HDMI-114A-版本介紹及生產(chǎn)工藝

1、HDMI SPEC & HDMI Cable制程.低壓差分信號(hào)傳輸:LVDSLow VoltageDifferential Signaling)筆記本和液晶顯示器內(nèi)部用于銜接驅(qū)動(dòng)模塊和屏幕面板常用內(nèi)部界面外部界面電視上常用RF射頻、Composite復(fù)合視頻、S-VideoS端子、Component色差端子回想當(dāng)前顯示領(lǐng)域的多種界面.外部界面RF界面Composite界面S端子色差端子端子回想當(dāng)前顯示領(lǐng)域的多種界面.外部界面PC常用VGA、DVI、IEEE 4回想當(dāng)前顯示領(lǐng)域的多種界面 這些界面大多是隨著時(shí)代提高而不斷更新的產(chǎn)物，種類過于繁多，且規(guī)范各不一致。隨著顯示器件的分辨率不斷提升，彩色

2、深度不斷提升，對(duì)于傳輸驅(qū)動(dòng)信號(hào)的界面要求也不斷提升，以上這些界面技術(shù)曾經(jīng)無法滿足需求 .HMDI的誕生HDMI，英文全稱是High Definition Multimedia Interface，中文稱號(hào)是高明晰多媒體界面的縮寫。2002年4月，日立、松下、飛利浦、新力、湯姆遜、東芝和Silicon Image七家公司結(jié)合組成HDMI組織 ，隨后發(fā)行HDMI規(guī)范:2002/12/09V1.02004/05/20V1.12005/08/22V1.22005/12/14V1.2a2006/06/22V1.32006/11/10 V1.3a2007/03/26 V1.3b2021/03/04 V1.

3、4a.HMDI Version HistoryHDMI 1.0HDMI 1.1HDMI 1.2HDMI 1.3HDMI 1.3aHDMI 1.3bHDMI 1.4/1.4aInitial SpecificationAdded support for DVD AudioAdded supportIncreases bandwidth to 10.2Gbps (340Mhz)修改Cable and Sink的HDMI C Type 接頭主要是修改HDMI 測(cè)試規(guī)格(HDMI Testing specification), 而 HDMI Specification依然是HDMI 1.3a。所以第一次

4、出現(xiàn)當(dāng)時(shí)的主要的HDMI Specification 跟測(cè)試規(guī)格(HDMI Testing specification)是不同版本的情況發(fā)生。HDMI Ethernet Channel Adds high-speed networking to an HDMI link, allowing users to take full advantage of their IP-enabled devices without a separate Ethernet cable. (more)for SACD AudioPermitted PC applications to use only RGB

5、color spaceOffers support for 16-bit color, increased refresh rates (ex. 120Hz), support for 1440p/WQXGA resolutionsSource termination recommendationHDMI Testing specification 1.3b 修改部分： Audio Return Channel Allows an HDMI-connected TV with a built-in tuner to send audio data upstream to a surround

6、audio system, eliminating the need for a separate audio cable. (more)Supported low-voltage (AC-coupled sources) in PCsSupports xvYCC color space standard移除上升時(shí)間(rise time)和下降時(shí)間(fall time)的最高最低限制1.3b 2007/03/26 Modifications to TE overview and policy description (4.1),Addition of Agilent TDR to Recomm

7、ended TE (4.2.1.11),Clarification of tentative cable emulators (4.2.1.17)3D Defines input/output protocols for major 3D video formats, paving the way for true 3D gaming and 3D home theater applications. (more)Adds mini connector改變CEC電容限制Jitter tolerance test changes (8-7),Added cable tests for TMDS_

8、CLOCK channel (5-3),New VL triggering (7-2)4K Support Enables video resolutions far beyond 1080p, supporting next-generation displays that will rival the Digital Cinema systems used in many commercial movie theatres. (more)Adds support for Dolby TrueHD and DTS-HD Master Audio standards澄清RGB 影像量化范圍Ed

