-9850-TM-KW,IPC-9850-TM-K Test Materials Kit for SurfaceMountPlacementEquipmentStandardization4IPC-9850PlacementAccuracyVerificationPanels1IPC-9850CMMMeasurementVerificationPanels150IPC-9850QFP-100Gl

32、assComponents130IPC-9850QFP-208GlassComponents150IPC-9850BGA-228GlassComponentsNISTTraceableMeasurementCertificate Custom Storage Case 94 IPC-7711/21AIPC/EIAJ-STD-002B SolderabilityTestsforComponent Leads,Terminations,Lugs,TerminalsandWiresIPC/EIAJ-STD-003ASolderabilityTestsforPrintedBoardsIPC-TR-46

33、1Trouble-ShootingChecklistforWaveSolderingPrintedWiringBoardsIPC-TR-462SolderabilityEvaluationofPrintedBoardswithProtectiveCoatingsOverLong-termStorageIPC-TR-464AcceleratedAgingforSolderabilityEvaluationsIPC-TR-465-1RoundRobinTestonSteamAgerTemperatureControlStabilityIPC-TR-465-2TheEffectofSteamAgin

34、gTimeandTemperatureonSolderabilityTestResultsIPC-TR-465-3EvaluationofSteamAgingonAlternativeFinishes, PhaseIIASMC-WP-001SolderingCapabilityWhitePaperReportSMC-WP-005PCBSurfaceSMC-WP-001SolderingCapabilityWhitePaperReportSMC-WP-005PCBSurfaceFinishesIPC-TR-466TechnicalReport:WettingBalanceStandardWeight103 ComparisonTest標(biāo)準(zhǔn)清單中文名稱電子電路互連與封裝的定義和術(shù)語試驗方法手冊電氣與電子組裝件錫焊要求J-STD-001輔助手冊及指南及修改說明1 印制板組裝件驗收條件IPC-610手冊和指南(包括IPC-A-610B和C的對比)電子組裝成套手冊，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A- 610C。電纜和引線貼裝的要求和驗收倒裝芯片及芯片級封裝技術(shù)的應(yīng)用芯片直裝技術(shù)實施導(dǎo)則倒裝芯片用半導(dǎo)體設(shè)計標(biāo)準(zhǔn) FC（倒裝片）和CSP(倒裝芯片及芯片級凸塊結(jié)構(gòu)的性能標(biāo)準(zhǔn)球柵陣列 (BGA)及其它高密度封裝技術(shù)的應(yīng)用球柵陣列的設(shè)計