SMT工藝流程講議

主旨：SMT工藝流程講議一.目的:通過(guò)集中進(jìn)行培訓(xùn).使技朮員掌握更多的知識(shí)去為生產(chǎn)過(guò)程當(dāng)中出現(xiàn)的問(wèn)題.更快更準(zhǔn)確地去分析和解決.達(dá)到提高生產(chǎn)效率.提高品質(zhì)質(zhì)量.降低物料消耗.二.培訓(xùn)人員劉鋒葉俊超黃旭煌黃育桃鐘訊冰吳靈霞尹建章三.內(nèi)容:ＳＭＴ工藝流程有關(guān)ＰＰＭ的魚(yú)骨架分析圖 3.1.1(Ｏven)3.1.3(Printing)３.１.5(員工補(bǔ)料)XY.Table穩(wěn)定性３.１.８(其它)XY.Table水平度軌道狀況剮刀速度切刀狀況剮刀壓力CAM速度爐溫極限設(shè)置網(wǎng)的平面度取放PCB板狀況程序優(yōu)化狀況爐溫設(shè)置網(wǎng)眼大小補(bǔ)料速度車(chē)間灰塵狀況排廢氣狀況網(wǎng)眼密度補(bǔ)料正確性車(chē)間澀度回流風(fēng)速網(wǎng)眼制造補(bǔ)料手法車(chē)間空氣狀況爐速鋼網(wǎng)厚度組件偏位認(rèn)識(shí)車(chē)間溫度錫漿金屬比來(lái)料規(guī)格成像參數(shù)設(shè)置nozzle尺寸狀況錫漿粘度性組件氧化狀況nozzle參數(shù)設(shè)置nozzle磨損狀況17.5MM錫漿溶點(diǎn)溫度組件極性組件外行尺寸設(shè)置nozzle中心位置金屬顆粒大小組件缺損狀況feeder參數(shù)設(shè)置nozzle堵塞狀況金屬顆粒形狀紙帶狀況組件識(shí)別數(shù)據(jù)設(shè)置nozzle反光紙狀況助焊劑含量膠帶狀況組件補(bǔ)償數(shù)據(jù)設(shè)置nozzle真空狀況PCB板規(guī)格有關(guān)速度數(shù)據(jù)設(shè)置feeder規(guī)格PCB拚板標(biāo)準(zhǔn)性feeder導(dǎo)蓋Feeder齒輪Feeder中心3.1.73.1.2(Solder)3.1.4(物料)nozz和3.1.6(組件數(shù)據(jù))feederFUJI--CP6,CP642,CP643OperationManuPowerBoxOperationBox1In-conveyorOut-conveyorServoBox1ServoBox2ControlBox2ControlBox1XY-TablePlacingHead CPURACK(FRONT)CPURACKJUNPERSETSpaceconsolespacevisionservo1servo2servo3I/OC/CGCHservo42345678910111213shortopenSERVOBOX1D2AXISXAXISD1AXIS(11SA-2)(125SA-1)(11SA-1)CACR-44-FK1CSY1ASGDBB-60VD-Y189CACR-FK1CSY1AFM5FM6SERVOBOX2YAXISZFRQFQNCMIPCB0FM11FM12SAPCB3SAPCB2SAPCB12012193181741665157148139121011CP機(jī)器操作介紹機(jī)器結(jié)構(gòu)說(shuō)明:有關(guān)CP-6series機(jī)器大致有以下幾部分組成.1.機(jī)架(用于放置和固定各部位的連結(jié)接).2.伺服箱BOX1(用于對(duì)D1.D2.X.AXIS的控制以及相關(guān)繼電器回路控制)3.伺服箱BOX2(用于對(duì)Y.Z.FRQ.FQ.NC等AXIS的控制以及相關(guān)繼電回路控制)4.控制箱BOX1(各動(dòng)作位置的感應(yīng)輸出和輸入控制)5.控制箱BOX2(機(jī)器各部分的供電輸出和VME主板)6.主電源箱(主供電箱交流電380~V的輸入和應(yīng)輸出轉(zhuǎn)換回路)7.操作箱BOX前(CRT1.CRT2.CAMAXIS的控制回路)8.操作箱BOX后(CRT3的控制回路)9.物料驅(qū)動(dòng)臺(tái)TABLE1.TABLE2.10.