9、itorial and clarifications on CEC Line Degradation (7-15, 8-14),Added testing of additional source-supported Deep Color formats (7-34,)Additional HDMI VSDB EDID checks (8-3)Content Type Real-time signaling of content types between display and source devices, enabling a TV to optimize picture setting

10、s based on content type (more)增加CEC指令關(guān)于時(shí)間及聲音控制Additional TTC usage (5-3, 8-5, 8-6, 8-7),Incorporated Tek-recommended setup and calibration for TDR (8-8),Clarification on Sink Deep Color Recommended Test Method (8-25)Additional Color Spaces Adds support for additional color models used in digital pho

11、tography and computer graphics. (more)同時(shí)Released認(rèn)證的測(cè)試規(guī)格文件 Added long cable or cable emulator use for Repeater test (9-3),Added color-depths for each format in Source_Video_Formats (App. 3),Removed test for filler bytes (8-3),Removed Tektronix part number of cable emulator EFF-HDMI-CE-01 HDMI Micro C

12、onnector A new, smaller connector for phones and other portable devices, supporting video resolutions up to 1080p. (more)Automotive Connection System New cables and connectors for automotive video systems, designed to meet the unique demands of the motoring environment while delivering true HD quali

13、ty. (more) .HMDI Version ComparisonHDMI version1.0-1.2a1.31.4Maximum clock rate (MHz)165340340 51Maximum TMDS throughput per channel (Gbit/s)1.653.43.4Maximum total TMDS throughput (Gbit/s)4.9510.210.2Maximum video throughput (Gbit/s)3.968.168.16Maximum audio throughput (Mbit/s)36.8636.8636.86Maximu

14、m color depth (bit/px)2448A48Maximum resolution over single link at 24-bit/pxB19201200p6025601600p7540962160p24Maximum resolution over single link at 30-bit/pxCN/A25601600p6040962160p24Maximum resolution over single link at 36-bit/pxDN/A19201200p7540962160p24Maximum resolution over single link at 48

15、-bit/pxEN/A19201200p6019201200p60.HMDI Version ComparisonHDMI version11.11.21.31.3a1.4 511.2a1.3b1.3b11.3csRGBYesYesYesYesYesYesYCbCrYesYesYesYesYesYes8 channel LPCM, 192 kHz, 24 bit audio capabilityYesYesYesYesYesYesBlu-ray Disc and HD DVD video and audio at full resolutionFYesYesYesYesYesYesConsum

16、er Electronic Control (CEC)GYesYesYesYesYesYesDVD-Audio supportNoYesYesYesYesYesSuper Audio CD (DSD) supportHNoNoYesYesYesYesDeep ColorNoNoNoYesYesYesxvYCCNoNoNoYesYesYesAuto lip-syncNoNoNoYesYesYesDolby TrueHD bitstream capableNoNoNoYesYesYesDTS-HD Master Audio bitstream capableNoNoNoYesYesYesUpdat

17、ed list of CEC commandsINoNoNoNoYesYes3D Over HDMINoNoNoNoNoYesEthernet ChannelNoNoNoNoNoYesAudio Return ChannelNoNoNoNoNoYes4k 2k Resolution SupportNoNoNoNoNoYes.HMDI 1.4新特性HDMI Ethernet Channel Adds high-speed networking to an HDMI link, allowing users to take full advantage of their IP-enabled de

18、vices without a separate Ethernet cable.Audio Return Channel Allows an HDMI-connected TV with a built-in tuner to send audio data upstream to a surround audio system, eliminating the need for a separate audio cable.HMDI 1.4新特性4K Support Enables video resolutions far beyond 1080p, supporting next-gen

19、eration displays that will rival the Digital Cinema systems used in many commercial movie theatres. 3D Defines input/output protocols for major 3D video formats, paving the way for true 3D gaming and 3D home theater applications. Content Type Real-time signaling of content types between display and

20、source devices, enabling a TV to optimize picture settings based on content type Additional Color Spaces Adds support for additional color models used in digital photography and computer graphics.HMDI 1.4新特性Automotive Connection System New cables and connectors for automotive video systems, designed

