半導(dǎo)體行業(yè)常用英語

本文格式為Word版，下載可任意編輯——半導(dǎo)體行業(yè)常用英語Siliconingot硅錠Wafer晶片Mirrorwafer鏡面晶圓Patter晶圓片F(xiàn)AB：

fabrication制造FabricationFacility制造wafer生產(chǎn)工廠Probetest探針測試Probecard探針板Contact連接ProbeTip探頭端部ChipFunction功能EPM：

ElectricalParameterMonitoringSummary總結(jié)R&D：ResearchandDevelopment研究和開發(fā)MCP：MultiChipPackage多芯片封裝POP：PackageonPackagee-MMC：embeddedMultiMediacard嵌入式多媒體卡WLP：WaferLevelPackage晶圓級封裝SDP一層DDP兩層QDP四層ODP八層PadoutBackGrind背研磨WaferGrindBackGrind磨片Overview概述TPM：TotalProfitManagementSKTPMOperation操作Erase消釋KeyPara.：Keyparameter關(guān)鍵參數(shù)Cycling寫入次數(shù)、循環(huán)次數(shù)Retention留存時間Non-VolatilememoryVolatilememoryRead讀Write寫Refresh更新Speed速度、速率、轉(zhuǎn)速Restore修復(fù)、恢復(fù)ElectricalSignal電信號WFBI：WaferBurn-InPT1H：ProbeTest1HotTestPT1C：ProbeTest1ColdTestL/Rep：LaserRepairPurpose目的Substrate基片Trend趨勢SmallSize小體積HighDensity高集成HighSpeed高速度Roadmap路標(biāo)TSOP：Thinsmalloutlinepackage薄型小尺寸封裝FBGA：（FineBallGridArray）package細(xì)間距球柵陣列（一種封裝模式）FlipChipPackage：

在wafer的chip上形成bump直接在substrate或PCB基板上填充形態(tài)，使I/O最高密度化的填充方式。

Stack堆疊stackpackageB/G：BackGrind背研磨W/S：WaferSawD/A：DieAttachW/B：WireBondM/D：MoldM/K：MarkingSBM：SolderBallMountS/G：SingulationEMS：EpoxyMoldingCompound環(huán)氧樹脂Assembly裝配、集會、集合PreLoardTDBI：TestDuringBurnInEarlyfailure初期不良率Constantfail-rate穩(wěn)定的fail分布Wear-out磨損PDA：PercentageDefectAllowanceBurn-In后Device的穩(wěn)當(dāng)性check的基準(zhǔn)Burn-In高溫加速老化試驗MVP：MarkingVisualPackingM/S：Markingstore按speed分類……Laser激光Server服務(wù)器FB-DIMM：FullyBufferedDualIn-lineMemoryModule全緩存雙線內(nèi)存模組So-DIMM：SmalloutlineDIMM筆記本內(nèi)存Application應(yīng)用程序Shipping產(chǎn)品出口PCB：PrintCircuitBoard印刷電路板MLCC：MultiLayerCeramicCapacitor多層陶瓷電容器A/R：ArrayResister數(shù)組電阻器ChipResister片狀電阻器EEPROM：ElectricallyErasableProgrammableReadOnlyMemory電可擦只讀儲存器PrintPCBPad上涂抹SolderPasteSolder焊接ChipMount往PCB上Mount附件Reflow用Reflow用產(chǎn)生的熱來使附件和PCB舉行連接AutoOpticalInspection通過光學(xué)檢查附件的Joint狀態(tài)LabelAttach用Auto在Module上貼LabelRouter分割連在一起的PCBAOQ：AverageOutgoingQuality平均出貨品質(zhì)T/B：TestBankLOAD：LoadingU/L：UnloadingLIS：LeadInspectionSystemFVI：FinalVisualInspection結(jié)果外觀檢查EFR：EarlyFailureRateQPE：QAPackageElectricalQPV：

