手機(jī)開發(fā)與設(shè)計流程詳解課件

24十二月2022手機(jī)開發(fā)與設(shè)計流程詳解17十二月2022手機(jī)開發(fā)與設(shè)計流程詳解1Topic個人簡介明基BenQ簡介產(chǎn)品開發(fā)流程手機(jī)開發(fā)功能區(qū)塊手機(jī)系統(tǒng)演進(jìn)3G介紹手機(jī)功能發(fā)展趨勢無線通信發(fā)展趨勢Topic個人簡介2個人簡介個人簡介3個人簡介2000年畢業(yè)於中山大學(xué)物理研究所2001.04~2006.03:明基儲存事業(yè)部研發(fā)處研發(fā)部TeamLeaderofWriteStrategyTeam/FirmwareR&DSlimDVD+-R(RW)(12x)/DVD+-R(RW)(4x,8x,16x)/CDR(RW)(32x,40x,48x)drivedevelopment團(tuán)隊發(fā)表世界第一的4x,8x,DL,16xDVD燒錄機(jī)IEEE論文發(fā)表發(fā)表4篇專利2006.03~2006.12:明基移動通訊事業(yè)群專案管理部技術(shù)產(chǎn)品經(jīng)理-目前負(fù)責(zé)3.5GHSDPAfeaturephoneproject個人簡介2000年畢業(yè)於中山大學(xué)物理研究所4明基BenQ簡介-享受快樂科技

數(shù)位時尚品牌

3C數(shù)位整合

國際級設(shè)計實力明基BenQ簡介-享受快樂科技

數(shù)位時尚品牌

3C數(shù)位整51984年成立企業(yè)願景:傳達(dá)資訊生活的真善美1996年股票在臺灣上市2001年BenQ品牌誕生2005年營收:明基電通:新臺幣1,623億元明基集團(tuán):新臺幣3,979億元全球員工人數(shù)(2006/10)明基電通:13,000+人明基集團(tuán):68,000+人「量做精品」:量身訂做讓消費者生活充滿樂趣的網(wǎng)絡(luò)時尚產(chǎn)品獨特3C產(chǎn)品組合：將數(shù)位產(chǎn)品整合成符合未來消費者生活型態(tài)的數(shù)位中樞一筆記型電腦、手機(jī)、數(shù)位電視享受快樂科技之企業(yè)1984年成立享受快樂科技之企業(yè)6化企業(yè)願景為品牌使命19922002明基集團(tuán)企業(yè)願景化企業(yè)願景為品牌使命19922002明基集團(tuán)企業(yè)願景71562632695268311264162846243517371,0471,6501,6231,2082847774271,1002,3473811,8753,6483,979BenQGroupBenQCorp.單位:億元(新臺幣)Phase11984-1991OEM強(qiáng)大的生產(chǎn)製造能力從製造代工到深耕技術(shù)與設(shè)計之品牌Phase21991-2001FromOEMtoODM多元化的技術(shù)投資“水平整合+專業(yè)分工”Phase32001-2006FromODMtoBrandedBusiness數(shù)位時尚品牌3C數(shù)位整合國際級設(shè)計實力

單位:億元(新臺幣)1562632695268311264162846248三大事業(yè)群明基電通移動通信事業(yè)群

(MCG)數(shù)位媒體事業(yè)群

(DMG)整合製造服務(wù)事業(yè)群

(IMS)三大事業(yè)群明基電通移動通信數(shù)位媒體整合製造服務(wù)9洞悉數(shù)位市場掌握絕對優(yōu)勢獨特5C策略強(qiáng)化競爭優(yōu)勢洞悉數(shù)位市場掌握絕對優(yōu)勢獨特5C策略強(qiáng)化競爭優(yōu)勢10電子商品整合趨勢贏家Computing資訊產(chǎn)品個人電腦,液晶顯示器,電腦週邊ConsumerElectronics數(shù)位媒體產(chǎn)品數(shù)位投影機(jī),液晶電視,個人無線影音,

