PCB封裝設(shè)計(jì)規(guī)范標(biāo)準(zhǔn)V1.0

1、HPCB封裝設(shè)計(jì)規(guī)范文件編號(hào) 受控標(biāo)識(shí)： 版本狀態(tài): 發(fā)放序號(hào)編制：日期:審核：日期:批準(zhǔn)：日期:PCB封裝設(shè)計(jì)規(guī)范1、2、適用范圍3、4、術(shù)語(yǔ)定義5、引用標(biāo)準(zhǔn)6、PCB封裝設(shè)計(jì)過(guò)程框圖7、SMC （表面組裝元件）封裝及命名簡(jiǎn)介8、SMD （表面組裝器件）封裝及命名簡(jiǎn)介9、設(shè)計(jì)規(guī)則10、PCB封裝設(shè)計(jì)命名方式11、PCB封裝放置入庫(kù)方式12、封裝設(shè)計(jì)分類12.1、矩形元件（標(biāo)準(zhǔn)類）12.2、圓形元件（標(biāo)準(zhǔn)類）1512.3、小外形晶體管（SOT）及二極管（SOD）（標(biāo)準(zhǔn)類）1712.4、集成電路（IC）（標(biāo)準(zhǔn)類）2412.5、微波器件（非標(biāo)準(zhǔn)類）3412.6、接插件（非標(biāo)準(zhǔn)類）37PCB封裝設(shè)計(jì)

2、規(guī)范1、目的本規(guī)范是為電子元器件的表面屬性提供模版信息，即為表面器件焊盤圖形設(shè)計(jì)提供模版尺寸，外形以及公差,以便檢查和測(cè)試，確保表面裝配產(chǎn)品的可靠性，從而規(guī)范電子元器件的PCB封裝設(shè)計(jì)2、適用范圍本規(guī)范適用于研發(fā)中心 PCB部所有PCB封裝的設(shè)計(jì)。3、職責(zé)PCB封裝庫(kù)評(píng)審由PCB部門經(jīng)理與工藝部門經(jīng)理共同評(píng)審?fù)瓿?，特殊封裝除外。PCB部門專職PCB封裝設(shè)計(jì)人員負(fù)責(zé) PCB封裝庫(kù)的設(shè)計(jì)、評(píng)審和更新。4、術(shù)語(yǔ)定義PCB ( Print circuit Board):印刷電路板Foot print :封裝IC (integrated circuits):集成電路SMC ( Surface Mount

3、ed Components):表面組裝元件SMD( Surface Mounted Devices):表面組裝器件5、引用標(biāo)準(zhǔn)下列標(biāo)準(zhǔn)包含的條文，通過(guò)在本規(guī)范中引用而構(gòu)成本規(guī)范的條文。在規(guī)范歸檔時(shí)，所示版本均為有效。所有規(guī)范都會(huì)被修訂，使用本規(guī)范的各方應(yīng)探討，使用下列標(biāo)準(zhǔn)最新版本的可能性。IPC Batch Foot print Gen erator Refere neeIP C-7351Gen eric Requireme nts for Surface Mount Desig n and Land P atter n Stan dardIP C-SM-782ASurface Mount D

4、esig n and Land P atter n Stan dard表面組裝技術(shù)基礎(chǔ)與可制造性設(shè)計(jì)6、PCB封裝設(shè)計(jì)過(guò)程框圖圖6.1 PCB封裝設(shè)計(jì)過(guò)程框圖7、SMC（表面組裝元件）封裝及命名簡(jiǎn)介SMC主要是指無(wú)源元件的機(jī)電元件，包括各種電阻器、 陶瓷電容器、鋁電解電容器、電感器、磁珠、陶瓷各種開關(guān)、繼電器、連接器等，封裝形狀有矩形、振子、濾波器、電阻網(wǎng)絡(luò)、電容網(wǎng)絡(luò)、微調(diào)電容器、電位器、 圓柱形、復(fù)合形和異形。SMC的封裝是以元件的外形尺寸來(lái)命名的，其標(biāo)稱以3位或4位數(shù)字來(lái)表示，SMC的封裝命名及標(biāo)稱已經(jīng)標(biāo)準(zhǔn)化。SMC常用外形尺寸長(zhǎng)度和寬度命名，來(lái)標(biāo)志其外形大小,通常有公制（mm）和英制（i

