一諾銀合金絲產(chǎn)品介紹ppt課件

1、煙臺(tái)一諾電子資料1Welcome to 熱烈歡迎 Our Company 光 臨 指 導(dǎo)先生和朋友們 .煙臺(tái)一諾電子資料2煙臺(tái)一諾電子資料Yantai YesNo Electronic Materials Co.,Ltd 您值得信任的同伴和朋友產(chǎn)品引見(jiàn)Introductions of Products.煙臺(tái)一諾電子資料3 鍵合絲 Bonding wire 銀鍵合絲 Silver bonding wire 銅鍵合絲 Copper bonding wire 鋁鍵合絲 Aluminum bonding wire 靶材、蒸發(fā)材 Evaporating / Target Materials 主要內(nèi)容 C

2、ontent.煙臺(tái)一諾電子資料4金/銀/銅/鋁等鍵合絲 Gold/Silver/Aluminum /Copper etc. Bonding wire 貴金屬蒸發(fā)材、靶材、焊線， 以及用于特殊用途的合金資料 Evaporating precious metal ,Target Materials, Solder wire and other alloy for multipurpose applications航空發(fā)動(dòng)機(jī)/輻射維護(hù)等資料 Aero engine/Radioprotection etc. materials 主要產(chǎn)品和效力(1/2) Mainly Products & Servic

3、es.煙臺(tái)一諾電子資料5主要產(chǎn)品和效力(2/2) Mainly Products & ServicesAl targetAg/Au for evaporation 銀鍵合絲Ag Bonding Wire 銅鍵合絲Cu Bonding Wire 金鍵合絲Au Bonding Wire 鋁鍵合絲Al Bonding wire .煙臺(tái)一諾電子資料66N高純?cè)?棒材合金化絲材廢品的絲材廢品一鍵合絲 Bonding Wire鍵合絲工藝流程Bonding wire process flow.良好的焊接化合性能，沒(méi)有虛焊，最大程度減少對(duì)芯片的損害煙臺(tái)一諾電子資料7鍵合絲和鍵合過(guò)程 Bonding Wire

4、 and Bonding Process 線軸外表清潔、尺寸準(zhǔn)確，好的放線性能成弧規(guī)那么、均勻、穩(wěn)定，足夠的強(qiáng)度 成球尺寸、硬度適宜，外表圓滑，盡能夠減少氧化和污染EFO外表清潔，間隙正確穩(wěn)定，電流、時(shí)間適宜，兼顧適宜的成球和效率鍵合絲要求尺寸準(zhǔn)確，清潔，無(wú)污染，無(wú)損傷Bonding wire must be in right size, clean, and no damage.The spool must be clean, in right, and have good despooling propertyClean surface, stable gap, right current

5、 and time to FABThe loop must be equal, uniform, stable and hard enoughGood bonding performance, no virtual welding, do little harm to chips.Right FAB and hardness, smoothing, little oxide and contamination. 尺寸適宜，外表光滑，沒(méi)有污染損傷，盡能夠減少與線材的摩擦Capillary: in right size, clean, smoothing, no damage, low frict

6、ion with wire.煙臺(tái)一諾電子資料8物理性能參數(shù)(金銀銅鋁)Physical properties (Au, Ag, Cu, Al) 項(xiàng)目 Item單位Unit金Au銀Ag銅Cu鋁Al鋁硅 Al-1%Si鈀Pd熔點(diǎn) Melting Point106396210836606301555沸點(diǎn)Boiling Point28602163259527673167密度Density at 20g/19.3210.438.962.72.712.16電阻率Electrical Resistancecm2.31.621.72.72.812.16熱傳導(dǎo)率(at 20)Thermo-conductivit

7、yW/m.K29542039523619675線膨脹率Coefficients of expansion14.218.917.524.624.511.5楊氏模量Young ModulusKN/mm2788312870.565126剛性模量Rigidity modulus KN/mm22731452626.255.煙臺(tái)一諾電子資料9熔斷電流對(duì)比(1/2)Comparisons of fusing currents熔斷電流數(shù)值的獲得根據(jù)實(shí)驗(yàn)條件的不同會(huì)有略微的差別。Slightly differences may exist due to different experiment conditio

8、ns.Ag Wire Fusing Current (Amp)Dia.(um)1820232530Wire Length(mm)0.54.284.587.157.1510.2812.152.283.583.585.251.51.211.552.382.383.520.981.151.791.792.582.50.860.931.441.442.0530.750.761.21.21.72Cu Wire Fusing Current(Amp)Dia.(um)1820232530Wire Length(mm)0.53.954.166.56.59.3611.962.083.253.254.681.51

