新產(chǎn)品開(kāi)發(fā)整體流程介紹

C-SystemIntroductionwillcoverRole&Responsibility(R&R)ProcessCxStage:C0:Proposalphase構(gòu)想階段C1:Planningphase規(guī)劃階段C2:R&DDesignphase設(shè)計(jì)階段C3:LabPilotRunphase樣品試作階段C4:EngPilotRunphase工程試作階段C5:PDPilotRunphase試產(chǎn)階段C6:MassProductionphase量產(chǎn)階段Role&Responsibility

FunctionResponsibilityPM產(chǎn)品經(jīng)理-ProductManager(或計(jì)畫專案經(jīng)理-ProjectManager)為所負(fù)責(zé)計(jì)畫或產(chǎn)品線成敗之總負(fù)責(zé)人,將依產(chǎn)品線之性質(zhì)指定專人負(fù)責(zé)某類產(chǎn)品,必須對(duì)所負(fù)責(zé)產(chǎn)品線專業(yè)領(lǐng)域之發(fā)展及行銷雙方面皆有相當(dāng)程度的了解.並依照產(chǎn)品之條件及市場(chǎng)狀況,做適當(dāng)?shù)倪\(yùn)用,訂定技術(shù)或產(chǎn)品市場(chǎng)競(jìng)爭(zhēng)策略,並在適當(dāng)?shù)臅r(shí)機(jī)推出適當(dāng)之技術(shù)或產(chǎn)品.TMTMisresponsibletocoordinatetechnicalissuesconflictamongHW,SW,IDandMEanddecision-making.TMhastohandleallprojecttechnicalissues.

PCC為規(guī)劃推廣、連絡(luò)及控制專案進(jìn)行的負(fù)責(zé)人,掌握專案進(jìn)行之情況以協(xié)助處理異常狀況,使新產(chǎn)品能順暢切入工廠且如期推出,以提高產(chǎn)品競(jìng)爭(zhēng)力.協(xié)助R&DRELEASE開(kāi)發(fā)階段BOMCHANGENOTICE.R&DR&D包括電子部門及工業(yè)設(shè)計(jì)部門,若只寫HW(HardwareDesign)則指電子部門,若只寫ID(INDUSTRIALDESIGN)則指工業(yè)設(shè)計(jì)部門;包括ME,Thermal,Packingdesign.若只寫SW(Softwaredesign)則指軟體設(shè)計(jì)部門有負(fù)責(zé)BIOS,Driver及Pre-load不同工作性質(zhì)之軟體開(kāi)發(fā)功能.R&D人員負(fù)責(zé)產(chǎn)品之開(kāi)發(fā)、設(shè)計(jì)、測(cè)試規(guī)劃，包括H/W、S/W及ID的開(kāi)發(fā)、設(shè)計(jì)、提出新發(fā)明及著作權(quán)揭露書.

-WistronCaseRole&Responsibility

FunctionResponsibilityHW(HardwareDesign)*HardwareisresponsibleforElectronicEngineeringDesign*Co-workswithS/WandQTtomakesurethattheeveryfunctionworkswellaccordingtospec.*H/WshouldconducttechnicaltransfertoPE.*H/Wshouldinput,update,andmaintainthebugs/issuesinformationinthebugtrackingsystem.SW(SoftwareDesign)*SoftwareisresponsibleforthedesignofBIOS,Driver,Utilities,andS/WPreload.*S/Wco-workswithH/WandQTtomakesurethateveryfunctionworkswellaccordingtothespecification.*S/WhastoreleasetheSCDandtheCert.TeamDocument.*S/WshouldconducttechnicaltransfertoTE.*S/Whastoinput/update/maintainthebugs/issuesinformationinthebugtrackingsystem.ID/ME(IndustrialDesign/MechanicalEngineering)*ID/MEisresponsibleforMechanicalEngineering,ThermalandPackingdesigns.*ID/MEshouldconducttechnicaltransfertoPME.*ID/MEshouldinput,update,andmaintainthebugs/issuesinformationinthebugtrackingsystemused.-WistronCaseRole&Responsibility

