LED工藝制程+goodPPT

1、1LED工藝簡(jiǎn)介工藝簡(jiǎn)介2LED 發(fā)光管是怎樣練成的發(fā)光管是怎樣練成的襯底材料襯底材料生長(zhǎng)或購生長(zhǎng)或購買襯底買襯底LED結(jié)構(gòu)結(jié)構(gòu)MOCVD生長(zhǎng)生長(zhǎng)芯片加工芯片加工芯片切割芯片切割器件封裝器件封裝Sapphire藍(lán)寶石藍(lán)寶石 2-inch3襯底片襯底片 4氮化物氮化物L(fēng)ED發(fā)光管的器件結(jié)構(gòu)及發(fā)光機(jī)理發(fā)光管的器件結(jié)構(gòu)及發(fā)光機(jī)理electrons電子空穴電子空穴復(fù)合發(fā)光復(fù)合發(fā)光P 歐姆接觸N 歐姆接觸藍(lán)寶石或碳化硅5MOCVD外延藍(lán)寶石藍(lán)寶石緩沖層緩沖層N-GaNp-GaNMQW6第一步第一步 清洗清洗有機(jī)物有機(jī)物金屬離子金屬離子7第二步第二步n區(qū)光刻區(qū)光刻 8刻蝕刻蝕Cl2+Bcl3+Ar9去膠去

2、膠3#液10p電極蒸發(fā)電極蒸發(fā)11P電極光刻12P電極腐蝕KI+I213去膠丙酮+酒精14P電極合金O215N電極光刻16N電極蒸發(fā)17N剝離18N退火N219P壓焊點(diǎn)光刻20P壓焊點(diǎn)蒸發(fā)21P壓焊點(diǎn)剝離22鈍化層沉積氣體，功率氣體，功率23鈍化層光刻24鈍化層刻蝕25鈍化層去膠丙酮丙酮26中道終測(cè)檢驗(yàn)27減薄28劃片29裂片30擴(kuò)膜31 劃片,裂片工作流程圖劃片前晶片背面劃片后背面劃片后,側(cè)視圖裂片后,側(cè)視圖擴(kuò)膜后,正視圖32測(cè)試分檢33LED:Whats inside?electrodessemiconductor chipepoxydomebond wires“silver cup”re

3、flectorDesign Growth Processing Packaging CharacterizationA packaged LEDDifferent parts of an LEDProcess flow:34RadiometryPhotometryPowerWatt (W)lumen (lm)Power per unit areaW/m2lm/m2 = lux (lx)Power per unit solid angleW/srlm/sr = candela (cd)Photometry is just like radiometry except that everything is weighted by the spectral response of the eye光學(xué)知識(shí)Solid angle: sr = 2 (1 - cos(/2) 立體角立體角:35如何理解光通量如何理解光通量(Lumen)和發(fā)光強(qiáng)度和發(fā)光強(qiáng)度(Mcd)470nm LED: 3000mcd (20mA)P*62.139(lm)/