9、.11.392.172.173.1220.891.041.631.632.342.50.780.831.31.31.8730.670.691.081.081.56Au Wire Fusing Current (Amp)Dia.(um)1820232530Wire Length(mm)0.53.293.475.435.437.8111.671.742.712.713.911.50.961.161.811.812.620.730.871.361.361.952.50.60.691.091.091.5630.520.580.90.91.3.煙臺(tái)一諾電子資料10熔斷電流長(zhǎng)度：1mmI = Kd3/2I

10、 ： Maximum current in Ampsd：Wire diameter in inchesK：Materials constant,熔斷電流計(jì)算公式直徑熔斷電流對(duì)比(2/2)Comparisons of fusing currents.煙臺(tái)一諾電子資料11金屬間化合物增長(zhǎng)對(duì)比Comparisons of IMC IMC增長(zhǎng)對(duì)比Time of diffusion layer formed to 10nm(200)Test ConditionBaking Temp. : 175Baking Time : 1000hr.煙臺(tái)一諾電子資料12鍵合絲運(yùn)用本錢(qián)比較1/2Cost compari

11、sons of different bonding wires項(xiàng)目金絲銅絲鍍鈀銅絲銀絲價(jià)格非常高很低較高較高設(shè)備成本正常需要改設(shè)備需要改設(shè)備正常保護(hù)氣體無(wú)混合氣混合氣建議N2成品率高很底較高比較高儲(chǔ)存期限1年3個(gè)月6個(gè)月1年風(fēng)險(xiǎn)無(wú)很高很高無(wú)ItemsAuCuPdCuAgPriceVery highlowRelatively highRelatively highEquipment costRegularNeed changeNeed changeRegularProtective gasNoneGas mixtureGas mixtureSuggest N2YieldHighVery lowR

12、elatively highRelatively highShelf life1 year3 months6 months1 yearRiskNoneVery highVery highNone.煙臺(tái)一諾電子資料13鍵合絲運(yùn)用本錢(qián)比較2/2Cost comparisons of different bonding wires價(jià)錢(qián)比較 Price comparisons:綜合本錢(qián)比較 Comprehensive cost comparisons:綜合上述本錢(qián)，銀絲的價(jià)錢(qián)略低于鍍鈀銅絲，高于銅絲大約2倍，遠(yuǎn)低于金絲。思索到銅絲的控制風(fēng)險(xiǎn)，銀絲為最正確選擇。Above all, the price

13、of Ag wire is a little lower than Pd plating of Cu wire, 2 times higher than Cu wire, and far lower than Au wire. In consideration of the control risk of Cu, Ag wire is chosen to be the best.煙臺(tái)一諾電子資料14 Silver Bonding Wire-the worlds first 鍵合銀絲 世界首創(chuàng)廣泛運(yùn)用于發(fā)光管和部分分立器件及IC。 Widely used in LED and some TR 、

14、 IC. 1鍵合銀絲 Ag Bonding Wire 高純?cè)Y料：主要原資料6N銅，5N銀，及合金由美國(guó)一諾自制，現(xiàn)與山東國(guó)大捷克薩菲納、招金精煉協(xié)作，運(yùn)用電解區(qū)熔等高純提純工藝，保證6N的高純銀原料的消費(fèi)： 性能和質(zhì)量的穩(wěn)定性 較高的抗腐蝕和抗氧化性雜質(zhì)元素ImpurityCuBiNiFeCaMgSeZnTe含量Content0.10.050.050.010.050.010.010.050.05High Purity Ag Raw Material ： Main Materials(6NCu,5NAg,and Alloy) come from YesNo America. Ag raw ma

15、terial is guaranteed by using electrolytic zone melting purification method, and cooperated with Shandong Guodasafina Group and Zhaojin Group. Stability of performance and quality. Good corrosion resistance and oxidation resistance .煙臺(tái)一諾電子資料15優(yōu)點(diǎn) Advantages較好的導(dǎo)電和導(dǎo)熱性能 Good electric and thermal conduct

16、ivity較好的抗腐蝕和抗氧化性能與銅比較Good corrosion and oxidative resistance (Compared with Cu)僅需氮?dú)饩S護(hù)，比較平安與銅比較N2 as protective gas only (Compared with Cu)硬度較低銅比較Lower hardness (Compared with Cu)本錢(qián)較低-金的1/5-6 Lower price-1/5-6 to Au缺陷 Disadvantages加工性能較差，制造本錢(qián)較高 Poor process performance and high manufacturing cost本錢(qián)是銅

