FPC-專業(yè)詞匯-中英文對(duì)照(總7頁

1、FPC名詞中英對(duì)照1. 目的 通過對(duì)行業(yè)標(biāo)準(zhǔn)的FPC工程名詞引用及我司標(biāo)準(zhǔn)的整合，旨在為我司FPC名詞的中英用語實(shí)現(xiàn)使用上的統(tǒng)一化2. 適用范圍 規(guī)范FPC相關(guān)工程上出現(xiàn)之不良項(xiàng)目，生產(chǎn)使用之材料、設(shè)備、治具以及可靠性試驗(yàn)等中英文名詞3. 定義 無類別一：FPC不良項(xiàng)目名詞工程類別不良名稱中文英 文導(dǎo)線Visual Inspection of Conductors導(dǎo)線Conductors開路Open短路Short缺口Nicks針孔Pinholes額外銅刺Extraneous Copper Between Conductors毛刺Spurs結(jié)瘤Nodules蝕刻凹痕Etched Concave導(dǎo)

2、線分層Conductor Delamination裂紋Cracks導(dǎo)線劃痕Scratches on Conductor凹坑Dents變色Discoloration基底薄膜Visual Inspection of Base Film凹坑Dents劃痕Scratches on Base Film覆蓋層和覆蓋涂層Visual Inspection of Coverlay and Covercoat凹坑Dents on Coverlay and Covercoat劃痕Scratches on Coverlay and Covercoat空洞Void偏位Coverlay Misalign毛刺Coverl

3、ay Burrs外來物Foreign Matters導(dǎo)電性異物Conductive Foreign Matters非電性異物Non-conductive Foreign Matters起泡和分層Blistering and Delamination覆蓋層粘結(jié)劑擠出Squeeze-out of Adhesive of Coverlay覆蓋涂層滲出Ooze-out of Covercoat覆蓋涂層跳漏Skipping of Convercoat電鍍金屬或焊錫的表面條件Surface Condition of Plated Mental and Solder鍍金Gold Plating鍍金層缺陷Go

4、ld Plating Defects鍍錫Tin Plating電鍍金屬或焊料的滲透Penetration of Plated Metal or Solder變暗（變黑）Darkened Appearance (Blackening Discoloration)鍍銅孔內(nèi)鍍層空洞Plating Voids in Plated-though Hole鍍金粗糙Rough Gold鍍金白霧Gold Discoloration鍍金變色Gold Discoloration鍍金層龜裂Gold Crack鍍金針孔Gold Pinhole電鍍露銅Plated Expose Wetting剝離Plated Peel

5、ed Off電鍍滲入Plated Wicking漏鍍No Plating表面?zhèn)跴lating Scratch電鍍粗糙Rough Plated藥水滲入Wicking外形和孔邊緣Visual Inspection of Edges of Outline and Holes撕裂和缺口Tears and Nicks毛刺Burrs絲狀毛刺Thready Burrs彎曲、變形Warpage微連筋不良Poor Micro-joint外形偏移Outline Misalign外形漏沖No Outline反折偏位Bending Line Misalign增強(qiáng)板Visual Imperfections Relat

6、ed to Stiffener BondingFPC與增強(qiáng)板之間的外來物Foreign Matter Between Flexible Printed Board and StiffenerFPC與增強(qiáng)板之間的空洞Voids Between Flexible Printed Board and Stiffener裂紋Cracks缺角Chip-off劃痕Scratches變形Deformation表面附著物Affixed Substances on the Surface增強(qiáng)板貼偏移Stiffener Misalign熱固膠Thermosetting Adhesive焊劑殘?jiān)麱lux Resid

7、ues金屬粉末殘?jiān)黂esidue of Metal Powders粘結(jié)劑殘?jiān)黂esidue of Adhesive突起Protrusions凹坑Dents弓曲Bow扭曲Twist標(biāo)記Marking尺寸檢驗(yàn)Dimensional Inspections尺寸測(cè)量Measurement of Dimensions外部尺寸External Dimensions厚度Thickness孔Holes元件孔Component Holes導(dǎo)通孔Via Holes導(dǎo)通孔偏移Via Hole Misalign安裝孔Mounting Holes導(dǎo)線寬度Conductor Widths導(dǎo)線之間的間距Clearances

8、 Between Conductors孔中心間距Distance Between Hole Centers板邊和導(dǎo)線之間的最小距離Minimum Distance Between Board Edges and Conductors標(biāo)記錯(cuò)誤Wrong Marking字符不清晰Unclear Letter定位精度Positional Accuracy孔的定位精度Positional Accuracy of Holes孔與焊盤的重合性Registration of Hole to Land覆蓋層與焊盤的重合性Registration of Coverlay (or Covercoat) to La

9、nd增強(qiáng)板與FPC的重合性Registration of Stiffener to FPC孔的重合性Registration of Holes外形的重合性Registration of Outlines沖外形與導(dǎo)線圖形的重合性Registration of Punched Outline to Conductor Patterns壓敏膠或熱固膠與FPC和增強(qiáng)板的重合性Registration of Pressure Sensitive or Heat Activated Adhesives to FPC and Stiffener鍍通孔的鍍銅層厚度Plating Thickness of Co

10、pper Panted-through Holes其它Other短裝Shortage混裝Mixed Stowage/Packing離型紙脫落Released Paper Peeled off材料錯(cuò)誤Wrong Material 類別二：PFC工程用語工程類別中 文英 文板Board Type單面板Single Sided Flex Circuits單面雙接觸Double Access or Back-bared Flex Circuits雙面板Double Sided Flex Circuits軟硬結(jié)合板Rigid-flex Circuits模具Die模具圖紙Die Drawing量產(chǎn)模具M(jìn)a

