杜邦產(chǎn)品介紹(3)ppt課件

1、Introduction to Flexible Circuit MaterialsPresented by: Jonathan C. LimPart II : ( 40 minutes).簡報(bào)大綱軟性電路板基材之介紹基材的主要CompositionDielectric Substrates (絕緣體)Adhesive (膠質(zhì))Conductor (導(dǎo)體)m.簡報(bào)大綱 (continue)杜邦產(chǎn)品壓克力膠系列(Modified WA Acrylic)之基材環(huán)亞樹脂膠系列(Modified Epoxy)之基材杜邦 料號解說PyraluxTelcamm.軟性電路板之主要基材Copper Clad

2、Laminates (銅箔基材)Single-Sided C.C.L.(單面銅箔基材)AdhesiveConductorDielectric Substratem.Double-Sided C.C.L. .(雙面銅箔基材)ConductorDielectric SubstrateAdhesive軟性電路板之主要基材m.Adhesive-Less C.C.L. .(無膠銅箔基材)Dielectric SubstrateConductor軟性電路板之主要基材m.Coverlay(覆蓋膜)軟性電路板之主要基材mDielectric SubstrateAdhesive離型紙AdhesiveKapton

3、.Stiffner (補(bǔ)強(qiáng)材)軟性電路板之主要基材Dielectric SubstrateAdhesivem.BondplyDielectric SubstrateAdhesiveAdhesive軟性電路板之主要基材mMylarAdhesiveKaptonAdhesive.Sheet AdhesivePhotoImageable Coverlay (PIC)Dry FilmFine-Line ApplicationCameraAutomotiveOthers軟性電路板之主要基材m.Dielectric SubstratesDefinitionA base film on which the p

4、rinted conductors are laid.A film which provides electrical insulation between conductors.A film which provides mechanical strength of the circuit.m.必備之特性Mechanical StrengthFlexibilityDimensional StabilityDielectric PropertiesThermal PropertiesChemical ResistanceMoisture AbsorptionCostDielectric Sub

5、stratesm.Substrates 之種類PolyimidePolyesterFluorocarbonAramid PaperCompositeDielectric Substratesm.Polyimide:Popularized by DuPont under “KaptonAlso known as PI First choice of film in most FPCInfusible and flame retardantHigh Tg (約 260C - 280C)Good dimensional stabilitySubstratesm.SubstratesPolyester

6、:Popularized by DuPont under “Mylar Also known as PETLowest cost dielectric materialMostly used in low-cost consumer applicationGood mechanical propertiesBad thermal propertiesm.SubstratesAramid Paper:Sold under DuPont trade name “NomexUsed in specialized applicationGood thermal insulation materialm

7、.Property Polyester Polyimide Fluorocarbon Aramid Paper CompositeTensile Strength Excellent Excellent Fair Good BestFlexibility Excellent Excellent Excellent Good Fair/GoodDim. Stability Fair/Good Good Fair Good Fair/GoodDielectric Str. Good Good Very Good Very Good GoodSolderibility Poor Excellent

8、Fair Excellent ExcellentC.O.T. (C) 105 200-230 150-180 220 105-180Thermal Exp. Low Low High Moderate LowChem. Resist. Good Good Excellent Very Good FairMoisture Absorp. Very Low High Very Low Very High LowCost Low High High Moderate ModerateTrade Name Mylar Kapton Teflon/Tedlar NomexDielectric Subst

9、ratesm.AdhesiveDefinitionMaterial that bonds layers togetherThermosettingThermoplasticm.Adhesive必備之特性Adhesion StrengthFlexibilityChemical ResistanceThermal ResistanceMoisture AbsorptionElectrical PropertiesCostm.AdhesiveAdhesive之種類PolyesterAcrylicEpoxyPolyimideButyral Phenolicm.AdhesivePolyester:Use

10、d where the dielectric is also polyesterUsed where no soldering is neededTypical application:Instant camera film interconnectsInstrument cluster connection in automobilesm.AdhesiveAcrylic:Used in demanding temperature requirement applicationMost popular acrylic system is Pyralux by DuPontExcellent a

11、dhesionm.AdhesiveEpoxy:Widely used adhesive systemGenerally lower cost than acrylicAble to stand wave solderingGood in high temperature for long period of time (400 to 450 F)m.AdhesivePolyimide:Used in adhesiveless ccl and coverlayUsed where dimension stability is criticalUsed in high temperature ap

12、plicationHigh moisture absorptionm.AdhesivePolyesterAcrylicEpoxyPolyimideButyral PhenolicTemp.Resist.Chem.Resit.Elec.Prop.AdhesionFlexibilityCostMoisture FairGoodExcellentExcellentExcellentLowFairVery GoodGoodGoodExcellentVery GoodGoodGoodGoodGoodGoodExcellentExcellentExcellentGoodGoodGoodGoodGoodGo

13、odModerateFairFairVery HighPoorFairFairHighModeratePoorm.Conductors/FoilMajor types of conductorsMetalsMetal alloysconductive inksCopper (the most commonly used conductor in FPC)Electrolytically deposited copper (ED)Rolled Annealed copper (RA)m.Conductors/Foil必備之特性Current-carrying capacityFlexibilit

14、yService temperatureChemical resistanceMechanical strengthCostm.Conductors/FoilElectrical PropertiesThermal PropertiesMechanical PropertiesRelative CostAluminumCopperGoldNickelSilverExcellentGoodExcellentExcellentExcellentExcellentExcellentExcellentGoodGoodGoodGoodGoodFairFair/GoodFairFairVery GoodV

15、ery GoodBestm.軟板基材製造過程Copper RollKapton RollCopper Clad LaminateHeater 1Heater 2Liquid AdhesiveAgingm.Introduction to DuPont ProductsmPart III: ( 15 minutes).DuPont Product FamilyPyraluxPyralux FRPyralux LFPyralux APPyralux PCTeclamTeclam FNCTeclam DNC.Pyralux FR - series (Acrylic Based)Copper-Clad

16、LaminatesPanel Form Packaging. (24 x 36)UL Approved. (File# E124294)Very Good Flexure EnduranceEx. FR9111, FR9110, FR8510, FR8515CoverlayRoll Form Packaging. (24 x 250)UL Approved. (File# E124294)Excellent Dimensional StabilityEx. FR0110, FR0210m.Pyralux FR continue.Sheet AdhesiveRoll Form Packaging

17、. (24 x 250)UL ApprovedEx. FR0100, FR0200Bond PlyRoll Form Packaging. (24 x 250)UL ApprovedEx. FR0111, FR0212m.Pyralux LF - series (Acrylic Based)Military SpecificationsExcellent Flexure EnduranceVery Good for High-Density CircuitrySame Product Offerings as FR - seriesPC - series (Acrylic, urethane,

18、 & imide-based)Dry FilmPhotoimageable CoverlayCameras & Automotive Applicationsm.Pyralux P/NsFR 9 111CuPICu7 - Special construction8 - 1/2oz. C.C.L.9 - 1oz or more C.C.L.5 - 1/2 oz. Cu1 - 1 oz. Cu2 - 2 oz. Cu1 - 1 mil PI2 - 2 mil PI3 - 3 mil PIFRLFAPCopper-Clad Laminatesm.Pyralux P/NsFR 0 111Adh.PIAdh.FRLFAP7 - Special construction0 - Coverlay or Sheet Adhesive1 - 1 mil adhesive2 - 2 mil adhesive3 - 3 mil adhesive1 - 1 mil PI2 - 2 mil PI3 - 3 mil PICoverlay & Sheet Adhesivem.Teclam FNC - seriesCopper-C