6Sigma六西格瑪精益生產(chǎn)持續(xù)改善分析管理常用工具資料 Six_Sima_Project_Report_02_-_Measure_Phase

1、專案 Y 的 敘述 : 提升 F2 test yield rate from 93% to 98%.(NTF rate reduce from 5% to 1.4%)規(guī)格上限: NA規(guī)格下限: NAR2 MeasureSummary階段開始日期: 04/15/2005階段完成日期: 05/15/2005專案類型 : DMAIC製程能力分析:Process-Z:1.09 DPPM=137856資料收集計(jì)畫:Daily data from 4/15 to 5/15,N=30Y的常態(tài)化:定性型，無(wú)常態(tài)化分析專案名稱 :提升 F2 test yield rate from 93% to 98%. _組

2、別 : 旭福之星_Conclusion / Issues / Next Step : 1.Process Map : Macro 、Detail 、Ideal 。 - Key finding : Improve operators negligence at first.2. Data Collection Plan:F/T test failure rate; Test equipment detail data as using times and vendor; Repair report.- - Key finding : Improve the test equipment mate

3、rial poor quality is the important.3.Lean Manufacturing : Follow up SOP to operate, using 5S and others methodology to make lean and efficient processes. - Key finding : It is critical not to follow up SOP in 7 waste.4.Gage R&R :By quantitative measure performance. - Key finding : The measure system

4、 is accepted base on score 80%, The main effect is affected by test equipment.5. C&E Metrics : - Key finding: It is important to improve equipment material and train operator6. Process Capability: - Key finding: Process-Z:1.09 DPPM=137856 1M1-1流程圖宏觀流程圖我們想要知道什麼? (為何用此工具)宏觀流程圖表達(dá)專案範(fàn)圍及關(guān)鍵性製程在那裏與大架構(gòu)相連。F/T

5、PackingNGICT TestShippingPick up and Place boardInsert Test EquipmentOQCRepair有什麼發(fā)現(xiàn)? (運(yùn)用工具找出什麼重要結(jié)果/結(jié)論之重點(diǎn)摘要?) NTF yield rate:20%.NTF 20%Purchase Test Equipment2M1-2流程圖實(shí)際流程圖我們想要知道什麼? (為何用此工具)找出所有輸入變數(shù)的細(xì)節(jié)以期改進(jìn)，尤其是隱形工廠的部份。ICT TestPick up and place board on fixturePlace CPUPlace CPU coolerInsert MemoryVAVA

6、WI-PENG-A38VAWI-PENG-A38NVAWI-PENG-A38Insert HDD cableInsert other cableInsert Test CardVAWI-PENG-A38VAWI-PENG-A38VAWI-PENG-A38VAWI-PENG-A38F/TOQCPackingVAWI-PENG-A38RepairNGShippingPassRetestYesNVAWI-PENG-A38NVAWI-PENG-A38有什麼發(fā)現(xiàn)? (運(yùn)用工具找出什麼重要結(jié)果/結(jié)論之重點(diǎn)摘要?)1. Main hidden factory on insert test equipment

7、 in red colors.2. Retest need control for operators negligence.NVADDDDInsert FDD cableDVAWI-PENG-A38Backouttest equipmentPlace board on lineNVASOPVASOPNGPassNVA隱形工廠DDDReinsert test equipment3M1-2流程圖理想流程圖我們想要知道什麼? (為何用此工具)找出所有輸入變數(shù)的細(xì)節(jié)以期改進(jìn)，尤其是隱形工廠的部份。ICT TestPick up and place board on fixturePlace CPUP

8、lace CPU coolerInsert MemoryInsert HDD cableInsert other cableInsert Test CardF/TOQCPackingNVASOPRepairNGShippingYes有什麼發(fā)現(xiàn)? (運(yùn)用工具找出什麼重要結(jié)果/結(jié)論之重點(diǎn)摘要?)1. Retest need control for operators negligence.NVASOPInsert FDD cableBackouttest equipmentPlace board on linePassNGPass4M1-2詳細(xì)圖步驟分析表我們想要知道什麼? (為何用此工具)1.確