5、nch）兩種表示方法。公制（mm） /英制（inch）轉(zhuǎn)換式如下:25.4mmx英制（inch）尺寸=公制（mm）尺寸例如：0805 （0.08inch X 0.05inch ）英制轉(zhuǎn)換為公制元件長(zhǎng)度=25.4mm X 0.08=2.032 2.0mm元件寬度=25.4mm X 0.05=1.27 1.25mm 0805 的公制表示法為 2125 (2.0mmX 1.25mm)& SMD（表面組裝器件）封裝及命名簡(jiǎn)介SMD主要是指有源器件，包括半導(dǎo)體分立器件（二極管、三極管和半導(dǎo)體特殊器件）、集成電路。SMD是貼在PCB表面的，而不是插在PCB通孔中;SMD的體積小、重量輕、速度快；S

6、MD可以兩面貼裝,SMD封裝命名是以器件的外形命名的。SMD的引出腳有羽翼形(GULL )、J形、球形、和無(wú)引線引線框架形。SMD的封裝形式有:SOP(Small Outline Packages)羽翼形小外形塑料封裝，其中包括SOIC (Small Outline Integrated Circuits )小外形集成電路，SSOIC (Shrink Small Outline Integrated Circuits )縮小型小外形集成電路，TSOP (Thin Small OutlinePackage)薄型小外形圭寸裝;SOJ(Small Outline Integrated Circuit

7、s) , J 形小外形塑料封裝;PLCC(Plastic Leaded Chip Carriers)塑封 J 形引腳芯片載體;BGA(Ball Grid Array/Chip Scale Package)球形柵格陣列，根據(jù)材料和尺寸可分為六個(gè)類型：PBGA ( Plastic BallGrid Array )塑料封裝 BGA , CBGA (Ceramic Ball Grid Array )陶瓷封裝 BGA , CCGA (Ceramic Column BGA )陶瓷柱狀封裝 BGA , TBGA (Tape Ball Grid Array )載帶 BGA ,田GA (微型 BGA )芯片級(jí)封

8、裝，F(xiàn)C-PBGA ( FlipChip Plastic Ball Grid Array )倒裝芯片塑料封裝BGA ;CSP( Ch ip Scale Package)又稱 jiBGA ;QFN(Quad Flat No-lead)四方形扁平無(wú)引線引線框架封裝。9、設(shè)計(jì)規(guī)則由RF或控制人員預(yù)先給出需要設(shè)計(jì)PCB封裝器件的DATASHEET至PCB封裝設(shè)計(jì)人員，同時(shí)轉(zhuǎn)給原理圖封裝設(shè)計(jì)人員同步設(shè)計(jì)原理圖封裝，同步設(shè)計(jì)完成后需統(tǒng)一其命名方式，即PCB封裝的命名與原理圖封裝載入PCB設(shè)計(jì)時(shí)的封裝命名一致，否則無(wú)法導(dǎo)入PCB設(shè)計(jì)。設(shè)計(jì)PCB時(shí)，必須使用我司標(biāo)準(zhǔn)的 PCB封裝庫(kù)，不得自己創(chuàng)建PCB封裝庫(kù)。