21、 to meet the unique demands of the motoring environment while delivering true HD quality. HDMI Micro Connector A new, smaller connector for phones and other portable devices, supporting video resolutions up to 1080p.HMDI Connector & Cable OverviewType A : 19 Pin / 14*4.5*6.8mmType B : 29 Pin / 21.3*

22、4.55*6.8mmType C( Micro HDMI Conn.) : 19 Pin / 10.5*2.5*5mm.HMDI Type A Pin Assignments.HMDI Contact sequence.HMDI Mechanical PerformanceItemTest ConditionRefre Std.振動(dòng)振幅:1.52mm P-P or 147 m / S2 15G時(shí)間: 50200050 HZ in 20 minutes.時(shí)間: 12 times in each X,Y, Z axes ( total 36Times)ANSI/EIA - 364 - 28 Con

23、dition III沖擊脈波寬度11 msec波形半弦波, 490m / S2 50G 3 strokes in each X,Y,Z axes.ANSI/EIA - 364 - 27 Condition A耐久性After tests:Type A: 10,000 cycles at 100 50 cycles /HType C: 10,000 cycles at 100 50 cycles /H接觸阻抗:比原始阻抗變化30M ohms Max，鐵殼比原始阻抗變化30M ohms MaxN/A插拔力插拔速度:25mm/minutes拔出力Type A: 9.8N1.0kgf Min , 39

24、.2N1.0kgf MaxType C: 7 N min , 25N max插入力44.1N4.5kgf MaxANSI/EIA - 364 - 13Calbe Flex100 Cycle in each of 2 Planes Dimension X = 3.7 x Cable Diameter.ANSI/EIA - 364 - 41C, Condition I.HMDI Electrical PerformanceItemTest ConditionRefre Std.接觸陰抗Mated connectorsContact: Dry circuit, 20 mV max, 10m AShe

25、ll: Open circuit, 5 V max, 100m AANSI/EIA - 364 - 06B介電強(qiáng)度Unmated connectors, aplly 500V AC/ Mated 300V AC(RMS) between adjacent terminal and ground. ( no Breakdown)ANSI/EIA - 364 - 20C,method A絕緣阻抗Unmated connectors, aplly 500V DC/ Mated 150V DC between adjacent terminal and ground.ANSI/EIA - 364 -

26、21C接觸電流定額55oC , Maximum ambient85 oC , Maximum temperature change0.5 A MinANSI/EIA - 364 - 70A應(yīng)用電流定額40 V AC (RMS.) Continuous max, on any signal pin with respect to the shield. ( No Breakdown )NA靜電釋放Test unmated each connectors form 1KV to 8 KV in 1 kV steps using 8mm ball probe.IEC - 801- 2TMDS信號(hào)時(shí)域

27、阻抗Rise tiem 200 psec ( 10% - 90%)ANSI/EIA - 364 - 108TMDS信號(hào)時(shí)域、串?dāng)_Rise tiem 200 psec ( 10% - 90%)ANSI/EIA - 364 - 90.HMDI Environmental CharacteristicsItemTest ConditionRefre Std.溫度沖擊10 cycles of:a). - 55 oC for 30 minutes.b). + 85 oC for 30 minutes.ANSI/EIA - 364 - 32C溫濕度mated connectors together:+25

28、 + 85 oC ,相對(duì)濕度: 80 95%,持繼: 4 Cycles (96 H)ANSI/EIA - 364 - 31B端子老化Expose to +105 2 oC for 250 Hours,ANSI/EIA - 364 - 17B, Condition B, Method A.HMDI Cable Assy TMDS Parameters.Type A Receptacle.Type A ReceptacleThe shell shall have springs for locking. Additional springs may be used for EMI reductio

29、n.The spring property for locking shall be activated by the locking hole of the plug shell.Type A PulgThe dimension of *13.9mm(+0.04/-0.05)(on main diction)should be measured at the point *7mm(on view D). The taper(on view D)shall be one degree max.Cable Adapter type A to type APinAssignment.Cable A

