品質(zhì)管理英文名詞匯編

Accuracy準(zhǔn)確度Active主動(dòng)Action評(píng)價(jià).處理Activity活動(dòng)Add加Additionrule加法運(yùn)算規(guī)則AnalysisCovariance協(xié)方差分析AnalysisofVariance方差分析AppraisalVariation評(píng)價(jià)變差A(yù)pproved承認(rèn)ASQC美國(guó)質(zhì)量學(xué)會(huì)Attribute計(jì)數(shù)值A(chǔ)udit審核Automaticdatabaserecovery數(shù)據(jù)庫(kù)錯(cuò)誤自動(dòng)回復(fù)Average平均數(shù)balance平衡Balancesheet資產(chǎn)負(fù)債對(duì)比表Binomial二項(xiàng)分配Body機(jī)構(gòu)BrainstormingTechniques腦力風(fēng)暴法BusinessSystemsPlanning企業(yè)系統(tǒng)規(guī)劃Cable電纜Capability能力CauseandEffectmatrix因果圖.魚(yú)骨圖Centerline中心線check檢查CheckSheets檢查表Chi-squareDistribution卡方分布Clutchspring離合器彈簧Coining壓印加工Commoncause共同緣故Complaint投訴Compoundfactor調(diào)合因素Concept新概念Condenser聚光鏡Conformity合格Connection關(guān)聯(lián)Consumer’srisk消費(fèi)者之風(fēng)險(xiǎn)Control操縱Controlcharacteristic管制特性Controlchart管制圖Controlplan管制打算Correction糾正CorrelationMethods相關(guān)分析法Costdown降低成本CPI:continuouseProcessImprovement連續(xù)工序改善Creep漸變CrossTabulationTables交*表CS:customerSevice客戶中心Cushion緩沖Customer顧客DSA:DefectsAnalysisSystem缺陷分析系統(tǒng)Data數(shù)據(jù)DataCollection數(shù)據(jù)收集Dataconcentrator資料集中緩存器DCC:DocumentControlCenter文控中心Decision決策.判定Defectsperunit單位缺點(diǎn)數(shù)Description描述Detection難檢度Device裝置Digital數(shù)字Do執(zhí)行DOE:DesignofExperiments實(shí)驗(yàn)設(shè)計(jì)Element元素Else否則Engineeringrecbnology工程技術(shù)Entropy函數(shù)Environmental環(huán)境Equipment設(shè)備Estimatedaccumulativefrequency計(jì)算可能累計(jì)數(shù)EV:EquipmentVariation設(shè)備變異Event事件ExternalFailure外部失效,外部缺陷FA:FailureAnalysis壞品分析Factcontrol事實(shí)治理Fatique疲勞FMEA:FailureModeandEffectanalysis失效模式與效果分析FPY合格率FQA:FinalQualityAssurance最終品質(zhì)保證FQC:FinalQualitycontrol最終品質(zhì)操縱Full-steer完全轉(zhuǎn)向function職能Gaugesystem量測(cè)系統(tǒng)Grade等級(jí)Gum-roll橡皮滾筒Healthmeter體重計(jì)Heatpress沖壓粘著Histogram直方圖Hi-tech高科技hypergeometric超幾何分配hysteresis磁滯現(xiàn)象Improvement改善Inductance電感Information信息Initialreview先期審查Inspection檢驗(yàn)InternalFailure內(nèi)部失效,內(nèi)部缺陷IPQC:InProcessQualityControl制程品質(zhì)操縱IQC:IncommingQualityControl來(lái)料品質(zhì)操縱ISInternationalOrganizationforStandardization國(guó)際標(biāo)準(zhǔn)組織Lawoflargenumber大數(shù)法則Link連接LCL:LowerControllimit管制下限LQC:LineQualityControl生產(chǎn)線品質(zhì)操縱LSL:LowerSizeLimit規(guī)格下限Machine機(jī)械Manage治理Materials物料Measurement量測(cè)Median中位數(shù)Missfeed漏送Module,sub-system,sub-unit單位Momentum原動(dòng)力Montegarlomethod原子核分裂熱運(yùn)動(dòng