9、PCB封裝庫(kù)在不同的項(xiàng)目設(shè)計(jì)里同種類型器件必須使用同種類型的PCB封裝庫(kù)，保證PCB封裝庫(kù)的唯一性與統(tǒng)一性，從而提高設(shè)計(jì)的正確率。非標(biāo)準(zhǔn)且無(wú)明顯方向性的PCB封裝有輸入輸出要求的必須在相應(yīng)管腳增加輸入( IN )輸出(OUT)標(biāo)識(shí)，有極性的器件PCB封裝必須增加極性標(biāo)識(shí)；標(biāo)準(zhǔn)且有方向性的PCB封裝必須給出1Pin標(biāo)識(shí)。有引腳序號(hào)標(biāo)識(shí)的器件按DATASHEET標(biāo)明PCB封裝焊盤的引腳順號(hào)，DATASHEET引腳序號(hào)標(biāo)識(shí)含糊不清或根本沒有標(biāo)識(shí)引腳序號(hào)的按IC管腳焊盤序號(hào)來(lái)標(biāo)識(shí)，即逆時(shí)針順序標(biāo)識(shí)。同一個(gè)PCB封裝里不能有相同的引腳序號(hào)出現(xiàn)。PCB封裝保存時(shí)封裝信息包含 PCB封裝“命名”，該封裝“高

10、度”等，如有其他的可增加“描述”等。屬IPC標(biāo)準(zhǔn)封裝的參考IPC標(biāo)準(zhǔn)封裝來(lái)設(shè)計(jì) PCB封裝庫(kù)；除IPC標(biāo)準(zhǔn)封裝以外，DATASHEET有推薦封裝的采用推薦封裝設(shè)計(jì) PCB封裝，特殊情況除外；非標(biāo)準(zhǔn)封裝采用我司規(guī)定的標(biāo)準(zhǔn)來(lái)設(shè)計(jì)PCB封裝。所有封裝均用 PAD設(shè)計(jì)焊盤；用 PAD或keepout層設(shè)計(jì)定位孔；絲印與 PADS的距離10mil。設(shè)計(jì)PCB封裝外形絲印要求其自身的最大尺寸，IC除外。設(shè)計(jì)IC PCB封裝自動(dòng)生成的 PAD上有過(guò)孔(VIA )時(shí)，其過(guò)孔的內(nèi)徑為0.25mm，外徑為1520mil。PCB封裝設(shè)計(jì)規(guī)范貼片電容封裝推薦尺寸:10、PCB封裝設(shè)計(jì)命名方式屬于規(guī)則圭寸裝命名方式的統(tǒng)

11、一用IPC的圭寸裝命名。屬于不規(guī)則的單一的命名統(tǒng)一用其型號(hào)的全稱命名。設(shè)計(jì)人員完成PCB封裝設(shè)計(jì)后，要及時(shí)與原理圖封裝設(shè)計(jì)同步。11、PCB封裝放置入庫(kù)方式目前我司PCB封裝庫(kù)分類有：標(biāo)識(shí).lib，SMA . lib，電位器.lib，電感.lib，電容.lib，晶體管.lib，電源.lib，開關(guān).lib，插件.lib，微波.lib，功放管.lib，芯片.lib，時(shí)鐘.lib等等，設(shè)計(jì)人員根據(jù) DATASHEET所屬類型自行.lib ”類別以放置待評(píng)審判斷放置入庫(kù)，如分類不夠或不全可適當(dāng)增減種類，其中設(shè)計(jì)人員可設(shè)計(jì)一個(gè)“新器件 類型或有疑問(wèn)的 PCB封裝。PCB封裝放置入庫(kù)時(shí)以它封裝本身的1pi

12、n中心或器件本身中心點(diǎn)為原點(diǎn)放置。12、封裝設(shè)計(jì)分類電阻電容，晶體管，集成電路（IC）,功放管，隔離器與環(huán)形器，耦合器，接插件等，分為標(biāo)準(zhǔn)類與非標(biāo)準(zhǔn) 類。12.1、矩形元件（標(biāo)準(zhǔn)類）SH圖12.1貼片電阻封裝實(shí)際尺寸表12.1貼片電阻封裝實(shí)際尺寸mm（i n） component ide ntifierLSWTHminmaxminmaxminmaxminmaxmax1005 （0402）1.001.100.400.700.480.600.100.300.401608 （0603）1.501.700.701.110.700.950.150.400.602012 （0805）1.852.150.5

