印制電路板制程介紹

印制電路板制程介紹肖家君FlowChartofPCBProcess123487651211109IQCTRIMDRILLBLACKHOLEDRYFILMLAMINATING1819201415101723222127262524EXPOSURE13DEVELOPMENTPATTERNPLATINGETCHINGINSPECTINGS/MSURFACECLEAN1’STLIQULDSCREENPRINTPRE-CURE2’STLIQULDSCREENPRINTPRE-CURES/MEXPOSURES/MDEVELOPMENTPOST-CURELEGENDPRINTCUREHAL/ENIGG/FPUNCH/NC-RV-CUTFINALCLEANCUREO/STEST/OSPHOLECOUNT2829303132FQCOQCPACKINGWARHHOUSHOUTGOINGSYMBOL□:QUANTITYINSPECTION

:QULITYINSPECTION▽:STORAGE○:WORKING▲:100%INSPECTION(1)前制程治工具制作流程顧客CUSTOMER裁板LAMINATESHEAR業(yè)務SALESDEP.生產(chǎn)管理P&MCONTROLMASTERA/W底片DISK,M/T磁片磁帶藍圖DRAWING數(shù)據(jù)傳送MODEM,FTP網(wǎng)版制作STENCILDRAWING圖面RUNCARD制作規(guī)范PROGRAM程式帶鉆孔,成型機D.N.C.工程制前FRONT-ENDDEP.工作底片WORKINGA/W(2)多層板內(nèi)層制作流程曝光EXPOSURE壓膜LAMINATION前處理PRELIMINARYTREATMENT去膜STRIPPING蝕銅ETCHING顯影DEVELOPING黑化處理BLACKOXIDE烘烤BAKINGLAY-UP及預迭板迭板后處理POSTTREATMENT壓合LAMINATION內(nèi)層干膜INNERLAYERIMAGE預迭板及迭板LAY-UP蝕銅I/LETCHING鉆孔DRILLING壓合LAMINATION多層板內(nèi)層流程INNERLAYERPRODUCTMLBAOI檢查AOIINSPECTION裁板LAMINATESHEARDOUBLE

SIDE雷射鉆孔LASERABLATIONBlindedVia(3)外層制作流程通孔電鍍P.T.H.鉆孔DRILLING外層干膜OUTERLAYERIMAGE二次銅及錫鉛電鍍PATTERNPLATING檢查INSPECTION前處理PRELIMINARYTREATMENT二次銅電鍍PATTERNPLATING蝕銅ETCHING全板電鍍PANELPLATING外層制作OUTER-LAYERO/LETCHING蝕銅TENTINGPROCESSDESMER除膠渣E-LESSCU通孔電鍍前處理PRELIMINARYTREATMENT剝錫鉛T/LSTRIPPING去膜STRIPPING壓膜LAMINATION錫鉛電鍍T/LPLATING曝光EXPOSURE液態(tài)防焊LIQUIDS/M外觀檢查VISUALINSPECTION成型FINALSHAPING檢查INSPECTION電測ELECTRICALTEST出貨前檢查OQC包裝出貨PACKING&SHIPPING涂布印刷S/MCOATING前處理PRELIMINARYTREATMENT曝光EXPOSUREDEVELOPING顯影POSTCURE后烘烤預干燥PRE-CURE噴錫HOTAIRLEVELING銅面防氧化處理OSP(EntekCu106A)HOTAIRLEVELINGG/FPLATING鍍金手指鍍化學鎳金E-lessNi/Au印文字SCREENLEGEND選擇性鍍鎳鍍金SELECTIVEGOLD全面鍍鎳金GOLDPLATING(4)外觀及成型制作流程典型多層板制作流程1.內(nèi)層THINCORE2.內(nèi)層線路制作(壓膜)典型多層板制作流程4.內(nèi)層線路制作(顯影)3.內(nèi)層線路制作(曝光)典型多層板制作流程5.內(nèi)層線路制作(蝕刻)6.內(nèi)層線路制作(去膜)典型多層板制作流程7.迭板8.壓合LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6典型多多層板板制作作流程程9.鉆孔10.黑黑孔典型多多層板板制作作流程程11.外層線線路壓壓膜12.外層線線路曝曝光典型多多層板板制作作流程程13.外層線線路制制作(顯影)14.鍍二次次銅及及錫鉛鉛典型多多層板板制作作流程程15.去干膜膜16.蝕銅(堿性蝕蝕刻液液)典型多多層板板制作作流程程17.剝錫鉛鉛18.防焊(綠漆漆)制作作典型型多多層層板板制制作作流流程程15.浸金金(噴錫錫………)制作作干膜膜制制作作流流程程基板壓膜壓膜後曝光顯影蝕銅去膜典型型之之多多層層板板迭迭板板及及壓壓合合結(jié)結(jié)構(gòu)構(gòu)...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ迭合用之鋼板迭合用之鋼板10-12層迭合壓合機之熱板壓合機之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ迭合用之鋼板迭合用之鋼板1.下料料裁裁板板(PanelSize)COPPERFOILEpoxyGlassPhotoResist2.內(nèi)層層板板壓壓干干膜膜(光阻阻劑劑)3.曝光光4.曝光光后后Artwork(底片)Artwork(底片)PhotoResist光源5.內(nèi)層層板板顯顯影影PhotoResist6.酸性性蝕蝕刻刻(Power/Ground或Signal)PhotoResist8.黑化化(OxideCoating)7.去干干膜膜(StripResist)9.迭板板Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片片)Prepreg(膠片片)10.壓合合(Lamination)11.鉆孔孔(P.T.H.或盲盲孔孔Via)(Drill&Deburr)墊木板鋁板12.鍍通通孔孔附附著著碳碳粉粉13.外層層壓壓膜膜(干膜膜Tenting)PhotoResist14.外層層曝曝光光(patternplating)15.曝光光后后(patternplating)16.外層層顯顯影影17.線路路鍍鍍銅銅及及錫錫鉛鉛18.去去膜19.蝕銅(堿性蝕刻刻)20.剝錫鉛21.噴涂(液狀綠漆漆)22.23.綠漆顯影影光源S/MA/W24.印印文字25.噴錫(浸金……)R105WWEI94V-0R105WWEI94V-0光分解反反應(正性工作作)→底片,STENCIL(網(wǎng)版)光聚合反反應(負性工作作)→底片,STENCIL(網(wǎng)版)BURIEDVIALAY-UPA=THROUGHVIAHOLE(導通孔)B=BURIEDVIAHOLE(埋孔)C=BLINDVIAHOLE(盲孔)D=BLINDHOLEMLBVIA(多多層盲孔孔)BLINDVIALAY-UPBLINDVIASEQUENTIALLAY-UPABBACCARESINB-STAGEBLINDANDBURIEDVIAOPTION(盲埋埋孔孔的選擇)D6–SpindleDrillingMachine數(shù)控（鐳鐳射）鉆鉆孔機BlackHoleLine黑孔線Desmear除膠渣DryFilmLaminator自動貼膜機AutomaticExposureMachine自動曝光機PatternPlatingLine電鍍磨刷刷機EtchingLine蝕刻褪膜膜線AutomaticS/MPrintingLine自動絲印綠油印刷線AutomaticExposureMachine線路曝光機PostCureLine二次硬化線AutomaticLegendPrintingLine自動絲印印刷線SolderLevelingMachine噴錫機O/STester檢測謝謝！錫膏簡介介1.何謂錫膏