FunctionResponsibilityPA(EMI/Safety,QT,CE/Reliability,PCB,OSCertification)為產(chǎn)品保證暨開(kāi)發(fā)支援Function之總稱,主要負(fù)責(zé)根據(jù)MRS/PES執(zhí)行各項(xiàng)產(chǎn)品之測(cè)試,諸如EMC/Safety:REGULATORYTEST,CE:RELIABILITYTEST及KEYCOMPONENTAPPROVAL,PCB:PCBLAYOUT,DC:BOM,OS:OS認(rèn)證etc;…EMC/SafetyAllproductstomeetEMC/Safetyrequirementsandguaranteethelegalityintheinternationalmarketing.申請(qǐng)產(chǎn)品之安規(guī)、測(cè)試、Debug..QT為R&D轄下所屬之測(cè)試單位人員,主要負(fù)責(zé)各項(xiàng)產(chǎn)品之測(cè)試,諸如COMPATIBILITYTEST,SOFTWARETEST,S/WPRELOADTEST,DIAGNOSTICPROGRAMTEST,ETC.,CE/Reliability組件承認(rèn)測(cè)試、不良品故障分析及其他附件等材料品質(zhì)之管制及保證產(chǎn)品相關(guān)之可靠度與環(huán)境實(shí)驗(yàn)，以及可靠度工程之研究與制定.PCBPCBLayout之申請(qǐng)、PCB之設(shè)計(jì)、Orcadlibrary&Mentorlibrary的建立與管理.信號(hào)品質(zhì)CAE分析,PCBlayout外包廠商之管理，PCB製造廠商之管理.OSCertification執(zhí)行公司各產(chǎn)品之OS相容性認(rèn)證測(cè)試及LOGO申請(qǐng).O.S.BetaSite測(cè)試PDM料號(hào)編碼及控管,BOM製作-WistronCaseRole&Responsibility

FunctionResponsibilityAM(AccountManager)1.爭(zhēng)取訂單與客戶合約協(xié)商.2.協(xié)調(diào)產(chǎn)品SPEC.工程變更

SAMPLEAPPROVAL.3.適時(shí)反應(yīng)市場(chǎng)需求與趨勢(shì).MM(MaterialManagement)1.MMisresponsiblefornewsupplierdevelopment,partspurchasing2.Controllingmechanicaltoolingstatusincludingtheschedule,capacity,partsreadiness,concerns3.Managethedependencies,longlead-timeitems.4.MMalsoco-workswithSQMandCEforcomponentqualityimprovementandthekeycomponentQVLfinalversionSQM(SupplierQualityManagement)*零件品質(zhì)管理及參與分包商之評(píng)鑑/管理(SQRCPlan/Status)*負(fù)責(zé)異常材料分析、追蹤與改善.*負(fù)責(zé)進(jìn)行產(chǎn)品

QVLCANDIDATEAPPROVAL作業(yè)系統(tǒng)

ATmfg.

GCSD1.開(kāi)發(fā)及推動(dòng)全球客戶服務(wù)及支援計(jì)劃.2.各項(xiàng)售後服務(wù)及支援作業(yè).3.參與Field品質(zhì)改善作業(yè)(EWG)FI負(fù)責(zé)評(píng)估

ProjectCost,決定

Project是否可行以及

Project所花費(fèi)之

Cost.

Legal合約及專利審核-WistronCaseRole&Responsibility

FunctionResponsibilityCFECFEactsonbehalfofWistronglobalmanufacturingoperationtodealwiththecustomer,andalsoactsasarepresentativeofthecustomerwhendealingwithinternalWistronteams.BasedontheC4/C5checklist,relatedreportsandprojectstatus,CFEisresponsibletoconcludetheexitjudgment(ReadyorNotready)duringC4/C5ExitmeetingstodeterminewhetheraproductcanmoveontoPDpilotrun/MPornotNPI1.負(fù)責(zé)規(guī)劃、協(xié)調(diào)、整合與提供各Site製造所需相關(guān)資訊與技術(shù)資料2.協(xié)調(diào)安排新產(chǎn)品轉(zhuǎn)移至海外生產(chǎn)工廠3.協(xié)調(diào)處理海外生產(chǎn)工廠發(fā)生之生產(chǎn)相關(guān)問(wèn)題PE/PME1.產(chǎn)品設(shè)計(jì)審查,產(chǎn)品問(wèn)題之發(fā)覺(jué)及產(chǎn)品移交.2.協(xié)助生產(chǎn)良率提昇,克服生產(chǎn)瓶頸,提高生產(chǎn)力.