30、dapter type A to type BPinAssignment.Cable Adapter type A to type CPinAssignment.HMDI 1.4制程簡介1裁線治工具裁線刀任務(wù)闡明將線裁生長度為15154mm。本卷須知1.裁線尺寸應(yīng)在公差范圍內(nèi).2.應(yīng)檢查線材有無來料不良情況如:刮傷線徑、外被凸起 、外被異色、外表斑點(diǎn)等.任務(wù)闡明將線材繞成圈狀,兩端各留400mm REF,將線圈套入PE袋內(nèi),袋口處以魔帶束緊,以利后段作業(yè).HMDI 1.4制程簡介2繞線本卷須知1.應(yīng)檢查線材有無來料不良等情形如:刮傷線經(jīng)、外被凸起、外被異色、外被扭曲等.2.扎魔帶時(shí),不可扎太緊

31、,以免使線材變形.握線材距去皮機(jī)約50mm處,線端頂住頂桿,腳踩開關(guān),將兩端外被去皮231mm.1.線材去皮時(shí)線端務(wù)必確實(shí)頂住頂桿,且與刀片堅(jiān)持垂直,不可歪斜.2.去皮處端面須平正,不可凹凸不平,且去皮尺寸須在規(guī)格范圍內(nèi).3.去皮時(shí)不可傷及外被與芯線.4.留意平安(單人單機(jī)操作).HMDI 1.4制程簡介3兩端外被去皮.28任務(wù)闡明兩端編織360度均勻后翻于外被上,將鋁箔齊外被去皮處撕凈.本卷須知1.編織須360度均勻后翻于外被上.2.挑鋁箔時(shí),不可傷及色線及外被.3.鋁箔須齊外被切口處撕凈.HMDI 1.4制程簡介4兩端編織整理.29任務(wù)闡明兩端PP帶捻成一股后翻于外被上,在外被去皮處貼W5

32、*L60mm*2PCS的銅箔于編織及PP帶上.本卷須知1.銅箔須貼緊,不可松脫.2.PP帶及編織不可散亂.HMDI 1.4制程簡介5兩端貼鋁箔.任務(wù)闡明將兩端鋁箔麥拉齊外被去皮處留4.04.5mm刺破搖斷.本卷須知1.刺鋁箔麥拉時(shí),不可刺傷對(duì)線的絕緣皮.2.搖斷鋁箔麥拉時(shí)動(dòng)作幅度不要超出30度,以免傷及發(fā)泡PE.3.去好鋁箔麥拉后,不可有掐傷、折傷及割傷發(fā)泡PE.4.鋁箔麥拉去留尺寸須正確.4.0-4.5HMDI 1.4制程簡介6去鋁箔麥拉.任務(wù)闡明將兩端鋁箔麥拉拔掉,并將對(duì)線之地線分別捻緊.本卷須知1.地線不可散亂,須捻緊.2.捻地線時(shí),留意不可弄散鋁箔麥拉.HMDI 1.4制程簡介7捻地線

33、.任務(wù)闡明將兩端各對(duì)線之地線套0.6*L15mm*8PCS的套管,再于兩端鋁箔麥拉切口處對(duì)半套1.5*L6mm*8PCS的套管.本卷須知1.不可漏套及套錯(cuò)套管.HMDI 1.4制程簡介8套套管.任務(wù)闡明將兩端各對(duì)線之地線套管及鋁箔麥拉切口處的套管烘緊.本卷須知1.不可烘?zhèn)^緣皮,且烘套管后發(fā)泡PE不可變形.2.將兩端向下套管只須不零落即可,不可烘的過緊.3.手指不可離熱烘機(jī)口過近,以免燙傷.HMDI 1.4制程簡介9烘套管.任務(wù)闡明依DWG-2線位依序?qū)⒏鲗?duì)線、對(duì)線之地線及色線整齊陳列至扁平電纜治具上定位.治工具扁平電纜治具本卷須知1.扁平電纜后外被去皮處至扁平電纜治具前端的尺寸為11mm M

