LED封裝各站不良現(xiàn)象

Thursday,April27,2023簡述各站不良Thursday,April27,20231、固晶站1、膠多單電極要求膠量不少于1/3，不多于1/2雙電極要求底部有膠，且膠量不多于1/2Thursday,April27,20232、膠少Thursday,April27,20233、粘膠Thursday,April27,20234、覆晶Thursday,April27,20235、固反Thursday,April27,2023晶片電極：圓正方負(fù)。（020支架特殊）負(fù)極正極6、點(diǎn)膠偏移Thursday,April27,20237、固晶歪斜Thursday,April27,2023歪斜角度要不大于五度8、漏固Thursday,April27,20239、雙晶Thursday,April27,2023一般為晶片來料問題10、站晶Thursday,April27,202311、浮高吸嘴下壓高度不夠或藍(lán)膜被頂針頂破，造成晶片漂浮在固晶膠上面Thursday,April27,20232、焊線站Thursday,April27,20231、拔晶Thursday,April27,20232、雙線Thursday,April27,20233、無殘金Thursday,April27,20234、焊點(diǎn)偏移Thursday,April27,20235、斷線Thursday,April27,20236、焊不粘Thursday,April27,20237、焊錯位Thursday,April27,20238、滑球Thursday,April27,20239、金線接近晶片Thursday,April27,202310、漏焊Thursday,April27,202311、翹線Thursday,April27,202312、塌線Thursday,April27,202313.線弧過高Thursday,April27,2023Thursday,April27,20233.壓模站1.填充不足Thursday,April27,20232.溢膠Thursday,April27,20233.壓偏Thursday,April27,20234.異物Thursday,April27,20235.膠體剝離Thursday,April27,20236.銅箔發(fā)白Thursday,April27,20237.膠體破損Thursday,April27,20238.氣泡Thursday,April27,2023PCB170系列非晶片正上方區(qū)域氣泡不大于10mil，不大于10mil旳氣泡不得超出3個。194系列氣泡不得超出5mil9.膠體不平Thursday,April27,202310.膠體劃傷Thursday,April27,2023挑溢膠時要注意11.膠體模糊Thursday,April27,2023Thursday,April27,20234.點(diǎn)膠站1.膠量過多Thursday,April27,20232.膠量過少（露金線）Thursday,April27,20233.異物Thursday,April27,2023Thursday,April27,20235.切割站1.飛料Thursday,April27,20232.毛刺Thursday,April27,2023Thursday,April2