)法MSA:MeasurementSystemAnalysis量測(cè)系統(tǒng)分析Multiplicationrule乘法運(yùn)算規(guī)則NIST美國(guó):標(biāo)準(zhǔn)技術(shù)院Normal常態(tài)分布Occurrence發(fā)生率On.offsystem開(kāi),關(guān)系統(tǒng)OperationInstruction作業(yè)指導(dǎo)書(shū)Organization組織Parameter參數(shù)Parto柏拉圖Parts零件Partspermillion不良率Passive消極的,被動(dòng)的Plan打算Pulse脈沖Policy方針Population群體Power力量,能源PQA:ProcessQualityAssurance制程品質(zhì)保證Practice實(shí)務(wù)Precision周密度preemptive先占式多任務(wù)Pressure壓縮Prevention預(yù)防Probability機(jī)率Probabilitydensityfunction機(jī)率密度函數(shù)Procedure流程Process過(guò)程Processcapabilityanalysis制程能力分析圖Processcontrolandprocesscapability制程管制與制程能力Producer’srisk生產(chǎn)者之風(fēng)險(xiǎn)Product產(chǎn)品Production生產(chǎn)Program方案Projects項(xiàng)目QA:QualityAssurance品質(zhì)保證QC:QualityControl品質(zhì)操縱QE:QualityEngineering品質(zhì)工程QFD:QualityFunctionDesgin品質(zhì)機(jī)能展開(kāi)Quality質(zhì)量Qualitymanual品質(zhì)手冊(cè)Qualitypolicy品質(zhì)政策Randomexperiment隨機(jī)試驗(yàn)Randomnumbers隨機(jī)數(shù)Range全距Record記錄Reflow回流Reject拒收Repair返修Repeatusility再現(xiàn)性Reproducibility再生性Requirement要求Residual誤差Response響應(yīng)Responsibilities職責(zé)Review評(píng)審Reword返工Robustness穩(wěn)健性Rolledyield直通率RPN:RiskPriorityNumber風(fēng)險(xiǎn)系數(shù)sample抽樣,樣本Samplespace樣本空間Samplingwithreplacement放回抽樣Samplingwithoutreplacement不放回抽樣Scatterdiagram散布圖分析Scrap報(bào)廢Screw螺旋Severity嚴(yán)峻度Shot-preening微粒沖擊平面法Simplerandomsampling簡(jiǎn)單隨機(jī)取樣Size規(guī)格SL:SizeLine規(guī)格中心線Slip滑動(dòng)Stratifiedrandomsampling分層隨機(jī)抽樣SOP:StandardOperationProcedure標(biāo)準(zhǔn)作業(yè)書(shū)SPC:StatisticalProcessControl統(tǒng)計(jì)制程管制Specialcause專門(mén)緣故Specification規(guī)范SQA:Source(Supplier)QualityAssurance供貨商品質(zhì)保證Stagesampling分段隨機(jī)抽樣StandardDeviation標(biāo)準(zhǔn)差Sumofsquares統(tǒng)計(jì)表supplier平方和System供方systematicsampling系統(tǒng),體系Statisticaltables系統(tǒng)抽樣Taguchi-method田口方法Technicalcommittees技術(shù)委員會(huì)Testpiece測(cè)試片Theory原理Timestamp時(shí)刻戳印Time-lag延遲Title標(biāo)題Torque轉(zhuǎn)矩Total求和TQC:TotalQualityControl全面品質(zhì)操縱TQM:TotalQualityManagement全面品質(zhì)治理Traceability追溯Training培訓(xùn)Transactionprocessingandlogging交易處理Trouble困擾Upanddown上和下UCL:UpperControlLimit管制上限USL:UpperSizeLimit規(guī)格上限Validation確認(rèn)Variable計(jì)量值Variance變異和Vector向量Verification驗(yàn)證Version版本VOC:voiceofCustomer客戶需求VOE:VoiceofEngineer工程需求GRRGaugeRepeatabilityReproducibility量測(cè)的再現(xiàn)性與再生性FPIFirstPieceInspection首件檢查Samplingwithoutreplacement不放回抽樣SQA:Source(Supplier)QualityAudit供貨商品質(zhì)審核