17、的的2-3倍 cost 2-3times higher than Cu銀絲的特點(diǎn)Features of Ag Bonding Wire挑戰(zhàn) ChallengesIMC控制Ag 的電子遷移問(wèn)標(biāo)題前曾經(jīng)根本處理The control of IMC ( The problem of electron transfer of Ag is basically resolved) .煙臺(tái)一諾電子資料16銀絲機(jī)械性能參數(shù)Mechanical properties of Ag bonding wire更多參數(shù)請(qǐng)登錄我公司網(wǎng)站或咨詢我公司效力人員。Please log in the website of our

18、 company or consult us to get more information. DiameterAg()(mil)YA99YA95YA88YA80YAB/L(gf)E/L(%)150.61.523428180.74567210200.8 5678210230.9 781011215251.0 9101213215301.2 13151617520331.3 17181920520381.5 21222425520502.0 36384042525.煙臺(tái)一諾電子資料17銀絲和真球硬度Ag Wire & FAB Hardness 標(biāo)題.煙臺(tái)一諾電子資料18銀絲的熱影響區(qū)HAZ of

19、 Ag bonding wires弧高Loop height熱影響區(qū)小于弧高，可以最大程度保證線弧的強(qiáng)度和穩(wěn)定性。Ball NeckHeat affected zone The strength and stability of loop could be guaranteed when the height of HAZ is less than the loop.煙臺(tái)一諾電子資料19銀絲焊接性能 Welding performance of Ag bonding wire 實(shí)驗(yàn)條件 Experiment conditions0.8mil；高溫200儲(chǔ)存，0-300小時(shí) ；檢測(cè)速度：100u

20、m/sec；檢測(cè)數(shù)量：50。0.8mil, storaged under 200 for 0-300 hours, detection speed:100um/sec, detection quality:50.Ball Shear TestBond Pull Test.煙臺(tái)一諾電子資料20銀絲抗腐蝕性能Corrosion resistance of Ag bonding wire銀會(huì)與氧緩慢反響生成氧化銀 AgO和Ag2O，是對(duì)光敏感的灰白色固體，導(dǎo)電，100 時(shí)分解為銀和氧氣，對(duì)鍵合根本沒(méi)有影響。銀在有氧的環(huán)境下易硫化Ag + H2S + O2 = Ag2S + H2O，硫化銀呈灰黑色，導(dǎo)

21、電性較差，會(huì)影響焊接性能。故銀絲的鍵合時(shí)建議加氮?dú)饩S護(hù)，隔離氧氣，除此以外，銀很穩(wěn)定，普通不會(huì)被其他離子腐蝕。AgOAg2OSilver Ag2S試驗(yàn)條件：0.1mol/L 硫化鈉水溶液，0-200小時(shí)。Experiment condition:0.1mol/L Na2S solution dipping for 0-200 hours.Ag oxides to be AgO and Ag2O, which is electrical conduction and will decompose into Ag and O2. This reaction do little harm to bo

22、nding.Ag also can react into Ag2S Ag + H2S + O2 = Ag2S + H2O,which has poor electrical conduction and affect bonding seriously. Above all, the bonding process of Ag should be protected by N2.煙臺(tái)一諾電子資料21銀絲運(yùn)用范圍Applications of Ag bonding wiresYA99YA95YA88YA80低端LED低端TRLEDTRIC CARDQFNTSOPFlash Memo中高端封裝LE

23、DQFPTSSOPQFNDFNIC CARDMQFPPBGATQFPBGAFlash Memo中高端封裝TQFPTSSOPPBGABGA高端封裝鍵合銀絲的開(kāi)展將逐漸走向以一種型號(hào)順應(yīng)不同的封裝方式。Ag bonding wire with single type will gradually adapt to different packaging forms. .煙臺(tái)一諾電子資料22銀絲的運(yùn)用趨勢(shì)Ag Bonding Wire Application Trend 2021 2021 2021 2021 封 裝 形 式隨著鍵合銀絲研討的深化，鍵合銀絲將越來(lái)越順應(yīng)小型化、薄型化封裝方式開(kāi)展，是未

24、來(lái)取代昂貴金絲的最正確產(chǎn)品。With the deepening research on Ag bonding wire, it will more and more adapt to the miniaturization and thin packaging forms. It will replace Au which is expensive in the future.Packaging forms.煙臺(tái)一諾電子資料23銀絲專(zhuān)利及RoHS證書(shū)Our patent and RoHS certificate of Ag bonding wire.煙臺(tái)一諾電子資料24為什么選擇銅絲(1/3