QAPackageVisualIPK：InnerBoxPackingQPP：QAPackagePackingQFS：QAFinishedGoodsStoreFGS：FinishedGoodsStoreTAT：TurnAroundTimeLithography光刻Microlithography顯微光刻Expose曝光Coat涂層Bake烘烤Develop顯影Thickness層、濃度Temp臨時雇員、做臨時工作Energy精神、能量、活力focus焦距、明顯illumination景深overlay籠罩物、鍍lens透鏡、鏡頭、給…攝影alignment隊列、校準(zhǔn)、結(jié)盟oxide絕緣體、氧化物polymer聚合物WetEtching濕法刻蝕DryEtching干法刻蝕chamber房間、室、腔pump用抽水機(jī)抽…、泵、打氣筒plasma等離子體effect產(chǎn)生、作用、效果inhibitor抗化劑pattern模仿、樣品hole穴、洞、孔content內(nèi)容、目次Deposit存款、使沉積、沉淀物CVD：ChemicalVaporDeposition化學(xué)氣相沉積PVD：PhysicalVaporDeposition物理氣相沉積PECVD：PlasmaEnhancedCVD等離子鞏固化學(xué)氣象沉積HDPCVD：HighDensityPlasma高密度等離子化學(xué)氣相沉積rare速度、責(zé)罵temperature溫度Range偏差、排、山脈Uniformity平勻度Sigma標(biāo)準(zhǔn)差DriverTorqueWrenchWrenchLongNoseplierNipperSolderingFileWireStripperMonkeySpannerOpenspannerLevelMeterPipeWrenchSnapRingPlireMircoMeterStepCoverage臺階籠罩率AspectRatio深寬比Metal金屬Particle顆粒雜質(zhì)Stress應(yīng)力Reflectance反射系數(shù)Dielectric介電質(zhì)RefractiveIndex折射系數(shù)Dopant參雜濃度Tensile拉應(yīng)力Compressive壓應(yīng)力Incidentlight入射光Application應(yīng)用Conformity共形性O(shè)verhang懸突LPCVD：LowPressureChemicalVaporDeposition低壓化學(xué)氣相沉積CMP：ChemicalMechanicalPlanarization化學(xué)機(jī)械平坦化Analysis分析Synthesis綜合Convergent集中性Divergent發(fā)散性Vertical垂直性Latercal水平性Skills技術(shù)Techniques方法、技巧、技術(shù)LogicTree規(guī)律樹Brainstorming頭腦風(fēng)暴Visualization形象化Solution解決方案Thinking斟酌SPC：StatisticalProcessControlCPK：CapabilityIndexIQC：IncomingQualityControlCAR：correctiveActionRequestCleanRoomPurging去除產(chǎn)生的微粒子Prohibiting防止微粒子的產(chǎn)生Preventing防止微粒子的侵入Providing維持必要的溫度、濕度SupplyunitReturnunitAirshowerBondheadBondingtimeCodingtimeMCP：MultiChipPackageVacuum真空吸塵器Ventury噴嘴Cassette片匣TDBI：TestDuringBurnIn舉行rest中，舉行BurnIn的工程B/I：BurnInSORTER：向bib舉行Load/Unload作業(yè)的device設(shè)備SYSTEM：舉行B/I&test裝載Device的BIB設(shè)備BIB：BurnInBoardSYSREM設(shè)備中為了DeviceTest按Socket個別裝載Device的BoardBIN：按照DeviceTest結(jié)果值以Category來區(qū)分BS：Burn-infailsplit在SYSTEM設(shè)備DeviceTest結(jié)果中發(fā)生Fail的BIN用語O/S：Open/ShortDeviceTest結(jié)果中發(fā)生Fail的BIN用語BC：B/Ifailcombine1次BIfailcombineBCC：B/Ifailcombine2次BIfailcombineINS/REM：Insent/Remove舉行l(wèi)oad/Unload作業(yè)Device向BIBSocketCapa-UpAlign排列Renaissance復(fù)活、復(fù)興、新生Wearasmock穿防塵服Wearamask戴口罩Wearasmockcap帶防塵帽Putyourshoeso