IPC提供的標(biāo)準(zhǔn)清單080221

AssembelyMaterials,,裝配材料

Flux/Solder,,焊錫與助焊劑

J-STD-004,J-STD-004A-RequirementsforSolderingFluxes,焊錫之助焊劑要求

J-STD-005,J-STD-005-RequirementsforSolderingPastes,錫膏要求

J-STD-006,J-STD-006B-RequirementsforElectronicGradeSolderAlloysandFluxedandNon-FluxedSolidSoldersforElectronicSolderingApplications,電子焊接應(yīng)用中的電子級(jí)錫焊合金與助焊和非助焊固體焊錫的技術(shù)指標(biāo)

IPC-TP-1043,TP-1043-Cleaning&CleanlinessTestProgramPhase3WaterSolubleFluxesPart1,清洗和潔凈度測(cè)試程序第3階段水溶助劑第1部分

IPC-TP-1044,TP-1044-Cleaning&CleanlinessTestProgramPhase3WaterSolubleFluxesPart2,清洗和潔凈度測(cè)試程序第3階段水溶助劑第2部分

Adhesives,,粘合劑

IPC-SM-817,SM-817-OBSOLETEWITHOUTREPLACEMENT,SM-817廢棄無替代產(chǎn)品

IPC-CA-821,CA-821-GeneralRequirementsforThermallyConductiveAdhesives,CA-821導(dǎo)熱粘合劑通用要求

IPC-3406,3406-GuidelinesforElectricallyConductiveSurfaceMountAdhesives,3406表面貼裝導(dǎo)電膠使用指南

IPC-3408,3408-GeneralRequirementsforAnisotropicallyConductiveAdhesivesFilms,3408-各向異性導(dǎo)電膠膜的一般要求

Coat/Mask,,涂料及阻焊

IPC-CC-830,CC-830B-QualificationandPerformanceofElectricalInsulatingCompoundforPrintedWiringAssemblies,印制板組裝電氣絕緣性能和質(zhì)量手冊(cè)

IPC-HDBK-830,"HDBK-830-GuidelinesforDesign,SelectionandApplicationofConformalCoatings",保形涂層的設(shè)計(jì)、選擇和應(yīng)用手冊(cè).

IPC-SM-840,SM-840C-QualificationandPerformanceofPermanentSolderMask-IncludesAmendment1,永久性阻焊劑的鑒定及性能(包括修正條例1)

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COMPONENTS,,元器件

J-STD-020,J-STD-020C-IPC/JEDECMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevice,J-STD-020C-IPC/JEDEC非密封固態(tài)表面貼裝器件濕度／回流焊敏感度分類

IPC-9501,9501-PWBAssemblyProcessSimulationforEvaluationofElectronicComponents,9501-評(píng)估印制板組裝過程中電子元器件的模擬裝配工藝

IPC-9502,9502-PWBAssemblySolderingProcessGuidelineforElectronicComponents,9502-印制板組裝過程中電子元器件的焊接工藝指南

IPC-9503,9503-MoistureSensitivityClassificationforNon-ICComponents,9503-非集成電路元器件的濕度敏感性分類

IPC-9504,9504-AssemblyProcessSimulationforEvaluationofNon-ICComponents(PreconditioningNon-ICComponents),9504-評(píng)估非集成電路元器件的模擬裝配工藝

J-STD-027,J-STD-027-MechanicalOutlineStandardforFlipChipandChipSizeConfigurations,J-STD-027-倒裝片和芯片級(jí)封裝的外形輪廓標(biāo)準(zhǔn)

J-STD-032,J-STD-032-PerformanceStandardforBallGridArrayBalls,J-STD-032-BGA球形凸點(diǎn)標(biāo)準(zhǔn)規(guī)范

J-STD-033,"J-STD-033B-Handling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevices",J-STD-033B-對(duì)濕度、回流焊敏感的表面貼裝器件的處置、包裝、發(fā)運(yùn)及使用方法

J-STD-035,J-STD-035-AcousticMicroscopyforNon-HermeticEncapsulatedElectronicComponents,J-STD-035-用于非氣密封裝電子元件的聲波顯微鏡

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CLEANING/CLEANLINESS,,清洗及清洗工藝

IPC-SC-60,SC-60A-PostSolderSolventCleaningHandbook,SC-60A-錫焊后溶劑清洗手冊(cè)

IPC-SA-61,SA-61A-PostSolderSemi-AqueousCleaningHandbook,SA-61A-錫焊后半水溶劑清洗手冊(cè).

