下載本文檔
版權(quán)說明:本文檔由用戶提供并上傳,收益歸屬內(nèi)容提供方,若內(nèi)容存在侵權(quán),請(qǐng)進(jìn)行舉報(bào)或認(rèn)領(lǐng)
文檔簡(jiǎn)介
1、精選優(yōu)質(zhì)文檔-傾情為你奉上精選優(yōu)質(zhì)文檔-傾情為你奉上專心-專注-專業(yè)專心-專注-專業(yè)精選優(yōu)質(zhì)文檔-傾情為你奉上專心-專注-專業(yè)Thermoelectric Cooling - The Basics1 IntroductionAlthough thermoelectric (TE) phenomena were discovered more than 150 years ago, thermoelectric devices (TE coolers) have only been applied commercially during recent decades. For some time
2、, commercial TECs have been developing in parallel with two mainstream directions of technical progress electronics and photonics, particularly optoelectronics and laser techniques. Lately, a dramatic increase in the application of TE solutions in optoelectronic devices has been observed, such as di
3、ode lasers, superluminescent diodes (SLD), various photodetectors, diode pumped solid state lasers (DPSS), charge-coupled devices (CCDs), focal plane arrays (FPA) and others.The progress in applications is provided by advantages of TE coolers they are solid state, have no moving parts and are miniat
4、ure, highly reliable and flexible in design to meet particular requirements.2 What is Thermoelectric Cooling?Thermoelectric cooling uses the Peltier effect to create a heat flux between the junctions of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a soli
5、d-state active heat pump which transfers heat from one side of the device to the other side against the temperature gradient (from cold to hot), with consumption of electrical energy. Such an instrument is also called a Peltier device, Peltier heat pump, solid state refrigerator, or thermoelectric c
6、ooler (TEC). The Peltier device is a heat pump: when direct current runs through it, heat is moved from one side to the other. Therefore it can be used either for heating or for cooling (refrigeration), although in practice the main application is cooling. It can also be used as a temperature contro
7、ller that either heats or cools.This technology is far less commonly applied to refrigeration than is. The main advantages of a Peltier cooler (compared to a vapor-compression refrigerator) are its lack of moving parts or circulating liquid, and its small size and flexible shape (form factor). Its m
8、ain disadvantage is that it cannot simultaneously have low cost and high power efficiency. Many researchers and companies are trying to develop Peltier coolers that are both cheap and efficient. A Peltier cooler is the opposite of a . In a Peltier cooler, electric power is used to generate a tempera
9、ture difference between the two sides of the device, while in a thermoelectric generator, a temperature difference between the two sides is used to generate electric power. The operation of both is closely related (both are manifestations of the thermoelectric effect), and therefore the devices are
10、generally constructed from similar materials using similar designs.3 What is Thermoelectric Cooler?Thermoelectric cooler (TEC), or Peltier Cooler is a solid-state heat pump that uses the Peltier effect to move heat. The modern commercial TEC consists of a number of p- and n- type semiconductor coupl
11、es connected electrically in series and thermally in parallel. These couples are sandwiched between two thermally conductive and electrically insulated substrates. The heat pumping direction can be altered by altering the polarity of the charging DC current. TEC schematic is illustrated in Figure 1.
12、 The typical materials used for constructing TEC are:1. Substrate: aluminum oxide (Al2O3), aluminum nitride (AlN), or barium oxide (BaO)2. Conductor: Copper3. Thermoelectric semiconductori. n-type: bismuth-telluride-selenium (BiTeSe) compoundii. p-type: bismuth-telluride-antimony (BiTeSb) compound4.
13、 Assembled and joined by solder.Figure 1. Thermoelectric Cooler SchematicThe TEC can be made in different shapes and sizes, but most common shape is a square or a rectangular substrate device. The practical size of a single stage TEC ranges from 3 mm x 3 mm up to 60 mm x 60 mm. The size limitation o
14、f 60 mm x 60 mm is due to the thermal stress. This stress comes from thermal expansion deformations between the cold and the hot junctions of the TEC. To obtain a larger temperature difference, a multistage TEC can be build. The multistage TEC is usually in cascade shape and 6 stages are the maximum
15、 practical limit. Figure 2 depicts various sizes of TEC.Figure 2. Various Sizes of TEC4 When to consider TEC?TEC can be used in different application where cooling or temperature control of an object is required. In general, TEC is most often used when an object:1. Needs to be cooled below the ambie