25、) Why Cu wire 由上可見(jiàn)，銅原料的價(jià)錢(qián)相對(duì)金來(lái)說(shuō)根本上可以忽略不記，但由于加工的本錢(qián)較大，實(shí)踐從線材價(jià)錢(qián)來(lái)對(duì)比的話銅絲僅為金絲的10%左右。Its clear that the price of Cu can be ignored compared with Au. But due to its high processing cost, the actual price of Cu wire is only about 10% of the Au wire. Price of Cu in 5 yearsPrice of Au in 5 years2鍵合銅絲 Cu Bonding

26、Wire.煙臺(tái)一諾電子資料25為什么選擇銅絲(2/3)Why Cu wire項(xiàng)目 Item單位Unit金Au銀Ag銅Cu鋁Al鋁硅 Al-1%Si鈀Pd熔點(diǎn) Melting Point106396210836606301555沸點(diǎn)Boiling Point28602163259527673167密度Density at 20g/19.3210.438.962.72.712.16電阻率Electrical Resistancecm2.31.621.72.72.812.16熱傳導(dǎo)率(at 20)Thermo-conductivityW/m.K29542039523619675線膨脹率Coeffic

27、ients of expansion14.218.917.524.624.511.5楊氏模量Young ModulusKN/mm2788312870.565126剛性模量Rigidity modulus KN/mm22731452626.255.煙臺(tái)一諾電子資料26為什么選擇銅絲 (3/3)Why Cu wire熔斷電流(Fusing current)1mm.煙臺(tái)一諾電子資料27銅絲的特性 優(yōu)點(diǎn)1/2) Features of Cu bonding wire -advantage更高的機(jī)械性能保證了線弧的穩(wěn)定，不易構(gòu)成塌絲或者歪絲。Higher mechanical guarantees th

28、e stability of the loop. Sagging and sweeping are not easily formed.煙臺(tái)一諾電子資料28金屬間化合物IMC生長(zhǎng)緩慢，提高可靠性。The reliability are enhanced because of the slow growth of IMC.銅絲的特性 優(yōu)點(diǎn)2/2) Features of Cu bonding wire -advantage.煙臺(tái)一諾電子資料291.易氧化，儲(chǔ)存及鍵合期間需采用專(zhuān)門(mén)設(shè)備及氣體進(jìn)展維護(hù)。The oxidation of Cu, special equipments and gases

29、 are needed to protect it during bonding and storage.2.硬度比較大，容易對(duì)芯片呵斥損傷。The pad is likely to be damaged because of the high hardness of Cu. 3.焊接球下面的鋁層厚度的不規(guī)那么減少,能夠會(huì)導(dǎo)致銅鋁金屬間浸透的可靠性失效。 Al extrusion happens when Cu is bonding to softer Al by supersonic, which lead to short circuit and irregular reduce of A

30、l thickness. 4.硅彈坑和焊接墊下開(kāi)裂。Two failure modes: Si cratering and Pad cracking.銅絲的特性 缺陷 Features of Cu bonding wire-disadvantage.煙臺(tái)一諾電子資料30柔性銅絲專(zhuān)利及RoHS證書(shū) Our patents and RoHS certificate of soft Cu bonding wire針對(duì)上述銅絲的缺陷，我公司專(zhuān)門(mén)研發(fā)一款柔性銅絲來(lái)處理上述問(wèn)題，并且獲得了國(guó)家發(fā)明專(zhuān)利。Aimed at the disadvantages of Cu, a soft Cu wire was

31、 developed to resolve the problems and got invention patent by our company.煙臺(tái)一諾電子資料31YesNo銅絲的機(jī)械性能(1/2) Mechanical properties of Cu bonding wireDiameterCu()(mil)YC1,YC3YC2,YC4YCB/L(gf)E/L(%)180.734510200.8 56510230.9 89816251.0 1012816301.234 20221020381.5 23251020502.0 3842

32、1525YC1 5N高純銅絲，硬度低，較好的成球性能 High purity(5N)，low hardness，good FAB YC2 3N通用銅絲，有一定的抗疲勞性 Good fatigue resistance YC3 4N柔性銅絲，硬度較低 Flexible Cu wire, low hardnessYC4 2N抗氧化銅絲，同時(shí)楔形焊接性能較好 Anti-oxidation Cu wire, good wedge welding performance .煙臺(tái)一諾電子資料32上圖：中心線上有明顯壓痕的焊球照片；以下圖：銅和金球焊隨位置函數(shù)變化的硬度與FAB硬度的對(duì)比圖。上圖：FEM模擬

