塑封基礎知識培訓課件

1、塑封基礎知識培訓塑封基礎知識培訓 樹 脂 Resin填充料 Filler 硬化劑Curing agent 添加劑Additive 混 合Pre-mixing 加熱混練 Kneading 冷 卻Cooling 粉 碎 Crushing 混 合Blending錠粒成型Tableting 秤量包裝 Weigh Package EMEProduct1- EME的原材料和生產(chǎn)過程 樹 脂填充料 硬化劑 添加劑 混 合 加熱1.1-Raw Material Support for EME In CCP(藍色為CCP自產(chǎn)） PHENOLIC NOVOLAC RESIN線性酚醛樹脂PHENOL苯酚EMEEpi

2、chlorohydrin環(huán)氧氯丙烷（表氯醇） Bisphnol A雙酚ABROMINATED EPOXY溴化環(huán)氧樹脂F(xiàn)ILLER填充劑ADDITIVE添加劑OTHERS其它EPOXY CRESOL NOVOLAC RESIN鄰甲酚醛環(huán)氧樹脂1.1-Raw Material Support for E環(huán)氧樹脂填充劑添加劑粉碎、混合、攪拌塑封料塑封料生產(chǎn)流程環(huán)氧樹脂填充劑添加劑粉碎、混合、攪拌塑封料塑封料生產(chǎn)流程2-EME固化（交聯(lián)）過程2.1-樹脂體系2-EME固化（交聯(lián)）過程2.1-樹脂體系塑封基礎知識培訓課件2.2- EME固化（交聯(lián)）程度行為曲線2.2- EME固化（交聯(lián)）程度行為曲線3-

3、在充填過程中，EME黏度行為曲線 Viscosity behavior during filling at 175 CTimeHot hardness 預熱 成型 后固化3-在充填過程中，EME黏度行為曲線 ViscosEME系列膠化時間&螺旋流動長度v.s.模溫EME Series Gel Time & Spiral Flow v.s. Molding Temperature EME系列膠化時間&螺旋流動長度v.s.模溫4-成型 Molding冷凍保存 (10)Cold Storage (10)回溫 Stabilizing(20-30,50-70%RH )成型 Molding再保存(必要時)

4、Re-Storage在成型車間,原封不動.需回溫16-24 小時.(溫度平衡)Keep the package sealed. Thaw16-24 hours in molding room condition*需重新包裝好*回溫后72小時內(nèi)用完Seal up package as before it was opened.*不要用手直接碰觸黑膠. *72小時內(nèi)使用完畢Dont touch compound with your bare hand.4.1.黑膠準備 Compound Preparation4-成型 Molding冷凍保存 (10)回溫 StabiStorage Life VS

5、Temp.EME存儲壽命隨著存儲溫度的提高顯著短縮。Storage Life VS Temp.EME存儲壽命隨著成型條件 Molding Conditions 成型條件 Molding Conditions a.錠粒預熱Preheating of Pellet 預熱前的準備Preparation for stable preheating *回溫充分，趕走濕氣Stabilization of compound temperature and humidity *預熱時間Preheat time： 2040sec.(根據(jù)預熱設備調(diào)整Depending on pre-heater) *精確的設定P

6、recise adjustment of： 滾筒間的距離Distance between rollers 電極間的距離/水平度Distance/horizontal level of electrode如何測量預熱溫度How to measure the preheat temp. *確認錠粒表面溫度優(yōu)于確認錠粒內(nèi)部溫度 Check the surface temp. of pellets rather than inside of pellets此法之優(yōu)點Advantages of this method： 預熱后可快速的進行測量 Quick checking right after hea

7、ting 不會受黑膠本身的影響 Not affected by the heat from compound itself 可以快速、個別地測量錠粒溫度Can check the temp. pellet to pellet individuallya.錠粒預熱Preheating of Pellet 預熱b.殘留餅厚度/錠重 Cull Thickness / Pellet Weight通過獲得合適的殘留餅厚度確認錠粒重量是否合適ADJUST PELLET WEIGHT TO GET PROPER CULL THICKNESS理想的厚度 IDEAL THICKNESS太厚TOO THICK黑膠