34、ax.2.扁平電纜時(shí),不可用指甲掐傷及壓傷絕緣皮,且發(fā)泡PE不可變形.3.扁平電纜后,線材外被與治具手柄部分須平行.4.扁平電纜時(shí)不可有絞線景象.1#19#HMDI 1.4制程簡介10 10PIN扁平電纜.任務(wù)闡明先將各對(duì)線、對(duì)線之地線及色線至治具前端裁留4.55.5mm,再各色線及對(duì)線去皮2.12.5mm.治工具芯線去皮機(jī)/鑷子本卷須知1.各色線及對(duì)線的去皮尺寸須正確.2.色線及對(duì)線去皮時(shí)不可去斷芯線,且不可夾傷發(fā)泡PE及色線.3.各色線及對(duì)線去皮后芯線不可散亂.4.留意平安(單人單機(jī)操作).2.12.5mm4.55.5mmHMDI 1.4制程簡介11芯線去皮.任務(wù)闡明將10PIN各色線、對(duì)

35、線及地線沾適量的錫.治工具溫控錫爐/鑷子/挑針本卷須知1.沾錫時(shí)色線、對(duì)線及地線須與爐面垂直.2.沾錫時(shí)不可燙傷套管及絕緣皮.3.沾錫后發(fā)泡PE及絕緣皮不可有后縮及變形景象.4.沾錫時(shí)間為:0.5-1.0s.5.沾錫前先將溫度到達(dá)32030,待錫完全溶解后,將操作溫作調(diào)為28010.HMDI 1.4制程簡介12 10PIN沾錫.37任務(wù)闡明將10PIN端子置于鉚壓治具上定位,再將各對(duì)線、對(duì)線之地線及色線與端子鉚合.治工具端子機(jī)/鑷子本卷須知1.欲打端子之色線置入端子機(jī)下刀?；瑝K承座上,線端務(wù)必堅(jiān)持平齊,且置入深度及打包位置需正確.2.手指不可離刀模太近.3.Ppk1.67或Cpk1.33,當(dāng)C

36、PK1.33時(shí)停線,并知會(huì)工務(wù)調(diào)機(jī).HMDI 1.4制程簡介13鉚10PIN端子.38任務(wù)闡明依DWG-1線位依序?qū)⒏鲗?duì)線、對(duì)線之地線及色線整齊陳列至扁平電纜治具上定位.治工具扁平電纜治具本卷須知1.扁平電纜后外被去皮處至扁平電纜治具前端的尺寸為11mm Max.2.扁平電纜時(shí),不可用指甲掐傷及壓傷絕緣皮,且發(fā)泡PE不可變形.3.扁平電纜后,線材外被與治具手柄部分須平行.4.扁平電纜時(shí)不可有絞線景象.2#18#18#2#HMDI 1.4制程簡介14 9PIN扁平電纜.39任務(wù)闡明先將各對(duì)線、對(duì)線之地線及色線至治具前端裁留4.55.5mm,再各色線及對(duì)線去皮2.12.5mm.治工具芯線去皮機(jī)/鑷

37、子本卷須知1.各色線及對(duì)線的去皮尺寸須正確.2.色線及對(duì)線去皮時(shí)不可去斷芯線,且不可夾傷發(fā)泡PE及色線.3.各色線及對(duì)線去皮后芯線不可散亂.4.留意平安(單人單機(jī)操作).2.12.5mm4.55.5mmHMDI 1.4制程簡介15 9PIN芯線去皮.40任務(wù)闡明將9PIN各色線、對(duì)線及地線沾適量的錫.治工具溫控錫爐/鑷子/挑針本卷須知1.各色線及對(duì)線的去皮尺寸須正確.2.色線及對(duì)線去皮時(shí)不可去斷芯線,且不可夾傷發(fā)泡PE及色線.3.各色線及對(duì)線去皮后芯線不可散亂.4.留意平安(單人單機(jī)操作).HMDI 1.4制程簡介16 9PIN沾錫.41任務(wù)闡明將9PIN端子置于鉚壓治具上定位,再將各對(duì)線、對(duì)