33、顯示了一個(gè)焊球內(nèi)部的應(yīng)力；以下圖：Cu球焊的橫截面4hrs at 250闡明了Al襯墊的變形和薄的Cu-Al相。YesNo銅絲的機(jī)械性能(2/2) Mechanical properties of Cu bonding wire.煙臺(tái)一諾電子資料33HardnessTypeYC1YC2 YC33N GoldBall part65856858Wire part751108070Test ConditionWire dia. : 1.0 MilM/C : Mitutoyo MVK-H3Test Load : 3 grLoading Time : 10 sec鍵合銅絲的硬度 Hardness of

34、Cu bonding wire .煙臺(tái)一諾電子資料34HAZTypeHAZ Length ()Ball Neck Grain ()Wire Grain ()YC1135 1807.0 10.03.5 5.0YC2100 1303.0 4.01.5 2.0YC3110 1506.0 8.03.0 4.0Etching Condition-. Etchant : 10 HNO3 + 10 D.I. Water) -. Etching Method : Fuming Method- Etching Time : 1 10 sec.HAZ Length（m）YC1YC2YC31001101201301

35、40150160170180Ball Neck Grain(m)YC1YC2YC33.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 Wire Grain(m)YC1YC2YC31.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 鍵合銅絲的熱影響區(qū) HAZ of Cu bonding wire .煙臺(tái)一諾電子資料35Electrical PropertyWire dia.Fusing current (A)YC33N gold(Mil)L=5L=10L=100.8 0.50 0.50 0.50 0.9 0.60 0.60 0.60 1.0 0.70 0.65 0.65

36、 1.2 0.90 0.70 0.68 1.5 1.200.95 0.90 2.0 1.80 1.30 1.00 3.0 3.10 2.45 1.20 4.0 4.80 3.80 1.70 5.0 6.60 5.30 1.90 YC1YC2YC34N goldAuResistivity (u)1.671.981.872.322.655鍵合銅絲的電氣性能 Electrical property of Cu bonding wire .煙臺(tái)一諾電子資料36注：一切鍵合絲的挑斷力和剪切力測(cè)試數(shù)據(jù)見(jiàn)規(guī)格書(shū)。Remark: All of wire pull & ball shear data is me

37、et Spec.鍵合銅絲的焊接性能 Welding property of Cu bonding wire .煙臺(tái)一諾電子資料37銅絲目前最大的問(wèn)題是氧化，尤其是儲(chǔ)存及鍵合期間的維護(hù)非常重要。The largest problem is the oxidation of Cu, so the protect during storage and bonding are especially important.Copper Cu2OCuOCu4O(SO4)(OH) 6 Cu5O(SO4)(OH)3 CuCl2 CuNO3銅絲與金絲和銀絲最大的不同在于銅絲易氧化，焊線過(guò)程中因放電即基板加熱，會(huì)構(gòu)

38、成氧化銅，呵斥FAB球型不圓，易構(gòu)成虛焊，且氧化銅很容易與其他酸根離子反響。Cu will oxide into CuO during bonding, which can made bad FAB and lead to NSOP or NSOL. CuO also can react with other acid radical ions easily.1000: 4CuO2Cu2O+O2鍵合銅絲的抗腐蝕性能 Corrosion resistance of Cu bonding wire .煙臺(tái)一諾電子資料38 2021 2021 2021 2021 封 裝 形 式鍵合銅絲的運(yùn)用 App

39、lications of Cu bonding wirePackage TypeYear.煙臺(tái)一諾電子資料39為什么選擇鋁絲 Why Al wire 適用于楔形焊接封裝，主要運(yùn)用于汽車(chē)電子，大功率傳感器，大功率器件等。Al wire is suitable to wedge welding, which including automotive electronics, high-power sensor and some high-power-device. 高可靠性 High reliability 單一金屬間鍵合，無(wú)IMC問(wèn)題 Without problems of IMC 很好的熱穩(wěn)定

40、性 Good thermal stability 良好的抗腐蝕性能 Good corrosion resistance propertyAl wire Al pad 3鍵合鋁絲 Al Bonding Wire.煙臺(tái)一諾電子資料40鋁絲的特點(diǎn) (1/2)Features of Al bonding wire YL1 高純型鋁絲 (5N) YL1 high purity Al (5N)良好的成弧性能和穩(wěn)定性，并有一定的抗腐蝕性能。Good loop shape, stability and corrosion resistance property.適用于大部分要求較高的功率器件，適用范圍廣，價(jià)錢(qián)相對(duì)適中。It is suitable to most of the high-power-device with a moderate cost .YL2 抗腐蝕型鋁絲 (4N) YL2 corrosion resistance Al (4N)在YL1的根底上添加一定的合金，比較好的抗腐蝕性能 。Adding some alloys on the basis of YL1, which results in good corrosion resistance property.適用于有要求抗腐