13、51.321.101.400.150.650.653216 （1206）3.053.351.552.321.451.750.250.750.713225 （1210）3.053.351.552.322.342.640.250.750.715025 （2010）4.822.352.650.350.850.716332 （2512）6.156.454.455.223.053.350.350.850.71圖12.2貼片電阻封裝推薦尺寸表12.2貼片電阻封裝推薦尺寸RLP No.ComponentZ(mm)G(mm)X(mm)Y(mm)C(mm)P laceme ntIde n

14、tifiermm(i n)refrefgrid100A1005 (0402)2.200.400.700.901.302X6101A1608 (0603)2.800.601.001.101.704X6102A2012 (0805)3.200.601.501.301.904X8103A3216 (1206)4.401.201.801.602.804X10104A3225 (1210)4.401.202.701.602.806X10105A5025 (2010)6.202.602.701.804.406X14106A6332 (2512)7.403.803.201.805.608X16IH圖12.3

15、貼片電容封裝實(shí)際尺寸表12.3貼片電容封裝實(shí)際尺寸ComponentIde ntifiermm（i n）LSWTHminmaxminmaxminmaxminmaxmax1005 （0402）0.901.100.300.650.400.600.100.300.601310 （0504）1.021.320.260.720.771.270.130.381.021608 （0603）1.451.750.450.970.650.950.200.500.852012 （0805）1.802.200.301.111.051.450.250.751.103216 （1206）3.003.401.502.311

16、.401.800.250.751.353225 （1210）3.003.401.502.312.302.700.250.751.354532 （1812）4.204.802.303.463.003.400.250.951.354564 （1825）4.204.802.303.466.006.800.250.951.10PCB封裝設(shè)計(jì)規(guī)范表12.4貼片電容封裝實(shí)際尺寸RLP No.ComponentIde ntifiermm(i n)Z(mm)G(mm)X(mm)Y(mm)C(mm)PI aceme ntgridrefref130A1005(0402)2.200.400.700.901.302X

17、6131A1310(0504)2.400.401.301.001.404X6132A1608(0603)2.800.601.001.101.704X6133A2012(0805)3.200.601.501.301.904X8134A3216(1206)4.401.201.801.602.804X10135A3225(1210)4.401.202.701.602.806X10136A4532(1812)5.802.003.401.903.908X12137A4564(1825)5.802.006.801.903.9014X12wIT 1SJ£MlSL L 一H1h11W2 -圖12.5

18、貼片電感封裝實(shí)際尺寸表12.5貼片電感封裝實(shí)際尺寸ComponentIde ntifier(mm)L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minmaxminmaxminmaxminmaxminmaxmaxmax2012 chip1.702.301.101.760.601.20-0.100.301.20-3216 chip2.903.501.902.631.301.90-0.200.501.90-4516 chip4.204.802.603.530.601.20-0.300.801.90-2825 prec.w/w2.202.800.901.621.952.

19、112.102.540.370.652.290.073225 p rec.w/w2.903.500.901.831.401.80-0.501.002.000.504532 p rec.w/w4.204.8003.40-0.501.002.800.505038 prec.w/w4.354.952.813.512.462.623.413.810.510.773.800.763225/3230 molded3.003.401.602.181.802.002.302.700.400.702.400.514035 molded3.814.320.811.601.201.502.92

20、02.671.274532 molded4.204.802.303.152.002.203.003.400.650.953.400.505650 molded5.305.503.304.323.804.204.705.300.501.005.801.008530 molded8.258.765.256.041.201.502.902.671.27貼片電感圭寸裝推薦尺寸:PCB封裝設(shè)計(jì)規(guī)范圖12.6貼片電感封裝推薦尺寸表12.6貼片電感封裝推薦尺寸RLP No.ComponentZ(mm)G(mm)X(mm)C(mm)Y(mm)P laceme nt

