ipc印制電路板

1、印 制 電 路 板（printed circuit boards）  ipc-m-105rigid printed board manual 剛性印制板設(shè)計手冊ipc-d-325adocumentation requirements for printed boards 印制板設(shè)計文件圖冊要求ipc-pe-740atroubleshooting for printed board manufacture and assembly印制板制造和組裝的故障排除ipc-mb-380guidelines for molded interconnection devices 模壓互連器件導(dǎo)則ip

2、c-d-326ainformation requirements for manufacturing printed circuit boards and other electronic assemblies印制板制造和其它電子組裝的信息要求規(guī)范ipc-6010 seriesipc-6010 qualification and performance seriesipc-6010印制電路板質(zhì)量標(biāo)準(zhǔn)和性能規(guī)范系列手冊ipc-6011generic performance specification for printed boards 印制板通用性能規(guī)范ipc-6012bqualificati

3、on and performance specification for rigid printed boards剛性板的合格和性能規(guī)范要求ipc-6015qualification & performance specification for organic multichip module (mcm-l) mounting and interconnections 有機多芯片模塊(mcm-l)安裝及互連結(jié)構(gòu)的鑒定與性能規(guī)范ipc-6016qualification & performance specification for high density interconn

4、ect (hdi) layers or boards 高密度互連(hdi)層或印制板的鑒定與性能規(guī)范ipc-6018amicrowave end product board inspection and tech 微波成品印制板的檢驗和測試 ipc-a-600gacceptability of printed boards 印制板驗收條件ipc-qe-605a printed board quality evaluation handbook 印制板質(zhì)量評價ipc-pwb-eval-chprinted circuit board defect evaluation chart印制板缺陷評估圖表

5、ipc-hm-860specification for multilayer hybrid circuits多層混合電路規(guī)范ipc-tf-870qualification and performance of polymer thick film printed boards聚合物厚膜印制板的鑒定與性能ipc-ml-960qualification and performance specification for mass lamination panels for multilayer printed boards 多層印制板的鑒定與性能規(guī)范用預(yù)制內(nèi)層在制板的鑒定與性能規(guī)范ipc-tr-4

6、81results of multilayer tests program round robin多層印制板聯(lián)合試驗計劃結(jié)果ipc-tr-551quality assessment of printed boards used for mounting and interconnecting electronic components 用于電子元件安裝與互連的印制板質(zhì)量評價ipc-tr-579round robin reliability evaluation of small diameter plated through holes in pcbs 印制板中小直徑鍍覆孔可靠性評價聯(lián)合試驗i

7、pc-4552specification for electroless nickel/immersion gold(enig) plating for printed circuit boards 印制電路板表面非電鍍鎳/沉金規(guī)范ipc-dr-572drilling guidelines for printed boards 印制板鉆孔導(dǎo)則it-95080improvements/alternatives to mechanical drilling of pcb vias印制板通孔機加工方案的改進(jìn)和優(yōu)選手冊ipc-nc-349computer numerical control forma

8、tting for drillers and routers鉆床和銑床用計算機數(shù)字控制格式ipc-sm-839pre & post solder mask application cleaning guidelines施加阻焊前及施加后清洗導(dǎo)則ipc-hdi-1high density interconnect microvia technology compendium高密度(hdi)互連微通孔技術(shù)綱要ipc/jpca-4104specification for high density interconnect (hdi) and microvia materials高密度互連(h

9、di)及微導(dǎo)通孔材料規(guī)范ipc-6016qualification & performance specification for high density interconnect (hdi) layers or boards 高密度互連(hdi)層或印制板的鑒定與性能規(guī)范ipc/jpca-6801ipc/jpca terms & definitions, test methods, and design examples for build-up/high density interconnection 積層/高密度互連的術(shù)語和定義、試驗方法與設(shè)計例ipc-dd-135qu

10、alification testing for deposited organic interlayer dielectric materials for multichip modules 多芯片組件內(nèi)層有機絕緣材料的鑒定試驗it-96060high density pcb microvia evaluation (october project), phase i, round 1高密度印制板微通孔評價指標(biāo)手冊, 第一期第一版it-97071high density pcb microvia evaluation, phase i, round 2高密度印制板微通孔評價指標(biāo)手冊, 第一期第

11、二版it-30101high density pcb microvia evaluation, phase i, round 3高密度印制板微通孔評價指標(biāo)手冊, 第一期第三版it-98123microvia manufacturing technology cost analysis report微通孔制作技術(shù)成本核算報告ipc-2141acontrolled impedance circuit boards & high speed logic design控制阻抗電路板與高速邏輯設(shè)計ipc-2251design guide for the packaging of high spe