IPC-AC-62,AC-62A-AqueousPostSolderCleaningHandbook,AC-62A-錫焊后水溶液清洗手冊(cè)

IPC-CH-65,CH-65A-GuidelinesforCleaningofPrintedBoards&Assemblies,CH-65A-印制板及組裝件清洗導(dǎo)則

IPC-TR-468,TR-468-FactorsAffectingInsulationResistancePerformanceofPrintedBoards,"TR-468-影響印制板絕緣電阻性能的因素

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IPC-TR-476,TR-476A-ElectrochemicalMigration:ElectricallyInducedFailuresinPrintedWiringAssemblies,TR-476A-電化學(xué)遷移：印制電路組件的電氣誘發(fā)故障

IPC-TR-580,TR-580-CleaningandCleanlinessTestProgramPhase1TestResults,TR-580-測(cè)試程序1：測(cè)試結(jié)果

IPC-TR-581,TR-581-IPCPhaseIIIControlledAtmosphereSolderingStudy,TR-581-第3階段：受控環(huán)境下的錫焊研究

IPC-TR-582,TR-582-Cleaning&CleanlinessTestProgramfor:Phase3-LowSolidsFluxes&PastesProcessedinAmbientAir,TR-582-測(cè)試程序3：環(huán)境空氣下的低固相阻焊及錫焊的清洗測(cè)試工藝

IPC-TR-583,TR-583-AnIn-DepthLookAtIonicCleanlinessTesting,TR-583-深入離子潔凈度測(cè)試

IPC-SM-839,SM-839-Pre&PostSolderMaskApplicationCleaningGuidelines,SM-839-焊接前/后阻焊膜的清洗指南

IPC-9201,9201-SurfaceInsulationResistanceHandbook,9201-表面絕緣電阻手冊(cè)

IPC-5701,5701-UsersGuideforCleanlinessofUnpopulatedPrintedBoards,5701-裸板清潔應(yīng)用指南

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EHS,,環(huán)境健康與安全

IPC-WP/TR-584,WP/TR-584-IPCWhitePaperandTechnicalReportonHalogen,WP/TR-584-IPC有關(guān)鹵素的白皮書及技術(shù)報(bào)告

IPC-1331,1331-VoluntarySafetyStandardforElectricallyHeatedProcessEquipment,1331-電氣加熱工藝設(shè)備義務(wù)安全標(biāo)準(zhǔn)

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ASSEMBLY,,裝配

IPC-D-279,D-279-DesignGuidelinesforReliableSurfaceMountTechnologyPrintedBoardAssemblies,D-279-高可靠表面貼裝技術(shù)印制板組裝件設(shè)計(jì)導(dǎo)則

IPC-D-326,D-326A-InformationRequirementsforManufacturingPrintedCircuitBoardsandOtherElectronicAssemblies,D-326A-生產(chǎn)制造印制板及其他電子裝配件的信息要求

IPC-C-406,C-406-Design&ApplicationGuidelinesforSurfaceMountApplicationsConnectors,C-406-貼裝應(yīng)用連接器設(shè)計(jì)應(yīng)用指南

IPC-CI-408,CI-408-Design&ApplicationGuidelinesfortheUseofSolderlessSurfaceMountConnectors,CI-408-采用無焊貼裝連接器的設(shè)計(jì)應(yīng)用指南

IPC-7351,7351-GenericRequirementsforSurfaceMountLandPatternandDesignStandard,7351-表面貼裝焊盤形狀以及設(shè)計(jì)標(biāo)準(zhǔn)通用要求

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INTERFACES,,數(shù)據(jù)接口

IPC-D-310,D-310C-GuidelinesforPhototoolGenerationandMeasurementTechniques,"D-310C-照相版制作指南和測(cè)量技術(shù)

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IPC-A-311,A-311-ProcessControlsforPhototoolGenerationandUse,A-311-照相版制作和使用的工藝過程控制