21、Ide ntifier(mm)refrfegrid1602012 chip3.001.001.002.001.004X81613216 chip4.201.801.603.001.206X101624516 chip5.802.601.004.201.604X121632825 Prec3.801.002.402.401.406X101643225 Prec4.601.002.002.801.806X101654532 Prec5.802.203.604.001.808X141665038 Prec5.803.002.804.401.408X141673225/3230 Molded4.401

22、.202.202.801.606X101684035 Molded5.401.001.403.202.208X121694532 Molded5.801.802.403.802.008X141705650 Molded6.803.204.005.001.8012X161718530 Molded9.805.001.407.402.408X22缶Hills2 Pl'acesL圖12.7鉭電容封裝實(shí)際尺寸W?圖12.7鉭電容封裝實(shí)際尺寸ComponentIde ntifier(mm)L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minmaxminmaxmin

23、maxminmaxminmaxminmax32163.003.400.801.701.800.501.100.701.8035283.303.701.102.003.000.501.100.702.1060325.706.302.503.503.501.001.601.002.8073437.007.603.804.842.392.414.004.601.001.601.003.10鉭電容封裝推薦尺寸:PCB封裝設(shè)計(jì)規(guī)范表12.8鉭電容封裝推薦尺寸RLP No.ComponentZ(mm)G(mm)X(mm)Y(mm)C(

24、mm)P laceme ntIde ntifier(mm)refrefgrid180A32164.800.801.202.002.806X12181A35285.001.002.202.003.008X12182A60327.602.402.202.605.008X18183A73439.003.802.402.606.4010X2012.2、圓形元件（標(biāo)準(zhǔn)類）表12.9貼片二極管封裝實(shí)際尺寸ComponentIde ntifierMm(i n)L(mm)S(mm)W(mm)T(mm)ComponenttypeminmaxminmaxminmaxminmaxSOD-80/MLL343.303.

25、702.202.651.601.700.410.55DiodeSOD-87/MLL414.805.203.804.252.442.540.360.50Diode2012(0805)1.9041.351.450.230.370.10mw resistor3216(1206)3.003.401.862.311.751.850.430.570.25mw resistor3516(1406)3.303.702.162.611.551.650.430.570.12w resistor5923(2309)5.706.104.364.812.402.500.530.670.25w re

26、sistor圖12.9貼片二極管封裝實(shí)際尺寸W (DIA.)貼片二極管封裝推薦尺寸:PCB封裝設(shè)計(jì)規(guī)范圖12.10貼片二極管封裝推薦尺寸表12.10貼片二極管封裝推薦尺寸RLP No.ComponentIde ntifierMm(i n)Z(mm)G(mm)X(mm)Y(mm)C(mm)ABP laceme ntgridrefref200ASOD-80/MLL344.802.001.801.403.400.500.506X12201ASOD-87/MLL416.303.402.601.454.850.500.506X14202A2012(0805)3.200.601.601.301.900.5

27、00.354X8203A3216(1206)4.401.202.001.602.800.500.556X10204A3516(1406)4.802.001.801.403.400.500.556X12205A5923(2309)01.505.700.500.656X1812.3、小外形晶體管（SOT及二極管（SOD （標(biāo)準(zhǔn)類）H測(cè)profiletabk圖12.11 SOT23封裝實(shí)際尺寸表12.11 SOT23封裝實(shí)際尺寸ComponentIde ntifierL(mm)S(mm)W(mm)T(mm)H(mm)P (mm)minmaxminmaxminmaxminmaxm

28、axnomSOT232.302.601.101.470.360.460.450.601.100.95SOT23封裝推薦尺寸:Y(mm)C(mm)E(mm)refrefrefGirdComponentP laceme ntRLP No.Z(mm)G(mm)X(mm)iden tifierPCB封裝設(shè)計(jì)規(guī)范210SOT233.600.801.001.402.200.958X84.40-4.60K2.2fr-2.e01W1 -P 圖12.13 SOT89封裝實(shí)際尺寸SOT89封裝實(shí)際尺寸:RLPComponentZY1X1P laceme ntNo.Iden tifier(mm)(mm)(mm)gr