8、的浪費，cull固化不完全(COMPOUND LOSS, UNCURED CULL)太薄TOO THIN(不完全充填INCOMPLETE FILL)轉進方向 Transfer directionb.殘留餅厚度/錠重 Cull Thickness / Pec.轉進壓力TRANSFER PRESSURE 正確的判斷表壓和實際轉進壓力之間的關系 ACCURATE ADJUSTMENT IS REQUIRED GAUGE PRESSURE VS ACTUAL PRESSURE 注意NOTE 實際的轉進壓力需要周期性地用壓力計校正ACTUAL PRESSURE SHOULD BE CHECKED PER

9、IODICALLY WITH DILLON GAUGE (FORCE GAUGE) 轉進頭和轉進筒需要周期性地進行更換PLUNGER HEAD AND TRANSFER POT SHOULD BE REPLACED PERIODICALLY. (PREVENT PRESSURE LOSS) c.轉進壓力TRANSFER PRESSURE 正確的判轉進壓力Transfer Pressure 表壓和實際的轉進壓力Gauge pressure v.s. Actual pressurePr x Sr = Pp x SpSr =(Dr/2)2Sp =(Dp/2)2Dr : Diameter of Ram

10、Dp : Diameter of PlungerPp : actual pressure to PKG.Pr : oil pressure shown on Gage with unit kg/cm2(Also all Ram pressure ( = Pr x Sr ) is shown on the same gage with unit ton) Die surface area doesnt relate in ideal.But complexed runner and cavity structure will make pressure loss.轉進壓力Transfer Pre

11、ssure 表壓和實際的轉d.轉進速度/時間TRANSFER SPEED/TIME 轉進速度是通過轉進距離除于轉進時間得到的TR. SPEED IS CALCULATED WITH TR. DISTANCE AND TR.TIME TR. SPEED (CM/SEC)= TR. DISTANCE (L) L = =r2hn/R2 2r : 錠粒直徑PELLET DIAMETER h: 錠粒高度PELLET HEIGHT n: 錠粒的顆數(shù) NO. OF PELLETS 2R: 轉進筒直徑 POT DIAMETER錠粒的直徑應該要和轉進筒的直徑相近PELLET DIAMETER SHOULD BE

12、 CLOSE TO POT DIAMETER EXAMPLE 2R=50mm 2r =48mm d.轉進速度/時間TRANSFER SPEED/TIME 轉e.后固化POST MOLD CURE烘箱OVEN 為了加熱的均勻性，烘箱必需是通過熱風扇加熱OVEN WITH INSIDE HEATING FAN IS DESIRABLE FOR UNIFORM HEATING固化溫度和時間CURE TEMP. AND TIME后固化時間要在烘箱達到合適的溫度后開始計時CURE TIME SHOULD BE COUNTED AFTER REACHING PROPERTEMP. LEVELe.后固化PO

13、ST MOLD CURE烘箱OVEN 后固化后各個主要參數(shù)的比較Post Mold Cure Comparison后固化后各個主要參數(shù)的比較Post Mold Cure Co5-EME 成型常見問題及其對策充填不良( Incomplete Fill) 氣孔(Voids)麻點(Pin Hole)溢料（Resin Bleed）流痕(Flow mark)黏模(Stick)開裂(Crack)沖線(Wire sweep)5-EME 成型常見問題及其對策充填不良( Incomple5-1 EMC封裝成型不良相關因素5-1 EMC封裝成型不良相關因素充填不良( Incomplete Fill)充填不良( I

14、ncomplete Fill)充填不良( 趨向性）充填不良( 隨機性）充填不良( 趨向性）充填不良( 隨機性）氣孔（Void）氣孔（Void）外部氣孔（air vent側）外部氣孔（gate側）內(nèi)部氣孔外部氣孔（air vent側）外部氣孔（gate側）內(nèi)部氣孔麻點在封裝成形后,封裝體的表面有時會出現(xiàn)大量微細小孔,而且位置都比較集中,看卜去是一片麻點。這些缺陷往往會伴隨其他缺陷同時出現(xiàn),比如充填不良、氣孔等。這種缺陷產(chǎn)生的原因主要是料餅在預熱的過程中受熱不均勻,各部位的溫差較大,注入模腔后引起固化反應不一致,以至于形成麻點缺陷。麻點在封裝成形后,封裝體的表面有時會出現(xiàn)大量微細小孔,而且位錠粒無間隙,預熱不均錠粒有間隙(均勻擺放),預熱均勻麻點錠粒無間隙,預熱不均錠粒有間隙(均勻擺放),預熱均勻麻點溢料(Resin bleed/Flash)溢料(Resin bleed/Flash)溢料溢