9、認(rèn)製程步驟, 標(biāo)明VA/NVA2.將文件編號(hào)或以SOP號(hào)碼紀(jì)錄或Spec.表示.3.確認(rèn)I/O類型, 規(guī)格,可控制性(C)或噪音性(N), 製程能力和設(shè)備有什麼發(fā)現(xiàn)? (運(yùn)用工具找出什麼重要結(jié)果/結(jié)論之重點(diǎn)摘要?)5M2精簡(jiǎn)製造我們想要知道什麼? (為何用此工具)1.有那些浪費(fèi)?(找出立即改善的機(jī)會(huì)點(diǎn))2.有那些5S改善機(jī)會(huì)?3.就7項(xiàng)浪費(fèi)分類與5S改善方向逐一表列有什麼發(fā)現(xiàn)? (運(yùn)用工具找出什麼重要結(jié)果/結(jié)論之重點(diǎn)摘要?)七大浪費(fèi)因材料品質(zhì)問(wèn)題所造成的影響最多。6M3因果關(guān)係矩陣我們想要知道什麼? (為何用此工具)1.以Minitab繪製魚骨圖並列舉出所有相關(guān)Xs2.建立 C&E Metri

10、cs表有什麼發(fā)現(xiàn)? (運(yùn)用工具找出什麼重要結(jié)果/結(jié)論之重點(diǎn)摘要?)It is important to improve equipment material and train operator.魚骨圖NTF yield rateEnvironment MethodMachineManMaterialMeasurementTest experienceOperation method CPU covert house Manual test fixtureAuto test fixture Insert order Fixture maintenance TemperatureHumidity

11、5STest cardsize HDD vendorUse timescableFDD vendorUse timesCableMemory covert connectorProgram7M3因果關(guān)係矩陣我們想要知道什麼? (為何用此工具)1.以Minitab繪製魚骨圖並列舉出所有相關(guān)Xs2.建立 C&E Metrics表有什麼發(fā)現(xiàn)? (運(yùn)用工具找出什麼重要結(jié)果/結(jié)論之重點(diǎn)摘要?)It is important to improve equipment material and train operator.8我們想要知道什麼? (為何用此工具)若為定性型MSA則以 AttributeR&R

12、.xls 表格檢驗(yàn)M4-3量測(cè)系統(tǒng)分析定性型 Gage R&R 實(shí)例有什麼發(fā)現(xiàn)? (運(yùn)用工具找出什麼重要結(jié)果/結(jié)論之重點(diǎn)摘要?)1. 懷疑測(cè)試治具不穩(wěn)定.結(jié)論與改善建議(量測(cè)系統(tǒng)或量具)9我們想要知道什麼? (為何用此工具)位置, 分散度, 形狀, 穩(wěn)定度M5-1Y 的敘述有什麼發(fā)現(xiàn)? (運(yùn)用工具找出什麼重要結(jié)果/結(jié)論之重點(diǎn)摘要?)Process Z=1.09;Process capacity is poor, it need be improved.10Primary Metricsii fiii有什麼發(fā)現(xiàn)? (運(yùn)用工具找出什麼重要結(jié)果/結(jié)論之重點(diǎn)摘要?)The defect DPPM is

13、 high, there is improvement space.11FinancialEstimateii fiii有什麼發(fā)現(xiàn)? (運(yùn)用工具找出什麼重要結(jié)果/結(jié)論之重點(diǎn)摘要?)12tMeasureAttachments資料收集計(jì)畫工作表Data Collection Purpose:運(yùn)用相關(guān)統(tǒng)計(jì)手法及計(jì)算工具,製作6 sigma R2表What to measure: (Output measure and segmentation factors)資料名稱資料類別(X/Y)資料屬性(Discrete/Continuous)定義範(fàn)圍(Continuous) 值(Discrete)Repai

14、r defect reporty1DiscreteIPY,RTY自4/155/15每天二次(白晚班各一次)，Measure system analysisy1DiscreteFunction test ok or fail在4/23收集30組數(shù)據(jù)，by三個(gè)員工各進(jìn)行兩次檢查Test equipment using timesXContinuousDefine range for timesFrom 4/15 to 5/15如何收集: (Sampling Plan-方法,頻率,大小,範(fàn)圍)1.Repair defect data is collected from 4/15 to 5/15,Test ok is good, Test fail is NG.收集程序: (Refer to