29、id表12.14 SOT89封裝推薦尺寸表12.13 SOT89封裝實(shí)際尺寸ComponentIde ntifierL(mm)T(mm)W1(mm)W2(mm)W3(mm)K(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxminmaxmaxnomSOT893.944.250.891.200.360.480.440.561.621.832.602.851.601.50SOT89封裝推薦尺寸:X2(mm)X3(mm)Y2(mm)Y3(mm)E(mm)minmaxminmaxrefrefnomPCB封裝設(shè)計(jì)規(guī)范215SOT895.401.400.800.801

30、.001.802.002.404.601.5012X105 MBLIITSOD123封裝實(shí)際尺寸:ComponentP laceme ntRLP No.Z(mm)G(mm)X(mm)Iden tifiergrid圖12.15 SOD123封裝實(shí)際尺寸CGrid placement courtyard1I LX i111十11111111iLj11Yf+ G *Z圖12.16 SOD123封裝推薦尺寸表12.15 SOD123封裝實(shí)際尺寸ComponentIde ntifierL(mm)S(mm)W1(mm)W2(mm)T(mm)Hminmaxminmaxminmaxminmaxminmaxma

31、xSOD1233.553.852.352.930.450.651.401.700.250.601.35SMB5.215.592.173.311.962.213.303.940.761.522.41SOD123封裝推薦尺寸:表12.16 SOD123封裝推薦尺寸Y(mm)C(mm)refrefPCB封裝設(shè)計(jì)規(guī)范220ASOD1235.001.800.801.603.404X12221ASMB6.802.002.402.404.408X16P1- V 0 思 D/I3DS1.20-1140 LVV*-VWfW12.60-3.04SOT143封裝實(shí)際尺寸:ComponentZGX1P laceme

32、ntIden tifier(mm)(mm)(mm)grid圖12.17 SOT143封裝實(shí)際尺寸表12.17 SOT143封裝實(shí)際尺寸ComponentIde ntifierL(mm)S(mm)W1(mm)W2(mm)T(mm)P 1(mm)P 2(mm)H(mm)minmaxminmaxminmaxminmaxminmaxnomnommaxSOT1432.102.641.001.690.370.460.760.890.250.551.921.721.20SOT143封裝推薦尺寸:圖12.18 SOT143封裝推薦尺寸表12.18 SOT143封裝推薦尺寸X2(mm)CE1E2Yminmaxr

33、efnomnomref225SOT1433.600.801.001.00 01.701.408X86 30-6 .70H 一waS圖12.19 SOT223封裝實(shí)際尺寸w P2T13,30-3.701SOT223封裝實(shí)際尺寸:圖12. 20 SOT223封裝推薦尺寸表12.19 SOT223封裝實(shí)際尺寸ComponentIde ntifierL(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)P 1(mm)P 2(mm)minmaxminmaxminmaxminmaxminmaxmaxnomnomSOT2236.707.304.104.920.600.882.

34、903.180.901.301.802.304.60SOT223封裝推薦尺寸:表12. 20 SOT223封裝推薦尺寸RLP No.X2(mm)Y(mm)C(mm)E1(mm)E2(mm)minmaxrefrefnomnomPCB封裝設(shè)計(jì)規(guī)范230SOT2238.404.001.203.403.6004.6018X14W? »特殊晶體管（DPAK） -1特殊晶體管（DP AK）:ComponentIde ntifierLW1W2T1T2P1P2HminmaxminmaxminmaxminmaxminmaxbasicbasicMaxTS-003*9.3210.41

35、0.640.914.355.350.510.804.005.502.284.572.38TS-005*14.6015.880.510.916.226.862.292.798.009.002.545.084.83TO36818.70513.3013.602.402.7012.4012.705.4510.905.10表 12.21特殊晶體管（DPAK） -1I-|'"Grid；P IflgmantI courtyard圖12.22 特殊晶體管（DPAK） -2表12.22 特殊晶體管（DPAK） -2RLP No.ComponentZ(mm)Y1Y2X1X

