PCB 印制電路板工序中英文結(jié)合

1、ABOUT SOGRACE PRODUCTS Bella SOGRACE TECHNOLOGY CO.LTD1深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD Three Products Parts in SOGRACE 1、PCB products 印制電路板2、PCBA 貼片3、LED PCB LED PCBA2深圳市賽格瑞有限公司 SOGRACE TECHNOLOGY CO.LTD About PCBDefinition and application of PCB 定義和用途Classifation of PCB 分類PCB Production Process

2、 工序3深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD什么是PCB(what is PCB)Printed circuit board； 簡(jiǎn)寫：PCB 中文為：印制線路板或者電路板在絕緣基板上，有選擇地加工安裝孔、連接導(dǎo)線和裝配焊接電子元器件的焊盤，以實(shí)現(xiàn)元器件間的電氣連接的組裝板。POC is an assembly plate which in the aim of achieving electrical connection between some components through some paticular working process like p

3、rocessing the mounting hole,connecting the wires pad assembly and welding different electronic components on an insulating substrate.也就是說(shuō)，PCB是為完成第一層次的元件和其它電子電路零件接合提供的一個(gè)組裝基地，組裝成一個(gè)具特定功能的模塊或產(chǎn)品。 PCB products印制電路板4PCB 的用途(application of PCB)有特定功能的電子產(chǎn)品都需要電路板才能實(shí)現(xiàn)如電視機(jī)，電子玩具，收音機(jī)，電腦, 手機(jī)，儀表器 或者一些軍用的設(shè)施等(Most ele

4、ctronic products requires PCB to rechieve some paticular fuctions, like televisions, electronic toys, radios,Computers, mobile phones, meters oand some military facilities)深圳市聯(lián)合益佰有限公司SOGRACE TECHNOLOGY CO.LTD PCB 印制電路板5深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD2、PCB 的分類 classification of PCBA. 以材料分 sort by

5、 raw materials a.有機(jī)材料organic materials紙基板 Paper board（FR-1,FR-2,FR-3)環(huán)氧玻纖布基板 Epoxy fiberglass cloth board（FR-4,FR-5)復(fù)合基板Complex board(CEM-1,CEM-3) HDI board（RCC) 特殊基材 some special board (金屬類基材 Metal board、陶瓷類基材Ceramics board、熱塑性基材 Thermoplastic board etc.)b.無(wú)機(jī)材料Inorganic materials鋁基板、銅基板、陶瓷基板等皆屬之，主要

6、取其散熱功能。aluminum(Tn), copper(Cu) and cermaics board, the major fuction is heat rejection.6深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD2、PCB 的分類 classification of PCBB. 以成品軟硬區(qū)分 sort by flex degree a. 硬板 Rigid PCB b. 軟板 Flexible PCB c. 軟硬結(jié)合板 Rigid-Flexiable PCBC. 以結(jié)構(gòu)分sort by structure a. 單面板 Single-PCB b. 雙面板 D

7、ouble-PCB c. 多層板 Multi-PCB7深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD2、PCB 的分類 classification of PCBSingle-PCBDouble-PCBPCB with 4 boardsPCB with 16 boards8深圳市賽格瑞有限公司 SOGRACE TECHNOLOGY CO.LTDPCB Production Process 工序 01 內(nèi)層線路Inner layer02 鉆孔 Drilling 03孔金屬化 PTH 04 外層干膜 Outer dry film05 外層線路 outer layer06 絲

8、印 silkscreen07 表面工藝Surface crafts08 后工序Final checking9深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD01、內(nèi)層線路流程介紹 Inner layer process 開(kāi)料BOARD CUT)壓膜LAMINATION曝光EXPOSUREDES顯影，蝕刻，去膜連線前處理PRETREATMENT沖孔PUNCHING10深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD 01內(nèi)層線路（Inner layer） 開(kāi)料 （ board cut）目的： 把基板材料裁剪成不同工作所需尺寸Aim: cut the l

9、amilates into different size for down stream process主要生產(chǎn)物料：覆銅板main tool: CCLBoard Cutting Machine11深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD01 內(nèi)層線路（Inner layer） 前處理（pretreatment）目的：去除銅面上的污染物，增加銅面粗糙度,以利於后續(xù)的壓膜制程Aim: To remove some contaminants on the copper surface, increasing surface roughness of copper to

