石墨烯泡沫應(yīng)用于寬屏電磁波屏蔽實(shí)用教案

1、Our research interests我們的研究我們的研究(ynji)興趣興趣Development of extrusion foaming technology開發(fā)連續(xù)開發(fā)連續(xù)(linx)擠出發(fā)泡技術(shù)擠出發(fā)泡技術(shù) Extrusion foaming system with using CO2 as the blowing agent; 以超臨界CO2流體為發(fā)泡劑 Regular PP was used to produce PP foam 通用(tngyng)PP用作發(fā)泡體系第1頁/共38頁第一頁，共38頁。Development of autoclave foaming techn

2、ology開發(fā)開發(fā)(kif)釜壓發(fā)泡技術(shù)釜壓發(fā)泡技術(shù)EPPEPPEPLAEPIETPUOur research interests我們的研究我們的研究(ynji)興趣興趣第2頁/共38頁第二頁，共38頁。3Development of multi-functional polymer foam film開發(fā)開發(fā)(kif)多功能聚合物發(fā)泡薄膜多功能聚合物發(fā)泡薄膜 Polymer/filler/DMFPrecipitationDryingRedissolving Water vapor induced phase separationWater vaporH2OSolution blendingP

3、olymer nanocompositePolymer foam filmDryingFilm casting Our research interests我們的研究我們的研究(ynji)興趣興趣第3頁/共38頁第三頁，共38頁。4Advantages of (microcellar) foaming微發(fā)泡的優(yōu)勢(shì)微發(fā)泡的優(yōu)勢(shì)(yush) lightweight/輕量化; Thermal insulation/隔熱( r); Sound insulation/隔音； Improved impact/cushion properties/提高了沖擊/緩沖性能； Reduced dielectric

4、 properties/降低了介電性能第4頁/共38頁第四頁，共38頁。 Absorbing the microwave as a maze structure; 為電磁波提供迷宮(mgng)結(jié)構(gòu)；EMI shielding materials電磁屏蔽電磁屏蔽(pngb)材料材料Advantages of (microcellar) foaming微發(fā)泡的優(yōu)勢(shì)微發(fā)泡的優(yōu)勢(shì)(yush)第5頁/共38頁第五頁，共38頁。EM interference effects 電磁電磁(dinc)干擾干擾 Compromise the performance and lifetime of devises

5、Interfere with the function of other nearby components EM information leakage 電磁電磁(dinc)泄露泄露Computer, cell phone,To damage the human body 危害人體危害人體Harmful effects of EM wave電磁波的危害電磁波的危害(wihi)第6頁/共38頁第六頁，共38頁。7Radar detection雷達(dá)探測(cè)雷達(dá)探測(cè)Electromagnetic stealth materialsRadar detection: Broad band EM wavet

6、ransmitted or received by radar第7頁/共38頁第七頁，共38頁。Classical protection against EMIMetal sheetsBut: high density Poor mechanical flexibility Corrosion Limited tuning of the shielding effectiveness (SE)Advantages brought by polymersEasy shapingLightweightLow costBut most polymers are transparent to the

7、EMI waveMethods to improve the EMI SE of polymersTo disperse electrically conductive fillers in polymer matrixThe carbon materials such as carbon black, graphite, carbon nanotube, graphene nanosheets are usually selected as the conductive fillers.Classical materials for EMI shielding經(jīng)典的電磁經(jīng)典的電磁(dinc)

8、屏蔽材料屏蔽材料第8頁/共38頁第八頁，共38頁。Novel cellular structure of polymer composites for EMI shieldingPolymer/conductive filler compositePolymer/conductive filler composite foam金屬材料的電磁屏蔽機(jī)制為反射損耗；聚合物復(fù)合材料以反射損耗為主；均易導(dǎo)致電磁波二次污染問題。 入射波能量 反射波能量透射波能量聚合物發(fā)泡材料以吸收損耗為主，有效避免電磁波的二次污染問題透射波能量入射波能量反射波能量第9頁/共38頁第九頁，共38頁。Tendency of

9、EMI shielding materials電磁屏蔽電磁屏蔽(pngb)材料發(fā)展趨勢(shì)材料發(fā)展趨勢(shì)Lighter/輕量化輕量化Thinner/更薄更薄Higher EMI SE/更高的屏蔽效能更高的屏蔽效能For the application in special fields such as aerospace, weapon equipment, microelectrionics.Superior thermal stability/耐高溫耐高溫Flame retardancy/阻燃阻燃Excellent mechanical properties/有益有益(yuy)的性能的性能Fle

