SMD專業(yè)術(shù)語中英文對照電子類知識寶典

1、SMD專業(yè)術(shù)語中英文對照電子類知識寶典Revised by BLUE on the afternoon of December 12,2020.SMD 常用術(shù)語微組裝技術(shù)：MPT/MicroelectronicPackagingechnology混裝技術(shù)：MixedComponentMountingTechnology封裝：Package貼片：PickandPlace拆焊:Desoldering再流：Reflow浸焊:DipSoldering拖焊：Dragsoldering印制電路：PrintedCircuitE 卩制線路:PrintedWiring印制電路板:printedcircuitbo

2、ard卬制線路板：printedwiringboard層壓板：laminate覆銅薄層壓板：copper-cladlaminate基材.:basematerial成品 板：product ionboard印刷:printing導(dǎo)電圖形：conductivepattern印制組件:printedcomponent 單而印制板：single-sidedprintedboard雙而印制板：double-sidedprintedboard 多層印制板：multilayerprintedboard 電烙鐵：Iron熱風(fēng)嘴：hotairreflowingnoozle吸錫帶：solderingwick 吸錫

3、器：tinextractor 焊后檢驗:post-solderinginspection 目焊料爬越:solderwicking視檢驗:visual inspection 機(jī)器檢驗:machine inspect ion 焊點(diǎn)質(zhì)量：soldering jointquality 焊電缺陷：solderingjontdefect 錯焊：solderwrong 漏焊:solderskips 虛焊：pseudosoldering 冷焊:coldsoldering 橋焊：solderbridge 脫焊：opensoldering 焊點(diǎn)剝離：solderoff 不潤濕焊點(diǎn)：solderingnonwett

4、ing 錫珠:solderball拉尖 :icicle； solderprojection 孔洞:void過熱焊點(diǎn)：overheatedsolderconnection不飽和焊點(diǎn)：insufficientsolderconnection過量焊點(diǎn)：excesssolderconnection微組裝技術(shù)：NIPT/MicroelectronicPackagingechnology混裝技術(shù)：MixedComponentMountingTechnology封裝：Package貼片：PickandPlace拆焊:Desoldering再流：Reflow浸焊:DipSoldering拖焊：Dragsold

5、ering卬制電路：PrintedCircuit印制線路：PrintedWiringE 卩制電路板:printedcircuitboard卬制線路板：printedwiringboard層壓板：laminate覆銅薄層壓板：copper-cladlaminate基材： basematerial成品板：productionboard卬刷:printing導(dǎo)電圖形：conductivepattern卬制組件：printedcomponent 單而印制板：single-sidedprintedboard焊料爬越:solderwicking雙而印制板：double-sidedprintedboard

6、多層印制板：multilayerprintedboard 電烙鐵：Iron熱風(fēng)嘴：hotairreflowingnoozle吸錫帶：solderingwick 吸錫器：tinextractor 焊后檢驗:post-solderinginspection 目視檢驗:visual inspection 機(jī)器檢驗:machine inspect ion 焊點(diǎn)質(zhì)量：soldering jointquality 焊電缺陷：solderingjontdefect 錯焊：solderwrong 漏焊:solderskips 虛焊：pseudosoldering 冷焊:coldsoldering 橋焊：sol

7、derbridge 脫焊：opensoldering 焊點(diǎn)剝離：solderoff 不潤濕焊點(diǎn)：solderingnonwetting 錫珠:solderball拉尖 :icicle； solderprojection 孔洞:void過熱焊點(diǎn)：overheatedsolderconnection不飽和焊點(diǎn)：insuf fici ent sol der c onne c t i on過量焊點(diǎn)：excesssolderconnection助焊劑剩余：fluxresidue焊料裂紋：soldercrazeing焊角翹起:fillet-lifting： lift-offAl:Auto-Insertio

8、n 自動插件AQL: acceptablequalitylevel 允收水平ATE: automatictestequipment 自動測試ATM:atmosphere 氣壓BG;: ba 11 gridarray 球形矩陣CCD:chargecoupleddevice 監(jiān)視連接組件（攝彫機(jī)）CLCC:Ceramicleadlesschipcarrier 陶瓷引腳載具COB: chip-on-board 芯片直接貼附在電路板上cps: centipoises （黏度單位）百分之一CSB:chipscaleballgridarray 芯片尺寸 BGACSP:chipscalepackage 芯片