36、2CP laceme ntIde ntifierrefGrid235ATS-003*11.201.606.201.005.407.3024X16236TS-005*16.603.409.601.006.8010.1036X24237TO26819.803.4013.401.4013.6011.4042X3412.4、集成電路（IC）（標(biāo)準(zhǔn)類）所有對(duì)稱IC都需增加1 pin標(biāo)識(shí)。SOIC系列封裝實(shí)際尺寸:PCB封裝設(shè)計(jì)規(guī)范表12.23 SOIC系列封裝實(shí)際尺寸Compo nent IdentifierJEDECL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)Pminmaxm

37、inmaxminmaxminmaxminmaxminmaxminmaxnomSO8MS-012AA5.806.203.264.550.330.510.401.273.804.004.805.001.351.751.27S08W-10.0010.657.468.850.330.510.401.277.407.605.055.452.352.651.27SO14MS-012AB5.806.203.264.550.330.510.401.273.804.008.558.751.351.751.27SO14W-10.0010.657.468.850.330.510.401.277.407.608.80

38、9.202.352.65SO16MS-012AC5.806.203.264.550.330.510.401.273.804.009.8010.001.351.751.27SO16WMS-013AA10.0010.657.468.850.330.510.401.277.407.6010.1010.502.352.651.27SO20WMS-013AC10.0010.657.468.850.330.510.401.277.407.6012.6013.002.352.651.27SO24WMO-119AA10.2910.648.219.010.360.510.531.047.407.6015.541

39、5.852.342.641.27SO24XMO-120AA11.8112.179.7310.540.360.510.531.048.769.0215.5415.852.342.641.27SO28WMO-119AB10.2910.648.219.010.360.510.531.047.407.6018.0818.392.342.641.27SO28XMO-120AB11.8112.179.7310.540.360.510.531.048.769.0218.0818.392.342.641.27SO32WMO-119AC10.2910.648.219.010.360.510.531.047.40

40、7.6020.6220.932.342.641.27SO32XMO-120AC11.8112.179.7310.540.360.510.531.048.769.0220.6220.932.342.641.27SO36WMO-119AD10.2910.648.219.010.360.510.531.047.407.6023.1623.472.342.641.27SO36XMO-120AD11.8112.179.7310.540.360.510.531.048.769.0223.1623.472.342.641.27SOIC系列封裝推薦尺寸:G7V圖12.24 SOIC系列封裝推薦尺寸Srid p

41、lacement courtyard表12.24 SOIC系列封裝推薦尺寸RLP No.Component ide ntifierZ(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)P laceme ntgridrefRefrefref300ASO87.403.000.6011.2716X12301ASO8W11.407.000.6011.2724X12302ASO147.403.000.6021.2716X20303ASO14W11.407.000.6021.2724X20304ASO1

42、67.403.000.6091.2716X22305ASO16W11.407.000.6091.2724X22306ASO20W11.407.000.602.209.2011.431.2724X28307ASO24W11.407.000.602.209.2013.971.2724X32308ASO24X13.008.600.602.2010.8013.971.2728X32309ASO28W11.407.000.602.209.2016.511.2724X38310ASO28X13.008.600.602.2010.8016.511.2728X383

43、11ASO32W11.407.000.602.209.2019.051.2724X44312ASO32X13.008.600.602.2010.8019.051.2728X44313ASO36W11.407.000.602.209.2021.591.2724X48314ASO36X13.008.600.602.2010.8021.591.2728X48ABSSOPIC系列封裝實(shí)際尺寸:圖12.25 SOPIC系列封裝實(shí)際尺寸PCB封裝設(shè)計(jì)規(guī)范表12.25 SOPIC系列封裝實(shí)際尺寸Compo nent identifiertypeL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxmaxmaxnomSOP6I5.726.993.725.110.350.510.60