38、線之地線及色線與端子鉚合.治工具端子機(jī)/鑷子本卷須知1.欲打端子之色線置入端子機(jī)下刀?；瑝K承座上,線端務(wù)必堅(jiān)持平齊,且置入深度及打包位置需正確.2.手指不可離刀模太近.3.Ppk1.67或Cpk1.33,當(dāng)CPK1.33時(shí)停線,并知會(huì)工務(wù)調(diào)機(jī).HMDI 1.4制程簡介17鉚9PIN端子.42任務(wù)闡明先將HOUSING插入母端插座內(nèi),再先于10PIN端子兩凸點(diǎn)面裝一鐵片,再一同與9PIN的有凹點(diǎn)面合在一同并捏到位,然后將組合好的端子插入裝好母端插座的HOUSING內(nèi)并拔出母座,然后將兩側(cè)鐵片壓平.治工具HDMI母端插座/挑針本卷須知1.端鐵片前須檢查PIN針能否在同不斷在線.2.不可漏裝鐵片.3

39、.端子須完全插到位.4.插端子時(shí),不可使端子變形.HMDI 1.4制程簡介18插端子.43任務(wù)闡明用放大鏡檢查各端子能否不良治工具放大鏡/烙鐵本卷須知1.挑出不良品,并標(biāo)示不良情形,置于紅箱內(nèi),待修繕.2.將不良情形詳細(xì)記錄于不良記錄日?qǐng)?bào)表中.3.不良情形回應(yīng)于前序工站.4.產(chǎn)線須輕拿輕放.5.烙鐵溫度為:38030.6.每一個(gè)小時(shí)改換一次海綿,清理一次錫渣.7.焊35點(diǎn)須擦拭一下烙鐵頭.8.點(diǎn)檢烙鐵溫度后,將烙鐵溫度記錄于烙鐵溫度管控表中.9.焊錫人員須有技術(shù)合格證才可上崗.HMDI 1.4制程簡介19檢查端子.44任務(wù)闡明沿兩端CONN塑料邊緣貼W11*L80mm*2PCS的黃色透明無鹵膠

40、帶,以包覆錫點(diǎn)及色線.本卷須知1.貼膠帶前須將各對(duì)線及色線理順后再貼膠帶.2.不可漏貼膠帶,且膠帶須完全包覆錫點(diǎn)及色線,并貼緊.3.挑出不良品,并掛牌標(biāo)示不良情形,置于紅箱內(nèi),待修繕.4.產(chǎn)線須輕拿輕放.HMDI 1.4制程簡介20貼膠帶.45任務(wù)闡明組裝上下鐵殼并使之密合,并置于鉚壓治具內(nèi)鉚壓.治工具鉚壓機(jī)/尖嘴鉗本卷須知1.鉚壓時(shí)位置須正確,不可歪斜;不可傷及外被,鐵殼不能變形.2.IPQC應(yīng)嚴(yán)把此關(guān),以防鉚壓的高寬度尺寸超出公差范圍,導(dǎo)致線徑零落或頭部在受力過大的情況下會(huì)出現(xiàn)芯線有斷裂景象.3.留意平安(單人單機(jī)操作).4.鉚壓高寬度為:W=7.900.10mm;H=6.900.10mm

41、.HMDI 1.4制程簡介21裝鉚鐵殼.46任務(wù)闡明測(cè)試能否有錯(cuò)位、短路、斷路及電阻大等情形,直流電阻:2.0 Max.,絕緣阻抗:10M/300V DC.本卷須知1.測(cè)試機(jī)參數(shù)需設(shè)定正確(詳見測(cè)試參數(shù)設(shè)定表).2.做電氣測(cè)試前先由IPQC拿一條NG品和一條OK品檢測(cè)測(cè)試機(jī)能否OK.3.挑出不良品,并掛牌標(biāo)示不良情形,置于紅箱內(nèi),待修繕.4.將不良情形詳細(xì)記錄于不良記錄日?qǐng)?bào)表中.5.不良情形及時(shí)回應(yīng)于前序工站HMDI 1.4制程簡介22 T1測(cè)試.47任務(wù)闡明兩端PP帶齊鐵殼邊沿剪凈,編織齊鐵殼末端剪留34mm,再將編織前翻于鐵殼上360度加錫焊接.本卷須知1.PP帶須齊鐵殼邊沿剪凈,且兩端編織剪留