9、尺寸構(gòu)裝CTE: coef f ic i ent of thermal expans i on 熱膨脹系數(shù)DIP: dualin-1 inepackage 雙內(nèi)線包裝（泛指乎插組件）FPT: f inepitchtechnology 微間距技術(shù)FR-4: flame-retardantsubstrate 玻璃纖維膠片（用來制作 PCB 材質(zhì)）IC： integratecircuit 集成電路IR: infra-red 紅外線Kpa: kilopascals （壓力單位）LCC: leadlesschipcarrier 引腳式芯片承載器MCH:multi-chipmodule 多層芯片模塊MEL

10、F:metalelectrodeface 二極管MQFP:metalizedQFP 金屬四方扁平封裝NEPC0N:NationalElectronicPackageandProductionConference 國際電子包裝及生產(chǎn)會議ppm:partspermiIlion 指每百萬 PAD（點(diǎn)）有多少個不良 PAD（點(diǎn)）psi :pounds/inch2 磅/英寸 2PWB:printedwiringboard 電路板QFP: quadflatpackage 四邊平坦封裝SIP:singlein-linepackageSIR:surfaceinsulationresistance 絕緣阻抗SM

11、C:SurfaceMountComponent 表而黏著組件SMD: SurfaceMountDevice 表而黏著組件SMEMA:SurfaceMountEquipmentManufacturersAssociation 表而黏著設(shè)備制適協(xié)會SMT: surfacemounttechnology 表而黏著技術(shù)SOIC:smalloutlineintegratedcircuitSOJ:smallout-linej-leadedpackageSOP: smallout-1 inepackage 小外型封裝SOT:smalloutlinetransistor 晶體管SPC:statisticalp

12、rocesscontrol 統(tǒng)汁過程控制SSOP:shrinksmalloutlinepackage 收縮型小外形封裝TAB: tapeautomaticedbonding 帶狀自動結(jié)合TCE: thermalcoefficientofexpansion 膨脹(因熱)系數(shù)Tg:glasstransitiontemperature 玻璃轉(zhuǎn)換溫度THD:Throughholedevice 須穿過洞 Z 組件(貫穿孔)TQFP: tapequadflatpackage 帶狀四方平坦封裝UVT:ultraviolet 紫外線uBGAmicroBGA 微小球型矩陣cBGA:ceramicBGA 陶瓷球型

13、矩陣PTHlatedThruHole 導(dǎo)通孔IAInformat ionAppliance 信息家電產(chǎn)品MESH 網(wǎng)目OXIDE 氧化物FLUX 助焊劑LGA (LandGri dArry)封裝技術(shù) LGA 封裝不需植球，適合輕薄短小產(chǎn)品 應(yīng)用。TCP (TapeCarrierPackage)ACFAnisotropicConductiveF 訂 m 異方性導(dǎo)電膠膜制程Soldermask 防焊漆Solderinglron 烙鐵Solderballs 錫球SolderSplash 錫渣SolderSkips 漏焊Throughhole 貫穿孔Touchup 補(bǔ)焊Briding 穡接（短路）So

14、lderWires 焊錫線SolderBars 錫棒GreenStrength 未固化強(qiáng)度（紅膠）TransterPressure 轉(zhuǎn)印壓力（E 卩刷）ScreenPrinting 刮刀式印刷SolderPowder 錫顆粒Wettengability 潤濕能力Viscosity 黏度Solderability 焊錫性Applicability 使用性Flipchip 覆晶DepanelingMachine 組裝電路板切割機(jī)So 1 derRecover ySy s t em 錫料回收再使用系統(tǒng)WireWelder 主機(jī)板補(bǔ)線機(jī)X-RayMulti-layerlnspectionSystemX-Ray 孔偏檢査機(jī)BGxAOpen/ShortX-RaylnspectionMachineBGAX-Ray 檢測機(jī)PrepregCopperFoilSheeterP. P.銅箔裁切機(jī)FlexCircuitConnections 軟性排線焊接機(jī)LCDReworkStat ion 液晶就示器修護(hù)機(jī) BatteryElectroWelder 電池電極焊接機(jī)PCMCIACardWelderPCMCIA 卡連接器焊接 LaserDiode 半導(dǎo)體雷射IonLasers 離子雷射Nd:YAGLaser 石溜石