1.QC:qualitycontrol質(zhì)量治理2.IQC:incomingqualitycontrol進(jìn)料質(zhì)量治理3.OQC:outputqualitycontrol出貨質(zhì)量治理4.PQC:processqualitycontrol制程質(zhì)量治理也稱IPQC:inprocessqualitycontrol.5.AQL:acceptablequalitylevel允收標(biāo)準(zhǔn)6.CQA:customerqualityassurance客戶品質(zhì)保證7.MA:majordefeat要緊缺點(diǎn)8.MI:minordefeat次要缺點(diǎn)9.CR:criticaldefeat關(guān)鍵缺點(diǎn)10.SMT:surfacemountingtechnology表面粘貼技術(shù)11.SMD:surfacemountingdevice表面粘貼程序SMC:surfacemountingcomponent表面粘貼組件12.ECN:engineeringchangenotice工程變更通知13.DCN:designchangenotice設(shè)計(jì)變更通知14.PCB:printedcircuitboard印刷電路板15.PCBA:printedcircuitboardassembly裝配印刷電路板16.BOM:billofmaterial材料清單17.BIOS:basicallyinputandoutputsystem差不多輸入輸出系統(tǒng)18.MIL-STD-105E:美國(guó)陸軍標(biāo)準(zhǔn),也稱單次抽樣打算.19.ISO:internationalstandardorganization國(guó)際標(biāo)準(zhǔn)化組織20.DRAM:內(nèi)存條21.Polarity:電性22.Icicles:錫尖23.Non-wetting:空焊24.Shortcircuit:短路25.Missingcomponent:缺件26.Wrongcomponent:錯(cuò)件27.Excesscomponent:多件28.Insufficientsolder:錫少29.Excessivesolder:錫多30.Solderresidue:錫渣31.Solderball:錫球32.Tombstone:墓碑33.Sideward：側(cè)立34.Componentdamage:零件破損35.Goldfinger:金手指36.SOP:standardoperationprocess標(biāo)準(zhǔn)操作流程37.SIP:standardinspectionprocess標(biāo)準(zhǔn)檢驗(yàn)流程38.Thegoodandnotgoodsegregation:良品和不良品區(qū)分39.OBW:onboardwriter熸錄BIOS40.Simplerandomsampling:簡(jiǎn)單隨機(jī)抽樣41.Histogram:直方圖42.Standarddeviation:標(biāo)準(zhǔn)差43.CIP:Continuousimprovementprogram持續(xù)改善打算44.SPC:Statisticalprocesscontrol制程統(tǒng)制45.Sub-contractors:分包商46.SQE:Supplierqualityengineering47.Samplingsample:抽樣打算48.Loader:治具49.QTS:Qualitytrackingsystem質(zhì)量追查系統(tǒng)50.Debug:調(diào)試51.Spareparts:備用品52.Inventoryreportfor:庫(kù)存表53.Manpower/Tactestimation工時(shí)預(yù)算54.Calibration:校驗(yàn)55.S/N:serialnumber序號(hào)56.Corrugatedpad:波浪墊57.Takeouttray:內(nèi)包裝盒58.Outerbox:外包裝箱59.Vericode:檢驗(yàn)碼60.Sumofsquare:平方和61.Range:全距62.Conductivebag:愛(ài)護(hù)袋63.Preventivemaintenance:預(yù)防性維護(hù)64.Baseunit:基體65.Fixture:制具66.Probe:探針67.Hostprobe:主探針68.Goldencard:樣本卡69.Diagnosticsprogram:診斷程序70.Frame:屏面71.Lint-freegloves:靜電手套72.Wristwrap:靜電手環(huán)73.Targetvalue:目標(biāo)值74.Relateddepartment:相關(guān)部門(mén)75.liftedsolder浮焊76.plughole孔塞77.Wrongdirection極性反78.componentdamageorbroken零件破損79.Unmeletedsolder熔錫不良80.fluxresidue松香未拭81.wronglabelorupsidedownlabel貼反82.mixedparts機(jī)種混裝83.poorsoldermask綠漆不