12、ed electronic circuits高速電子電路封裝的設(shè)計指南ipc-2252design guide for rf/microwave circuit boards 射頻/微波電路板設(shè)計指南ipc-4103specification for base materials for high speed/high frequency applications 高速高頻用基材規(guī)范ipc-6018amicrowave end product board inspection and test 微波成品印制板的檢驗和測試ipc-d-317adesign guidelines for elect

13、ronic packaging utilizing high speed techniques采用高速技術(shù)電子封裝設(shè)計導(dǎo)則ipc-m-102flexible circuits compendium 撓性電路綱要ipc-4202flexible base dielectrics for use in flexible printed circuitry撓性印制線路用撓性絕緣基底材料ipc-4203adhesive coated dielectric films for use as cover sheets for flexible printed circuitry and flexible

14、adhesive bonding films 撓性印制線路覆蓋層用涂粘接劑絕緣薄膜ipc-4204flexible metal-clad dielectrics for use in fabrication of flexible printed circuitry撓性金屬箔去電應(yīng)用于柔性電路組裝ipc-6013aqualification & performance specification for flexible printed boards撓性印制板的鑒定與性能規(guī)范ipc/jpca-6202ipc/jpca performance guide manual for singl

15、e- and double-sided flexible printed wiring boards ipc/jpca單雙面撓性印制板性能手冊ipc-fa-251guidelines for assembly of single- and double-sided flex circuits單面和雙面撓性電路組裝導(dǎo)則ipc-fc-234composite metallic materials specification for printed wiring boards印制線路板復(fù)合金屬材料規(guī)范ipc-m-107standards for printed board materials man

16、ual 印制板材料標(biāo)準(zhǔn)手冊ipc-mi-660incoming inspection of raw materials manual 原材料接收檢驗手冊ipc-4101aspecifications for base materials for rigid and multilayer printed boards剛性及多層印制板用基材規(guī)范ipc-4121guidelines for selecting core construction for multilayer printed wiring board applications 多層印制板用芯板結(jié)構(gòu)選擇導(dǎo)則ipc-4562metal f

17、oil for printed wiring applications 印制線路用金屬箔ipc-cf-148aresin coated metal for printed boards 印制板用涂樹脂金屬箔ipc-cf-152bcomposite metallic materials specification for printed wiring boards印制線路板復(fù)合金屬材料規(guī)范ipc-tr-482new developments in thin copper foils 薄銅箔的新發(fā)展ipc-tr-484results of ipc copper foil ductility rou

18、nd robin studyipc銅箔延展性聯(lián)合研究結(jié)果 ipc-tr-485results of copper foil rupture strength test round robin study銅箔斷裂強度試驗聯(lián)合研究結(jié)果ipc-4412specification for finished fabric woven from ”e” glass for printed boards“e”類精紡玻璃纖維層印制板技術(shù)規(guī)范ipc-4130specification & characterization methods for nonwoven "e" glass

19、materialse 玻璃纖維非織布材料規(guī)范及性能確定方法ipc-4110specification and characterization methods for nonwoven cellulose based paper for printed boards印制板用纖維紙規(guī)范及性能確定方法ipc-4411-aspecification and characterization methods for non-woven para-aramid reinforcement聚芳基酰胺非織布規(guī)范及性能確定方法ipc-sg-141specification for finished fabri

20、c woven from "s" glass for printed boards印制板用經(jīng)處理s玻璃纖維織物規(guī)范ipc-a-142specification for finished fabric woven from aramid for printed boards印制板用經(jīng)處理聚芳酰胺纖維編織物規(guī)范ipc-qf-143specification for finished fabric woven from quartz (pure fused silica) for printed boards 印制板用經(jīng)處理石英（熔融純氧化硅）纖維編織物規(guī)范ipc-2524pwb

21、 fabrication data quality rating system 印制板制造數(shù)據(jù)質(zhì)量定級體系ipc-9151aprinted board process, capability, quality and relative reliability benchmark test standard and database印制板工藝, 容量, 質(zhì)量,可靠性試驗標(biāo)準(zhǔn)和數(shù)據(jù)庫ipc-9191general guidelines for implementation of statistical process control (spc) 實施統(tǒng)計過程控制(spc)的通用導(dǎo)則ipc-9199statistical process control (spc) quality rating 統(tǒng)計分析控制ipc-9252guidelines and requirements for e