打造新興物聯(lián)網(wǎng)時代

1、打造新興物聯(lián)網(wǎng)時代Building a New IoT Era許天燊 Sunny Hui 中芯國際全球市場部資深副總裁7. 2015Safe Harbor Statements(Under the Private Securities Litigation Reform Act of 1995)This document contains, in addition to historical information, “forward-looking statements” within the meaning of the “safe harbor” provisions of the U.

2、S. Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on SMICs current assumptions, expectations and projections about future events. SMIC uses words like “believe,” “anticipate,” “intend,” “estimate,” “expect,” “project” and similar expressions to identify

3、forward looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMICs senior management and involve significant risks, both known and unknown, uncertainties and other factors that

4、may cause SMICs actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, intense competition, time

5、ly wafer acceptance by SMICs customers, timely introduction of new technologies, SMICs ability to ramp new products into volume, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, availability of manufacturing capacity,

6、financial stability in end markets and intensive intellectual property litigation in high tech industry.In addition to the information contained in this document, you should also consider the information contained in our other filings with the SEC, including our annual report on Form 20-F filed with

7、 the SEC on April 28, 2015, especially in the “Risk Factors” section and such other documents that we may file with the SEC or SEHK from time to time, including on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on our future results, performance or achievem

8、ents. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this document may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated or, if no date is stated, as of the da

9、te of this document.2Worldwide Semiconductor Shipment Forecast $B/Yr.* Source: iSuppli-IHS, AMFT1Q15, Team Analysis, May, 2015.3Market Volume Driver & TrendsMobile, Smart Cards, MEMS/Sensors, Cloud, IoT DevicesTabletIoTClient DevicesSmart CardsBank CardsMEMS & SensorsBillionUnitsGrowthPotential1Bu10

10、Bu50BuCloudComputingSmartphoneAutomotives4The Evolution of Electronic “Things”IoT Internet Connected Intelligence In-ControlIndividual of ThingsIntegrated ofThingsInternet ofThingsConsumerElectronic EraMobileComputing EraSmartEverything EraInternet,MobileClouds,Smart5Emerging Big Data, Cloud Computi

11、ng and IoT Era Brings New OpportunitiesSmart HomeWearableSmart Grid & LightingAutomotive & TransportationHealthcare& MedicalLogisticEnvironment& AgricultureIndustrial & RobotsData Source: IBS, SMIC Analysis, 2014 6Connecting Users & ServicesEnhancingAutomation & QualitySafety & SecurityCloudComputin

12、gSMIC Application Portfolio Mobile ComputingWirelessConnectivityWireline Comm.Digital HomePower MgmtCISLCD DriverMCUSmart CardNOR/NAND/ Memory IoT14nm24nm28nm38nm40/45nm55nm65nm90nmSPOCULL950.11m0.13m0.15/0.153m0.18m0.25m0.35mRelease/In ProductionMajor Focus (close to or in early production)Developi

13、ng/Future Plan * SMIC is developing 90nmPlus CIS-BSI which is comparable with 65/55nm on design rule & pixel. Updated : 201504307SMIC Provides the Building Blocks for IoT TechnologiesCISMEMS&TSVMemoryEmbedded NVMRFFSI and BSI in Production, up to 8MPExcellent Performance and Competitive Cost Structu

14、reFull Turn-Key Services (in-House)Focuses on IoT SensorsOscillator Production Ready Since 2Q13 Microphone & Accelerometer Risk Production in 2Q15; Total TSV Packaging Solution for MEMS and CIS Application.RF Wireless for Wifi, BT, NFC, GPS, etc.Complete Technology OfferingMass Production on Various

15、 Product LineRF-FEM for PA,SW, Tuner, Filter, etc.55nm eFlashProduction Proven TechnologyCompatible to 55nm LL Platform Low Power, High Speed Macros 38nm NAND FlashIndependently DevelopedHigh Quality, Low DensityTarget Embedded, Mobile Computing, Storage, TV, STB and IoT MarketHighest Density Soluti

16、on at 8” Foundry TechnologyExcellent Transistors Characteristics Smallest SRAM at 8” TechEmbedded NVM Solutions8SMICs Technology Platform forAgricultural Unmanned Aerial Vehicle (UAV)The Agricultural UAV can be used in monitoring and getting agricultural information by low-altitude flying, and aeria

17、l crop protection. SMICs UAV technology platform can offer manufacturing service for the main components. UAV ComponentsDevices & Tech Nodes Provided by SMIC:Operation Processing MCU/AP65/5528nm Communication ModuleBB6528nmWireless Transmission Wi-Fi/BT Module65/55, 40, 28nmPositioningGPS65/55, 40,

18、28nmPowerPMIC0.18m65nm Camera and VideoCIS0.153m65/55nmSensorMEMS Sensors0.35m 0.18umDisplay Control Display0.18m90nmTouch ScreenTouch0.18m90nm Fingerprint IdentificationFinger Print, NFC0.35m, 65/55nmLow-Density Memory NAND, NOR, eMMC65/55nm38nm9IoT Product Mass Production at SMICRealtek Ameba IoT

19、Solutions with Full Support for Apple HomeKit, key circuit blocks are WiFi and BT.Source: Realtek website 10HSINCHU, Taiwan 4 June 2015 Realtek Semiconductor Corp., one of the worlds leading IC providers, today announced its Ameba and IoT solutions with full support for Apples HomeKit. Realtek offer