16、nt temperature, or 2. Requires to be maintained at a consist temperature under a fluctuating ambient temperature.TEC is perfect for cooling a small, low heat load object. Due to the low COP (Coefficient of Performance) compared with compressor cooling, TEC looses its advantage if the cooling load is
17、 higher than 200 watts. But, because TECs have no moving parts, they are lightweight and reliable; they create no electrical noise, and can be operated at any orientation or environment, in some instances TECs are used to cool kilowatts of heat.TEC is exceptionally suitable for a precision temperatu
18、re control of an object such as a laser diode, CCD or other small objects. Paired with a DC power supply and an electronics proportional/integral (PI) controller packaged in a single chip device, TEC is able to control an object to +/- 0.1oC accuracy. Today, no other cooling method yet can provide s
19、uch precise, simple and convenient temperature control.5 Application of TECTEC is mainly used for cooling of electronic components, especially of optical devices, so as to improve the performance of electronic components, such as computer chips, infrared detectors, lasers and so on. These devices ty
20、pically require less cooling power. U.S. Marlow Company has set up a laser cooling segment, and about one third of the personnel are engaged in this study area. TECs applications on the biology and medical. PCR instrument is known as temperature control device or gene amplification process instrumen
21、t, which can be used for the diagnosis of genetic diseases, infectious disease detection, and forensics test that its essence is a temperature circulator. The worlds most advanced PCR instrument is manufactured by using semiconductor refrigeration technology, for example, the British LEP company pro
22、duced PREM , the Swedish PHARMACIA company produced Gene ATAQ and the United States MJ company produced PTC-150 type PCR instrument. The ventilator pump is made use of semiconductor refrigeration technology, which has a simple structure, has no noise, high speed of condense and high condensing effic
23、iency and which is the most advanced respiratory pump, such as the production of 900-C ventilator by Siemens; Nd-YAG laser surgery devices were made by the semiconductor refrigeration technology, which has many characteristics such as small size, light weight, easy to use, sustainable to work, sophi
24、sticated temperature alarm device. For example, our country made H-100-IV-type Nd- YAG laser surgery devices by using semiconductor cooling technology, and application of semiconductor cooling technology also made the stage microscope, slice freezer, hot and cold acupuncture device, cold hats, and f
25、reezing therapy devices. TEC can be applied in the appliance industry. This industry is characterized by the application of portable and small volume cabinet for special occasions. For instance, the Chicago Thermopol Company produced M-50B-type military refrigerating devices, and Michigan Hylan Comp
26、any produced 46 liters thermoelectric refrigerator. Now the larger manufacturers are: Koolatron Corporation in Canada, Europe Elecriolux in Belgium, Supercool Corporation in Sweden, Far East Yams company in Hong Kong and Commander Highclass Electrical Corporation in Taiwan.TEC is applied in desiccant technology. Using this technology to produce the condensing mirror dew point meter is 2-standard equipment which measured condensing humidity. The semiconductor refrigeration techno
溫馨提示
- 1. 本站所有資源如無(wú)特殊說明,都需要本地電腦安裝OFFICE2007和PDF閱讀器。圖紙軟件為CAD,CAXA,PROE,UG,SolidWorks等.壓縮文件請(qǐng)下載最新的WinRAR軟件解壓。
- 2. 本站的文檔不包含任何第三方提供的附件圖紙等,如果需要附件,請(qǐng)聯(lián)系上傳者。文件的所有權(quán)益歸上傳用戶所有。
- 3. 本站RAR壓縮包中若帶圖紙,網(wǎng)頁(yè)內(nèi)容里面會(huì)有圖紙預(yù)覽,若沒有圖紙預(yù)覽就沒有圖紙。
- 4. 未經(jīng)權(quán)益所有人同意不得將文件中的內(nèi)容挪作商業(yè)或盈利用途。
- 5. 人人文庫(kù)網(wǎng)僅提供信息存儲(chǔ)空間,僅對(duì)用戶上傳內(nèi)容的表現(xiàn)方式做保護(hù)處理,對(duì)用戶上傳分享的文檔內(nèi)容本身不做任何修改或編輯,并不能對(duì)任何下載內(nèi)容負(fù)責(zé)。
- 6. 下載文件中如有侵權(quán)或不適當(dāng)內(nèi)容,請(qǐng)與我們聯(lián)系,我們立即糾正。
- 7. 本站不保證下載資源的準(zhǔn)確性、安全性和完整性, 同時(shí)也不承擔(dān)用戶因使用這些下載資源對(duì)自己和他人造成任何形式的傷害或損失。
最新文檔
- 股東會(huì)表決票-文書模板
- WPS辦公應(yīng)用(高級(jí))習(xí)題及答案 ch3 WPS表格的高級(jí)應(yīng)用
- 強(qiáng)化安全管理-創(chuàng)建平安校園
- 單選之冠詞與數(shù)詞(原卷版)
- 2024年汽車電子產(chǎn)品項(xiàng)目投資申請(qǐng)報(bào)告代可行性研究報(bào)告
- 系繩物體的浮力問題-2023年中考物理復(fù)習(xí)講練(原卷版)
- 知識(shí)產(chǎn)權(quán)保護(hù)承諾書
- 美麗的頤和園導(dǎo)游詞(33篇)
- 物流運(yùn)輸車輛租賃合同(35篇)
- 粗砂墊層試驗(yàn)段的施工方案及試驗(yàn)段總結(jié)
- 54設(shè)計(jì)和開發(fā)驗(yàn)證記錄表
- 2023年新改版教科版四年級(jí)上冊(cè)科學(xué)期中測(cè)試卷 (超全)
- 二上【教學(xué)】《我們不亂扔》
- 研發(fā)流程(EVT-DVT-PVT-MP)實(shí)用文檔
- 《中國(guó)夢(mèng)我的夢(mèng)》課件
- 大數(shù)據(jù)與數(shù)學(xué)研究課件
- 藥劑科運(yùn)用PDCA循環(huán)減少門診藥房藥品調(diào)劑差錯(cuò)PDCA成果匯報(bào)
- 《五育并舉 豐盈孩子的心靈》 論文
- 中國(guó)電信知識(shí)普及100題
- 物品接收單模板(接受聯(lián)、存根聯(lián))
- 16G362 鋼筋混凝土結(jié)構(gòu)預(yù)埋件
評(píng)論
0/150
提交評(píng)論