信賴性基本知識-講師版 (2)

11-1.)Environmentinfluence環(huán)境對產(chǎn)品的影響:環(huán)境條件影響溫度氧化、擴散等化學反應的促進，膨脹、收縮後造成的受熱，機械性歪斜、軟化、脆性濕度絕緣性降低、腐蝕及電解結(jié)露或乾燥時造成靜電氣阻礙振動、衝擊機械性搖動鬆弛，疲乏破壞、斷線、共振造成的破損發(fā)霉絕緣性降低氣壓電氣耐壓降低，氣封不良(封漏)鹽害腐蝕、生鏽、絕綠性降低有害氣體氯氣、亞硫酸等造成腐蝕絕緣性降低砂或塵埃阻塞、帶電、絕綠性降低、磨耗臭氧氧化、有機材料脆弱化帶電電磁誘導妨害電波、破壞絕緣、附著異物、灰塵1.可靠度觀念篇21-2.)Reliabilityderive可靠度的起源:Nineteencentury十九世紀開始研究WorldwarII二次世界大戰(zhàn)Militarysystem軍事系統(tǒng)Aviationsystem航太系統(tǒng)Commercial商用1.可靠度觀念篇31-3.Marketdemandforreliability市場對可靠度需求:Notonlypredictdatabutalsotestdada要求証實資料而不是預估可靠度Standard標準的定訂?Betterandbetter科技不斷變化，可靠度要維持/更好Lowrecallrate回修率越低越好1.可靠度觀念篇41-4.)Challenge面臨挑戰(zhàn):Tech.Changequickly技術(shù)快速變化Highreliabilityproduct高可靠度產(chǎn)品Utilizationwidely使用範圍廣Shortmarketlife產(chǎn)品市場壽命短Shorttimetomarket快速上市時間

traditionaltestmethod傳統(tǒng)測試方法?newaccelerationtestmethod創(chuàng)新加速測試!1.可靠度觀念篇51-5.)Howtowin如何脫穎而出?:Highreliabilityassurance提出高可靠度的保證Reliabilitysystem公司可靠度制度Experience公司經(jīng)驗Reliabilityplan產(chǎn)品可靠度計劃Reliabilitytestdata產(chǎn)品可靠度測試記錄TQM1.可靠度觀念篇61-6.)Traditionalandnew傳統(tǒng)與現(xiàn)代:Traditional傳統(tǒng)思考：

reliabilityistheresponsibilityofRA

personnel

可靠度是品?；蚩煽慷裙こ倘藛T的職責New現(xiàn)代思考：

reliabilityisteam-workresult

可靠度是Team-work的成果，公司其他成員如設(shè)計、製程、製造工程師，必須在其職責中，考慮如何提昇可靠度1.可靠度觀念篇71-7.)Reliabilityengineering可靠度工程:DesignforReliability(Design-in,Build-in)

可靠度設(shè)計ReliabilityTestandDataAnalysis

可靠度測試與資料分析FailureAnalysis失效分析1.可靠度觀念篇8DesignforReliability可靠度設(shè)計:Reliabilitypredict可靠度預估FMEA(失效模式效果分析)FTA(失效樹分析)Margin預估DesignGuideline制定設(shè)計審核(DesignReview)1.可靠度觀念篇9產(chǎn)品在規(guī)定的使用環(huán)境中，能於規(guī)定的期間內(nèi)毫無故障的發(fā)揮其特定功能的機率

(某信心水準下)Qualityovertime1-8.)Reliabilitydefinition可靠度的定義:1.可靠度觀念篇101-9.)Nounintroduction可靠度常用名詞:MTTF:meantimetofailure平均失效時間MTBF:meantimebetweenfailure平均失效間隔Burn-in:催熟(將earlyfailure產(chǎn)品去除)FIT:failureintime單位時間失效,10^91.可靠度觀念篇11Time時間Earlyfailure早夭期(ppm)Randomfailure有用期(FIT)Wear-out磨耗期(MTTF/MTBF)品質(zhì)失效隨機失效磨耗失效Failurerate失效率(t)1-10.)Failureratecurve半導體失效曲線(浴缸曲線):1.可靠度觀念篇122-1.)Purpose可靠度測試目的:2.可靠度測試與失效機制findoutpotential

failuremechanism發(fā)現(xiàn)潛在的失效機制evaluate

failurerate評估產(chǎn)品的失效率makesurewearoutmechanismsdonotoperateinproductlifeperiod確保於老化階段之失效機制不會出現(xiàn)在產(chǎn)品正常的壽命階段132-2.)Environmentandreliabilitytest環(huán)境與可靠度測試:環(huán)境條件試驗種類