3.協(xié)助訂定製造規(guī)格及引進(jìn)新的製作技術(shù),進(jìn)行改善以確保產(chǎn)品品質(zhì).IE1.設(shè)計(jì)及管理一個(gè)高效率的整合製造系統(tǒng).2.消除浪費(fèi)、杜絕不合理，提高生產(chǎn)力

3.生產(chǎn)流程規(guī)劃、製程改善、標(biāo)準(zhǔn)工時(shí)製定

QA1.執(zhí)行製程及產(chǎn)品之檢驗(yàn)並反應(yīng)品質(zhì)報(bào)告請(qǐng)相關(guān)單位改善品質(zhì)2.收集及處理市場(chǎng)及客戶品質(zhì)回饋資料反應(yīng)相關(guān)單位改善品質(zhì)3.協(xié)助工程單位必要之驗(yàn)證測(cè)試.

4.建立PCBA,FinalAssembly之檢驗(yàn)標(biāo)準(zhǔn)QE1.執(zhí)行DQA.FDI,MTBF,ORTTest2.執(zhí)行產(chǎn)品開(kāi)發(fā)過(guò)程之可靠度及環(huán)境測(cè)試(C4)3.協(xié)助工程測(cè)試驗(yàn)證4.品質(zhì)工程問(wèn)題分析與解決

-WistronCaseRole&Responsibility

FunctionResponsibilityPD(Production)PDhastoworkwithPE,PMEandIErespectivelytogettestingequipment&tools,assemblytools,andSOPreadybeforeC5Exit.PDisresponsibletoproducetheproduct.PDisnotjustforefficiencyonlybutalsoquality.PSE(ProcessEngineer)PSEisresponsibleforSMTprocessandforreleasingtheSMTpilotrunreport.PSEisalsoresponsiblefortheprocesscontinuousimprovement(CIP).FAE(FailureAnalysisEngineer)orREFAEisresponsibleforissuingthefailureanalysisreportandforwardingthistorelateddepartmentsforproductqualityimprovement.FAEisalsoresponsibleforpreparingrepairSOPifapplicable.TETEisresponsibleforprovidingandmaintainingTestPlanandTestProgram.TEalsoimplementallthepreloadtoproductionlineandreporttheproblemsrelatedtopreloadtopreloadteam.PMC/GPMC(PlanMaterialControl/GlobalPlanMaterialControl)GPMC/PMCisresponsibleforproductfulfillment,finalshippingmodel,supplysiteandcapacityplan,andrampupplanforallsites.-WistronCaseWistronC-SystemQualityControlProposalPhasePlanningPhaseR&DDesignPhaseLabPilot-runPhaseEngineeringPilot-runPhaseProductionPilot-runPhaseMassProductionPhaseC0C1C2C3C4C5CheckPointWistronC-PhaseNPIFDI/MTBFDQA/PQC/FQCCompatibility/DiagnosticSimulationTestLayout&drawing-SignalIntegrity-DFXCheck-AVL-C-TestPlansReliability/StressEMI/SafetyOS&Pre-LoadWIH/WPH/WZS/WKSMRSCheck-ServiceCostEstimate-Simulation-DesignPeerReview-LessonsLearnedAvailabilityDevelopPlanLaunchFAI&SPCMTBFDemoCIP/CLCAParetoAnalysisEWGReadyAFRTestReportsPre-QVLReadyDiagnosticsProgramBugList&ActionDCN/ECN/ECRFAIreportPFMEASQRCTrainingMTBFReviewQMP/QPA/QSAFPYRPPAPServiceability