置放頭(貼片主體部分)11.X.Y工作臺(tái)(PCB貼組件工作臺(tái))12.凸輪箱(置放頭的傳動(dòng)主體)13.機(jī)板輸出和輸入部分(PCB板輸送主體)14.消音箱(廢料箱以及雜音控制)TwentyWorkStation的說(shuō)明:CP6以上的機(jī)器工作站有20個(gè).一般都是每個(gè)頭所在的位子,相對(duì)應(yīng)也有一個(gè)工作站,CP6一般都是20個(gè)頭,從字母A到從字母T.每個(gè)頭上都有6個(gè)NOZ-ZLE.吸嘴.機(jī)器在生產(chǎn)時(shí)按PROGRAM中PDDATA資料規(guī)定的來(lái)選不同的NOZ-ZLE.ST1:從FEEDER上吸取組件,料帶切刀動(dòng)作,真空開(kāi)關(guān)切換,吸嘴上下動(dòng)作,供料連桿動(dòng)作,組件耗盡偵測(cè).ST2:大組件吸取偵測(cè).ST3:置件角度的預(yù)轉(zhuǎn),在這里只能做粗略的預(yù)轉(zhuǎn).ST4:無(wú)功能.ST5::置件工作頭誤差角度的校正.ST6:組件照相處理和PDDATA的數(shù)據(jù)進(jìn)行核對(duì).ST7.8.9:把ST6站的數(shù)據(jù)進(jìn)行軟件處理.硬件不動(dòng)作.ST10:對(duì)ST3D的預(yù)轉(zhuǎn)角度進(jìn)行最終確認(rèn).ST11:吸嘴上下動(dòng)作真空開(kāi)關(guān)切換進(jìn)行貼片工作.ST12:針對(duì)ST10站最終貼片角度的還原.ST13:置件角度的預(yù)轉(zhuǎn)還原.對(duì)ST13粗略預(yù)轉(zhuǎn)角度還原.ST14:置件工作頭A的檢知.ST15:吸咀頭角度原點(diǎn)的確認(rèn),不在原點(diǎn)位置的將被SKIP退到ST12進(jìn)行重新還原.ST16:對(duì)做影像處理不能通過(guò)之零件進(jìn)行收集.ST17:對(duì)切換前NOZZLE位置進(jìn)行檢測(cè).ST18:對(duì)吸咀位置進(jìn)行切換(也就是選出下步要吸料的NOZZLER).ST19:對(duì)ST18吸咀對(duì)切的位置進(jìn)行最終確認(rèn).ST20:無(wú)功能.備注:ST1-ST11是吸料,檢查,貼裝過(guò)程,ST12-ST20是還原檢查確認(rèn)過(guò)程.SMT生產(chǎn)現(xiàn)場(chǎng)工藝參數(shù)的調(diào)整方法合格焊接工藝參數(shù)控制絲印工藝參數(shù)控制貼裝工藝參數(shù)控制結(jié)束開(kāi)始PCB烘..烤90分鐘左右平整度.可焊性檢查焊膏的攪拌(3/5分鐘)分析原因及時(shí)解決問(wèn)題合格合格一.鉛錫膏功能I/O信號(hào)名稱(chēng)說(shuō)明地址信號(hào)名稱(chēng)注解X000EMERGENCYSW緊急停止鍵X001STARTSW開(kāi)始鍵X003CYCLESTOP恢復(fù)鍵X004TMCOUNT1定時(shí)器2000小時(shí)已滿(mǎn)X005TMCOUNT2定時(shí)器6000小時(shí)已滿(mǎn)X008INCHINGRIGHTMCHING右鍵X009INCHINGLEFTINCHING左鍵X00AINCHINGDOWNINCHING下降鍵X00BINCHINGUPINCHING上升鍵X00CINCHINGCWINCHING順時(shí)針按鍵X00DINCHINGCCWINCHING逆時(shí)針按鍵X00FSHIFTKEY軸的選擇鍵X010-X015F1-F6六個(gè)功能鍵X017-(MINUSSKY)負(fù)號(hào)鍵X018-X01BE1-E4INCHING數(shù)字鍵X01C-X01FTENKEY1-TENKEY4數(shù)字鍵X020MACHINEREDY機(jī)器準(zhǔn)備就緒X021AIROK氣壓檢查開(kāi)關(guān)X022THERMALOK溫度感應(yīng)SENRORSX023SERVOREADY伺服狀態(tài)就緒X024