良84.oxidize零件氧化85.standoffheight浮高86.ICreverseIC反向87.supervisor課長(zhǎng)88.Forman組長(zhǎng)89.WI=workinstruction作業(yè)指導(dǎo)90.B.P.V:非擦除狀態(tài)91.Internalnotification:內(nèi)部聯(lián)絡(luò)單92.QP:Qualitypolicy質(zhì)量政策93.QT:Qualitytarget品質(zhì)目標(biāo)94.Trend:推移圖95.Paret柏拉圖96.UCL:Uppercontrollimit管制上限97.LCL:Lowercontrollimit管制下限98.CL:Centerline中心線99.R.T.Y:Rolledthroughoutyield直通率100.PPM:Partspermillion不良率101.DPU:Defectsperunit單位不良率102.Resistor:電阻103.Capacitor:電容104.Resistorarray:排阻105.Capacitorarray:排容106.DIODE:二極管107.SOT:三極管108.Crystal:震蕩器109.Fuse:保險(xiǎn)絲110.Bead:電感111.Connector:聯(lián)結(jié)器112.ADM:AdministrationDepartment行政單位113.CE:ComponentEngineering零件工程114.CSD:CustomerServiceDepartment客戶服務(wù)部115.ID:IndustrialDesign工業(yè)設(shè)計(jì)116.IE:IndustrialEngineering工業(yè)工程117.IR:IndustrialRelationship工業(yè)關(guān)系118.ME:MechanicalEngineering機(jī)構(gòu)工程119.MIS:ManagementInformationSystem信息部120.MM:MaterialManagement資材121.PCC:ProjectCoordination/Control專案協(xié)調(diào)操縱122.PD:ProductionDepartment生產(chǎn)部123.PE:ProductEngineering產(chǎn)品工程124.PM:ProductManager產(chǎn)品經(jīng)理125.PMC:ProductionMaterialControl生產(chǎn)物料治理126.PSC:ProjectSupport&Control產(chǎn)品協(xié)調(diào)127.MagnesiumAlloy:鎂合金128.MetalShearing:裁剪129.CEM:ContractElectronicsManufacturing電子制造服務(wù)企業(yè)EMS:ElectronicsManufacturingServices130.ERP:EnterpriseResourcePlanning企業(yè)資源規(guī)劃SCM+CRM+ERP+EAI=NetworkdirectTMlinksprocurement,production,Logisticsandsales采購(gòu),生產(chǎn),后勤治理及市場(chǎng)營(yíng)銷(xiāo)的融合EAI:EnterpriseapplicationIntegration企業(yè)應(yīng)用系統(tǒng)整合CRM:CustomerRelationshipPlanning客戶服務(wù)規(guī)劃SCM:Supplychainmanagement供應(yīng)鏈治理131.OJT:Onjobtraining在職培訓(xùn)132.AccessTime:光盤(pán)搜尋時(shí)刻133.B2CEC:Businesstoconsumerelectroniccommerce企業(yè)對(duì)消費(fèi)者的電子商務(wù)B2BEC:BusinesstobusinesselectronicCommerce企業(yè)間的電子商務(wù)134.CCL:CopperCladLaminate銅箔基板135.Intranet:企業(yè)內(nèi)部通訊網(wǎng)路136.ISP:InternetServiceProvider網(wǎng)絡(luò)服務(wù)提供者ICP:InternetContentProvider網(wǎng)絡(luò)內(nèi)容提供者137.GSM:GlobalSystemforMobileCommunication泛歐數(shù)字式行動(dòng)電話系統(tǒng)GPS:全球衛(wèi)星定位系統(tǒng)138.HomePage:網(wǎng)絡(luò)首頁(yè)139.VideoClip:影像文件140.HTML:超文標(biāo)記語(yǔ)言141.Domainname:網(wǎng)域名稱142.IP:網(wǎng)絡(luò)網(wǎng)域通訊協(xié)議地址143.Notebook:筆記型計(jì)算機(jī)144.VR:VirtualReality虛擬實(shí)境145.WAP:WirelessApplicationProtocol無(wú)線應(yīng)用軟件協(xié)議146.LAN:Localareanetwork局域網(wǎng