DesignTestPlansIntegrateDesignReviewSignalQualityDFXIndexInitialSupplierAuditMemorandumDFMEASimulationMTBFEstimateMVPConcept/ProposalMRSDefinitionScopeSCEInvestigation&ProposalDesign&SourcingIntegrationValidationReleaseProductLifeCycleMDRR/C4Go/NoGo?MRR/C5Go/NoGo?C6OOB/OBAORT/StressEWG/FQHAFR/DOANewCSystemArchitectureProgressC0ExitC0ActivityC0EntryC1ExitC1ActivityC1EntryC2ExitC2ActivityC2EntryC3ExitC3ActivityC3EntryC4ExitC4ActivityC4EntryC5ExitC5ActivityC5EntryC6ExitC6ActivityC6EntryTimeDetailActivitiesSubjectScopeDefinitionProcedure….ActivitiesDefinitionRecord&ReportFormatDefinitionEscalationRuleMeasurementStandardProjectManagement&SystemMaintenanceNewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytest

report(prel.)ME/Artwork

/packingdrawingPAL/ROM

datalistingC3manufacturability

reviewreportSampleapprove

status&buglist

reviewC4checklistBOMQVLTimestandardSystemBIOS/KBC

FWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMPMC0meeting C1meetingPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC0ChecklistMRSC0/PMC0Meeting 階段C0構(gòu)想階段(ProposalPhase)負(fù)責(zé)單位計(jì)畫經(jīng)理(ProjectManager)或產(chǎn)品經(jīng)理(ProductManager)目的*確訂提案構(gòu)想或市場(chǎng)需求規(guī)格書(MRS)*可行性分析工作重點(diǎn)

*相關(guān)提案之市場(chǎng)資料搜集*相關(guān)提案之關(guān)鍵技術(shù)資料搜集*R&D提出技術(shù)可行性分析*PM執(zhí)行可行性及效益評(píng)估審核會(huì)議C0目的評(píng)估是否成立專案計(jì)畫，進(jìn)行研發(fā)檢核項(xiàng)目計(jì)畫提案書或市場(chǎng)需求規(guī)格書(MRS)

C0-工作重點(diǎn)及及檢核項(xiàng)目目NewCSystemProductDevelopmentProposalPhasePlanningPhaseR&DDesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meetingC3meetingC4meetingC5meetingC3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport(prel.)ME/Artwork

/packingdrawingPAL/ROMdatalistingC3manufacturabilityreviewreportSampleapprove

status&buglistreviewC4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMPMC0meetingC1meetingPMC0ChecklistMRSC2checklistPESEMC/SafetyRequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC1checklistInvention

disclosureTimescheduleProjectteamModelnumberdefineGreendesignguideandreview

checklistNonQVL/Sample

approvalrequestformC1/PMC1MeetingC1-工作重點(diǎn)及及檢核項(xiàng)目目階段C1規(guī)劃階段(PlanningPhase)負(fù)責(zé)單位計(jì)畫經(jīng)理(ProjectManager)或產(chǎn)品經(jīng)理(ProductManager)目的*規(guī)格的擬訂

*專案組織的成立*專案時(shí)程的規(guī)劃工作重點(diǎn)

*選任技術(shù)經(jīng)理(TechnicalManager,簡(jiǎn)稱TM)並成立專案組織*計(jì)畫專案經(jīng)理(ProjectManager)或產(chǎn)品經(jīng)理，規(guī)劃專案時(shí)程*召開(kāi)C1審核會(huì)議*法務(wù)確認(rèn)LegalConcern、如PotentialPatentList,InventionDisclosure*成立專案團(tuán)隊(duì)審核會(huì)議C1目的成立專案團(tuán)隊(duì)、確定開(kāi)發(fā)時(shí)程檢核項(xiàng)目TimeScheduleProjectTeamInventionDisclosureGreenDesignCheckListSampleRequestForm