數(shù)位相機(jī),車用顯示器MobileCommunications移動通信產(chǎn)品行動電話電子商品整合趨勢贏家ComputingConsumerE11產(chǎn)品開發(fā)流程產(chǎn)品開發(fā)流程12產(chǎn)品開發(fā)流程Proposal構(gòu)想階段Plan評估規(guī)劃階段Design設(shè)計階段Execute研發(fā)執(zhí)行階段Massproduction生產(chǎn)階段Close結(jié)束階段產(chǎn)品開發(fā)流程Proposal構(gòu)想階段13CSystemC1PlanningPhaseC2R&DDesignPhaseC3LabPilotRunPhaseC4ENGPilotRunPhaseC5PDPilotRunPhaseMassProductionPhaseC6C0ProposalPhasePlanning-PM

Manufacture-FactoryDesign-RDProductdefinitionFeasibilityanalysisIDinitiationOrganizeProjectteammemberProjectscheduleHW/SWdesignHW/SWdesignlockdownHW/SWdesignapprovedVerificationofProductmaturityverificationProductionlinesetupVerificationofproductionlinematurity/stabilityProductdesignfinalizedMassproductionDVTPhaseMVTPhaseQVTPhaseDVT:DesignVerificationTestingMVT:ManufactureVerificationTestingQVT:QualityVerificationTestingLPR:LaboratoryPilotRunEPR:EngineeringPilotRunPPR:ProductionPilotRunMP:MassProductionCSystemC1PlanningC2R&DDesign14MobiledevelopmentfunctionIntroductionMobiledevelopmentfunctionIn15Mobiledevelopmentfunction外觀設(shè)計(ID)IndustryDesign機(jī)構(gòu)設(shè)計(MD)MaterialDesign硬體設(shè)計(HW)HardWareBB(BaseBand基頻)RF(RadioFrequency射頻)Antenna(天線)軟體設(shè)計(SW)SoftWareMMI(ManMachineInterface人機(jī)介面)ProtocolDriverMobiledevelopmentfunction外觀設(shè)16FunctionalArchitectureofMobileTodayFunctionalArchitectureofMob17FeatureList-HW[Camera]Sony2.0MegaPixelCMOSAutoFocuscamera[Strobe]LEDflashlight[Display]AUO2.0”AMOLED176x220Pixels,262Kcolors[Memory]NORFlash:128Mbit,PSRAM:64Mbit,NAND:256MbitSDRAM:128Mbit[ExternalMemory]T-Flash[I/O]DCJack,10pinI/O[Connectivity]USB1.1,BluetoothFeatureList-HW[Camera]18IDVol.Up/Vol.Down2SegmentShutterKeyModeSwitchKey10PinI/ODCJackMicrophoneReceiverT-FlashCardIDVol.Up/Vol.Down2Segment19MD:AppearancetreatmentdescriptionA鋁板陽極+噴砂B塑膠射出+噴漆C塑膠射出+噴漆D塑膠射出+噴漆E平板背印FP+R噴塗雷雕GH雙料射出+噴漆IRUBBERJ電鍍K電鍍L玻璃背印M塑膠射出+背印N銘版髮絲處理PQ噴漆MD:Appearancetreatmentdesc20Explodeddrawing1235810796111241513141716Frontcaseassy.Keypadassy.MainlensJoystickcapOLEDmoduleReceiverKeypadFPCMainPCBassy.DSCmoduleDSCFPCDSCholderSpeakerVibratorRearcaseassy.AntennacoverBatterycover.Batterypack.Explodeddrawing1235810796111221Placementdescription-IShieldingcase1-BBShieldingcase2-BBT-flashconnector(push-pushtype)Pogopin(forESD)Back-upbattery(Capacitor)30pinBTBConn.