)絡(luò)WWW:WorldWideWeb世域網(wǎng)WAN:WideAreaNetwork廣域網(wǎng)絡(luò)147.3C:Computer,Communication,Consumerelectronic計(jì)算機(jī),通訊,消費(fèi)性電子三大產(chǎn)品的整合148.InformationSupplierHighway:信息高速公路149.UPS:Uninterruptedpowersystem不斷電系統(tǒng)150.Processedmaterial:流程性材料151.Entity/Item:實(shí)體152.Qualityloop:質(zhì)量環(huán)153.Qualitylosses:質(zhì)量損失154.Correctiveaction:糾正措施155.Preventiveaction:預(yù)防措施156.PDCA:Plan/Do/Check/Action打算/實(shí)施/檢查/處理157.Integratedcircuits(IC):集成電路158.Applicationprogram:應(yīng)用程序159.Utilities:有用程序160.Auxiliarystorage/Secondstorage:;輔助存儲(chǔ)器161.Siliconchip:硅片162Diskettedrive:軟驅(qū)163.Displayscreen/Monitor:顯示器164.Foreground:前面165.Montherboard:母板166.Mermoryboard:內(nèi)存板167.Slot:插槽168.Bus:Data-bus/address-bus/Controlbus:總線/數(shù)據(jù)總線/地址總線/操縱總線169.Plotter:繪圖170.MPC:Multimediapersonalcomputer多媒體171.Oscillator:振蕩器172.Automatictellerterminal:自動(dòng)終端(出納)機(jī)173.Joystickport:操縱端口174.VGA:VideoGraphicsArray顯示卡175.Resolution:分辨率176.Register:寄存器177.ISA:IndustryStandardArchitecture:工業(yè)標(biāo)準(zhǔn)結(jié)構(gòu)178.EISA:ExtendedIndustryArchitecture179.Adapter:適配器180.Peripheral:外部設(shè)備181.Faxmodem:調(diào)制解調(diào)器181.NIC:Networkinterfacecard網(wǎng)絡(luò)接口卡182.SCSI:Smallcomputersysteminterface183.VESA:VideoElectronicStandardsAssociation184.SIMM:Singlein-linememorymodule單排座存儲(chǔ)器模塊(內(nèi)存條)185.Casing:外箱186.Aluminum:鋁質(zhì)187.Ceramic:陶瓷的188.Platter:圓盤(pán)片189.Actuator:調(diào)節(jié)器190.Spindle:軸心191.Actuationarm:存取臂192.Defaultcode:缺省代碼193.Auxiliaryport:輔助端口194.Carriagereturn:回車(chē)195.Linefeed:換行196.ASCII:AmericanStandardCodeforInformationInterchange197.Videoanalog:視頻模擬198.TTL:Transistor-Transistorlogic晶體管-晶體管邏輯電路199.Three-prongplug:三芯電插頭200.Femaleconnector:連接插座201.Floppydisk:軟盤(pán)202.Outputlevel:輸出電平203.Vertical/Horizontalsynchronization:場(chǎng)/行同步204.H(Horizontal)-Phase:行相位205.Compatible:兼容機(jī)206.HardwareExpansionCard:硬件擴(kuò)充卡207.Buffer:緩沖208.CRM:CustomerrelationshipManagement客戶關(guān)系治理209.WIP:Workinprocess半成品210.Waiver:特不采納211.CXO系列—CEOChiefExecutiveOffice首COO:ChiefOperatingOfficeCFOChiefFinanceOfficerCBOChiefBusinessOfficerCTOChiefTechnologyOfficerCIOChiefInformationOfficerCGOChiefGovernmentOfficer212.NASDAQ:納斯達(dá)克證券市場(chǎng)NASDAQAutomatedQuotationsystem213.VC:VentureCapital風(fēng)險(xiǎn)投資214.PDA:PersonalDateAssistant個(gè)人數(shù)字助理PLA:PersonalInformationAssistant個(gè)人信息助理215.PPAP:AdvancedProductQualityPlanningandControlPlan生產(chǎn)性零組件核準(zhǔn)程序216.FMEA:PotentialFailureModeandEffectsAnalysis失效模式與效應(yīng)分析217.MSA:MeasurementSystemsAnalysis量測(cè)系統(tǒng)分析218.QAS:QualitySystemAssessment質(zhì)量系統(tǒng)評(píng)鑒219.Cusum:累計(jì)總合圖220.OverallEquipmentEffectiveness設(shè)備移動(dòng)率221.Benchmarking:競(jìng)爭(zhēng)標(biāo)桿Analysisofmotion/Ergonomics動(dòng)作分析/人體工程學(xué)222.RokaYoke防錯(cuò)法MCR:machinecapabilityratio機(jī)器利用率223.MistakeProofing防呆法Taguchimethods田口式方法224,Verticalintegration垂直整合Surveillance定期追蹤審查225.EMS:ElectronicsManufacturingSupply-chain226.Cause&Effectscharts特性要因圖227.Scatter:散布圖Fool-ProofSystem防呆系統(tǒng)228.VE:ValueEngineering價(jià)值工程QFD:QualityFunctionDevelopment質(zhì)量機(jī)能展開(kāi)229.ArrowChart箭頭圖法AffiliateChart親和圖法230.PDPC:ProcessDecisionProgramChartSystemChart系統(tǒng)圖法231.RelationChart關(guān)邊圖法MatrixChart矩陣圖法232.MatrixDataAnalysis矩陣數(shù)據(jù)分析法234.Brain-storm腦風(fēng)暴法JIT:JustInTime:及時(shí)性生產(chǎn)模擬235.DemingPrize:戴明獎(jiǎng)Prototype技術(shù)試作236.BPM:BusinessProcessManagement.業(yè)務(wù)流程管MBO目標(biāo)治理237.MBP:方針治理FTA:故障樹(shù)分析QSCV:服務(wù)質(zhì)量238.IPPB:Information情況planning策劃Programming規(guī)劃Budget預(yù)算239.EQ:EmotionQuotient:情商IQ:IntelligenceQuotient:智商240.ImpliedNeeds:隱含要求SpecifiedRequirement:規(guī)定要求241.Probation:觀看期IncomingProductreleasedforurgentproduction緊急放行242.Advancedqualityplanning先進(jìn)的質(zhì)量策劃243.AOQ:AverageOutgoingQuality平均檢出質(zhì)量AOQL:AverageOutgoingQualityLimit平均檢出質(zhì)量界限244.ApprovedSupplierList經(jīng)核準(zhǔn)認(rèn)可的供應(yīng)商名單245.Attributedate特征Benchmarking基準(zhǔn)點(diǎn)Calibration校準(zhǔn)246.Capableprocess工序能力CapabilityIndex工序能力指數(shù)Capabilityratio工序能力率247.CHANGECYCLETIME修改的時(shí)刻周期Continuousimprovement持續(xù)改進(jìn)248.Controlplans操縱策劃Costofquality質(zhì)量成本249.Cycletimereduction減少周期時(shí)刻250.Designofexperiments實(shí)驗(yàn)設(shè)計(jì)Deviation/Substitution偏差/置換251.ESD:Electrostaticdischarge靜電釋放252.EH&S:Environmental,Health,andSafely環(huán)境,健康.安全253.ESS:EnvironmentalStressScreening環(huán)境應(yīng)力篩選254.FMEA:FailureModeEffectAnalysis失誤模式效應(yīng)分析255.FirstArticleapproval產(chǎn)品的首次論證256.Firstpassyield一次性通過(guò)的成品率257.Firstsampleinspection第一次樣品檢驗(yàn)258.FMECA:Failuremodeeffectandcriticallyanalysis失誤模式,效應(yīng)及后果分析259.Gaugecontrol測(cè)量?jī)x器操縱260.GR&R:Gaugerepeatabilityandreproducibility測(cè)量?jī)x器重復(fù)性和再現(xiàn)性261.HALT:HighlyAcceleratedLifeTest高加速壽命試驗(yàn)262.HAST:HighlyAccelerated