溫度溫度試驗、溫度循環(huán)試驗高、低溫放置試驗濕度溫度試驗、溫度循環(huán)試驗、HAST試驗振動、衝擊振動試驗、衝擊試驗發(fā)霉溫度試驗、HAST試驗氣壓滅壓試驗、HAST試驗鹽害鹽水噴霧試驗有害氣體腐蝕試驗、混合氣體試驗砂或塵埃砂塵試驗、塵埃試驗臭氧臭氧、環(huán)境試驗帶電電磁誘導靜電試驗電氣雜音試驗2.可靠度測試與失效機制14ReliabilityLab.capabilitySPILConfidentialTestItemJEDECMILorotherMoisturesensitivity/PreconditionJ-STD-020,JESD22-A113~TemperaturecyclingJESD22-A104MIL-STD-883Method1010.7ThermalshockJESD22-A106MIL-STD-883Method1011.9PressureCookerJESD22-A102~HighTemperatureStorageJESD22-A103MIL-STD-883Method1008HighTemperatureoperatinglifeJESD22-A108~TemperatureandHumidityBiased/unbiasedJESD22-B101EIAJ-IC-121HASTBiased/unbiasedJESD22-A110,A118~SolderJoint~kkkkkIPC-9701BumpElectromigrationJESD63~Solderability

JESD22-B102MIL-STD-883Method2003.7LeadfatigueJESD22-B105MIL-STD-883Method2004MarkpermanencyJESD22-B107MIL-STD-883Method2015.11152-3.)濕敏感度測試(Moisturesensitivitytest/Precondition):Reference參考規(guī)範:J-STD-020,JEDC-22-A113Purpose目的:simulateSMTprocess模擬元件上板製程Failuremode常見電性失效:斷路(open),功能失效(functionalfail)Failuremechanism常見失效機制:脫層(Delamination),爆米花

(Popcorn),晶片斷裂(diecrack),金球脫(balllifted),金線斷(2ndbondbroken)..等

2.可靠度測試與失效機制162.可靠度測試與失效機制主機板(motherboard)黏著於主機板後(afterSMT)172-3.)濕敏感度測試(Moisturesensitivitytest/Precondition):爆米花(Popcorn)金線斷(2ndbondbroken)2.可靠度測試與失效機制182-3.)濕敏感度測試(Moisturesensitivitytest/Precondition):脫層(Delamination)2.可靠度測試與失效機制19

濕敏感度分類

(J-STD-020Moisturesensitivitylevel):2.可靠度測試與失效機制20212-3.)濕敏感度測試(Moisturesensitivitytest/Precondition):

流程:(1)

Electricaltesting電性測試

(2)

SATinspection超音波檢驗

(3)

Temperaturecycling,5cycles,-65~150C（option）溫度循環(huán),5cycles--(選擇)

(4)

Hightemperaturebake,24hours@125C高溫烘烤,24小時,125C

(5)

Moisturesoak吸濕(level1:85C/85%R.H168h,level2:85C/60%R.H168h,level2A:60C/60%RH120h,level3:30C/60%R.H192h)

(6)

SMTsimulation,3cyclesIRreflow225C/240C/250C上板模擬,流焊3次

(7)

Electricaltesting電性測試(8)SATinspection超音波檢驗

2.可靠度測試與失效機制222.可靠度測試與失效機制Delamination

脫層PackageCrack膠體破裂DieCrack晶片破裂Void氣洞Tilt

傾斜DelaminationPKGCrackVoidPKGCrackChipCrackSAT可檢出不良:232.可靠度測試與失效機制超音波遇到脫層(空氣)時波的相位會反轉(zhuǎn)180度242.可靠度測試與失效機制DieCrack晶片破裂PKGBottomPKGCrackPadBottomPKGCrack膠體破裂Throughscan脫層252.可靠度測試與失效機制SAT規(guī)格(SATcriteria,RA-0501):26IR/ConvectionreflowOvenTemp.andhumiditychamber272.可靠度測試與失效機制有鉛流銲溫度曲線Sn/Pbreflowprofile282.可靠度測試與失效機制無鉛流銲溫度曲線Leadfreereflowprofile292-4.)高壓蒸煮試驗PressureCookerTest（PCT）:Reference參考規(guī)範:JESD22-A102Purpose目的:Todetectmoisturerelateddefect偵測與濕相關(guān)之不良Condition常用條件:121C/100%RH/2ATM,168HFailuremode常見電性失效:短路(short),

漏電(leakage),斷路(open)Failuremechanism常見失效機制:金屬離子遷移(ironmigration/dendrite),

脫層(Delamination),金屬層剝離(metalpeeling),腐蝕(corrosion)…等

302-4.)高壓蒸煮試驗PressureCookerTest（PCT）:金屬離子遷移(ironmigration/dendrite)2.可靠度測試與失效機制312-4.)高壓蒸煮試驗PressureCookerTest（PCT）:金屬層剝離(metalpeeling)2.可靠度測試與失效機制32TemperaturecyclingchamberCcondition:-65~150CBcondition:-55~125CGcondition:-40~125CThermalshockchamberDcondition:-65~150CCcondition:-55~125COthers332-5.)溫度循環(huán)試驗TemperatureCycleTest（TCT,airtoair）:Reference參考規(guī)範:MIL-STD-883EMethod1010.7,JESD22-A104Purpose目的:Todetectthedefectthatrelatedtopackagingstructure,material,process偵測與封裝結(jié)構(gòu),材料,製程相關(guān)之不良Condition常用條件:-65C~150C(C條件),-55~125C(B條件),1000CYCFailuremode常見電性失效:斷路(open),功能失效(functionalfail)Failuremechanism常見失效機制:晶片斷裂(diecrack),金球脫,金線斷,

脫層(Delamination),導孔斷裂(viaholecrack),線路斷裂(tracebroken),掉球(ballmissing)…等

2.可靠度測試與失效機制342.可靠度測試與失效機制線路斷裂(tracebroken)掉球(ballmissing)352.可靠度測試與失效機制導孔斷裂(viaholecrack)362-6.)冷熱衝擊試驗ThermalShockTest（TST,liquidtoliquid）:Reference參考規(guī)範:MIL-STD-883EMethod1011.9,JESD22-A106Purpose目的:Todetectthedefectthatrelatedtopackagingstructure,material,process偵測與封裝結(jié)構(gòu),材料,製程相關(guān)之不良Condition常用條件:-65C~150C(D條件),-55~125C(C條件),500CYCFailuremode常見電性失效:斷路(open),功能失效(functionalfail)Failuremechanism常見失效機制:晶片斷裂(diecrack),金球脫,金線斷,

脫層(Delamination),導孔斷裂(viaholecrack),線路斷裂(tracebroken),掉球(ballmissing)…等

2.可靠度測試與失效機制37150CAir-65CAir150Cliquid-65CliquidTCTTST-65C,10mins150C,10mins25CMax:15mins-65C,5mins150C,5mins25CMax:5minsTCTandTST比較382-7.).溫濕度偏壓壽命試驗TemperatureHumidityBias（THB）:Reference參考規(guī)範:EIA/JESD22-A101Purpose目的:Todetectmoisturerelateddefect

偵測與濕相關(guān)之不良Condition常用條件:85C/85%RH,Bias,1000HFailuremode常見電性失效:短路(short),漏電

(leakage)Failuremechanism常見失效機制:金屬離子遷移

(ironmigration/dendrite),過大電流(electricaloverstress),腐蝕(corrosion)…等

392-7.).溫濕度偏壓壽命試驗TemperatureHumidityBias（THB）:2.可靠度測試與失效機制過大電流(electricaloverstress)402-8.)高溫儲存試驗HightemperatureStoragelife(HTSL):Reference參考規(guī)範:JESD22-A103Purpose目的:Toacceleratethediffusionofinter-metallic(Au/Al,Sn/Au),and

confirmwhethertocauseopenfailure

加速合金(金/鋁,錫/金IMC)之擴散並確認其是否因而造成開路Condition常用條件:150C,1000HFailuremode常見電性失效:斷路(open),功能失效(functionalfail)Failuremechanism常見失效機制:金球脫(紫斑效應),掉球(ballmissing),過大電流(electricaloverstress)…等412.可靠度測試與失效機制0HRIMC175C/24HIMC150C/1000HIMCcrack422.可靠度測試與失效機制Purpleplague:AuAl2Blackdeath:Au,Al,SiBestIMC:Au4Al432.可靠度測試與失效機制Kirkendallvoid:longtime,hightemp.anddifferentdiffusionratebetweenAu-Al(2.5X)resultinvoid.長時間高溫下IMC快速成長,再加上Au-Al之間擴散速率相差2.5倍而形成void442-9.)超加速壽命試驗Highacceleratedstresstest(HAST):Reference參考規(guī)範:JESD22-A110Purpose目的:Toevaluateonthedeviceresistancetohighhumidityandtemperature(withpressure)underspecifiedbiascondition.

評價產(chǎn)品在高溫、高濕(壓力)及偏壓條件下之耐久性Condition常用條件:130C,85%RH,96H/100H,Biasorun-biasFailuremode常見電性失效:短路(short),漏電(leakage)Failuremechanism常見失效機制:金屬離子遷移(ironmigration/dendrite),

過大電流(electricaloverstress),腐蝕(corrosion)…等

452-9.)超加速壽命試驗Highacceleratedstresstest(HAST):2.可靠度測試與失效機制錫鉛離子遷移(Sn/Pbdendrite)462-9.)超加速壽命試驗Highacceleratedstresstest(HAST):2.可靠度測試與失效機制鋁墊腐蝕(Alpadcorrosion)472-10.)沾錫附著性試驗Solderability:Reference參考規(guī)範:EIA/JESD22-B102Purpose目的:toprovideameansofdeterminingofthesolderabilityofdevicepackageterminationsthatareintendedtobejointedtoanothersurfaceusingsolderorattachmen