(forDSCmodule)Joystick(Mitsumi)SMT-typeMICPlacementdescription-IShiel22Placementdescription-III/OconnectorBatteryconnectorModeswitchBTantennaswitchDCjackAntennaconnectorAntennaswitchSide-key(Vol-key)RFshieldingcase10pinConn.(Spk.andflash)LCMconnectorBBshieldingcaseSIMconnectorKeyFPCconnectorPlacementdescription-III/O23HWBlockDiagram-2GHWBlockDiagram-2G24Placement(TopSide)AntennaRFArea10PinI/OBatteryConnectorIOTASIMConnectorG23ComboMemoryLCDMConnectorKeypadConnectorBTAreaDCJackPlacement(TopSide)AntennaRF25Placement(BottomSide)AudioCODECMMPMIC.TFlashConnectorOLEDLimitAreaLevelShifterCameraConnectorReceiverChargingICPowerICPlacement(BottomSide)AudioC26AntennaAntenna27SWFeatureReviewBandTri-bandGSM/GPRS900/1800/1900,GPRSClass10Tri-bandGSM/GPRS850/1800/1900,GPRSClass10SpeechCodecFR/EFR/HF/AMREmbeddedDSC2.0MegaPixelCMOSsensorwithAutoFocus+LEDflashlightMemoryRSS3combo:NORflash:128Mb,PseudoSRAM:64Mb,Super-AND:256Mb,SDRAM:SH-MobileJ2embedded128MbConnectivityUSB1.1(MSC,CDC,Pict-Bridge),Bluetooth(A2DP,HS/HF,BIP,OPP,DUN)JavaMIDP2.0,CLDC1.1,JTWIMP3,MelodyMP3/AAC(3D,EQ)/AAC+,SW-MIDIVoicerecordingAMRVideorecording/playingMP4,3GP,H.263DRMOMADRM1.0SWFeatureReviewBandTri-band28SWArchitecture-2GToolMMIXPI(ExtendProgrammingInterface)Layer-1/DriverServiceDisplayInputMenuPPF…APCameraMP3PIMTool…ProtocolCCWAPSTKJava…MessageSMSEMSMMSEmail…PS(ProtocolStack)OSSWArchitecture-2GToolMMIXPI(29手機(jī)系統(tǒng)演進(jìn)手機(jī)系統(tǒng)演進(jìn)303GEvolutionOverviewAnalogcdmaOne[US]GSM[Europe]TDMA[US]PDC[JP]GPRSEDGEWCDMA(UMTS,ULTRAFDD)HSDPAcdma2000cdma2000(1xEVDO)cdma2000(1xEVDV)TD-SCDMA[China]1G2G2.5G3G3.5G3GEvolutionOverviewAnalogcdm313Gintroduction3Gintroduction32RFchipsetBBchipsetPowerMgmtIC3GMobileHWRFchipsetBBchipsetPowerMgmt33SiriusBREW-3GApplicationsDevicedriverServicesBREWOEMBREWExtensionsBREWSiriusBREW-3GApplicationsDevi343G手機(jī)單晶片趨勢多模式應(yīng)用WEDGE晶片(WCDMA+EDGE)支援WCDMA、EDGE、GPRS、GSM和HSDPA標(biāo)準(zhǔn)可以在2G和3G網(wǎng)路間切換（roaming）以CMOS製程應(yīng)用,達(dá)到低成本減少零組件數(shù)、縮小尺寸、降低功耗，及提高效能等3G手機(jī)單晶片趨勢多模式應(yīng)用WEDGE晶片(WCDMA+353G-->3.5GHSDPA網(wǎng)路陸續(xù)開通3G升級到3.5G，不需再進(jìn)行基地臺建設(shè)，只需軟體升級3.5G網(wǎng)路的下載傳輸速率已達(dá)3.6Mbps(比3G快9倍,甚至高於一般家用的2MADSL)2010年預(yù)計行動數(shù)據(jù)服務(wù)將會超越行動語音服務(wù)，為手機(jī)系統(tǒng)業(yè)者最重要的收入來源預(yù)計全球3.5G用戶數(shù)將從250萬個(2006年)，成長到3億個(2011年)

