西門子可靠性培訓(xùn)資料-PPT課件

1、M. Chbat, S. Eberlin, M. Tochtermann, T. JuhnkehiT 7500 Multi-Haul DWDM system Product Reliability Update Processes, Status, and MeasuresSept 15, 2019Siemens Reliability Process OverviewOptical Components: EDFA VOA GTC PassivesNegotiations with suppliers: Modeling Field experience Supplier compariso

2、nElectrical Components: Resistors Capacitors Transistors ICs etc.Standards: SN 29500 IEC 61709Mechanical Components: Connectors Boards etc.Standards: SN 29500 IEC 61709Card FIT RateFeedback from Field Return RateProduct Reliability Assurance ProcessReference : Siemens standard; in agreement with int

3、ernational standards IEC 61709product definitionproduct developmentproduct deliveredrequirements aligned with technology basis failure rate allocation to individual cards involvement of component engineering & QAcard failure rates on basis of parts listscomponent rating by designnew & critical compo

4、nents specificationnew components & supplier auditsin production failure controlfield return analysis & threshold monitoringconservative data based on predicted valuesregular component supplier auditsReliability Control and ImprovementCross-functional team established to install focused program Clos

5、e interaction with the supplier for design, technology and processEarly failure monitoring and feedback in development phase Extended testing including temperature cycling in productionDetailed failure monitoring in production for early corrective actionPredicted FIT rates vs. field return FIT rates

6、Field return FIT rate inherently is (!) lower than predicted FIT rate spare parts dont contribute to FMAnon-installed equipment at certain carrierslow channel count for many yearstemperature for FIT estimation probably higher than in realitymargin (e.g., due to low channel count, low PMD, BOL) can m

7、ask performance degradationFunctional Partition of OLIOptical amplification via EDFA gain blockPump diodesMonitor diodesEDF-HeaterInternal Gain SwitchOSC splitting functions asAdd / Drop of the OSC channel using wavelength selective couplersSplitting of monitor signals at the input and output port a

8、nd at intermediate measurement pointsSpectral shaping of the signal using aVOA for setting the EDFA to an optimized operating pointGTC for tilt compensationOptical monitor ports at input and output for signal supervisionAPSD circuitryGain Control and Supervision (DSP, on-board processor)Electrical c

9、omponents for control and power supplyMechanics including PCB0 1 2 3 4 5 6 7 8 9 10 11 12 13 Operating time T in yearsFailure rate l Early failuresl totalWear-out failureThe bathtub curve: Failure rates l via time TRandom failureFor the field replaceable HW-units and their componentsthe failure rate

10、 l could be only predicted by random failures!The unit of the failure rate l is a FIT(Failure in Time; 1 FIT = 1 Failure per 109h)!Bathtub CurveIEC 61709: Electronic components ReliabilityReference conditions for failure rates and stress models for conversion (no basic failure rates)Relationship bet

11、ween StandardsSIEMENS standard SN29500 / IEC61709 compared to SR-332SR-332: Reliability Prediction Procedure forElectronic EquipmentSN29500: Failure rates of componentsExpected values(This is in addition to IEC 61709)a) Climatic and mechanical stresses per IEC 721-3-3 (see next slide)multiplying fac

12、tors for environmentalconditionsb) Quality factortested components SN725004 quality levels knownc) Temperature and electrical stressby reference conditions IEC 61709given reference conditions and conversion (SR-332)IEC 61709: Electronic components Reliability Reference conditions for failure rates a

13、nd stress models for conversionThe failure rate under operating conditions is calculated as follows:Wherelref is the failure rate under reference conditions;pU is the voltage dependence factor;pI is the current dependence factor;pT is the temperature dependence factor.These Parameter are listed e.g

14、in the SN29000 library!Reference conditions for climatic and mechanical stressesType of stressReference condition 1)qamb, ref = 40 CClimatic conditionsClass 3K3 as per IEC 721-3-3Mechanical stressClass 3M3 as per IEC 721-3-3Special stresses 3)NoneFor details of notes (-1, -2,-3) please refer to IEC

15、61709Ambient temperature 2)The definitions, reference conditions and conversion models used in the IEC 61709 fullycorrespond with the already existing SIEMENS standard SN 29500 method.Details: SIEMENS Standard SN29500 and IEC61709FIT Rates of Individual Electrical Components (1)Voltage dependence an

16、d Current dependenceor(1)(2)UOperating voltage in VUrefReference voltage in VUmaxRated voltage in VC1Constant in (1/V)C2C2,C3Constants(1).Digital CMOS Families, Contactors (2).OthersIOperating current in AIrefReference current in AImaxRated current in AC4,C5ConstantsFIT Rates of Individual Electrica

17、l Components (2)AConstantEa1,Ea2Activation energies in eVTU,refReference ambient temperature in KT1Reference junction*)- (comp.*)-) temperature in KT2Actual junction*)- (comp.*)-) temperature in K*) Depends on type of component, see also SN 29500, Part 1, Capt. 4.3Temperature dependenceThe expected

18、failure rate of a HW-unit can be calculatedby adding the expected failure rates of the components :EPROMCapa. Resi.FanTrans.DiodeDC/DCOptic. ModuleICPINsLEDSolder jointsASICfield-replaceable HW-unit (Example)EPROMOptic. ModulePINsLEDICICICTrans.DiodeDiodeTrans.Trans.FanCapa. Capa. Capa. Capa. Capa.