10、xible/柔性柔性第10頁/共38頁第十頁，共38頁。High Tg: 220 C;Flame retardant;Solid stat foaming using compressed CO2 as the physical blowing agentPreparation of high performance PEI microcellular foam 制備制備(zhbi)高性能高性能PEI微發(fā)泡材料微發(fā)泡材料Miller, D. et al., Polymer, 2011, 52, 2910.第11頁/共38頁第十一頁，共38頁。Published data of microcel

11、lular high performance foam/發(fā)表發(fā)表(fbio)的高性能聚合物發(fā)泡材料論文的高性能聚合物發(fā)泡材料論文Expansion ratio lower than 5 times膨脹(png zhng)倍率低于5倍第12頁/共38頁第十二頁，共38頁。Method to improve the expansion ratio of PI microcellular foam/提高膨脹提高膨脹(png zhng)倍率的方法倍率的方法Density：90 kg/m3Expansion rate: 15timesW.T. Zhai*, W.W. Feng, J.Q. Ling, W

12、.G. Zheng, Ind. Eng. Chem. Res., 2012, 51, 12827. THF as a co-blowing agentTg: 265 C第13頁/共38頁第十三頁，共38頁。50 mCell size：2030 mCell morphology of microcellular PI bead foam PEI微發(fā)泡粒子微發(fā)泡粒子(lz)的泡孔形態(tài)的泡孔形態(tài)第14頁/共38頁第十四頁，共38頁。Compression molding of PI bead foam模壓模壓(my)粘結(jié)成型粘結(jié)成型第15頁/共38頁第十五頁，共38頁。Tg:230C, 50 tim

13、es expansion/50倍膨脹(png zhng);翟文濤，鄭文革，凌建強(qiáng)，中國(guó)(zhn u)發(fā)明專利， 201210171721.X翟文濤，鄭文革，馮衛(wèi)衛(wèi)，凌建強(qiáng)，中國(guó)(zhn u)發(fā)明專利， 201210170254.9PI microcellular foam with superhigh volume expansion/制備超高倍率制備超高倍率PI泡沫泡沫第16頁/共38頁第十六頁，共38頁。Compression molding模壓模壓(my)成型成型第17頁/共38頁第十七頁，共38頁。 High processing temperature up to 320-360 C

14、/加工溫加工溫度高達(dá)度高達(dá)(o d)320-360度；度； High viscosity of composite melt and difficult to disperse high content of nanofillers/體系粘度高，難以分散體系粘度高，難以分散; Difficult to achieve a high foam expansion ratio/難以得難以得到高的膨脹倍率；到高的膨脹倍率； A high filler content requirement to achieve a good EMI shielding properties/優(yōu)異的屏蔽效能需要添加高

15、含量的吸收優(yōu)異的屏蔽效能需要添加高含量的吸收劑！劑！Challenging in the preparation of PI composite foam with high filler loading 制備制備(zhbi)高填充高填充PI復(fù)合材料泡沫的挑戰(zhàn)復(fù)合材料泡沫的挑戰(zhàn)第18頁/共38頁第十八頁，共38頁。19Polymer/filler/DMFPrecipitationDryingRedissolving Water vapor induced phase separationWater vaporH2OSolution blendingPolymer nanocompositePo

16、lymer foam filmDryingFilm casting Method to solve the challenging/解決辦法解決辦法第19頁/共38頁第十九頁，共38頁。Preparation of PEI/graphene microcellular foam/制制備備(zhbi)PEI/石墨烯發(fā)泡材料石墨烯發(fā)泡材料J.Q. Ling, W.T. Zhai*, W.W. Feng. et al., ACS Appl. Mater. Interfaces, 2013, 5, 2677.B. Shen, D.D. Lu, W.T. Zhai*, et al., ACS Appl.