11、ss Production Die樣品模具 Prototype Die鋼模Steel Die刀模Die上模Top Die下模Bottom Die線切割Wire Cut外形模具Outline Cut保護(hù)膜模具Coverlay Die膠紙模具Pressure Sensitive Adhesive Die補(bǔ)強(qiáng)模具 Stiffener Die銀漿模具Silver Die 導(dǎo)柱Post沖頭Punch分割刀模Cutting Steel Rule Die銷釘Pin治具Jig( Fixture)貼合治具Lamination Jig電測(cè)治具Electrical Check Jig假貼治具Tacking Jig曝

12、光治具Exposure Jig絲印網(wǎng)框Screen Printing Frame孔Hole曝光定位孔Guide Hole for Exposure模具定位孔Guide Hole for Die假貼定位孔Guide Hole for Tacking貼合定位孔Guide Hole for Adhesive電測(cè)定位孔Guide Hole for Electrical Test絲印定位孔Guide Hole for Screen Printing孔環(huán)Lifted Land滲錫孔Stannize Hole裝配孔Fitting Hole制程Manufacture Procedure下料Material P

13、reparation鉆孔Drilling鍍銅Copper Plating化學(xué)銅Ele Eletcroless Plating Copper貼干膜Sensitive Dry Film 絲印阻焊油墨Liquid Photosensitive Soldermask曝光Exposure顯影Developing蝕刻Etching脫膜Stripping貼保護(hù)膜Tacking Coverlay粗化Abrade層壓Lamination固化(烘烤）Curing黑孔Black Hole表面處理Surface Treatment循環(huán)水洗Cascade Rinse微蝕Micro-etch酸洗Acid Cleaning

14、水洗Water Cleaning防銹處理Anti-corrosion Treatment前處理Pre-treatment刷板Brushing干燥Dry up電鍍（金、錫、鎳）(Gold、Solder、Nickel) Plating閃鍍(Gold ) Flash Plating/Strike Plating局部電鍍Pattern Plate化學(xué)鎳金Immersion Gold有機(jī)保焊膜Organic Solderability Preservatives (OSP)絲印字符Printing of Legend貼補(bǔ)強(qiáng)板Back Board Lamination電性能測(cè)試Electrical Ins

15、pection貼膠紙Double Faced Adhesive Tape打孔Punching雷射切割Laser Cut自動(dòng)光學(xué)檢驗(yàn)Automatic Optical Inspection （AOI）表面貼裝 Surface Mounting Technology （SMT）外形沖切Punching沖孔Punching外觀檢查Final Inspection目視檢查Visual Inspection（Final Inspection)線路顯微鏡檢驗(yàn)（鏡檢）Conductor Microscope Inspection性能測(cè)試Reliability Test包裝Packing原材料 Materia

16、l銅箔Copper Foil (CU)電解銅Electro-deposited Copper Foil (ED)壓延銅Rolled Annealed Copper Foil (RA)保護(hù)膜 Coverlay (CVL)基材Base Material撓性覆銅板Flexible Copper Clad Laminate (FCCL)無膠基材Adhesiveless FCCL粘接劑（膠）Adhesives (Ad)壓克力Acrylic頂層補(bǔ)強(qiáng)Top Stiffener底層補(bǔ)強(qiáng)Bottom Stiffener頂層銀漿膜Top Silver Paste底層銀漿膜Bottom Silver Paste銀漿

17、油墨Sliver Ink頂層線路Top Circuits/Conductors底層線路Bottom Circuits/Conductors半固化片Bonding Film (BOD)聚酰亞胺Polyimide(PI)聚酯Polyester Film (PET) 鋼片Sheet Steel玻璃纖維布Woven Glass ClothFR4補(bǔ)強(qiáng)板Fiberboard 液態(tài)感光油墨Liquid Photoimageable Resist Ink 壓敏膠Pressure Sensitive Adhesive（PSA）離型膜Release Paper導(dǎo)電膠Conducting Resin導(dǎo)電布Elect

18、ric Fabric泡棉Foam導(dǎo)向?qū)щ娔zAnisotropic Conductive Film （ACF）導(dǎo)電泡棉Conductive/Electric Foam屏蔽膜Shield Film (金屬)薄膜開關(guān)Metal Dome （DOME）連接器Connector電容Capacitance ( C )電阻Resistance ( R )集成電路Integrated Circuit （IC）二極管Diode (D)靜電Electro-Static Discharge（ESD）其 它 Others機(jī)械方向Machine Direction （MD）垂直方向Transverse Directio

19、n （TD）進(jìn)刀Feed進(jìn)刀量Chip Load轉(zhuǎn)速Speed焊接Soldering手工焊接Hand Soldering波焊Wave Soldering品質(zhì)允收標(biāo)準(zhǔn)Acceptable Quality Level（ AQL）菲林Film字符Legend烘箱Oven溫度Temperature濕度Humidity速度Speed壓力Pressure噴淋壓力Spouting Pressure濃度Concentration原理圖紙Schematic Diagram線寬Line Space線距Line Width線路間距Pitch 類別三：FPC可靠性測(cè)試項(xiàng)目中 文英 文電氣性能Testing of Electrical Performance導(dǎo)線電阻Conductor Resistance表面層絕緣電阻Surface Insulation Resistance (SIR)表面介質(zhì)層耐電壓強(qiáng)度Dielectric Withstanding Voltage of Surface Layers機(jī)械性能測(cè)試Testing of Mechanical Property剝離強(qiáng)度Peel Strength孔和焊墊的拉脫強(qiáng)度Pull-out Strength fo