臺灣業(yè)者中華電信:採諾基亞的系統(tǒng),只開通支援1.8Mbps的HSDPA網(wǎng)路服務(wù)遠(yuǎn)傳電信:採易利信的系統(tǒng),推廣傳輸速率高達(dá)3.6Mbps的HSDPA網(wǎng)路支援3.6Mbps的手機(jī)尚未到位，只能以3.5G數(shù)據(jù)網(wǎng)卡先行困難–2007年會大幅改善網(wǎng)路涵蓋率不足3.5G手機(jī)選擇少,價格高3G-->3.5GHSDPA網(wǎng)路陸續(xù)開通36手機(jī)功能發(fā)展趨勢-高整合化重外觀設(shè)計個人化多媒體多用途手機(jī)功能發(fā)展趨勢-高整合化重外觀設(shè)計37手機(jī)功能發(fā)展趨勢

-整合通訊(Voice)，資訊(Data)，傳播(Video)和無線(Wireless)

現(xiàn)有功能Mobile/Music/Video/Camera/Recorder/GameStorageMemory/FMradio/Application/Brower/Highdatarate/Connectivity:E-mail,BT,USB,IrDA/Light/Indicator/VoicerecognitionGPS/A-GPS->定位導(dǎo)航/LBS位置資訊服務(wù)（LocationBasedServices）TV-Out2DBarcode/QRCode新功能發(fā)展數(shù)位電視DVB-H/廣播FingerPrinter電子錢包:NFC近距離無線傳輸（NearFieldCommunication,NFC）Projector

手機(jī)功能發(fā)展趨勢

-整合通訊(Voice)，資訊(Data)38手機(jī)投影手機(jī)投影39無線通信發(fā)展趨勢無線通信發(fā)展趨勢40無線通信發(fā)展趨勢無線通信發(fā)展趨勢41FunctionalArchitectureofMobileTomorrowFunctionalArchitectureofMob42FMC(Fixed-MobileConvergence)固網(wǎng)行動聚合固網(wǎng)和行動網(wǎng)融合:FMC（Fixed-MobileConvergence)-無縫隙不間斷的通訊品質(zhì)由各種裝置、服務(wù)、網(wǎng)路，以及技術(shù)所融合而成FMC(Fixed-MobileConvergence43What’sIMS?What’sIMS?44What’sIMS?What’sIMS?45UMA-UnlicensedMobileAccess提出一套解決方案，讓使用授權(quán)頻段的GSM和GPRS和使用無需授權(quán)頻段的Bluetooth和802.11彼此間能夠互相漫遊可用單一手機(jī)享受雙網(wǎng)合一的優(yōu)勢，甚至兼具節(jié)省話費的好處。UMA（UnlicensedMobileAccess）對用戶來說，採用UMA的技術(shù)後，在手機(jī)網(wǎng)路和WiFi或Bluetooth網(wǎng)路之間的切換是由系統(tǒng)來完成的，用戶一點感覺都沒有UMA-UnlicensedMobileAccess提46Question?Question?4724十二月2022手機(jī)開發(fā)與設(shè)計流程詳解17十二月2022手機(jī)開發(fā)與設(shè)計流程詳解48Topic個人簡介明基BenQ簡介產(chǎn)品開發(fā)流程手機(jī)開發(fā)功能區(qū)塊手機(jī)系統(tǒng)演進(jìn)3G介紹手機(jī)功能發(fā)展趨勢無線通信發(fā)展趨勢Topic個人簡介49個人簡介個人簡介50個人簡介2000年畢業(yè)於中山大學(xué)物理研究所2001.04~2006.03:明基儲存事業(yè)部研發(fā)處研發(fā)部TeamLeaderofWriteStrategyTeam/FirmwareR&DSlimDVD+-R(RW)(12x)/DVD+-R(RW)(4x,8x,16x)/CDR(RW)(32x,40x,48x)drivedevelopment團(tuán)隊發(fā)表世界第一的4x,8x,DL,16xDVD燒錄機(jī)IEEE論文發(fā)表發(fā)表4篇專利2006.03~2006.12:明基移動通訊事業(yè)群專案管理部技術(shù)產(chǎn)品經(jīng)理-目前負(fù)責(zé)3.5GHSDPAfeaturephoneproject個人簡介2000年畢業(yè)於中山大學(xué)物理研究所51明基BenQ簡介-享受快樂科技