10、 prepare for the next procedure lamination工具： 摩刷 brush 銅箱絕緣層前處理后的銅面狀況 after pretreat12深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD01 內(nèi)層線路（Inner layer） 壓膜LAMINATION目的：將經(jīng)處理之基板銅面透過(guò)熱壓方式貼上抗蝕干膜Aim: To put on inner dry film on the pretreat laminates by heat- press主要生產(chǎn)物料: 干膜main material: dry filmbefore laminationaf

11、ter lamination Auto-Laminator13深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD01 內(nèi)層線路（Inner layer） 曝光 EXPOSURE目的：經(jīng)光線照射作用將原始底片上的圖像轉(zhuǎn)移到感光底板上Aim: To transfer the original film image onto a photo sensitive plate by light irradiation主要工具： 菲林main tool： film products beforeafter Auto-Exposure Machine14深圳市賽格瑞有限公司SOGRACE

12、 TECHNOLOGY CO.LTD 01 內(nèi)層線路（Inner layer） DES顯影，蝕刻，去膜連線The so called DES areDeveloping,Etching,Strip目的：通過(guò)顯影藥水沖掉未發(fā)生化學(xué)反應(yīng)的干膜，利用蝕刻藥液 沖掉顯影后露出的銅，利用強(qiáng)堿沖掉發(fā)生化學(xué)反應(yīng)形成的抗蝕層，目的都是為了顯出內(nèi)層電路圖形Aim: remove dry film by K2CO3 remove nude copper by CuCl2 remove anti-corrosion board by NaOH Then we got the shaped inner layer D

13、evelop-Etch-Strip Line (DES Line before after15深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD 01 內(nèi)層線路（Inner layer） 沖孔PUNCHING目的：利用CCD對(duì)位沖出檢驗(yàn)作業(yè)之定位孔及鉚釘孔Aim: To fix position by CCD16深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD 02 鉆孔流程介紹 Drilling process棕化 brown oxidation鉚 合Riveting疊板 lay up后處理Post Treatment壓合 Pressing鉆孔Dri

14、lling17深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD02 鉆孔流程介紹 Drilling process 棕化 brown oxidation目的：粗化銅面,增加與樹(shù)脂接觸表面積Aim: To rough the copper pattern surface and increase the bonding strength between copper and resin.材料：棕化液 MS100material: Brown liquid MS100beforeafter18深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD02 鉆孔流程

15、介紹 Drilling process 鉚 合 Riveting 目的：利用鉚釘將多張內(nèi)層板釘在一起,以避免后續(xù)加工時(shí)產(chǎn)生層間滑移Aim：To nai multi inner layers (4)together 主要生產(chǎn)物料:鉚釘;半固化片（P/P)main material: P/P(Prepreg)19深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD02 鉆孔流程介紹 Drilling process 疊板 lay up目的 :將預(yù)疊合好之板疊成待壓多層板形式 Aim: To organize the inner layer sequence and stackin

16、g.Automatic Lay-up Machine20深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD02 鉆孔流程介紹 Drilling process 壓合 Pressing目的：使用加熱系統(tǒng)以熔化樹(shù)脂然后用真空腔和壓力來(lái)填充空的空間，并在同一時(shí)間使樹(shù)脂固化。Aim: To use heating system to melt the resin then use by vacuum chamber and pressure to fill up the empty space and cure the resin at the same time.21深圳市賽格瑞

17、有限公司SOGRACE TECHNOLOGY CO.LTD02 鉆孔流程介紹 Drilling process 后處理Post Treatment目的：對(duì)層壓后的板經(jīng)過(guò)磨邊;打靶;銑邊等工序進(jìn)行初步的外形處理以便后工序生產(chǎn)品質(zhì)控制要求及提供后工序加工之工具孔。Aim: to make the pressed inner layer in good shape and some holes are drilled for later procedure22深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD02 鉆孔流程介紹 Drilling process 鉆孔Drillin