Case-bottleCocainEngland開(kāi)採(cǎi)鋁礦一噸鋁土提提鍊半噸氧氧化鋁半小時(shí)加工工半噸氧化鋁鋁熔煉成1/4噸金金屬鋁再加工二週週成鋁錠瑞典或梛威威熔爐工廠澳大利亞澳大利亞化學(xué)還原工工廠加熱至華氏氏900度度壓延成1/8inch薄片瑞典和德國(guó)國(guó)壓延廠船運(yùn)一個(gè)月月冷軋成1/80inch薄片冷軋廠英國(guó)易開(kāi)罐罐廠成型，清洗洗，烘乾，，防鏽裝填，印刷刷英國(guó)可樂(lè)廠廠消費(fèi)鋁罐回收儘儘16%EcologicalRucksack(生態(tài)包袱)生產(chǎn)一片半半導(dǎo)體晶片片所產(chǎn)生之之廢料為產(chǎn)產(chǎn)品重量之之十萬(wàn)倍生產(chǎn)一臺(tái)筆筆記型電腦腦所產(chǎn)生之之廢料為產(chǎn)產(chǎn)品重量之之四千倍生產(chǎn)一公升升佛羅里達(dá)達(dá)橘子汁需需要兩公升汽油油及一千公公升之水生產(chǎn)一噸紙紙需用掉九十八噸之其他資源源資料來(lái)源:綠色色資本主義義─天天下出版社社EURoHSDirective指令期程2003.01.27指令發(fā)布2003.02.13歐盟公報(bào)發(fā)發(fā)行,指令生效2004.08.13轉(zhuǎn)為會(huì)員國(guó)國(guó)當(dāng)?shù)胤陕?法規(guī)或行政政指令2006.07.01新投入之產(chǎn)產(chǎn)品不得含含有禁用物物質(zhì)指令要求/禁用項(xiàng)目目鉛(Pb)鎘(Cd)汞(Hg)六價(jià)鉻(Cr6+)多溴聯(lián)苯(PBB)多溴化二苯苯乙醚(PBDE)(Therestrictionoftheuseofcertainhazardoussubstancesinelectricalandelectronicequipment)EURoHS管制規(guī)格SubstancesE.U.建議值Lead(Pb)鉛;銲錫1000PPMLead(Pb)鉛;塑膠,線材,塗料1000PPMCadmium(Cd)鎘100PPMMercury(Hg)汞1000PPMHex.Chromium(Cr6+)六價(jià)鉻1000PPMPBB(聚溴聯(lián)苯)1000PPMPBDE(聚溴二苯醚)1000PPM重金屬：汞、鉛、鎘鎘、六價(jià)鉻鉻溴性耐燃劑劑：聚溴聯(lián)聯(lián)苯(PBBs)、溴聯(lián)苯醚(PBDEs)註：另有管制規(guī)範(fàn)外外的項(xiàng)目EUWEEEDirectiveDirective2002/96/EC期程2003.01.27指指令發(fā)布2003.02.13歐歐盟公報(bào)發(fā)發(fā)行，指令令生效2004.08.13轉(zhuǎn)轉(zhuǎn)為會(huì)員國(guó)國(guó)當(dāng)?shù)胤陕?法規(guī)或或行政指令令2005.08.13完完成回收系系統(tǒng)建構(gòu),製造商因因應(yīng)回收之之財(cái)財(cái)務(wù)規(guī)規(guī)劃就緒2006.12.31回回收再利用用率達(dá)每人人每年4kg2008.12.31訂定下階段段目標(biāo)回收TargetofRecoveryandRecycling(WasteElectricalandElectronicEquipment)WEEECategory

Largehouseholdappliances

Smallhouseholdappliances

IT&telecommunicationsappliances

Consumerequipment

Lightingequipment

Electricalandelectronictools

Toys,leisure&sportsequipment

Medicaldevices

Monitoringandcontrolinstruments

Automaticdispensers

RateofRecovery

RateofRecycling

80%

75%

70%

50%

75%

65%

75%

65%

70%

50%

70%

50%

70%

50%

*

*

70%

50%

80%

75%

*Tobedeterminedby31December2006

NewCSystemProductDevelopmentProposalPhasePlanningPhaseR&DDesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meetingC3meetingC4meetingC5meetingC3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport(prel.)ME/Artwork

/packingdrawingPAL/ROMdatalistingC3manufacturabilityreviewreportSampleapprove

status&buglistreviewC4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMPMC0meetingC1meetingPMC0ChecklistMRSPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumberdefineGreendesign

guideandreviewchecklistNonQVL/SampleapprovalrequestformNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphaseoutnoticeC2checklistPESEMC/SafetyRequestFormBOM/QVL(Prel.)PCBLayout(prel.)OutsourcingmodulespecificationC2/PMC2MeetingC2-工作作重重點(diǎn)點(diǎn)及及檢檢核核項(xiàng)項(xiàng)目目階段C2設(shè)計(jì)階段(R&DDesignPhase)