數(shù)位時尚品牌

3C數(shù)位整合

國際級設(shè)計實力明基BenQ簡介-享受快樂科技

數(shù)位時尚品牌

3C數(shù)位整521984年成立企業(yè)願景:傳達(dá)資訊生活的真善美1996年股票在臺灣上市2001年BenQ品牌誕生2005年營收:明基電通:新臺幣1,623億元明基集團(tuán):新臺幣3,979億元全球員工人數(shù)(2006/10)明基電通:13,000+人明基集團(tuán):68,000+人「量做精品」:量身訂做讓消費者生活充滿樂趣的網(wǎng)絡(luò)時尚產(chǎn)品獨特3C產(chǎn)品組合：將數(shù)位產(chǎn)品整合成符合未來消費者生活型態(tài)的數(shù)位中樞一筆記型電腦、手機(jī)、數(shù)位電視享受快樂科技之企業(yè)1984年成立享受快樂科技之企業(yè)53化企業(yè)願景為品牌使命19922002明基集團(tuán)企業(yè)願景化企業(yè)願景為品牌使命19922002明基集團(tuán)企業(yè)願景541562632695268311264162846243517371,0471,6501,6231,2082847774271,1002,3473811,8753,6483,979BenQGroupBenQCorp.單位:億元(新臺幣)Phase11984-1991OEM強(qiáng)大的生產(chǎn)製造能力從製造代工到深耕技術(shù)與設(shè)計之品牌Phase21991-2001FromOEMtoODM多元化的技術(shù)投資“水平整合+專業(yè)分工”Phase32001-2006FromODMtoBrandedBusiness數(shù)位時尚品牌3C數(shù)位整合國際級設(shè)計實力

單位:億元(新臺幣)15626326952683112641628462455三大事業(yè)群明基電通移動通信事業(yè)群

(MCG)數(shù)位媒體事業(yè)群

(DMG)整合製造服務(wù)事業(yè)群

(IMS)三大事業(yè)群明基電通移動通信數(shù)位媒體整合製造服務(wù)56洞悉數(shù)位市場掌握絕對優(yōu)勢獨特5C策略強(qiáng)化競爭優(yōu)勢洞悉數(shù)位市場掌握絕對優(yōu)勢獨特5C策略強(qiáng)化競爭優(yōu)勢57電子商品整合趨勢贏家Computing資訊產(chǎn)品個人電腦,液晶顯示器,電腦週邊ConsumerElectronics數(shù)位媒體產(chǎn)品數(shù)位投影機(jī),液晶電視,個人無線影音,

數(shù)位相機(jī),車用顯示器MobileCommunications移動通信產(chǎn)品行動電話電子商品整合趨勢贏家ComputingConsumerE58產(chǎn)品開發(fā)流程產(chǎn)品開發(fā)流程59產(chǎn)品開發(fā)流程Proposal構(gòu)想階段Plan評估規(guī)劃階段Design設(shè)計階段Execute研發(fā)執(zhí)行階段Massproduction生產(chǎn)階段Close結(jié)束階段產(chǎn)品開發(fā)流程Proposal構(gòu)想階段60CSystemC1PlanningPhaseC2R&DDesignPhaseC3LabPilotRunPhaseC4ENGPilotRunPhaseC5PDPilotRunPhaseMassProductionPhaseC6C0ProposalPhasePlanning-PM