17、 Mater. Interfaces, 2013, 5, 11383.PEI/Graphene/DMF solutionSample size: 2.3 mm第20頁/共38頁第二十頁，共38頁。21EMI SE test/電磁屏蔽效能電磁屏蔽效能(xionng)測(cè)試測(cè)試R&S ZVA67 vestor network analyzer 網(wǎng)絡(luò)(wnglu)分析儀 Sample size: 22.5 mm 10.0 mm第21頁/共38頁第二十一頁，共38頁。Foaming: Volume expansion of 5 timesFor the commercial usage 20dB

18、商用電磁(dinc)屏蔽材料需要效能大于20dBPEI/graphene microcellular foam used for EMI shielding/電磁電磁(dinc)屏蔽效能屏蔽效能第22頁/共38頁第二十二頁，共38頁。23Preparation of high thermal stable PI/graphene microcellular foam/制備制備(zhbi)泡沫泡沫The improved dispersion of graphene oxide by in-situ polymerization通過原位聚合來改善氧化通過原位聚合來改善氧化(ynghu)石石墨烯的

19、分散墨烯的分散Y. Li, W.T. Zhai*, et al., RSC Adv., 2015, 5, 24342.第23頁/共38頁第二十三頁，共38頁。24Thermal imidization at 350 C350度亞胺化Cell morphology of PAA/graphane and PI/graphene microcellular foams/泡孔形態(tài)泡孔形態(tài)(xngti)第24頁/共38頁第二十四頁，共38頁。Samples with the thickness of 0.8 mm樣品樣品(yngpn)厚度僅為厚度僅為0.8毫米毫米 EMI SE of PI/graph

20、ene microcellular foam/PI/石石墨烯泡沫的電磁屏蔽墨烯泡沫的電磁屏蔽(pngb)效能效能16 wt % rGO第25頁/共38頁第二十五頁，共38頁。26PMDA/ODA/GO/DMFCarbonization and graphitizationImidizationCasting on glass substrateIn situ polymerizationPhase separationMicrocellular PI/graphene foamsCarbon/graphene foamGraphite plateN2 atmospherePAA/GO cast

21、ing solutionCoagulant bathPreparation of carbon/graphene microcellular foam/制備制備(zhbi)石墨烯石墨烯/碳泡沫碳泡沫Y. Li, W.T. Zhai*, et al., Carbon, 2016, 100, 375-385.第26頁/共38頁第二十六頁，共38頁。350 C1000 C1500 C2100 C2600 C2600 C5 m5 m5 m5 m5 m1 m10203040506070802600 C2100 C1500 C1000 C(004)(100) (002)350 C Intensity (a

22、.u.)2 100015002000250030002600 CID/IG= 0.429ID/IG= 0.814ID/IG= 2.207ID/IG= 1.425ID/IG= 1.972G-bandD-bandG-bandD-band350 C1000 C1500 C Intensity (a.u.)Raman shift (cm-1)2100 CPI (350C) Carbonization (1000-1500C) Graphitization (2100-2600 C) Cell morphology evolution during the pyrolysis/碳化碳化/石墨化過程石墨化

23、過程(guchng)中泡孔結(jié)構(gòu)的演變中泡孔結(jié)構(gòu)的演變第27頁/共38頁第二十七頁，共38頁。EMI SE of carbon/graphene microcellular foam/石墨石墨烯烯/碳復(fù)合碳復(fù)合(fh)泡沫的屏蔽效能泡沫的屏蔽效能第28頁/共38頁第二十八頁，共38頁。Preparation of graphene film by direct evaporation of GO suspension/GO薄膜薄膜 self-assembly of GO into the GO film 自組裝(z zhun)成GO薄膜； GO was thermal reduction int

24、o graphene film； 熱還原成石墨烯薄膜B. Shen, W.T. Zhai*, W.G. Zheng*, Advanced Functional Materials, 2014, 24, 4542.第29頁/共38頁第二十九頁，共38頁。Proofs of the thermal reduction of graphene oxide into graphene/熱還原熱還原(hun yun)的證據(jù)的證據(jù)第30頁/共38頁第三十頁，共38頁。Conductivity of GO and grpahene電導(dǎo)率電導(dǎo)率sp3 Csp2 C第31頁/共38頁第三十一頁，共38頁。The EMI SE of GO and graphene屏蔽屏蔽(pngb)效能效能 第32頁/共38頁第三十二頁，共38頁。B. Shen, W.T. Zhai* et al., Carbon, 2016, 102,154.Preparation of graphene foam by the hydrazine foaming/水合肼發(fā)泡制備石墨水合肼發(fā)泡制備石墨(shm)烯泡沫烯泡沫The generated CO2 and H2O gas during chemical reduction was used for expansio