負(fù)責(zé)單位技術(shù)經(jīng)理(TechnicalManager)研發(fā)部門目的*軟、硬體、機(jī)構(gòu)設(shè)計(jì)

*証實(shí)設(shè)計(jì)可行性*修正軟、硬體、機(jī)構(gòu)規(guī)格工作重點(diǎn)

*電路設(shè)計(jì)並完成電路圖*機(jī)構(gòu)設(shè)計(jì)並完成機(jī)構(gòu)設(shè)計(jì)圖*機(jī)電整合設(shè)計(jì)並完成機(jī)電介面設(shè)計(jì)*軟體設(shè)計(jì)並完成初步版本*電路設(shè)計(jì)Review*機(jī)構(gòu)設(shè)計(jì)Review*機(jī)電整合設(shè)計(jì)Review*建立初步之測(cè)試計(jì)畫(硬體、軟體、機(jī)構(gòu))審核會(huì)議C2目的*確定計(jì)畫規(guī)格*檢討設(shè)計(jì)階段之工作成效*決定是否進(jìn)入樣品試作*查核是否發(fā)出專利之申請(qǐng)檢核項(xiàng)目Schematics(Preliminary)S/WSpecificationMechanical&ThermalTestPlanInventionDisclosureInventionDisclosureNewCSystemProductDevelopmentProposalPhasePlanningPhaseR&DDesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meetingC3meetingC4meetingC5meetingC4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/Utility/DiagnosticReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMC0meeting C1meeting PMC0ChecklistMRSPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphaseoutnoticeC3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport(prel.)ME/ArtworkpackingdrawingPAL/ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus&buglistreviewC3/PMC3MeetingC3-工作作重重點(diǎn)點(diǎn)及及檢檢核核項(xiàng)項(xiàng)目目階段C3樣品試作階段(LabPilotRunPhase)

負(fù)責(zé)單位技術(shù)經(jīng)理(TechnicalManager)研發(fā)部門目的*設(shè)計(jì)驗(yàn)證

*依測(cè)試結(jié)果修改、變更設(shè)計(jì)工作重點(diǎn)

*樣品試作材料準(zhǔn)備*樣品試作*針對(duì)樣品進(jìn)行測(cè)試及驗(yàn)證*搜集Project成本資料*擬定C3品質(zhì)量化目標(biāo)*機(jī)構(gòu)設(shè)計(jì)問(wèn)題檢討及除錯(cuò)(Debug)，測(cè)試報(bào)告檢討*電路設(shè)計(jì)問(wèn)題檢討及除錯(cuò)(Debug)，測(cè)試報(bào)告檢討*軟體設(shè)計(jì)問(wèn)題檢討除錯(cuò)(Debug)，測(cè)試報(bào)告檢討*法務(wù)-稽核文件之形成要件是否符合法定要件或工程規(guī)範(fàn)-專利著作權(quán)、商標(biāo)等智慧財(cái)產(chǎn)權(quán)之申請(qǐng)準(zhǔn)備

審核會(huì)議C3目的檢討樣品測(cè)試驗(yàn)證之結(jié)果、並決定是否進(jìn)入工程試作階段檢核項(xiàng)目*HWdesignverificationreport*Microprocessor/EEPROMdatalisting*Mechanicaltestreport*SWfunctionverificationtestreport*MechanicalDrawing(Preliminary)*C3TestReport*C4TestPlan