Manufacture-FactoryDesign-RDProductdefinitionFeasibilityanalysisIDinitiationOrganizeProjectteammemberProjectscheduleHW/SWdesignHW/SWdesignlockdownHW/SWdesignapprovedVerificationofProductmaturityverificationProductionlinesetupVerificationofproductionlinematurity/stabilityProductdesignfinalizedMassproductionDVTPhaseMVTPhaseQVTPhaseDVT:DesignVerificationTestingMVT:ManufactureVerificationTestingQVT:QualityVerificationTestingLPR:LaboratoryPilotRunEPR:EngineeringPilotRunPPR:ProductionPilotRunMP:MassProductionCSystemC1PlanningC2R&DDesign61MobiledevelopmentfunctionIntroductionMobiledevelopmentfunctionIn62Mobiledevelopmentfunction外觀設(shè)計(ID)IndustryDesign機(jī)構(gòu)設(shè)計(MD)MaterialDesign硬體設(shè)計(HW)HardWareBB(BaseBand基頻)RF(RadioFrequency射頻)Antenna(天線)軟體設(shè)計(SW)SoftWareMMI(ManMachineInterface人機(jī)介面)ProtocolDriverMobiledevelopmentfunction外觀設(shè)63FunctionalArchitectureofMobileTodayFunctionalArchitectureofMob64FeatureList-HW[Camera]Sony2.0MegaPixelCMOSAutoFocuscamera[Strobe]LEDflashlight[Display]AUO2.0”AMOLED176x220Pixels,262Kcolors[Memory]NORFlash:128Mbit,PSRAM:64Mbit,NAND:256MbitSDRAM:128Mbit[ExternalMemory]T-Flash[I/O]DCJack,10pinI/O[Connectivity]USB1.1,BluetoothFeatureList-HW[Camera]65IDVol.Up/Vol.Down2SegmentShutterKeyModeSwitchKey10PinI/ODCJackMicrophoneReceiverT-FlashCardIDVol.Up/Vol.Down2Segment66MD:AppearancetreatmentdescriptionA鋁板陽極+噴砂B塑膠射出+噴漆C塑膠射出+噴漆D塑膠射出+噴漆E平板背印FP+R噴塗雷雕GH雙料射出+噴漆IRUBBERJ電鍍K電鍍L玻璃背印M塑膠射出+背印N銘版髮絲處理PQ噴漆MD:Appearancetreatmentdesc67Explodeddrawing1235810796111241513141716Frontcaseassy.Keypadassy.MainlensJoystickcapOLEDmoduleReceiverKeypadFPCMainPCBassy.DSCmoduleDSCFPCDSCholderSpeakerVibratorRearcaseassy.AntennacoverBatterycover.Batterypack.Explodeddrawing1235810796111268Placementdescription-IShieldingcase1-BBShieldingcase2-BBT-flashconnector(push-pushtype)Pogopin(forESD)Back-upbattery(Capacitor)30pinBTBConn.(forDSCmodule)Joystick(Mitsumi)SMT-typeMICPlacementdescription-IShiel69Placementdescription-III/OconnectorBatteryconnectorModeswitchBTantennaswitchDCjackAntennaconnectorAntennaswitchSide-key(Vol-key)RFshieldingcase10pinConn.(Spk.andflash)LCMconnectorBBshieldingcaseSIMconnectorKeyFPCconnectorPlacementdescription-III/O70HWBlockDiagram-2GHWBlockDiagram-2G71Placement(TopSide)AntennaRFArea10PinI/OBatteryConnectorIOTASIMConnectorG23ComboMemoryLCDMConnectorKeypadConnectorBTAreaDCJackPlacement(TopSide)AntennaRF72Placement(BottomSide)AudioCODECMMPMIC.TFlashConnectorOLEDLimitAreaLevelShifterCameraConnectorReceiverChargingICPowerICPlacement(BottomSide)AudioC73AntennaAntenna74SWFeatureReviewBandTri-bandGSM/GPRS900/1800/1900,GPRSClass10Tri-bandGSM/GPRS850/1800/1900,GPRSClass10SpeechCodecFR/EFR/HF/AMREmbeddedDSC2.0MegaPixelCMOSsensorwithAutoFocus+LEDflashlightMemoryRSS3combo:NORflash:128Mb,PseudoSRAM:64Mb,Super-AND:256Mb,SDRAM:SH-MobileJ2embedded128MbConnectivityUSB1.1(MSC,CDC,Pict-Bridge),Bluetooth(A2DP,HS/HF,BIP,OPP,DUN)JavaMIDP2.0,CLDC1.1,JTWIMP3,MelodyMP3/AAC(3D,EQ)/AAC+,SW-MIDIVoicerecordingAMRVideorecording/playingMP4,3GP,H.263DRMOMADRM1.0SWFeatureReviewBandTri-band75SWArchitecture-2GToolMMIXPI(ExtendProgrammingInterface)Layer-1/DriverServiceDisplayInputMenuPPF…APCameraMP3PIMTool…ProtocolCCWAPSTKJava…MessageSMSEMSMMSEmail…PS(ProtocolStack)OSSWArchitecture-2GToolMMIXPI(76手機(jī)系統(tǒng)演進(jìn)手機(jī)系統(tǒng)演進(jìn)773GEvolutionOverviewAnalogcdmaOne[US]GSM[Europe]TDMA[US]PDC[JP]GPRSEDGEWCDMA(UMTS,ULTRAFDD)HSDPAcdma2000cdma2000(1xEVDO)cdma2000(1xEVDV)TD-SCDMA[China]1G2G2.5G3G3.5G3GEvolutionOverviewAnalogcdm783Gintroduction3Gintroduction79RFchipsetBBchipsetPowerMgmtIC3GMobileHWRFchipsetBBchipsetPowerMgmt80SiriusBREW-3GApplicationsDevicedriverServicesBREWOEMBREWExtensionsBREWSiriusBREW-3GApplicationsDevi813G手機(jī)單晶片趨勢多模式應(yīng)用WEDGE晶片(WCDMA+EDGE)支援WCDMA、EDGE、GPRS、GSM和H