IPC-D-350,D-350D-PrintedBoardDescriptioninDigitalForm,D-350D-印制板的電子版技術(shù)說明

IPC-D-351,D-351-PrintedBoardDrawingsinDigitalForm,D-351-印制板的電子版圖紙

IPC-D-356,D-356B-BareSubstrateElectricalTestDataFormat,D-356B-裸底板電氣測(cè)試數(shù)據(jù)格式

IPC-D-390,D-390A-AutomatedDesignGuidelines,D-390A-自動(dòng)設(shè)計(jì)指南

IPC-2501,2501-DefinitionforWeb-BasedExchangeofXMLData,2501-XML數(shù)據(jù)網(wǎng)格交換定義

IPC-2511,2511A-GenericRequirementsforImplementationofProductManufacturingDescriptionData&TransferMethodology,2511A-實(shí)施產(chǎn)品制造數(shù)據(jù)描述及其傳輸方法學(xué)的通用要求

IPC-2531,2531-StandardRecipeFileFormatSpecification,2531-標(biāo)準(zhǔn)“菜單”（過程控制）文件格式規(guī)范

IPC-2541,2541-GenericRequirementsforElectronicsManufacturingShopFloorEquipmentCommunication(CAMX),2541-電子制造車間現(xiàn)場(chǎng)設(shè)備信息溝通(CAMX)通用要求

IPC-2571,2571-GenericRequirementsforElectronicsMfg.SupplyChainCommunication-ProductDataeXchange(PDX),2571-電子制造供應(yīng)鏈信息溝通分要求-產(chǎn)品數(shù)據(jù)交換

IPC-2581,2581-GenericRequirementsforPrintedBoardAssemblyProductsManufacturingDescriptionDataandTransferMethodology,2581-印制板組裝產(chǎn)品制造種類數(shù)據(jù)和傳送方法

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PCB,,PCB

SMC-WP-004,WP-004-DesignforSuccess,WP-004-成功設(shè)計(jì)案例分析手冊(cè)

IPC-D-859,D-859-DesignStandardforThickFilmMultilayerHybridCircuits,D-859-厚膜多層混合電路設(shè)計(jì)標(biāo)準(zhǔn)

IPC-1902,1902-IPC/IECGridSystemsforPrintedCircuits,1902-IPC/IEC印制板網(wǎng)格系統(tǒng)

IPC-2141,2141A-DesignGuideforHigh-SpeedControlledImpedanceCircuitBoards,2141A-高速可阻抗電路板設(shè)計(jì)指南

IPC-2221,2221A-GenericStandardonPrintedBoardDesign,2221A-印制板設(shè)計(jì)通用標(biāo)準(zhǔn)

IPC-2222,2222-SectionalStandardonRigidOrganicPrintedBoards,2222-`剛性有機(jī)印制板設(shè)計(jì)分標(biāo)準(zhǔn)

IPC-2223,2223A-SectionalDesignStandardforFlexiblePrintedBoards,2223A-揉性印制板設(shè)計(jì)分標(biāo)準(zhǔn)

IPC-2224,2224-SectionalStandardofDesignofPWBforPCCards,2224-PC卡用印制電路板分設(shè)計(jì)分標(biāo)準(zhǔn)

IPC-2225,2225-SectionalDesignStandardforOrganicMultichipModules(MCM-L)andMCM-LAssemblies,2225-有機(jī)多芯片模塊(MCM-L)及其組裝件設(shè)計(jì)分標(biāo)準(zhǔn)

IPC-2252,2252-DesignGuideforRF/MicrowaveCircuitBoards,2252-射頻/微波電路板設(shè)計(jì)指南

IPC-2251,2251-DesignGuideforthePackagingofHighSpeedElectronicCircuits,2251-高速電子電路封裝設(shè)計(jì)指南

IPC-2226,2226-SectionalDesignStandardforHighDensityInterconnect(HDI)Boards,2226-高密度互連(HDI)印制板設(shè)計(jì)分標(biāo)準(zhǔn)

IPC-2315,2315-DesignGuideforHighDensityInterconnects&Microvias,2315-高密度互連(HDI)和微通孔設(shè)計(jì)指南

IPC-2615,2615-PrintedBoardDimensionsandTolerances,2615-印制板尺寸和公差

IPC-1065,1065-MaterialDeclarationHandbook,1065-材料申報(bào)手冊(cè)

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