NewCSystemProductDevelopmentProposalPhasePlanningPhaseR&DDesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meetingC3meetingC4meetingC5meetingC3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport(prel.)ME/Artwork/packingdrawingPAL/ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus&buglistreviewC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMC0meeting C1meeting PMC0ChecklistMRSPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphaseoutnoticeC4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/Utility/DiagnosticreleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC4/PMC4MeetingWistronMobileReliabilityTestPlanEnvironmentThermalProfileTestTemperatureandHumidityTestVibration,Shock,DropTestsAltitudeTest,AcousticsTestsMTBFPredictionEMCLightning/SurgeTestVoltageDipTestEFT,ESDTestHarmonicTestIEC1000-4-XXEMI/EMSPowerLineInterferenceLineVoltage/FrequencyTestPowerSurgeTestVoltageDipandInterruptionPowerOn/OffTestEFT/BImmunityTestComplexMarginTestTransportationVibrationTestAltitudeTestShockTestDropTestUserInclineOperationTestBenchHandlingTestPowerSavingTestPressureTestAudioQualityTortureTestReliabilityTest–LCDModuleWistronMobileReliabilityTestPlanItemTestConditionSampleSizeTimeResultHighTemp/HighHumidOp50℃80%RHDynamin20500HoursPassLowTempOp0℃,Dynamic5500HoursPassHighTempOp60℃,Dynamic10500HoursPassHighTemp/HighHumidstorage60℃,90%RH,Storage2240HoursPassLowTempstorage-20℃,Storage2240HoursPassT/C(Non-Op)-20℃(30Min)~60℃(30Min),Storage3100cyclePassAltitudetestOperating&Storage272HoursPassELP-20℃,Dynamic5072HoursPassVibration(Non-Op)5~500Hz,0.37Oct/min,1.5G,X/Y/Z3-PassShock(Non-Op)180G,2msec,HalfSine,±X,±Y,±Z3-PassBoxVibration5~500Hz,1.0G,0.5Oct/min15-PassBoxDrop76㎝drop15-PassESDOperatingTop_Case:±12kVPanelⅠ:±15kVPanelⅡ:±15kV5-PassNon-OperatingUserconnector:±2kVBottomcover:±12kV5-PassPanel(ref)±3kV5-PassPush5kgf(resultAfter24Hours)2-PassImageStickingMosaicPattern(8X6)104HoursPassWistronMobileReliabilityTest-LCDC4-工作重點(diǎn)及檢檢核項(xiàng)目階段C4工程試作階段(ENGPilotRunPhase)

負(fù)責(zé)單位技術(shù)經(jīng)理(TechnicalManager)研發(fā)部門工程部門目的*工程試作與驗(yàn)證

*依驗(yàn)證結(jié)果改善設(shè)計(jì)*準(zhǔn)備技術(shù)資料以便技術(shù)移轉(zhuǎn)、授權(quán)或移轉(zhuǎn)技術(shù)至相關(guān)生產(chǎn)單位工作重點(diǎn)

完成系統(tǒng)軟體或應(yīng)用軟體之設(shè)計(jì)、測(cè)試及除錯(cuò)提出軟體之程式碼(SourceCode)正式發(fā)出電路圖(Schematics)、料表清單(BOM)及已驗(yàn)證料表供應(yīng)商清單(QVL)進(jìn)行工程試作階段之測(cè)試、驗(yàn)證及除錯(cuò)並提出測(cè)試驗(yàn)證報(bào)告提出工程試作階段之試作報(bào)告及改善建議完成生產(chǎn)或技術(shù)移轉(zhuǎn)所需之相關(guān)測(cè)試程式及程序法務(wù)﹕完成專利、著作權(quán)、商標(biāo)申請(qǐng)

審核會(huì)議C4目的檢討工程試作結(jié)果，並決定是否進(jìn)入試產(chǎn)階段完成各項(xiàng)技術(shù)移轉(zhuǎn)或生產(chǎn)所需之文件，並進(jìn)行系統(tǒng)殘留問(wèn)題之檢討與對(duì)策驗(yàn)證檢核項(xiàng)目*S/WFirmwarerelease*BOM*MEENGP/Rreport*EEENGP/Rreport*TestProgram*PCBartwork*C4Testreport*Schematics*SWsourcecode*Transferplan

NewCSystemProductDevelopmentProposalPhasePlanningPhaseR&DDesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meetingC3meetingC4meetingC5meetingC3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytest

report(prel.)ME/Artwork/packingdrawingPAL/ROM

datalistingC3manufacturabilityreviewreportSampleapprovestatus&buglist

reviewC4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistPMPMC0meeting C1meeting PMC0ChecklistMRSPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportC5/NPIC5MeetingC5-工作重點(diǎn)及檢檢核項(xiàng)目階段C5試產(chǎn)階段(ProductionPilotRunPhase)

負(fù)責(zé)單位生產(chǎn)部門(Production)物管部門(MaterialManagement)工程部門(Engineering)技術(shù)經(jīng)理(TechnicalManager)研發(fā)部門(R&D)目的預(yù)為建立量產(chǎn)之準(zhǔn)備,完成