20、s total HomeKit solutions with Ameba (RTL8711 series) and (RTL8196/8188 series) that can be easily implemented into various IoT platform designs, e.g. smart plug, smart home appliances, home security systems, and smart sensor/lighting devices.“Realteks expertise in wireless technologies, SoC (System

21、 on Chip), and dedicated technical support allows us to provide ultra-low-power, highly-integrated, and high-performance products that give our customers access to the full potential of their products”, said Realteks Vice President and Spokesman, Yee-Wei Huang. “We are excited to be among the first

22、in Asia to bring full HomeKit support to our IoT solutions and see HomeKit as a game changer for the connected home industry. SMIC Successfully Produces m Snapdragon410 processor in 28nm ProcessThis milestone represents an important step for SMIC in their 28nm process maturity as they e one of the f

23、irst Chinese foundries to produce 28nm high-performance, low-power mobile processors.11Dec. 18, 2014 - m and SMIC have achieved a major milestone in fabrication of 28nm m Snapdragon 410 processors. It comes just six months after the announcement of their initial 28nm collaboration plans.Snapdragon 4

24、10 is a leading-edge processor designed to enable a new class of smartphones and tablets at the high-volume tier through offering integrated LTE, high-performance graphics and imaging, 1080P HD display, 64-bit capable processing and a range of advanced modem features. Source: Company Press ReleaseSM

25、IC Manufactured Chips for Huawei Mate 7Hi6421SMIC 0.18um 1.8/5VPower Management for CPU/BBHi6561SMIC 0.18um 1.8/5V Power Management for PA/RFHi6361SMIC 90nm RF Trans/Reces6 HiSilicons chips in Mate7: Kirin 925 processor, Hi6401 Audio CODEC, Hi6421 & Hi6561 PMICs and two Hi6361 RF Transceivers SMIC 0

26、.18m MS Finger printer12Skyworth & HiSilicon Launched Domestically-Made Smart TV Chip Produced by SMIC“Skyworth and HiSilicon Join Forces to Mass Produce Their Own Smart TV Chips and End Chinas Shortage on TV Chips.”The configuration of this domestically-made smart TV chip are “quad-core CPU, octa-c

27、ore GPU and dual-core VPU”, “its Start Up sequence is world class at only 15 seconds”. The chip is manufactured by SMIC. Its design, manufacturing, package and downstream end-product application are all completed in China.Source: CBN創(chuàng)維海思合推國產(chǎn)智能電視芯片量產(chǎn) 中國電視缺芯時代結(jié)束13SMIC Achieves 8M Pixel CIS Production

28、on 0.13-Micron BSI with Cista Mass production for two CIS-BSI products of 1.3MP resolution with 1.75-micron pixel and 8MP resolution with 1.4-micron pixel respectively. Both sensors are based on SMICs independently developed 0.13-micron BSI technology platform. Based on a low leakage process, it onl

29、y uses three aluminum metal layers for reduced costs and supports pixel sizes down to 1.4-micron for 8MP resolution CIS. Provide full in-house turn-key service which includes CIS wafer fabrication, color filter & micro-lens processing, TSV-CSP and testing to help customers shorten the supply chain w

30、ith fast cycle times and low costs.Back-Side Illumination (BSI) CMOS Image Sensor technology increases the amount of light captured by the sensor, and thus enables image sensors with improved low-light performance.FSIBSI14Based on SMICs 55nm LL eFlash PlatformHED Launches the First 55nm Smart Card C

31、hipSource: SHANGHAI, Aug. 4, 2014 /PRNewswire/ Aug. 4, 2014, SMIC and HED jointly announced that HED has launched Chinas first 55nm smart card chip based on SMICs 55nm LL (low leakage) eFlash (embedded flash) platform. With the benefits of being smaller in size, lower power consumption and faster pe

32、rformance, it has been put into mass production and is being widely recognized by customers.15It has been put into mass production and adopted by CMCC, China and some oversea operators. SMIC Provides RFID Technology SMICs processes which can fit RFID mass production:0.18m/0.13m Mix-Signal/ EEPROM pr

33、ocess:Better solutions for security and contactlessSMIC has mass produced smart cards in 0.18/0.13m processes for many years. 95 ULP provides highest density solution and smallest SRAM at 8” foundry technology. Excellent transistors characteristics with low leakage, low power and low parasitic capac

34、itance. 16MEMS Technology Production Roadmap MicrophonePressureInertialFutureOscillatorAccelerometerGyro/6 Axis9 AxisJD projectFOT projectRF MEMSOpticalBiosciencesMPFOT Project2015 MP2015 RP2015 MPRFMEMSBioscience sensorsMicrodisplaysProjectionMicrofluidicsIR sensors17MEMSensing Launches the Worlds

35、Smallest Commercial 3-Axis Accelerometer MSA330 with SMICThe Worlds Smallest Commercial 3-Axis Accelerometer MSA330The worlds smallest 3-axis accelerometer MSA330 uses SMICs CMOS integrated MEMS device fabrication and TSV-based wafer level packaging technologies.MSA330 achieves about 30% shrink in f

36、ootprint and 70% reduction in the total size compared to the latest commercial products. It is also the thinnest of its kind, only 0.5mm after SMT and 0.6mm in total height including 0.2mm solder balls. MSA330 is competitive not only in overall fabrication costs through all wafer level fabrication and packaging but also in miniaturization particularly for mobile and wearable applications.SHANGHAI, Jan. 5, 2015/PRNewswire/18The Most Advanced China Based Pure-play Foundry* kWPM 1,00