TABLEREADYTABLE在用臺(tái)狀態(tài)X025-X027處于短路狀態(tài)X028FRONTDOOROK前面安全門(mén)開(kāi)關(guān)檢查X029REARDOOROK后面安全門(mén)開(kāi)關(guān)檢查X02BVACUUMOK真空開(kāi)關(guān)檢查X02CCAMHANDIECHK凸輪手柄開(kāi)關(guān)檢查X02DFEEDERCHKFEEDER位開(kāi)關(guān)檢查X02EFENCE1CHK料臺(tái)柵欄桿1開(kāi)關(guān)檢查X02FFENCE2CHK料臺(tái)柵欄桿2開(kāi)關(guān)檢查X030TABLEUPCHKTABLE上升位檢查X032TABLEDNCHKTABLE下升位檢查X033PCBSETOKTABLEPCB水平檢查X034CONVCLUKCHKTABLE上下位的狀態(tài)檢查X036HARDREADY凸輪準(zhǔn)備就緒X03ACONVPCBCHKTABLE上板的感應(yīng)檢查X03BREAROPERATION機(jī)器操作板轉(zhuǎn)到后面操作X03CFEEDERFWPOSST1FEEDER連桿的上極限檢查X03DFEEDERBWPOSST1FEEDER連桿的下極限檢查X03ECAMZERVPOSCAM原點(diǎn)位置檢查X03FST11DNPOSST11氣缸的下極限檢查X040SERVOBOX1SERVOBOX1準(zhǔn)備就緒X041SERVCBOX2SERVOBOX2準(zhǔn)備就緒X042TAPEENDCHKTAPEENDDETECTION零件用盡檢測(cè)X044PQROT270DEG預(yù)轉(zhuǎn)角度氣缸的回開(kāi)位檢查X045PQROT90DEG預(yù)轉(zhuǎn)角度氣缸的回退位檢查X046SETCANCEL1取消右邊料臺(tái)X047SETCANCEL2取消左邊料臺(tái)X049HEADACHK置件頭A位的檢查X04A-X04CNOZCHKST171-3ST17NOZZLE型號(hào)的檢查分三組光束X04D-X04FNOZCHKST191-3ST19NOZZLE型號(hào)的檢查分三組光束X050PRQROT270DEG預(yù)轉(zhuǎn)角度還原氣缸的回開(kāi)位檢查X051PRQROT90DEG預(yù)轉(zhuǎn)角度還原氣缸的回退位檢查X052NOZORGPOSST12ST12NOZ吻合齒輸原點(diǎn)位檢查X053NOZCLUTST12ST12NOZ齒輸吻合狀況檢查X054DUMPPARTS廢料盒的測(cè)知X055OILALARM循環(huán)油報(bào)警X056NOLORGPOSST15ST15NOZZLE原點(diǎn)的確認(rèn)X057CYCLEMODE轉(zhuǎn)為暫停模式X05ASHUTTER1UPCHK料站擋板1上升位檢查X05BSHUTTER1DNCHK料站擋板1下降位檢查X05CSHUTTER1-2UPDNCHK料站擋板1上升.下降位檢查X05ETRANSFERIN輸送板傳送輸入位感應(yīng)器檢查X05FTRANSFEROUT輸送板傳送輸出位感應(yīng)器檢查SX006CAXISZEROCAM歸零感應(yīng)SX00AFRQAXISZERO預(yù)轉(zhuǎn)AXIS歸零感應(yīng)SX00EZAXISZEROZAXIS歸零感應(yīng)SX00C-DZAXIS+_OTZAXIS上下極限感應(yīng)SX014-15XAXIS+_OTXAXIS正負(fù)極限感應(yīng)SX016XAXISZEROX軸歸零感應(yīng)SX017XAXISREADYX軸INTERLOC打開(kāi)SX018-19YAXIS+_OTYAXIS正負(fù)極限感應(yīng)SX01EFQAXISZERO預(yù)轉(zhuǎn)確認(rèn)軸歸零感應(yīng)SX024-25D1AXIS_+OTD1軸正負(fù)極限感應(yīng)SX026D1AXISZERROD1軸歸零感應(yīng)SX027D1AXISREADTD1軸INTERLOCK打開(kāi)SX028-SX02B為D2軸同上D1軸為D2軸同上D1軸SX02ENCAXISZERONC軸歸零感應(yīng)(SET)-(MANUAL)-(I/O)檢查輸入和輸出信號(hào)SMT組件的貼裝方式類(lèi)型貼裝方式貼裝結(jié)構(gòu)電路基板元器件特征全單面APCB單面表面工藝簡(jiǎn)單,適合IA表表面貼裝陶瓷基板貼裝于小型,薄型化面B組件的電路貼裝IB組雙面APCB雙面同上高密度貼裝裝表面貼裝B陶瓷基板薄型化SMD和THTA先插后貼,工藝較IIA都在A面雙面PCB同上復(fù)雜,貼裝密度高雙B面THC在A面,A和BTHT和SMC/SMDIIB混兩面都有SMD雙面PCB同上貼裝在PCB同一裝側(cè)IICSMD和THT雙面PCB同上復(fù)雜,很少用在雙面表面貼裝先貼后插,工藝,單先貼法單面PCB及通孔插簡(jiǎn)單組裝密度低III面裝元器件混先插后貼,工藝裝后貼法單面PCB同上復(fù)雜組裝密度高(1).全表面組裝(IA和IB型):IA型,所有SMT組件均放在PCB板的一面,組裝密度高,IB型,SMT組件在PCB板的二面,組裝密度更高.可采用細(xì)間距器件和再流焊工藝進(jìn)行組裝.(2).雙面混合組裝(IIA型.IIB型.IIC型):采用雙面印制板,雙波峰焊和再流焊.一般采用先貼后插法.(3).單面混合組裝(III型):III型有先貼和后貼之分,均采用單面板和雙波峰焊工藝.鉛焊膏特性(配方比較)序組成成分溫度塑性應(yīng)用特性號(hào)(配方)(溶焊范圍)(偏差)180AU/20SN280E0黃金表面最佳沾焊258BI/42SN138E0溶點(diǎn)低,強(qiáng)度極高325BI/37.5IN/37.5SN70-110L40溶點(diǎn)更低,強(qiáng)度高可作各種金屬表面最焊接437.5PB/25IN/37.5SN134S-181L47沾錫性好43PB/14BI/43SN163E0缺點(diǎn):不適合作黃金的焊接2AG/36PB/62SN179E0含有少量銀,適合作銀表面焊52AG/88PB/10SN268S-290L22缺點(diǎn):不適合作金表面焊接1.5AG/97PB/1SN309E03.5AG/96.5SN221E0無(wú)鉛.應(yīng)用廣64AG/96SN221E0適合各種金屬表面焊接5AG/95SN221S-240L1975PB/25IN250S-264L14應(yīng)用于晶體.芯片內(nèi)部對(duì)裝750PB/50IN180S-209L29柔軟延展性好25PB/75IN156S-165L937PB/63SN183E040PB/60SN183S-188L5850PB/50SN183S-216L33成本低.固著力高90PB/10SN268S-302L34缺點(diǎn):不適合作金,銀表面焊接45PB/55SN183S-211L2895PB/5SN308S-312L4注:(1)E表示Eutectic,S表示Solids,L表示Liquids.(2)Au金Ag銀Bi鉍In鋅Pb鉛Sn錫SMT工藝流程說(shuō)明進(jìn)料/檢查錫膏,PCB.鋼板等及其它輔助材料的準(zhǔn)備與檢查印刷錫膏PCB錫膏印刷檢查點(diǎn)錫膏印刷質(zhì)量檢查貼片元器件貼裝檢查點(diǎn)貼片質(zhì)量檢查回流焊元器件焊接NO檢查焊點(diǎn)品質(zhì)檢查修補(bǔ)YES單面貼插混裝單面貼裝點(diǎn)膠膠水點(diǎn)滴檢查點(diǎn)點(diǎn)膠質(zhì)量檢查貼片組件貼裝檢查點(diǎn)貼片質(zhì)量檢查固化組件固化插?件NO單面貼裝是否插件選擇插件插裝組件YES單面貼插混裝元器件焊接波峰焊修補(bǔ)NO檢驗(yàn)焊接質(zhì)量檢查清洗PCB,元器件焊點(diǎn)清洗檢查點(diǎn)清洗效果檢查在線(xiàn)測(cè)試焊點(diǎn)電性測(cè)試修補(bǔ)OK!電性測(cè)試結(jié)果選擇包裝產(chǎn)品包裝入庫(kù)送入倉(cāng)庫(kù)存放DATA[non] 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