18、g目的：在板面上鉆出層與層之間線路連接的導(dǎo)通孔Aim: To drill some vias connecting different inner layersDrilling Machinebefore after23深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD03孔金屬化 流程介紹 (沉銅) PTH Process ( pated through hole )一次銅Panel plating化學(xué)銅PTH去膠渣Desmear去毛刺DeburrTo make sure the vias connecting different inner layers smooth

19、and bare,make it easier for Panel platingTo use Electro-less Copper Disposition (chemical way) and Copper Electro Panel Plating (electrical) to enable hole wall to connect patterns of different layers.24深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD04 外層干膜流程Outer dry film process 前處理Pretreatment壓膜Lamination顯影D

20、eveloping曝光ExposureTo remove some contaminants on the copper surface, increasing surface roughness of copperTo create photo resist layer on outer layer for pattern creation.To transfer the original film image onto a photo sensitive plate by light irradiationPattern defined after developing is so cal

21、led “Plating Resist” for post plating process.25深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD 05 外層線路流程介紹 outer layer process 二次鍍銅 Pattern Plating 鍍錫 Tin Plated 退錫 Tin Stripping退膜Stripping線路蝕刻Etching26深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD 二次鍍銅 Pattern Plating目的: 加厚顯影后的銅，達(dá)到客戶所 需要的厚度Aim:To increase copper thickne

22、ss after the procedure of developing 鍍錫 Tin Plated目的：在鍍完二次銅的表面鍍上一層錫保護(hù)，做為蝕刻時(shí)的保護(hù)劑。Aim: To propect copper from corrosion 05 outer layer process 外層線路流程介紹27深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD 05 outer layer process “SES Line” (退膜Stripping,線路蝕刻 Etching,退錫Tin Stripping）目的：要除去電鍍抗蝕劑（干膜）和下方的蝕刻銅暴露;錫涂層擔(dān)任抗蝕保護(hù)所需的

23、格局, 這種典型的薄膜剝離/蝕刻模式/錫剝離線是所謂的“SES”Aim: To remove plating resist (dry film) and expose copper underneath for etching;tin coating is served as etching resist for protecting pattern required. This typical film stripping / pattern etching / tin stripping line is so called “SES” line.28深圳市賽格瑞有限公司SOGRACE TE

24、CHNOLOGY CO.LTD 06、絲印工藝流程介紹 silkscreen process火山灰磨板Scrubbing阻焊 SolderMask顯影Developing字符 Compnent Mark固化Backing29深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD 06 silkscreen process火山灰磨板Scrubbing目的： 意義相當(dāng)于之前的前處理，保護(hù)銅面，防止被氧化，得到一個(gè)比較均勻的銅面粗糙度Aim: Same effect as pretreatment, to protect the copper surface from Oxidati

25、on and make a good thickness surface.main material : volcanic ash30深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD06 silkscreen process 阻焊 Solder Mask目的：將前處理后的PCB 板，通過(guò)絲網(wǎng)將阻焊油墨印刷到板面，并在一定的溫度、時(shí)間及抽風(fēng)量的條件下使油墨中的溶劑初步揮發(fā)，再用菲林圖形將客戶所需焊盤及孔保護(hù)住進(jìn)行曝光，顯影時(shí)將未與UV 光反應(yīng)的油墨溶解掉，最終得到客戶所需要焊接的焊盤和孔。Aim:To define assembly / selective areas fo

26、r assemblers soldering process and prevent pattern damage or oxidation.阻焊的步驟： 曝光和顯影Steps : Explore and Developing 31深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD 06 silkscreen process字符 Compnent Mark and 固化 Backing目的：也就是我們常說(shuō)的綠油，通過(guò)油墨印成所需的字符圖文，然后高溫烘烤成型。Aim: image and letters printing and shaping 32深圳市賽格瑞有限公司SOG

27、RACE TECHNOLOGY CO.LTD 07 表面工藝 Surface crafts電鍍鎳金plating gold金手指 gold fingers 化學(xué)沉鎳金ENIG沉錫IT有機(jī)涂覆OSP熱風(fēng)整平HASL沉銀IS 3308. Final Crafts外形ProfileElectric Testing電測(cè)FQC終檢深圳市賽格瑞有限公司SOGRACE TECHNOLOGY CO.LTD34Packing&ShippingTo vacuum or heat seal finished boards with desiccant inside for storage conditions controland to prevent water absorption which maycause