19、Resi.Resi.Resi.Resi.Resi.Resi.Resi.ASICResistors1 FIT8168 FITCapacitors2 FIT61212 FITDiodes8 FIT3624 FITTransistors15 FIT41260 FITICs25 FIT464100 FITEPROM100 FIT264200 FITDC/DC40 FIT22880 FITASIC250 FIT21016500 FITFAN150 FIT210300 FITOptical Module800 FIT2321.600 FITSolder joints0,1 FIT1260126 FIT3.

20、010 FITFailure rates ofl ComponentsSum offailure ratesName ofComponentsNo.ofPinsNo.ofComp.Example: tot. failure rate of the HW-unit l unit =Component 1R1, l1Component 2R2, l2Total functional reliability (survivor) Rtot of two components :Details: Total Reliability and Total Failure Rate of UnitSieme

21、ns Reliability Process OverviewOptical Components: EDFA VOA GTC PassivesNegotiations with suppliers: Modelling Field experience Supplier comparisonElectrical Components: Resistors Capacitors Transistors ICs etc.Standards: SN 29500 IEC 61709Mechanical Components: Connectors Boards etc.Standards: SN 2

22、9500 IEC 61709Card FIT RateFeedback from Field Return RateEstimation of FIT Rates for Optical ComponentsIn parallel to the qualification cross-check detailed discussions take place with the vendorWhat is the estimate of the vendor? How did he reach his estimate ? What is the FIT rate of sub-componen

23、ts and PCBAs of the module ?Results of the cross-qualification are taken into account (failures, corrective actions, changes)The estimation of the vendor and the expertise of qualification team lead to the Siemens estimate (not necessarily the same as the vendors estimate)Field returns are taken int

24、o account when available and compared to the estimateFIT rates are adapted accordingly (repetitive process)Example of FIT Rate Adaption: EDFA w/ 5 pumpsFirst estimate in 2019: 6000 FIT (complete new design incl. new Pumps, no experience at SIEMENS side)New vendors (new spec.) were qualified by CoC O

25、ptics and the CoC process took placeEstimates by two vendors: 3500 - 4800 FITReduction to 5000 FIT beginning of 2019Quality improvement discussions with the vendors ongoingCheck with field returns: 1600 FITReduction to 4000 FIT(Siemens estimate) in April of 2019Continuously monitoredSimilar process

26、with EDFAs (2 pumps) lead to an estimate of 2400 FITExample of FIT Rate Calculation for an Optical Amplifier Provided by the EDFA Supplier (1)Example of FIT Rate Calculation for an Optical Amplifier Provided by the EDFA Supplier (2)Overall FIT rate: 3457.7Siemens Reliability Process OverviewOptical

27、Components: EDFA VOA GTC PassivesNegotiations with suppliers: Modelling Field experience Supplier comparisonElectrical Components: Resistors Capacitors Transistors ICs etc.Standards: SN 29500 IEC 61709Mechanical Components: Connectors Boards etc.Standards: SN 29500 IEC 61709Card FIT RateFeedback fro

28、m Field Return RateReference FIT Rate for electrical and mechanical componentsSN 29500 developed by ZT SR Corporate Function Standardization and Regulation,Cross-functional expert team SN 29500, Committee QualityUsed by all Siemens divisionsUpdated by expert team with data from: field experience, co

29、mponent qualifying teams and component manufacturersHistory and acceptanceDeveloped as companys internal standardFirst edition in 1978Worldwide used by the most Siemens groupsWidely used outside the companyGenerally used calculating the Siemens telecommunications systemsApproved worldwide by the cus

30、tomersFully in accordance with EN/IEC 61709 actually parts Part1:GeneralPart2:integrated circuitsPart3:discrete semiconductorsPart4:passive componentsPart5:electrical connectionsPart6:connectors and socketsPart7:relaysPart9:switchesPart10:signal and pilote lampsPart11:contactorsPart12:optical semico

31、nductors, signal receiversPart13:light-emitting and infrared diodesPart14:optocouplerFIT Rates of Individual Electrical ComponentsReliability of Basic Booster (OLISTBNC):Contribution of Component GroupQuantityComponent GroupPercent.17Optoelectronics43%41Other Components11%550Capacitors8%64IC analogu

32、e6%7IC Memories5%45Connectors Sockets4%6IC ASIC4%26Transistors4%1087Resistors3%0Electr. Connections3%2Micro-Processors and -Controllers2%4IC Telecom2%15IC Standard1%68Diodes1%6Semiconductors Power1%1938Sum100%Reliability of Standard Booster (OLITBNC):Contribution of Component GroupQuantityComponent

33、GroupPercent.34Optoelectronics52%46Other Components9%828Capacitors7%104IC analogue6%63Transistors5%1791Resistors3%7IC Memories3%0Electrical Connections3%67Connectors Sockets3%6IC ASIC3%8IC Telecom2%126Diodes2%2Micro-Processors and -Controllers1%19IC Standard1%9Semiconductors Power1%3110Sum100%Siemen

34、s Reliability Process OverviewOptical Components: EDFA VOA GTC PassivesNegotiations with suppliers: Modelling Field experience Supplier comparisonElectrical Components: Resistors Capacitors Transistors ICs etc.Standards: SN 29500 IEC 61709Mechanical Components: Connectors Boards etc.Standards: SN 29500 IEC 61709Card FIT RateFeedback from Field Return RateFIT Rates of Individual Mechanical ComponentsSiemens Reliability Process OverviewOptical Components: EDFA VOA GTC Passi